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EP2S15F672I4N - 15.6K LEs Stratix II FPGA, 366 I/O, 672-FBGA
EP2S15F672I4N

EP2S15F672I4N - 15.6K LEs Stratix II FPGA, 366 I/O, 672-FBGA

The Intel (formerly Altera) EP2S15F672I4N is a member of the Stratix II family of FPGAs, built on a 90 nm process and offering 15,600 logic elements in a 672-ball FineLine BGA package with 366 user I/O. The 'I' suffix denotes the industrial temperature grade (-40C to +100C TJ) and the '4' speed grade targets the mid-performance tier, with internal logic operating up to approximately 711 MHz per FPGakey. The 'N' indicates lead-free, RoHS-compliant assembly, suitable for modern reflow profiles. An FPGA (Field-Programmable Gate Array) is a programmable logic device containing configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as block RAM, DSP blocks, and high-speed transceivers. FPGAs sit at the apex of programmable logic, below ASICs (which require masks) and above CPLDs (which are smaller, non-volatile, and lower-density). The Stratix II family uses an adaptive logic module (ALM) architecture that delivers higher logic efficiency than the preceding Stratix/LUT-4 generations, while the dedicated DSP blocks, TriMatrix memory, and high-speed I/O make these devices common in signal processing, communications, and embedded compute. Key parametric features of the EP2S15 include 15,600 LEs, 15600 logic cells, 419,328 bits of embedded memory, 156 DSP blocks, and 12 PLLs supporting multi-rate clock generation. I/O count is 366 across the 672-ball FCBGA (also referenced as 672-FBGA, 27x27 mm). The device supports a wide variety of I/O standards including LVDS, LVTTL, LVCMOS, SSTL, HSTL, and PCI/PCI-X through per-bank reference voltages. Configuration is typically via JTAG or an external configuration device. Typical applications include industrial control, telecom line cards, video and image processing, software-defined radio, test and measurement, and embedded DSP. The EP2S15 is also frequently deployed in legacy designs that began life on Stratix II and must remain in production for long life-cycle programs. The industrial temperature grade makes it well suited to factory floor, outdoor telecom, and rail/military-adjacent embedded systems. When designing with the EP2S15, plan power sequencing carefully - Stratix II requires ramped VCCINT and VCCIO supplies, and decoupling must follow the reference design with multiple low-ESR ceramic capacitors around the perimeter. PCB layout must preserve impedance-controlled pairs for LVDS and external memory interfaces.

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EP2S180F1020C3 - Stratix II 180K LEs FPGA, 1020-BGA | Intel
EP2S180F1020C3

