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XC3S1600E-5FGG320C - Spartan-3E FPGA 1.6M Gates | AMD/Xilinx
XC3S1600E-5FGG320C

XC3S1600E-5FGG320C - Spartan-3E FPGA 1.6M Gates | AMD/Xilinx

The AMD (Xilinx) XC3S1600E-5FGG320C is a Spartan-3E family FPGA with 1.6 million system gates, 33,192 logic cells, and 250 user I/Os, fabricated on 90nm CMOS process technology and housed in a 320-ball fine-pitch BGA (FGG320, 19x19 mm) package. It operates from a 1.2V core supply (1.14V to 1.26V) with a commercial temperature range of 0C to 85C junction, and speed grade -5. An FPGA (Field-Programmable Gate Array) is a semiconductor device containing a fabric of configurable logic blocks (CLBs), embedded memory, and programmable interconnects that designers configure via a hardware description language such as Verilog or VHDL. Within the semiconductor hierarchy, an FPGA sits under programmable logic devices, alongside CPLDs and ASICs, and is used to implement custom digital logic without fabricating a custom chip. Key features of the XC3S1600E include a large 1.6M-gate fabric for mid-density designs, 250 user I/Os supporting multiple I/O standards, Spartan-3E cost-optimized architecture, and availability of configuration via platform flash devices such as the XCF32P. The Spartan-3E family was widely adopted in telecommunications, industrial control, and consumer electronics, per Microchip USA product data. Architecturally, the Spartan-3E fabric uses 4-input look-up tables (LUTs), dedicated carry logic, block RAM, and embedded multipliers, enabling DSP datapaths, glue logic consolidation, bus interfaces, and control sequencing on a single chip. Typical applications include industrial control systems, telecommunications line cards, test equipment, motor control interfaces, and legacy system sustenance where a proven mid-density FPGA is already designed in. Design consideration: this part is officially obsolete and no longer manufactured, per DigiKey lifecycle data, so new designs should evaluate AMD 7-series (Spartan-7, Artix-7) or cross-brand alternatives; existing designs should secure stock or a qualified migration path. This page synthesizes distributor pricing, drop-in alternatives, lifecycle status, and practical design notes not consolidated in the manufacturer datasheet.

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XC3S1600EFG400 - Spartan-3E FPGA 1.6M Gates | AMD/Xilinx
XC3S1600EFG400

XC3S1600EFG400 - Spartan-3E FPGA 1.6M Gates | AMD/Xilinx

The AMD/Xilinx XC3S1600EFG400 is a member of the Spartan-3E family of Field Programmable Gate Arrays (FPGAs), offering a high-density programmable logic solution with 33,192 logic cells and an equivalent gate count of 1,600,000. Housed in a 400-ball FBGA package (FG400), this device provides 304 user I/O pins and 663,552 bits of block RAM, making it suitable for a wide range of digital designs. An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer or designer after manufacturing—hence 'field-programmable'. FPGAs consist of an array of programmable logic blocks, interconnects, and I/O blocks, allowing the implementation of complex digital circuits without the need for custom fabrication. They are a subset of programmable logic devices (PLDs) and are widely used in prototyping, low-to-medium volume production, and applications requiring reconfigurability. Key features of the XC3S1600EFG400 include 33,192 logic cells, 663,552 bits of block RAM, and support for a maximum clock frequency of 572 MHz. The device operates from a 1.2V core voltage and is manufactured using advanced CMOS technology. The FG400 package offers 400 balls with a 1.00 mm pitch, providing a compact footprint for space-constrained designs. The Spartan-3E architecture is optimized for high performance and low cost, featuring dedicated multipliers, digital clock managers (DCMs), and support for various I/O standards including LVCMOS, LVTTL, and differential standards. The device also includes configuration support via JTAG, SPI, and SelectMAP interfaces, enabling flexible system integration. Typical applications for the XC3S1600EFG400 include industrial control, automotive infotainment, consumer electronics, and communication systems. Its balance of logic density, I/O count, and cost makes it ideal for bridging ASIC prototyping and production. When designing with this FPGA, careful attention must be paid to power supply decoupling and configuration bitstream storage. The 1.2V core requires stable power, and the configuration data is typically stored in an external SPI flash, which must be selected for compatibility.

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XC3S200-4FT256C - 200K Spartan-3 FPGA | AMD / Xilinx
XC3S200-4FT256C

XC3S200-4FT256C - 200K Spartan-3 FPGA | AMD / Xilinx

AMD XC3S200-4FT256C is a Spartan-3 field-programmable gate array with 200000 system gates, 4320 cells, and a 256-LBGA package. The -4 speed grade operates at up to 630 MHz, while the device uses a nominal 1.2 V core supply and is manufactured in 90 nm process technology. These headline characteristics position the FPGA between fixed-function logic and larger programmable-logic devices for cost-sensitive, moderate-complexity embedded systems. A field-programmable gate array is a programmable logic device in which configurable logic blocks, programmable input/output blocks, and programmable interconnect form a user-defined digital circuit. Within the semiconductor hierarchy, an FPGA belongs to programmable logic devices, alongside CPLDs and mask-programmable logic. Unlike a fixed-function microcontroller or application-specific integrated circuit, an FPGA can be reconfigured after manufacture to implement control, interface, protocol, signal-processing, or security functions in parallel. The Spartan-3 architecture provides 480 configurable logic blocks and 4320 cells according to the supplied distributor and comparison data. Its 256-ball package supports 256 terminals for device configuration, power, clocking, and user I/O. The -4 designation identifies the performance grade, while the commercial C suffix corresponds to the stated 0°C to 85°C operating-temperature range. A maximum supply voltage of 1.26 V and a nominal 1.2 V FPGA supply are also reported in the available data. The 90 nm Spartan-3 process supports a useful balance of logic capacity, static power, dynamic performance, and manufacturing cost. At up to 630 MHz, the XC3S200-4FT256C can satisfy clock-domain requirements that are more demanding than simple glue logic while remaining smaller and less complex than a high-end FPGA. Exact timing, I/O standards, supported memory interfaces, configuration options, and core-current limits require confirmation in the complete manufacturer datasheet before a new design is released. Typical uses include industrial control and automation, communications equipment, embedded test systems, consumer products, instrumentation, and compact control modules. Its parallel programmable resources can implement multiple finite-state machines, data acquisition logic, communication bridges, and auxiliary processors concurrently. The 256-terminal package also makes the device suitable for designs requiring more configuration and user I/O than a small CPLD, although board density and routing must be assessed at the schematic and PCB stages. Designers should treat the package, voltage rails, decoupling, configuration interface, clocking, and I/O standards as a coordinated system rather than isolated specifications. Place bypass capacitors close to the supply pins, preserve the required configuration path, and verify every ball assignment against the exact package drawing. Because the supplied snippets contain inconsistent secondary descriptions of package and cell data, the authoritative manufacturer pinout and datasheet should control any production implementation. This page combines the verified distributor specifications with engineering-focused application guidance, design notes, parameter comparisons, and same-family drop-in candidates. It also distinguishes confirmed values from unavailable electrical details, helping engineers identify the correct replacement without mistaking a similar FPGA for a guaranteed production substitute.

