EP20K600CF672C8N
EP20K600CF672C8N - 600K-Gate FPGA, 508 I/O | Intel | APEX 20K
Intel EP20K600CF672C8N is a high-density programmable logic device containing 24,320 logic elements or cells, 2,432 macros, and 508 user I/O in a 672-pin FC-FBGA package. The verified sources identify a 600K-gate APEX 20KC-family FPGA, 1.8 V supply operation, a 0.15 µm fabrication process, and a 301.21 MHz listed frequency. Its square package measures 45 x 45 mm and uses a 1.27 mm ball pitch. An operating range of 0°C to 85°C makes the part appropriate for commercial-temperature equipment.
An FPGA, or field-programmable gate array, is an integrated circuit whose logic and interconnect resources are configured after manufacturing. FPGA technology sits within the broader programmable-logic hierarchy, alongside complex programmable logic devices, simple programmable logic devices, and fixed-function application-specific integrated circuits. The APEX 20K architecture combines programmable logic, embedded system capability, and configurable I/O, allowing engineers to implement parallel processing, interface adaptation, and digital control without fabricating a custom silicon device.
Key specifications include 24,320 logic cells, 2,432 macros, 508 I/O, 672 package terminals, and 600K nominal gate capacity. The 1.8 V core supply supports lower-voltage integration, while 508 user I/O provide extensive connectivity for memory buses, processors, peripheral interfaces, and custom backplanes. The 45 x 45 mm FC-FBGA package supports a large pin count but demands controlled assembly, power integrity, signal-integrity, and thermal design.
The device is manufactured using a 0.15 µm all-layer copper-metal fabrication process and belongs to the APEX 20KC family. Its 301.21 MHz listed frequency supports clocked digital designs, but achievable system frequency depends on routing, logic utilization, I/O timing, configuration, power distribution, and PCB implementation. A 672-ball interface also makes signal escape and simultaneous switching noise important board-level constraints.
Typical applications include communications infrastructure, industrial automation, test and measurement, image or video processing, and legacy computing-platform replacement. The density and 508-I/O count are useful where multiple interface blocks, datapaths, and control functions must coexist. Engineers may also use the FPGA as a protocol bridge, hardware accelerator, or reconfigurable controller. For long-life systems, sourcing risk and configuration compatibility should be evaluated before production release.
Power planning must account for the 1.8 V supply, clocking rate, I/O activity, logic occupancy, and the thermal path through the FC-FBGA package. Use the manufacturer design guidelines for power estimation, decoupling, ball escape, and signal integrity. Engineering samples should complete timing, configuration, thermal, and board-level validation before substitution or redesign.
This page consolidates the verified package, density, supply, I/O, temperature, and alternative data, and clearly separates exact-source facts from parameters that still require datasheet or platform-level confirmation.
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