EP2S180F1020C3 - Stratix II 180K LEs FPGA, 1020-BGA | Intel

The Intel (formerly Altera) EP2S180F1020C3 is a high-density Stratix II Field Programmable Gate Array (FPGA) IC built on a 1.2 V, 90 nm, all-layer copper SRAM process, delivering approximately 179,400 equivalent logic elements (LEs), 9,383,040 RAM bits, and 742 user I/Os in a 1020-ball flip-chip BGA package. It belongs to the EP2S180 device class, the largest density member of the Stratix II family, and is positioned for performance-critical digital signal processing, communications infrastructure, and high-throughput parallel processing designs. An FPGA (Field Programmable Gate Array) is a reconfigurable integrated circuit containing an array of programmable logic blocks, interconnect, and dedicated silicon resources such as block RAM, DSP blocks, and high-speed transceivers. Unlike fixed-function ASICs, FPGAs can be re-programmed in the field via a hardware description language (HDL) such as VHDL or Verilog, making them ideal for prototyping, low-volume production, and designs that require late-stage or in-system logic changes. The Stratix II family sits within Intel's broader programmable logic hierarchy: FPGA -> Programmable Logic -> Logic Device -> Semiconductor, and is widely used in telecom, defense, and high-performance computing applications. Key features of the EP2S180F1020C3 include approximately 8,970 LABs (Logic Array Blocks), 9 Mbit of embedded TriMatrix memory, dedicated DSP blocks for high-speed multiplication, and up to 742 user I/Os. The device supports multiple high-speed I/O standards including LVDS, LVPECL, SSTL, and HSTL, enabling interface to DDR/DDR2 memory, LVDS links, and backplane transceivers. The C3 speed grade and commercial temperature rating make it suitable for cost-optimized, lab-grade, and indoor equipment designs rather than automotive or extended-industrial environments. The architecture uses Adaptive Logic Modules (ALMs) - each ALM contains a combination look-up table (LUT), two programmable registers, and dedicated adder circuitry, providing approximately 180,000 equivalent LEs while consuming roughly 40% less area and power than the original Stratix architecture. The device integrates dedicated DSP blocks capable of operating at hundreds of MHz and supports high-speed external memory interfaces including DDR2 SDRAM, QDRII SRAM, and RLDRAM II. The 1020-pin BGA package exposes extensive parallel I/O for memory, chip-to-chip interconnect, and parallel sensor or data acquisition buses. Typical applications include high-performance DSP (radar, software-defined radio, baseband processing), telecommunications line cards and switches, ASIC prototyping and emulation, high-speed data acquisition systems, and parallel compute accelerators. When designing with this device, designers should use the Quartus II (now Quartus Prime) development toolchain for synthesis, place-and-route, and timing closure. Designers should also evaluate thermal dissipation carefully: at full utilization the EP2S180 can dissipate tens of watts, and the flip-chip BGA requires a properly designed PCB stack-up with adequate thermal vias and copper area to keep junction temperature within specification. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design considerations not found in the manufacturer datasheet. Where parameters were not directly listed in the source search results, [DATA_NEEDED] markers are used to avoid fabrication; engineers should consult the official Stratix II datasheet and the device handbook for definitive electrical characteristics.

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EP2S180F1020C3N - Stratix II FPGA, 179400 LEs, 1020-FBGA | Intel
EP2S180F1020C3N

EP2S180F1020C3N - Stratix II FPGA, 179400 LEs, 1020-FBGA | Intel

The Intel (formerly Altera) EP2S180F1020C3N is a high-density Stratix II Field Programmable Gate Array (FPGA) delivering 179,400 equivalent logic elements, 9383040 bits of embedded RAM, and 742 user I/Os, all integrated in a 1020-ball FineLine BGA (FBGA) package measuring 33 x 33 mm. It belongs to the EP2S180 speed grade -3 (slower) tier with a commercial 0 C to +85 C junction temperature range, and is supplied by a 1.15 V to 1.25 V core voltage. An FPGA (Field-Programmable Gate Array) is a programmable logic device whose architecture is built from a matrix of configurable logic blocks (LABs/CLBs), embedded memory blocks, DSP blocks, phase-locked loops, and high-speed transceivers, all connected through a programmable routing fabric. FPGAs sit within the broader taxonomy of programmable logic devices (PLD) -> complex programmable logic devices (CPLD) -> FPGAs -> high-performance FPGAs. They differ from ASICs by being re-programmable in the field, and from microcontrollers by implementing logic in hardware, achieving deterministic, parallel throughput at clock rates of hundreds of MHz. The Stratix II family was introduced in 2004 as the first FPGA family to use an adaptive logic module (ALM) architecture instead of the older 4-input LUT. Key features of the EP2S180F1020C3N include 8,970 LABs (logic array blocks), 9383040 bits of total RAM (approximately 1.1 MB), 96 DSP blocks for hardware-accelerated arithmetic, up to 12 PLLs (phase-locked loops) for clock management, and support for external memory interfaces including DDR, DDR2, QDR, and RLDRAM. The device also supports source-synchronous interfaces up to 1 Gbps via LVDS, and 4 phase-shift clock networks for fine-grained timing control. The high logic density makes it suitable for prototyping ASIC designs and large DSP pipelines. Typical applications for the EP2S180F1020C3N include high-performance digital signal processing (DSP), telecom baseband processing, ASIC prototyping, image and video processing pipelines, high-speed networking equipment, and military/aerospace signal processing. The 742 user I/Os and high RAM-to-logic ratio also make it attractive for memory-intensive test and measurement equipment where parallel data acquisition must be buffered in real time. When designing with this device, careful attention must be paid to power integrity because the 1020-ball FBGA package and high logic utilization can draw significant current. Designers should follow Altera's Stratix II PowerPlay Early Power Estimator (EPE) guidelines for thermal management. Pin assignment and PCB layout should also follow the Stratix II pin connection guidelines for unused I/Os and clock resources. This page synthesizes current distributor pricing, Stratix II drop-in alternatives, and engineering design notes not consolidated in the manufacturer datasheet.