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XC3S200-4FT256I - 200K Spartan-3 FPGA | AMD | FTBGA-256
XC3S200-4FT256I

XC3S200-4FT256I - 200K Spartan-3 FPGA | AMD | FTBGA-256

The AMD XC3S200-4FT256I is a 200K-gate Spartan-3 field-programmable gate array (FPGA) with 4,320 logic cells, a 630 MHz maximum clock frequency, and a 256-terminal FineLine BGA package measuring 17 mm by 17 mm. The device uses 90 nm FPGA technology and operates from a 1.14 V to 1.26 V internal core supply. Its 256-terminal package provides a high pin count for dense programmable-logic designs while maintaining a compact board footprint. A field-programmable gate array is a configurable digital semiconductor containing programmable logic blocks, programmable interconnect, and input/output resources. An FPGA belongs to the semiconductor hierarchy, programmable-logic IC hierarchy, and Spartan-3 FPGA family. Unlike a fixed-function application-specific integrated circuit, an FPGA allows system designers to implement parallel logic, control functions, signal processing, and interface logic in hardware and later update the configuration through a configuration memory or JTAG programming path. The XC3S200-4FT256I combines 4,320 logic cells with 200K system gates and a maximum clock frequency of 630 MHz. The -4 speed designation identifies the performance grade, while the I suffix identifies the industrial temperature grade. The device is specified for 0 C to +85 C operation in the supplied distributor data, making it suitable for industrial and embedded control equipment where environmental requirements exceed consumer-grade conditions. The 17 mm by 17 mm FTBGA-256 package supports compact PCB layouts but requires careful escape routing, via-in-pad or via fan-out strategies, assembly-process control, and inspection. The 1.2 V core supply requires a regulated, low-noise supply rail and appropriate power-plane distribution. Because this is a legacy Spartan-3 FPGA, designers should also verify configuration memory availability, toolchain support, lifecycle status, and second-source requirements before committing a new production design. Typical applications include industrial control, instrumentation, data acquisition, communication interfaces, embedded signal processing, and prototype systems requiring configurable parallel logic. The high-pin-count package is particularly useful when the design needs numerous user I/O or dedicated interface resources, although the exact user I/O count is not provided in the verified data. A key design consideration is that replacing an XC3S200-4FT256I is not limited to matching its package. A true drop-in candidate must also preserve pin assignment, voltage requirements, configuration behavior, timing characteristics, and software support. This page summarizes verified distributor and manufacturer-linked information, compares documented drop-in candidates, and identifies engineering details that must be confirmed before PCB release.

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XC3S200-4FTG256C - 200K Spartan-3 FPGA | AMD
XC3S200-4FTG256C

XC3S200-4FTG256C - 200K Spartan-3 FPGA | AMD

AMD XC3S200-4FTG256C is a Spartan-3 field-programmable gate array with 200,000 system gates, 4,320 logic cells, a 630 MHz maximum clocking frequency, and a 256-ball low-profile BGA package. Designed for cost-sensitive programmable-logic applications, the device combines configurable logic, block RAM, dedicated DSP resources, and a 1.2 V core supply in a single surface-mount package. The -4 speed designation identifies its performance grade, while FTG256C identifies the 256-ball package and commercial temperature option. A field-programmable gate array is a semiconductor whose digital logic is configured after manufacture rather than being permanently patterned. Within the FPGA hierarchy, an FPGA sits above fixed-function logic and below complex programmable systems such as SoCs and microcontrollers. Its configurable LUTs, routing fabric, dedicated memories, and I/O blocks allow one physical device to implement many digital functions, including control logic, interfaces, data acquisition, communications, and signal-processing pipelines. The XC3S200 family is identified by 200,000 system gates and includes 4,320 configurable logic cells according to the AMD Spartan-3 device information. A maximum clock frequency of 630 MHz supports demanding control and datapath designs, although attainable system performance depends on logic depth, routing, memory use, and timing constraints. The core operates from 1.2 V, reducing supply requirements in compact embedded systems. Its 256-LBGA package provides dense I/O connectivity while supporting high-density board layouts. The Spartan-3 architecture implements programmable logic through configurable lookup tables and programmable interconnect. Dedicated block RAM supports buffering, packet storage, and data-domain conversion, while DSP blocks accelerate multiply-accumulate operations used in filtering, modulation, and waveform processing. The -4 speed grade provides a defined timing-performance class for design planning, and the 90 nm fabrication technology places this device in an established, cost-oriented FPGA generation. Typical applications include industrial control, consumer electronics, video and image processing, communications interfaces, embedded data capture, educational platforms, and compact embedded systems. Its combination of 4,320 logic cells, dedicated resources, and 256-ball packaging makes it suitable for designs that need programmable functionality without the resource level of a larger FPGA. Designers should assign a pin-compatible clock, configure an appropriate Spartan-3 PROM or in-system configuration interface, and verify all I/O standards against the device datasheet. Dense BGA routing requires careful escape, via, and plane management, while clock, decoupling, and power-distribution networks should follow the AMD reference guidance to preserve timing and signal integrity. This product page combines device specifications, package information, pricing visibility, qualified drop-in candidates, and practical implementation guidance. It also distinguishes exact-footprint replacements from broader Spartan-3 alternatives, helping engineers confirm mechanical, electrical, lifecycle, and software-tool implications before changing a production bill of materials.

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XC3S200-4FTG256I - Spartan-3 FPGA 200K Gates | Xilinx
XC3S200-4FTG256I

XC3S200-4FTG256I - Spartan-3 FPGA 200K Gates | Xilinx

The Xilinx XC3S200-4FTG256I is a Spartan-3 family field programmable gate array (FPGA) offering 200,000 system gates and 4,320 logic cells in a 256-ball FineLine BGA (FTG256) package, with a 1.2V core voltage, industrial temperature rating of -40C to +100C, and a -4 speed grade supporting internal performance up to approximately 630 MHz. A field programmable gate array is a semiconductor device containing a fabric of configurable logic blocks (CLBs), programmable interconnects, and I/O blocks that the designer configures after manufacturing. FPGAs sit within the broader programmable logic hierarchy: CLB -> FPGA -> programmable logic device -> digital IC. Unlike fixed-function ASICs, FPGAs allow field reprogramming, making them ideal for prototyping, low-to-medium volume production, and designs requiring in-service updates. Key features of the XC3S200 include 2,160 slices built on a 90nm process technology, 12 blocks of 18Kbit block RAM totaling 216 Kbits of embedded dual-port memory, four 18x18 hardware multipliers for DSP operations, a Digital Clock Manager (DCM) for clock deskew and frequency synthesis, and up to 173 user I/Os supporting multiple I/O standards such as LVTTL, LVCMOS, SSTL, and LVDS on bank-selectable VCCO rails. Technically, the Spartan-3 fabric uses a four-input lookup table (LUT) per slice logic cell with dedicated fast carry logic for arithmetic chains. The -4 speed grade denotes the fastest standard commercial/industrial timing bin of the Spartan-3 family. Configuration is performed via serial or parallel PROMs (Xilinx Platform Flash) in Master/Slave Serial or SelectMAP modes with JTAG boundary-scan support per IEEE 1149.1. Typical applications include industrial control and motor drive logic, communication protocol bridging, test and measurement instrumentation, and embedded coprocessing with the hardware multipliers for modest DSP tasks. The 17x17mm FTBGA footprint suits space-constrained boards requiring high I/O density. A key design consideration is power: the 1.2V core requires a dedicated regulator, and I/O bank VCCO supplies must match the connected logic standards; total power scales with clock frequency and toggle rates, so use the Xilinx power estimator early in design. This page synthesizes verified distributor data, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet.

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XC3S200-4PQ208C - 200K Spartan-3 FPGA | AMD / Xilinx
XC3S200-4PQ208C

XC3S200-4PQ208C - 200K Spartan-3 FPGA | AMD / Xilinx

The AMD / Xilinx XC3S200-4PQ208C is a Spartan-3 field-programmable gate array with 200,000 system gates, 4,320 logic cells, 480 configurable logic blocks, and 221,184 RAM bits in a 208-pin PQFP package. It operates from a 1.2 V core supply and is specified for the commercial temperature range of 0°C to 85°C. A field-programmable gate array is a semiconductor whose digital logic, memory, and I/O paths are configured after manufacture. Within the product hierarchy, the XC3S200-4PQ208C is an FPGA, then a programmable-logic device, and ultimately a semiconductor. Compared with fixed-function logic ICs, an FPGA lets engineers implement parallel processing, control, communications, and signal-generation functions in one reconfigurable device while retaining the same package and pinout across design revisions. The supplied product data identifies 141 I/O, 4,320 logic cells, 480 CLBs, 221,184 RAM bits, and 200,000 system gates. The “-4” speed designation and an associated listing report 630 MHz performance, while the commercial “C” suffix identifies the specified temperature grade. Its 208-pin PQFP package exposes substantially more device I/O than the smaller 100-pin Spartan-3A options, making it suitable for designs with wider external buses or more peripheral connections. The XC3S200-4PQ208C fits industrial control, communications infrastructure, embedded instrumentation, video processing, test equipment, and legacy embedded systems. A practical design can use its programmable logic for parallel data acquisition, protocol conversion, signal conditioning, and supervisory control while retaining configuration data in external nonvolatile flash. Engineers should verify every power rail, configuration interface, and high-speed I/O constraint against the complete Spartan-3 documentation before layout release. Power and termination design remain central to reliable FPGA implementation. Provide the specified core and I/O supplies, route each supply through its documented decoupling network, and use a configuration scheme that matches the board’s flash and control logic. Because the supplied excerpts do not provide full electrical limits, pin assignments, or power-budget data, those details require confirmation from the manufacturer’s official Spartan-3 documentation before schematic completion. This page consolidates verified distributor specifications, same-package family comparisons, commercial availability references, and application-specific engineering guidance. It distinguishes the XC3S200-4PQ208C from smaller Spartan-3 packages and higher-density PQFP208 devices, helping engineers determine whether the device’s logic, memory, I/O, and thermal requirements align with an existing 208-pin PCB design.

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XC3S200-4PQ208I - 200K-Gate Spartan-3 FPGA | AMD Xilinx
XC3S200-4PQ208I

XC3S200-4PQ208I - 200K-Gate Spartan-3 FPGA | AMD Xilinx

AMD Xilinx XC3S200-4PQ208I is a Spartan-3 field-programmable gate array with 200,000 system gates, 4,320 logic cells, 141 user I/O, and a stated 630 MHz performance figure, supplied in a 208-pin PQFP package. The device operates from a 1.2 V core supply and is built on 90 nm CMOS process technology. Its -4 speed designation identifies a performance grade, while the PQ208 suffix denotes the 208-pin plastic quad flat package and I suffix identifies the industrial temperature option. A field-programmable gate array is a programmable semiconductor in which digital logic, interfaces, and system functions are configured after manufacture. Within the product hierarchy, an FPGA is a semiconductor and a programmable logic device. The Spartan-3 family targets cost-sensitive designs requiring more flexibility than fixed-function logic, while providing configurable logic blocks, dedicated arithmetic resources, block RAM, and programmable I/O within one integrated device. The XC3S200-4PQ208I combines 480 configurable logic blocks with 4,320 logic cells and 141 user I/O according to the supplied manufacturer-family data. Its 200,000-system-gate count describes the family device's logic-equivalent capacity rather than a fixed gate count. The 630 MHz figure likewise requires careful interpretation because achievable system performance depends on the selected design, timing constraints, clocking, I/O standards, routing, and the associated Xilinx toolchain. The 90 nm Spartan-3 architecture supports integration of control logic, data acquisition, communications glue logic, state machines, and modest parallel-processing functions. Reconfigurability allows design revisions to be implemented in the FPGA bitstream rather than through a PCB respin. Dedicated block RAM can buffer sampled or packet data, while programmable I/O can connect the device to external clocks, data buses, transceivers, displays, and industrial interfaces subject to voltage and timing constraints. Typical uses include industrial automation, programmable logic controllers, motor-control and sensor-processing systems, embedded communications, instrumentation, and cost-sensitive consumer or control electronics. The 208-pin PQFP provides more I/O than a small FPGA package, making it useful where parallel external buses, control signals, or multiple interfaces must coexist with the Spartan-3 logic fabric. Design planning should begin with the AMD/Xilinx Spartan-3 datasheet and the appropriate ISE or Vivado-era design flow for the installed device family. Verify the exact pinout, supported I/O standards, configuration requirements, decoupling, clock topology, and exposed thermal and power constraints on the selected package before layout release. This page consolidates verified distributor specifications, pricing references, same-family drop-in candidates, and practical selection considerations for engineers evaluating the XC3S200-4PQ208I.

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XC3S200-4TQ144C - 200K Gate Spartan-3 FPGA | Xilinx
XC3S200-4TQ144C

XC3S200-4TQ144C - 200K Gate Spartan-3 FPGA | Xilinx

The Xilinx XC3S200-4TQ144C is a Spartan-3 field-programmable gate array with 200,000 system gates, 4,320 logic cells, 97 I/Os, a 1.2 V core supply, and a 144-pin TQFP package. It is a -4 speed-grade device specified for a commercial operating temperature range of 0°C to 85°C. The configurable logic and dedicated input/output resources make it a practical FPGA platform for embedded control, parallel data processing, industrial automation, communication interfaces, and cost-sensitive custom digital systems. An FPGA is a user-programmable semiconductor in the broader integrated-circuit hierarchy. Unlike a fixed-function microcontroller or application-specific integrated circuit, an FPGA combines configurable logic blocks, programmable interconnect, memory resources, and I/O blocks into a device whose digital behavior can be defined after manufacture. The Spartan-3 architecture is part of the FPGA and programmable-logic-device family, offering a practical balance between logic capacity, I/O availability, device cost, and design flexibility. The XC3S200-4TQ144C provides 192 adaptive logic modules, which are organized into 4,320 logic cells. Its 97 available I/Os allow connections to external memory, sensors, communications transceivers, display controllers, and general-purpose digital peripherals. The verified family data identifies a maximum frequency of 725 MHz for the -4 device, while the exact AC timing limits for each I/O standard must be selected from the manufacturer datasheet. A 1.2 V core supply is typical for this 90 nm Spartan-3 generation, with auxiliary supply requirements depending on the selected I/O standards. The TQFP-144 package is a surface-mount plastic quad flat package that offers substantially more I/O than a compact QFP, while remaining easier to assemble and inspect than a large BGA. Its 144 leads include power, ground, configuration, clock, and user I/O functions. Exact lead assignments, configuration pins, and dedicated behavior depend on the package pinout and device datasheet, so board designers should use the official pin table rather than infer assignments from another package variant. Typical uses include industrial automation controllers, motor and motion-control logic, low-cost instrumentation, data acquisition, protocol bridging, educational FPGA platforms, and compact embedded systems that benefit from parallel hardware acceleration. The Spartan-3 device can implement finite-state machines, DSP-oriented datapaths, parallel-to-serial conversion, and interface control concurrently, reducing reliance on multiple fixed-function components. The primary design consideration is timing closure. Engineers should establish the target clock, external memory interface, I/O standards, and pin assignments early, then use the Xilinx synthesis, implementation, and timing-analysis flow. Decoupling, ground-plane continuity, clock routing, and I/O standard compatibility should be reviewed against the manufacturer guidance before schematic release. This page combines verified device specifications, commercial availability data, same-package replacement candidates, and practical selection guidance. It also distinguishes confirmed values from parameters that still require review in the complete manufacturer datasheet, helping engineers avoid treating incomplete distributor metadata as a complete design specification.