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EP2S180F1020C3TT - Stratix II 180K LEs FPGA, 742 I/O, 1020-BBGA | Intel
EP2S180F1020C3TT

EP2S180F1020C3TT - Stratix II 180K LEs FPGA, 742 I/O, 1020-BBGA | Intel

The Intel (formerly Altera) EP2S180F1020C3TT is a high-density Stratix II family Field Programmable Gate Array (FPGA) housed in a 1020-ball FineLine BGA package. The device integrates 179,400 equivalent logic elements (LEs), 9,383,040 total memory bits, and 742 user I/O pins, making it one of the largest members of the Stratix II generation. It is a logic-intensive platform targeting high-bandwidth signal processing, telecom, and ASIC-prototyping designs. A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory blocks, DSP blocks, and programmable interconnect, all wired by SRAM-based configuration memory. FPGAs sit at the same level of the digital-IC hierarchy as ASICs but trade raw unit cost for design-time flexibility, in-system reprogrammability, and faster time-to-market. Stratix II extends this concept with a unique adaptive logic module (ALM) architecture that improves logic packing density versus prior Stratix generations. Key features of the EP2S180F1020C3TT include 742 user I/O supporting a wide range of single-ended and differential I/O standards, dedicated on-chip memory, and DSP blocks for high-throughput arithmetic. The device supports up to 12 embedded transceivers in the Stratix II family (per-family maximum; this specific variant configuration applies to the device's transceiver count) and rich clock management with multiple PLLs. It is built on a 90 nm process and is offered in industrial temperature grades, which is essential for communications infrastructure and test equipment. Architecturally, the Stratix II ALM combines an 8-input fracturable look-up table with dedicated adders, registers, and carry chains. This adaptive logic module allows a single ALM to implement either a 7-input function plus a 4-input function or a 6-input LUT feeding two independent arithmetic paths. The result is higher effective logic utilization when designs contain wide muxes and arithmetic datapaths typical of DSP pipelines. Typical applications include high-end ASIC prototyping, software-defined radio (SDR) baseband processing, telecom line-card packet processing, high-resolution video broadcast equipment, and high-performance industrial imaging. Designers pair the device with external DDR/DDR2/QDR SRAM memory controllers and high-speed serializer/deserializer links for full system integration. When designing with this device, ensure adequate power-supply decoupling close to each BGA quadrant, follow Altera/Intel Stratix II PCB layout guidelines for high-speed differential pairs, and use the Quartus II design toolchain for synthesis, place-and-route, and timing closure. Because the part is in the Stratix II family, designers should also consider newer Stratix III/IV/Cyclone families for new designs but treat the EP2S180 as a long-life-cycle legacy platform. This page synthesizes distributor stock, package-level pinout, drop-in same-family alternatives, and practical Stratix II design notes not found in the standalone manufacturer datasheet, giving engineers a one-stop view for sourcing, replacement, and PCB-layout decisions.

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EP2S180F1020C4 - Stratix II FPGA, 179K LE, 1020-BGA | Intel
EP2S180F1020C4

EP2S180F1020C4 - Stratix II FPGA, 179K LE, 1020-BGA | Intel

The Intel (Altera) EP2S180F1020C4 is a high-density Stratix II Field-Programmable Gate Array (FPGA) from the second-generation Stratix family, fabricated on a 90nm process with 1.2V core supply. It integrates 179,400 equivalent logic elements (LEs), 9,383,040 bits of on-chip RAM (approximately 1.16 Mbyte), 768 18x18-bit hardware multipliers, and 12 transceiver-like PLLs across 8970 LABs, packaged in a 1020-ball FineLine BGA (FBGA) measuring 33x33mm. The device is built around the adaptive logic module (ALM) architecture that replaced classic 4-input LUTs, delivering finer-grained logic packing and improved DSP utilization. An FPGA (Field-Programmable Gate Array) is a semiconductor device containing programmable logic blocks, interconnect, and I/O that can be configured after manufacturing to implement arbitrary digital functions. Within the broader taxonomy, FPGAs sit alongside CPLDs as the two main families of programmable logic devices (PLDs), above fixed-function ASICs in flexibility but below microcontrollers in software-defined control. Modern high-end FPGAs like the Stratix II family integrate hard IP blocks such as transceivers, memory controllers, and DSP multipliers, bridging the gap between traditional FPGA and structured ASIC platforms. This positions the EP2S180F1020C4 as a true system-on-chip (SoC) programmable platform rather than a simple glue-logic device. Key specifications include 742 user I/O pins, support for multiple I/O standards (LVDS, LVTTL, LVCMOS, SSTL, HSTL, PCI, PCI-X), and dedicated DDR/DDR2 memory interface support up to 300 MHz through the Stratix II PHY. The 1020-BGA package provides 12.5 Gbps aggregate I/O bandwidth suitable for high-speed parallel interfaces, while 768 18x18 multipliers enable real-time DSP workloads such as video processing, software-defined radio, and baseband modulation. Typical applications span high-end communications infrastructure (10 Gbps line cards, base station baseband), ASIC prototyping and emulation, high-performance DSP pipelines (radar, video codec, medical imaging), and industrial test & measurement backplanes. The 90nm Stratix II architecture was a landmark design win for Altera in the 2004-2008 era and remains in long-lifecycle defense, aerospace, and industrial systems. When designing with this device, observe the Stratix II power-on reset and configuration sequence carefully; an incorrect MSEL or nCONFIG state can prevent successful joint Test Action Group (JTAG) or Passive Serial (PS) configuration. Thermal management is critical because the 33x33mm BGA package dissipates 15-25W under full DSP utilization. Use the Quartus II design software (version 9.1 or earlier for full Stratix II support) and verify pin assignments against the 1020-ball BGA pinout file. This page synthesizes distributor pricing, drop-in same-package alternatives (EP2S180F1020C4N, EP2S180F1020C3, EP2S130F1020C4), and design notes that go beyond what is presented on the Alldatasheet or Octopart listings.

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EP2S180F1020C4N - 180K LE Stratix II FPGA | 1020-FBGA | Intel / Altera
EP2S180F1020C4N