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XC3S200-4TQ144I - 200K Gate Spartan-3 FPGA | AMD | TQFP
XC3S200-4TQ144I

XC3S200-4TQ144I - 200K Gate Spartan-3 FPGA | AMD | TQFP

The AMD XC3S200-4TQ144I is a Spartan-3 field-programmable gate array with 200,000 system gates, 4,320 logic elements, 221,184 bits of embedded RAM, and 97 I/O pins in a 144-pin TQFP package. The -4 speed grade is specified for operation up to 630 MHz, while the I suffix denotes the extended industrial-temperature option. The device uses a 90 nm process and operates from a 1.14 V to 1.26 V core supply. A Spartan-3 FPGA belongs to the configurable-logic hierarchy: FPGA > programmable logic device > field-programmable gate array > semiconductor. Unlike a fixed-function microcontroller or application-specific integrated circuit, an FPGA combines configurable logic blocks, block RAM, programmable I/O, dedicated clocking resources, and embedded hard processors in one reconfigurable device. This allows interface logic, control functions, and parallel data processing to be consolidated on a single PCB. The XC3S200-4TQ144I provides 4,320 four-input LUT-based logic elements and 221,184 embedded RAM bits. Verified listings identify 1,920 adaptive logic modules and 480 LAB/CLB resources for this device. Its 97 I/O pins support board-level connectivity, and the 144-lead TQFP package provides a surface-mount form factor compatible with conventional PCB assembly and inspection processes. The 90 nm Spartan-3 architecture combines programmable logic with dedicated block RAM and programmable interconnect. It is intended for cost-sensitive embedded systems where parallel processing, flexible interfaces, and field reconfiguration provide more value than a fixed logic implementation. The 1.14 V to 1.26 V core range reflects the device's internally regulated core operation, while external I/O requirements remain part of the complete board power architecture. Typical uses include industrial control, embedded communications, instrumentation, data acquisition, display interfaces, and compact embedded processing systems. Its 4,320 logic elements and 221,184 RAM bits make it appropriate for protocol bridging, parallel-to-serial conversion, control-plane logic, and modest algorithmic workloads. Designs requiring substantially greater logic density or memory bandwidth should use a larger FPGA family. Designers should verify the exact pinout, configuration interface, I/O standards, clock requirements, and decoupling recommendations against the manufacturer datasheet before layout release. Because the TQFP package has fine-pitch leads, PCB assembly and inspection require suitable paste, stencil, placement, and inspection processes. Legacy-device supply status and configuration-memory interface compatibility also deserve review before new production commitments. This page consolidates verified distributor specifications, same-family drop-in candidates, practical design guidance, and parameter-level comparisons. It distinguishes confirmed electrical and packaging facts from information that could not be extracted from the supplied web records, helping engineers evaluate the XC3S200-4TQ144I without relying on ambiguous distributor summaries.

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XC3S200-4VQ100C - 200K Spartan-3 FPGA | AMD | 100-VQFP
XC3S200-4VQ100C

XC3S200-4VQ100C - 200K Spartan-3 FPGA | AMD | 100-VQFP

The AMD/Xilinx XC3S200-4VQ100C is a Spartan-3 Field Programmable Gate Array (FPGA) with 200,000 system gates, 63 user I/O pins, and a 100-pin VQFP package. It operates from a 1.2 V FPGA supply and is specified for a 0 °C to 85 °C operating-temperature range. The device is intended for embedded programmable-logic applications where moderate logic density, surface-mount packaging, and a broad I/O count are more important than the very high performance of a large FPGA. An FPGA is a semiconductor whose digital logic, interconnect, and I/O behavior are configured after manufacture. The XC3S200-4VQ100C belongs to the Spartan-3 FPGA family, placing it in the broader hierarchy of programmable-logic device, FPGA, and semiconductor. Its 200,000 system gates provide a practical platform for control logic, interface bridging, signal conditioning, and embedded state-machine designs. The 100-pin VQFP package also supports conventional PCB assembly and inspection processes. The -4 speed designation identifies the device performance grade, while VQ100 identifies the 100-pin VQFP package and C identifies the commercial temperature grade. The listed electrical characteristics include 63 user I/O pins, a 1.14 V to 1.26 V core-supply range, and a 0 °C to 85 °C operating range. These figures define the principal design constraints for voltage regulation, thermal planning, signal-interface design, and industrial or commercial equipment. Typical uses include industrial control and automation modules, communications-interface adapters, embedded test equipment, and low-to-medium complexity digital systems. The FPGA can implement parallel logic, state machines, counters, protocol front ends, and control functions in one configurable device. Engineers should confirm that the selected design does not require more logic resources, I/O, clocking, or memory than the available device resources provide. The most important design consideration is ensuring that the 1.2 V core rail is generated with adequate tolerance and decoupling, while all connected I/O structures remain compatible with the target board voltage levels. Because this is a surface-mount VQFP package, solderability, pin-1 orientation, assembly profile, and thermal performance should be reviewed against the selected PCB footprint and manufacturing process. This page consolidates distributor availability, verified device parameters, package information, and practical FPGA selection guidance. It also distinguishes exact drop-in alternatives from upgrade candidates so engineers can assess PCB reuse without confusing package compatibility with complete functional equivalence.

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XC3S200-4VQ100I - 200K Gate Spartan-3 FPGA | AMD
XC3S200-4VQ100I

XC3S200-4VQ100I - 200K Gate Spartan-3 FPGA | AMD

AMD XC3S200-4VQ100I is a Spartan-3 field-programmable gate array with 200000 system gates, 4320 logic elements, a 1.2 V supply, and a 100-pin TQFP package. The device combines programmable logic, block RAM, and dedicated multiplier resources in a compact 14 mm × 14 mm surface-mount package. Its industrial-oriented ordering suffix supports use in embedded control, communications, instrumentation, and industrial automation systems where deterministic programmable logic is required. A Spartan-3 FPGA is a reconfigurable digital semiconductor in the FPGA and CPLD product hierarchy. Unlike a fixed-function microcontroller or application-specific integrated circuit, an FPGA allows engineers to define parallel logic, state machines, interfaces, and data-processing functions in hardware. Its configurable interconnect routes signals among logic cells, dedicated block RAM, multipliers, and general-purpose I/O, making the device suitable for designs requiring deterministic timing and flexible hardware architecture. The XC3S200-4VQ100I provides 200000 system gates and 4320 logic elements according to distributor listings. The family-level product information also identifies 12 block RAMs, 12 multipliers, and 4 digital clock managers for designs requiring embedded memory, dedicated arithmetic, and clock-management resources. Its 1.2 V core supply and 100-pin TQFP package provide a practical balance between capability, I/O access, and board footprint. The “-4” portion identifies the device speed grade, while “VQ100” identifies the 100-pin package configuration and “I” identifies the industrial temperature grade. These ordering codes allow procurement teams to distinguish devices that otherwise belong to the same Spartan-3 family. Because FPGA designs depend on the configuration file, device speed, pinout, memory resources, and supported I/O standards, engineers should verify the exact ordering code against the AMD/Xilinx datasheet and board constraints before substitution. Typical uses include industrial control logic, low-latency communication interfaces, data acquisition, embedded signal processing, test equipment, and general-purpose embedded systems. The 100-pin package is particularly useful where a larger FPGA would be unnecessary and where external SDRAM or a high-pin-count BGA package would add unnecessary board complexity. Its integrated resources can reduce external logic-component count while retaining software-side reconfiguration flexibility. The primary design consideration is package-level resource and signal-integrity verification. The 100-TQFP footprint requires exact land-pattern, pin-orientation, and power-decoupling review before layout release. Engineers should also account for configuration memory, configuration interface, clocking, I/O voltage limits, unused pins, and startup behavior in the complete FPGA design rather than treating the FPGA only as a collection of logic blocks. This product page consolidates verified distributor specifications, package information, ordering-code details, sourcing links, and engineering guidance. It also distinguishes a genuine same-footprint replacement from a merely similar FPGA family member and records unknown technical values explicitly for engineers to confirm in the manufacturer datasheet.

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XC3S200-4VQG100C - 200K Spartan-3 FPGA | AMD Xilinx
XC3S200-4VQG100C

XC3S200-4VQG100C - 200K Spartan-3 FPGA | AMD Xilinx

AMD Xilinx XC3S200-4VQG100C is a Spartan-3 field-programmable gate array with 200,000 system gates, 4,320 logic cells, 63 I/Os, and a 1.2 V core operating from 0°C to 85°C. The device is packaged in a 100-pin VTQFP package and uses 90 nm FPGA technology. A field-programmable gate array, or FPGA, is a programmable semiconductor used to implement digital logic, control functions, signal processing, and interface logic. Within the semiconductor hierarchy, an FPGA is a configurable logic device that combines programmable logic blocks, programmable interconnect, and input/output resources. The Spartan-3 family was designed for cost-sensitive applications requiring substantial digital functionality without the complexity of a large processor system. The XC3S200-4VQG100C provides 4,320 logic cells, 221,184 gates, and 63 user I/Os. Its speed designation is -4, while the device is identified as a commercial-temperature grade part through the C suffix. The 100-pin VTQFP package provides a compact surface-mount option for boards requiring substantial logic density without moving to a larger fine-pitch or ball-grid-array package. The device is based on 90 nm FPGA technology and is specified at a 1.2 V core voltage. Within the Spartan-3 architecture, programmable logic blocks implement combinational and sequential functions, while programmable routing connects those functions and the available I/O resources. The 4,320-cell configuration supports designs involving parallel data processing, state machines, protocol bridging, control logic, and moderate-width data acquisition. Typical applications include industrial automation, communications equipment, consumer electronics, embedded control, video-processing subsystems, and general-purpose digital interface logic. The 63-I/O configuration is particularly relevant to designs that connect parallel buses, control peripherals, capture external signals, or bridge communication modules. A complete design still requires suitable configuration memory, decoupling, clocking, and I/O voltage planning. For PCB implementation, preserve the pin arrangement and exposed package geometry of the 100-pin VTQFP footprint, and follow the manufacturer pin-description table when assigning I/O standards. Confirm that every external interface uses a supported voltage, that configuration pins are terminated correctly, and that power-supply sequencing matches the device requirements before releasing the design for production. This product page combines the key Spartan-3 device characteristics, package information, replacement analysis, application guidance, and practical design notes. It is intended to accelerate component selection, PCB planning, firmware preparation, and lifecycle review for engineers working with the AMD Xilinx Spartan-3 FPGA family.

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XC3S200-5FT256C - 200K Gate 1.2V FPGA | AMD | 256-LBGA
XC3S200-5FT256C

XC3S200-5FT256C - 200K Gate 1.2V FPGA | AMD | 256-LBGA

The AMD XC3S200-5FT256C is a Spartan-3 field-programmable gate array with 200,000 system gates, 192 logic cells, and a 1.2 V supply in a 256-LBGA package. The -5 speed designation identifies the device performance grade, while the FT256C suffix identifies the lead-free commercial package variant. Its operating temperature range is 0°C to 85°C, making it suitable for cost-sensitive embedded systems that require programmable logic without the resources of a larger FPGA. A field-programmable gate array is a semiconductor whose digital logic and interconnect are configured after manufacture. An FPGA belongs to the broader programmable-logic hierarchy, which includes CPLDs, mask-programmed devices, and application-specific programmable logic. The Spartan-3 architecture combines configurable logic, memory resources, dedicated input/output structures, and programmable interconnect, allowing a designer to implement multiple control, interface, datapath, and signal-processing functions in one device. The XC3S200-5FT256C provides 50,000 system gates according to one distributor listing and 200,000 system gates according to Mouser and Partstack. The verified sources also report 192 logic cells, a 1.2 V FPGA supply, a 256-LBGA package, 256 terminals, and a square package shape. These source differences should be resolved against the applicable AMD Spartan-3 family data sheet before final design release. Because the device belongs to the Spartan-3 generation, engineers should treat it as a legacy programmable-logic platform and validate toolchain availability, configuration method, I/O standards, timing, and sourcing before beginning a new production design. The operating range of 0°C to 85°C distinguishes it from extended-temperature variants. Its 256-ball land-grid-array package also requires a PCB footprint and assembly process capable of handling fine-pitch balls, while configuration storage, clocking, decoupling, and I/O voltage planning remain central implementation concerns. Typical uses include industrial control and factory automation, embedded instrumentation, communications interfaces, display and video control, consumer products, and general-purpose digital signal processing. The Spartan-3 family was specifically positioned for high-volume, cost-sensitive consumer electronic applications, but individual designs still require complete timing, thermal, signal-integrity, and configuration verification. The principal design caution is that a replacement FPGA must match the package, ball assignment, supported I/O standards, voltage requirements, configuration interface, and timing constraints. A device with the same family name or logic density is not automatically pin-compatible. Migration decisions should therefore use AMD pinout data, device-generation constraints, and design-tool checks rather than relying only on distributor similarity labels. This page consolidates the verified distributor and manufacturer references for the XC3S200-5FT256C, distinguishes verified characteristics from parameters requiring confirmation, and provides migration, sourcing, and application guidance that is not present in a basic distributor listing.

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XC3S200-5VQ100C - 200K Gate Spartan-3 FPGA | AMD Xilinx
XC3S200-5VQ100C

XC3S200-5VQ100C - 200K Gate Spartan-3 FPGA | AMD Xilinx

The AMD Xilinx XC3S200-5VQ100C is a Spartan-3 field-programmable gate array with 200,000 system gates, 4,320 logic cells, 63 user I/O pins, and 221,184 RAM bits, supplied in a 100-pin TQFP package. It operates from a 1.2 V supply and is specified for a 0 to 85 °C operating temperature range. A field-programmable gate array is a programmable digital semiconductor that combines configurable logic, programmable interconnect, and memory resources in one device. In the broader semiconductor hierarchy, an FPGA belongs to programmable logic devices and provides a hardware alternative to implementing a fixed function in an application-specific integrated circuit. The Spartan-3 family was designed for cost-sensitive embedded, industrial, consumer, and communication systems. The XC3S200-5VQ100C provides 4,320 logic cells and 221,184 RAM bits for parallel datapaths, control logic, state machines, and interface conditioning. Its 63 user I/O pins provide connections to external memory, sensors, converters, communication transceivers, and display or control peripherals. The -5 speed designation identifies the device's performance grade, while the commercial C temperature designation corresponds to the stated 0 to 85 °C range. The device uses a 1.2 V core supply, making power-supply design important in compact embedded systems. Available details confirm 200,000 system gates, 4,320 logic cells, 63 I/O pins, 221,184 RAM bits, and a 100-TQFP package. Additional detailed information such as exact I/O standards, configuration interface characteristics, and recommended operating limits is not present in the supplied verified records and must be confirmed from the manufacturer datasheet before design release. Typical uses include industrial controllers, embedded control systems, video and image-processing front ends, communication equipment, and consumer electronics. In each case, the Spartan-3 architecture permits logic and memory functions to be updated in the field, reducing the need for a custom ASIC in moderate-volume designs. Designers should preserve the manufacturer's recommended power and decoupling arrangement, validate every I/O voltage and bank configuration, and account for configuration-pin requirements during power-up. Because the supplied records do not include a complete verified pin table, the package drawing is represented by the generic library key rather than an invented pinout. This page combines the verified distributor specifications, packaging information, source links, and drop-in alternatives. It also distinguishes directly comparable speed-grade parts from larger-package or functionally similar devices that cannot replace the target without PCB changes.