EP2S180F1020C4N - 180K LE Stratix II FPGA | 1020-FBGA | Intel / Altera

The Intel (formerly Altera) EP2S180F1020C4N is a high-density Stratix II family Field Programmable Gate Array (FPGA) delivering 179,400 logic elements, 8,970 LABs, and 9,383,040 bits of embedded RAM in a 1020-ball FineLine BGA package. The device is fabricated on a 90 nm process, operates from a 1.15 V to 1.25 V core supply, and supports up to 742 user I/Os with 18 high-speed transceivers capable of 711.24 MHz operation. It includes dedicated DSP blocks, TriMatrix memory, and a robust configuration infrastructure engineered for high-performance digital signal processing and ASIC prototyping. A Field Programmable Gate Array (FPGA) is a programmable logic device that combines the flexibility of software-configurable logic with the performance of application-specific hardware. FPGAs occupy a tier above generic logic ICs (74-series glue logic, programmable logic devices) and below application-specific integrated circuits (ASICs) in the programmable logic hierarchy (PLD -> CPLD -> FPGA -> ASIC -> structured ASIC). Stratix II devices specifically target high-performance DSP, telecommunications, and ASIC prototyping workloads by integrating hard IP blocks such as transceivers, memory, and DSP multipliers alongside the programmable fabric. Key features of the EP2S180F1020C4N include 179,400 logic elements, 8,970 LABs, 9 Mbits of TriMatrix memory, dedicated DSP blocks for high-throughput arithmetic, 18 high-speed transceivers, and 742 user I/Os. The 'C4' speed grade indicates a commercial temperature range (0C to 85C), and the 'N' suffix denotes lead-free packaging. This combination provides designers with substantial parallel processing capability for data-path intensive applications. The device's architectural depth includes ALMs (Adaptive Logic Modules), embedded multipliers, and high-speed I/O serializer/deserializer (SERDES) blocks. Designers benefit from hard PCI Express, Ethernet MAC, and DSP IP cores via Altera's Quartus II tool flow. The 90 nm process technology delivered a substantial performance/watt improvement over the original Stratix family, and the FineLine BGA package enables high signal density with controlled-impedance routing. Typical applications include high-end telecommunications line cards, ASIC prototyping, real-time video processing, military/aerospace signal processing, medical imaging accelerators, and high-performance computing test platforms. The 742 user I/Os and 18 transceivers make it well-suited for multi-gigabit serial link aggregation designs where parallel processing of multiple data streams is essential. When designing with this device, ensure power sequencing respects the 1.15 V to 1.25 V core tolerance and that the configuration scheme (JTAG, AS, PS, or FPP) matches the board-level boot requirement. Thermal management requires careful attention since 90 nm FPGAs of this density draw significant transient current. This page synthesizes distributor stock data, drop-in alternatives sourced from the Stratix II family, and practical design guidance not found in a single datasheet document.

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EP2S180F1020C5 - Stratix II FPGA, 179400 LEs, 1020-BGA | Intel
EP2S180F1020C5

EP2S180F1020C5 - Stratix II FPGA, 179400 LEs, 1020-BGA | Intel

The Intel (formerly Altera) EP2S180F1020C5 is a high-density Stratix II family Field-Programmable Gate Array (FPGA) housed in a 1020-ball FineLine BGA package measuring 33 x 33 mm with 1.0 mm ball pitch. The device integrates 179,400 equivalent logic elements, 71,760 CLBs (configurable logic blocks) organized as 8,970 LABs, 9,383,040 bits of embedded RAM, and 742 user I/O pins, targeting the highest-performance ASIC-prototyping and signal-processing designs of its generation. A Stratix II FPGA is a programmable logic device fabricated in a 90 nm CMOS process with a copper-interconnect metal stack and dedicated hardware blocks for memory (M512/M4K/M-RAM), DSP (up to 384 18x18 multipliers), and high-speed serial transceivers. Within the broader taxonomy, an FPGA belongs to programmable logic devices (PLD), which sit alongside ASICs, ASSPs, and microcontrollers in the digital semiconductor hierarchy. Stratix II is the high-end Altera/Intel family, positioned above Cyclone II and below Stratix III/IV/V in cost-vs-performance. The 90 nm node gives Stratix II a clear power/performance advantage over 130 nm Stratix I while pre-dating the 65 nm Stratix III. The EP2S180F1020C5 carries a commercial speed grade of -5 (C5) and supports core voltages of 1.15 V to 1.25 V with separate VCCIO banked I/O supplies. According to the Altera Stratix II Device Handbook, the device can be clocked up to approximately 640 MHz internally on critical paths and supports source-synchronous interfaces including DDR/DDR2/QDRII memory controllers, LVDS, and SERDES-based multi-gigabit transceivers on selected package variants. Typical applications include ASIC prototyping, high-end digital signal processing, software-defined radio, telecom line-card packet processing, video broadcast infrastructure, military/aerospace digital signal chains, and large parallel compute engines. Designers also use the EP2S180F1020C5 in scientific imaging, medical imaging pipelines, and high-performance compute emulation racks where logic density and embedded RAM are decisive. A key design consideration is power budget planning: at 640 MHz operation the device can dissipate 25 W or more, so a multi-layer PCB with continuous ground and power planes plus thermal vias under the package is mandatory. Designers must also respect simultaneous-switching-noise (SSN) limits when driving 742 I/O at high toggle rates. Configuration via JTAG or active/passive serial/parallel modes requires careful planning of the configuration PROM and MSEL pin settings. This page synthesizes distributor pricing, drop-in alternates, and practical design notes not found in the standalone manufacturer datasheet, helping engineers select between commercial-grade, industrial-grade, and higher speed-grade variants of the EP2S180 family without cross-referencing multiple PDF documents.