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XC3S2000-4FG900I - 2M-Gate Spartan-3 FPGA | AMD Xilinx
XC3S2000-4FG900I

XC3S2000-4FG900I - 2M-Gate Spartan-3 FPGA | AMD Xilinx

The AMD Xilinx XC3S2000-4FG900I is a Spartan-3 field-programmable gate array with 2,000,000 system gates, 46,080 logic cells, 565 I/O, and a 1.2 V supply in a 900-ball BGA package. The -4 speed designation places it in the device family’s -4 performance grade, while the I suffix identifies the industrial temperature option. A field-programmable gate array is a programmable digital semiconductor in which configurable logic blocks, programmable interconnect, and input/output resources implement digital systems. An FPGA belongs to the broader hierarchy of programmable logic devices, alongside CPLDs, and provides substantially greater logic capacity. The Spartan-3 architecture combines configurable logic, block RAM, dedicated DSP resources, programmable I/O, and on-chip support for clocking and configuration. The XC3S2000-4FG900I’s headline resources are 2,000,000 system gates, 46,080 logic cells, 565 I/O, and a 900-ball BGA package. Its 1.2 V core supply suits low-voltage digital systems where board-area efficiency and high I/O density are priorities. The large ball-grid array also supports dense connections between programmable resources and external circuitry without relying on a larger leaded package. Within the Spartan-3 family, the -4 speed grade provides a defined balance between logic performance and device organization. Exact maximum clock rates depend on the selected design, I/O standard, speed grade, timing constraints, and tool version. Because an FPGA’s usable performance is determined by the routed critical path rather than a single headline frequency, timing closure must be completed with the appropriate synthesis and implementation constraints. Typical uses include network-interface control, industrial automation, communications equipment, embedded video processing, instrumentation, and general-purpose digital signal-processing systems. A design requiring parallel interfaces, substantial logic density, moderate-to-high-speed serial links, and deterministic embedded control can benefit from combining programmable logic, block RAM, DSP, and dedicated I/O in one device. A 900-ball BGA requires careful PCB planning, including a multilayer board with controlled-impedance routing, via access beneath the device, adequate power and ground distribution, and assembly-process compatibility. Designers should also verify configuration logic, memory-interface topology, I/O standards, voltage tolerances, thermal performance, and pin constraints in the manufacturer datasheet before schematic capture and layout release. This product page consolidates the device’s principal architecture, package, and application information with engineering-focused comparison data and design guidance. It is intended to help engineers confirm fit, plan the PCB, and assess Spartan-3 alternatives without treating package similarity alone as proof of drop-in compatibility.

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XC3S200A-4FTG256I - 200K Gate Spartan-3A FPGA, 195 I/O | AMD/Xilinx
XC3S200A-4FTG256I

XC3S200A-4FTG256I - 200K Gate Spartan-3A FPGA, 195 I/O | AMD/Xilinx

The AMD/Xilinx XC3S200A-4FTG256I is a Spartan-3A family Field Programmable Gate Array (FPGA) with 200,000 system gates, 4,032 logic cells, and 195 user I/Os in a 256-ball FineLine Thin-profile BGA (FTG256) package at industrial temperature grade (I suffix). Built on 90nm CMOS technology with a 1.2V core, the device targets cost-sensitive, high-volume digital logic applications. An FPGA (Field Programmable Gate Array) is a class of programmable logic device that allows engineers to implement arbitrary digital circuits using a matrix of configurable logic blocks (CLBs), programmable interconnect, and dedicated hardware blocks such as block RAM and multipliers. Within the broader semiconductor taxonomy, FPGAs sit alongside ASICs and CPLDs as reconfigurable logic; the Spartan-3A family is Xilinx's low-cost, high-volume segment designed for consumer, industrial, and communications glue-logic applications. Key specifications of the XC3S200A-4FTG256I include 448 Configurable Logic Blocks (CLBs), 288 Kbits of block RAM, up to 667 MHz maximum operating frequency (speed grade -4), dedicated 18x18 hardware multipliers for DSP, and a Digital Clock Manager (DCM) block for clock synthesis. The FTG256 package measures 17x17 mm and uses a 1.0 mm ball pitch. Architecturally, the Spartan-3A integrates CLBs arranged in rows and columns, surrounded by IOBs (I/O blocks), with block RAM columns interleaved, four DCMs, and dedicated multiplier blocks. The device supports multiple I/O standards including LVTTL, LVCMOS, LVDS, and differential HSTL/SSTL for direct interface to external memories and high-speed peripherals. Typical applications include industrial control and machine vision, consumer electronics display controllers, communications protocol bridges, low-cost video processing, motor control, and educational/hobbyist development boards. The wide operating temperature range (-40C to +100C industrial grade) also suits factory automation and outdoor equipment. Designers should pay attention to the FTG256 ball-pinout for PCB layout: a 256-ball BGA with 1.0 mm pitch requires 4-6 layer PCB design with microvia or via-in-pad technology for reliable assembly. Use Xilinx ISE WebPACK or the modern AMD Vivado/Vivado Lab Edition for configuration bitstream generation. Power estimation should be performed with the Xilinx Power Estimator (XPE) tool before finalizing thermal management. This page consolidates current distributor pricing, verified pin-compatible drop-in alternatives in the Spartan-3A family, and practical design notes - practical context not found in the bare manufacturer datasheet.

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XC3S400-4FG320C - 400K-Gate Spartan-3 FPGA | AMD Xilinx
XC3S400-4FG320C

XC3S400-4FG320C - 400K-Gate Spartan-3 FPGA | AMD Xilinx

AMD Xilinx XC3S400-4FG320C is a Spartan-3 field-programmable gate array with 400,000 system gates, 221 I/O, and a 1.2 V operating voltage, packaged in a 320-ball fine-pitch BGA. The -4 suffix identifies its device speed grade, while the commercial C suffix denotes the grade category indicated in the manufacturer part number. It is designed for cost-sensitive embedded systems requiring configurable logic, parallel processing, and flexible interface support. A field-programmable gate array, or FPGA, is a semiconductor whose digital logic can be configured after manufacture. An FPGA sits above fixed-function logic in the hardware hierarchy: it combines programmable logic blocks, block RAM, programmable I/O, and dedicated configuration resources on one device. Unlike a microcontroller that executes firmware from nonvolatile memory, an FPGA implements digital circuits directly in its fabric, allowing parallel operation, deterministic latency, and custom hardware interfaces. The Spartan-3 XC3S400 provides 400,000 system gates, 221 user I/O, 294,912 flip-flops, and 8,064 configurable logic blocks. Its 1.2 V core voltage supports low-voltage, power-conscious digital designs. The device is particularly useful where several parallel datapaths must operate simultaneously or where interface timing must be controlled precisely by dedicated hardware rather than shared processor instructions. The XC3S400 architecture provides combinational and sequential logic resources, distributed and block memory, and programmable input/output structures. Distributed RAM supports small data buffers and lookup tables, while block RAM provides larger on-chip storage without external memory access. Dedicated clock-management and configuration resources allow the FPGA to implement counters, state machines, packet filters, arithmetic pipelines, bus bridges, and embedded control functions in parallel. Typical applications include industrial control and data acquisition, communications infrastructure, embedded vision, signal processing, and cost-sensitive consumer equipment. Its 221 I/O make it suitable for parallel sensors, converters, memory interfaces, displays, and communications transceivers. Designers can also partition the fabric into independent processing engines, allowing acquisition, filtering, and protocol handling to proceed concurrently. For a new design, verify device speed requirements, pin-bank voltage limits, configuration memory interface, clock topology, and termination requirements before committing the PCB. A migration to another Spartan-3 speed grade can preserve the package and pinout, but timing constraints and power behavior should be revalidated with the appropriate timing constraints. This page combines the confirmed device specifications, package characteristics, traceable source links, drop-in family alternatives, and practical engineering guidance to support component selection, schematic review, and legacy design maintenance.

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XC3S400-4FG320I - 400K Gate Spartan-3 FPGA | Xilinx
XC3S400-4FG320I

XC3S400-4FG320I - 400K Gate Spartan-3 FPGA | Xilinx

The Xilinx XC3S400-4FG320I is a Spartan-3 field-programmable gate array with 400,000 system gates, 8,064 logic cells, 294,912 RAM bits, and 221 user I/Os, packaged in a 19 mm × 19 mm 320-pin fine-pitch ball grid array. It operates from a 1.2 V core supply and is identified by the -4 performance grade and I industrial temperature designation. A field-programmable gate array, or FPGA, is a reconfigurable semiconductor in which digital logic and interconnects are programmed after manufacture. An FPGA belongs to the programmable-logic hierarchy, which combines parallel gate-level logic, block RAM, programmable I/O, and embedded processing resources. This combination allows one physical device to implement control logic, protocol interfaces, data acquisition, signal processing, or complete embedded systems without changing the printed circuit board. The XC3S400 provides 221 user I/Os for external buses, counters, serial links, memory interfaces, and mixed-signal control functions. Its 294,912 bits of block RAM support buffering, packet storage, lookup tables, and data-pipeline stages, while the -4 speed grade identifies its position within the Spartan-3 performance range. The industrial I suffix distinguishes it from commercial-temperature C variants. The 320-ball FBGA offers dense board connectivity but requires careful escape-routing, thermal analysis, and assembly control. Spartan-3 devices combine dedicated arithmetic and logic resources with programmable interconnect and a large selection of I/O standards. The 8,064 logic cells allow concurrent datapath and control operations, while block RAM avoids extensive use of logic for storage-heavy functions. Because the I/O count is fixed at 221 for the XC3S400, system planning must reserve enough pins for clocks, configuration access, power, ground, and high-speed interfaces. Typical uses include industrial automation, programmable logic controllers, sensor acquisition, motor-control interfaces, embedded communications, test equipment, and cost-sensitive control systems. The FPGA is especially useful where parallel logic, deterministic timing, configurable I/O, and field-updateable firmware must coexist in a compact package. Its 1.2 V core supply also allows modern low-voltage designs to consolidate multiple logic functions. PCB implementation should use the manufacturer's pinout and recommended layout guidance rather than a generic BGA fanout. Decoupling must be placed directly at the supply and ground balls, unused configuration pins must be handled exactly as specified, and every power ball must connect to the appropriate plane or via array. The high pin count also makes inspection, solderability, and thermal cycling important production considerations. This page combines the device's principal architecture and package data with same-family migration options, application guidance, and design checks. It focuses on the decisions that materially affect a Spartan-3 design: logic capacity, RAM, I/O availability, speed grade, temperature grade, package migration, configuration stability, and PCB implementation.

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XC3S400-4FG456C - 400K Spartan-3 FPGA | AMD Xilinx
XC3S400-4FG456C

XC3S400-4FG456C - 400K Spartan-3 FPGA | AMD Xilinx

AMD Xilinx XC3S400-4FG456C is a Spartan-3 field-programmable gate array with 400,000 system gates, 294,912 logic cells, 8,064 dedicated block RAM bits, 264 I/O sites, and a 456-BBGA package. It operates from a 1.2 V core supply and targets logic-intensive embedded systems requiring programmable combinational and sequential logic, dedicated memory, and a large general-purpose I/O complement. A field-programmable gate array, or FPGA, is a semiconductor whose digital logic is configured after manufacture. The XC3S400 belongs to the Spartan-3 FPGA hierarchy, which combines configurable logic, block RAM, programmable I/O, and dedicated arithmetic resources on one device. This position between fixed-function ASICs and microcontrollers makes it suitable when a design needs hardware-level parallelism, flexible interfaces, or product-specific logic that would be expensive to implement in silicon. The -4 designator identifies a Spartan-3 performance grade, while FG456 identifies the 456-ball fine-pitch BGA package and C identifies the commercial temperature designation. The 456-BBGA footprint supports a high pin count and dense board routing, making the device appropriate for industrial control, communications, instrumentation, embedded processing, and legacy platform designs that already use the Spartan-3 package. Its large I/O count can reduce the need for external interface logic when connecting the FPGA to buses, converters, memories, and control signals. The device includes 294,912 logic cells and 8,064 bits of dedicated block RAM. These resources allow parallel datapaths, state machines, protocol handling, data acquisition, and control functions to be implemented concurrently rather than executed sequentially by a general-purpose processor. Programming is performed through the Xilinx configuration flow, while the final configuration determines which interconnect and logic resources are active. Designers should preserve the exact 456-BBGA land pattern, power architecture, decoupling strategy, configuration interface, and I/O constraints when replacing another programmable device. Because this package contains many fine-pitch balls, assembly and inspection require qualified PCB manufacturing processes and appropriate BGA assembly capability. Any modernization should begin with a pin, configuration, I/O-standard, and timing comparison rather than assuming that a newer FPGA is automatically interchangeable. This product page combines the device identity, verified ordering information, package details, same-family replacement candidates, and practical implementation guidance. It supports faster sourcing decisions while keeping the distinction clear between exact package-compatible options and newer devices that require redesign. The Request a Quote form on this page is the appropriate route for current commercial terms, lead time, and availability. Engineers should also consult the Spartan-3 DS099 family data sheet and the exact device ordering information before releasing a new PCB layout.

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XC3S400-4FG456I - 400K Gate Industrial Spartan-3 FPGA | AMD
XC3S400-4FG456I

XC3S400-4FG456I - 400K Gate Industrial Spartan-3 FPGA | AMD

AMD XC3S400-4FG456I is an industrial-grade Spartan-3 field-programmable gate array with 400,000 system gates, 8,064 logic cells, and 264 user I/Os, packaged in a 456-ball FBGA. It uses 90 nm fabrication technology, supports a 1.14 V to 1.26 V core supply, and is specified for an industrial junction-temperature range of -40°C to +100°C. The -4 speed designation identifies its performance grade, while the I suffix identifies the industrial temperature option. A field-programmable gate array, or FPGA, is a reconfigurable digital semiconductor that combines programmable logic, flip-flops, memory blocks, and programmable I/O in one device. An FPGA belongs to the broader semiconductor and programmable-logic hierarchy. Unlike a fixed-function application-specific integrated circuit, an FPGA can be reprogrammed during development to implement control logic, interfaces, signal processing, and system functions without changing the printed circuit board. The Spartan-3 architecture provides substantial parallelism for cost-sensitive embedded systems. The XC3S400-4FG456I provides 400,000 system gates and 8,064 logic cells, allowing multiple datapaths, state machines, protocol engines, and control blocks to operate concurrently. Its 264 user I/Os support connections to external memory, converters, transceivers, and display or industrial peripherals. The 456-ball FBGA also provides a high pin count for designs requiring substantial parallel connectivity. Operating from a 1.14 V to 1.26 V core supply, the device is designed for low-voltage digital logic implementations. The 90 nm process generation balances programmable capacity with moderate system cost. This architecture is useful where fixed logic would be inflexible, where product variants require field updates, or where parallel hardware processing provides lower latency than a microcontroller-based software implementation. Typical applications include industrial control, telecommunications interface equipment, embedded video processing, instrumentation, data acquisition, and communication infrastructure. The 264 I/O count is particularly useful for parallel sensor acquisition and external bus interfaces, while the programmable logic can implement filters, protocol conversion, clocking, and real-time control functions. Existing Spartan-3 intellectual property can also support designs requiring established hardware interfaces. PCB design must address the fine-pitch BGA routing and power requirements carefully. Follow the Spartan-3 pinout, ball map, recommended decoupling, and PCB-layout guidance in the manufacturer datasheet. Confirm configuration pin states, clocking topology, bank supply requirements, and I/O standards before fabrication because these constraints determine whether a new board can be assembled and operated reliably. This page combines the manufacturer-family documentation with package, logic-capacity, I/O, temperature, application, and migration guidance. It also distinguishes verified same-package alternatives from broader FPGA upgrade paths that require board redesign, helping engineers assess replacement options without overlooking configuration, timing, and pin-compatibility constraints.

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XC3S400-4FT256C - 400K Gate Spartan-3 FPGA | AMD
XC3S400-4FT256C

XC3S400-4FT256C - 400K Gate Spartan-3 FPGA | AMD

AMD XC3S400-4FT256C is a Spartan-3 field-programmable gate array with 400,000 system gates, 8,064 configurable logic cells, 173 I/O, and a 1.2 V core supply, housed in a 256-LBGA package. The -4 suffix identifies the performance grade, while FT256 identifies the 256-ball surface-mount package offered in the verified distributor records. A field-programmable gate array, or FPGA, is a semiconductor whose digital logic is configured after manufacture. An FPGA belongs to the programmable-logic hierarchy, combining configurable logic blocks, programmable I/O, embedded memory, dedicated hard multipliers, and clock-management resources. This makes the Spartan-3 family useful when engineers need hardware-level parallelism, rapid design changes, or compact implementation of complex digital systems without committing to a custom application-specific integrated circuit. The verified listing identifies 400,000 system gates and 8,064 logic cells for the XC3S400 device. It provides 173 I/O in a 256-LBGA package and uses a 1.2 V core voltage. Related Spartan-3 data identifies 90 nm fabrication technology and a 630 MHz figure for the XC3S400-4FTG256C comparison variant; those values should not be transferred to XC3S400-4FT256C without confirmation from its own manufacturer datasheet. The device is suitable for parallel data processing, custom interface control, embedded signal processing, communications infrastructure, test equipment, and industrial control systems. Its 173 I/O permit substantial board-level connectivity, while the 8,064-cell logic resource supports parallel datapaths and state machines. The FT256 package can also simplify component density compared with larger leaded packages, but it requires careful PCB layout, thermal analysis, and BGA assembly capability. The commercial -4 grade is intended for cost-optimized designs rather than the extreme operating range implied by an industrial temperature suffix. Before releasing a design, engineers should verify the exact I/O standards, supported memory interfaces, configuration requirements, power-up behavior, and package pinout against the manufacturer documentation for XC3S400-4FT256C. A critical design consideration is that the FT256 package requires exact land-pattern, solder-mask, paste, via, and assembly-process control. Power rails and decoupling should be implemented according to the manufacturer's guidance, while configuration and programming interfaces should be checked for signal-integrity and termination requirements before layout signoff. This page consolidates verified distributor pricing, same-footprint Spartan-3 alternatives, application guidance, and design cautions that are not presented together on a manufacturer product page. It also distinguishes confirmed target-device facts from parameters that remain unavailable in the supplied source data.

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XC3S400-4FT256I - 400K Gates Spartan-3 FPGA | Xilinx
XC3S400-4FT256I

XC3S400-4FT256I - 400K Gates Spartan-3 FPGA | Xilinx

The Xilinx XC3S400-4FT256I is a Spartan-3 field-programmable gate array providing 400,000 system gates, 8,064 logic cells, and 173 user I/Os in a 256-ball FTBGA package. The device operates from a 1.14 V to 1.26 V core supply, uses 90 nm process technology, and is specified for industrial-temperature operation from 0 °C to 85 °C. Its -4 speed grade supports operation up to 630 MHz according to the compared manufacturer-family specification in the provided web data. A field-programmable gate array is a semiconductor device whose digital logic, interconnect, and I/O behavior are configured after fabrication. The Spartan-3 family belongs to the FPGA and programmable-logic hierarchy, providing configurable logic resources rather than a fixed instruction set. The XC3S400-4FT256I is intended for designs requiring substantial parallel logic, control, communications, or signal-processing functions while using a single highly integrated package. The main device characteristics include 400,000 system gates, 8,064 logic cells, 173 user I/Os, a 256-ball FTBGA package, and a 1.2 V nominal core supply. The listed family comparison identifies 90 nm technology and a 630 MHz performance figure for the XC3S400-4FT256I. Its industrial temperature range and lead-free package information make it relevant to industrial control, communications equipment, and embedded systems, although current availability and lifecycle status should be confirmed before new production commitments. The FTBGA package provides a dense connection arrangement for high-density programmable-logic designs. The 173 user I/Os can be assigned to digital interfaces, control signals, communications links, or mixed external circuitry, while the FPGA fabric allows parallel functions to be implemented with deterministic hardware timing. Unlike a microcontroller with a fixed peripheral architecture, the XC3S400-4FT256I allows system functions and interfaces to be defined during configuration, making it suitable for custom protocols, accelerators, and legacy system control logic. Typical applications include industrial automation controllers, communications equipment, embedded control systems, test and measurement platforms, and signal-processing modules. In these systems, the FPGA can implement parallel interfaces, protocol conversion, timing and sequencing functions, and custom hardware processing. The 400,000-system-gate density is substantially larger than small CPLDs, supporting multi-module designs while keeping the implementation in one programmable device. The primary design consideration is package-level integration. A 256-ball FTBGA requires careful PCB layout, via and escape-routing planning, thermal management, and assembly-process control. The core supply and I/O supply requirements, configuration interface, clocking, decoupling, and termination must follow the Spartan-3 device documentation. Because the XC3S400-4FT256I is associated with a discontinued-product notice in the provided AMD support result, engineers should preserve the exact MPN in legacy designs and evaluate any replacement against pinout, voltage, timing, and configuration compatibility. This product record combines verified distributor and manufacturer-search information with practical design guidance for industrial FPGA implementations. It highlights the density, logic-cell count, I/O count, package, voltage, temperature range, and source links while clearly separating confirmed data from specifications that require confirmation from the manufacturer datasheet.

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XC3S400-4FTG256C - 400K Gate Spartan-3 FPGA | AMD | 256-LBGA
XC3S400-4FTG256C

XC3S400-4FTG256C - 400K Gate Spartan-3 FPGA | AMD | 256-LBGA

The AMD XC3S400-4FTG256C is a Spartan-3 field-programmable gate array FPGA with 400,000 system gates, 8,064 logic cells, and a 256-LBGA package. It operates from a 1.2 V core supply and is specified for a 0 to 85 °C commercial operating-temperature range. The device combines programmable logic, block RAM, dedicated input/output resources, and configurable interconnect resources in a single integrated circuit. A field-programmable gate array is a digital semiconductor whose logic functions are established after fabrication by loading a configuration bitstream. FPGAs sit within the broader programmable-logic hierarchy, alongside CPLDs, and are used when parallel hardware processing, high logic density, configurable interfaces, or design revision flexibility are more important than the simplicity of a fixed-function ASIC. The Spartan-3 architecture is intended for embedded systems requiring moderate logic capacity without the cost and complexity of the largest FPGA families. The XC3S400-4FTG256C provides 8,064 logic cells and 294,912 system gates according to the manufacturer-related product listing. Its 256-LBGA package supports dense board integration, while the 1.2 V supply specification identifies it as a 1.2 V FPGA. The exact device speed grade is encoded by the -4 designation, and the FTG256 package, commercial temperature option, and RoHS-oriented lead-free construction are reflected in the ordering code. Typical uses include industrial control, communications infrastructure, instrumentation, video processing, embedded systems, and digital signal-processing front ends. The programmable architecture allows parallel datapaths, custom interface logic, protocol handling, and control functions to be consolidated into one device. Designers should verify pin-level power, configuration, clock, and differential-I/O requirements against the Spartan-3 family documentation before laying out the PCB. The most important design tradeoff is package migration. A part with the same logic-cell count but a different package cannot be assumed to be a drop-in replacement. When replacing the XC3S400-4FTG256C, confirm the exact FTG256 footprint, ball assignment, speed grade, temperature range, supply architecture, configuration interface, and high-speed I/O requirements. For new designs, the I/O count and selected package should be checked against the intended board outline and escape-routing strategy. This page combines the key ordering information for the XC3S400-4FTG256C with package-aware replacement guidance, comparison parameters, and practical design considerations. It is intended to help engineers identify whether a candidate is electrically and mechanically suitable before committing to a PCB or production BOM.

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