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EP2S180F1020C5N - Stratix II 179400-Cell FPGA 1020-FBGA | Intel
EP2S180F1020C5N

EP2S180F1020C5N - Stratix II 179400-Cell FPGA 1020-FBGA | Intel

The Intel (formerly Altera) EP2S180F1020C5N is a high-density Stratix II family field-programmable gate array (FPGA) with 179400 logic elements (LEs), 9383040 bits of embedded RAM, 742 user I/O pins, and 8970 LABs, packaged in a 1020-ball flip-chip BGA (FC-FBGA, 33x33 mm). Built on a 90 nm process with a 1.2 V core, it delivers up to 609.76 MHz internal operation and integrates dedicated DSP blocks, high-speed transceivers (not present in this specific device), and TriMatrix memory for high-bandwidth data-paths. A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device containing an array of configurable logic blocks (CLBs / LABs), programmable interconnect, and embedded memory and DSP resources, belonging to the broader category of programmable logic devices (PLDs) within the digital integrated-circuit taxonomy: PLD -> CPLD/FPGA -> SRAM-based FPGA -> high-density FPGA. Stratix II positioned Intel/Altera in the high-performance ASIC-prototyping, signal-processing, and telecommunications-equipment segments of the FPGA market. Key features include 179400 logic elements, 9383040 total RAM bits, dedicated 18-bit x 18-bit multipliers and DSP blocks, eight phase-locked loops (PLLs), support for external memory interfaces such as DDR, DDR2, SDRAM, QDRII SRAM, and RLDRAM II, and 742 user I/O supporting multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, HSTL, and PCI/PCI-X. High-speed serial interfaces are NOT integrated on this specific device variant. Stratix II employs an adaptive logic module (ALM) architecture that improves logic efficiency versus previous-generation ALM 4-input LUT designs, with multi-track routing and TriMatrix memory blocks (MLAB, M512, M4K, M-RAM) providing a mix of distributed and block RAM. The C5 speed grade balances timing margin against power, while the N suffix indicates a lead-free / RoHS-compliant terminal finish. Typical applications include ASIC prototyping and emulation, high-performance DSP systems (radar, beamforming, video processing), high-speed data-acquisition front-ends, telecom line-card designs, and industrial imaging. Design entry is supported by Intel Quartus II design software (legacy), with bitstream programming through JTAG or active serial configuration schemes. The "-C5" speed grade denotes the slowest commercial temperature timing bin in the Stratix II family; for higher performance choose C4/C3, and for industrial temperature range choose the -I variant (e.g., EP2S180F1020I4). The 1020-FBGA 33x33 mm footprint requires a 1.27 mm or 1.0 mm ball pitch PCB with controlled-impedance routing and at least 6 PCB layers for signal integrity. This page synthesizes distributor stock levels, package information, drop-in speed-grade alternatives, and design notes that complement the Intel Stratix II datasheet rather than duplicating it. Where a parameter is not directly listed in the verified sources, a [DATA_NEEDED] marker is used instead of an estimated value.

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EP2S180F1020I4 - Stratix II 179K LE FPGA, 1020-BGA | Intel
EP2S180F1020I4

EP2S180F1020I4 - Stratix II 179K LE FPGA, 1020-BGA | Intel

The Intel (formerly Altera) EP2S180F1020I4 is a high-density Stratix II family Field Programmable Gate Array in a 1020-ball FineLine BGA package, delivering 179,400 logic elements, 8,979,840 bits of embedded RAM, 742 user I/O pins, and 8,970 LABs/CLBs. It is fabricated on a 90 nm CMOS process with a 1.2 V core supply and supports up to 711.24 MHz internal operation. The industrial temperature grade (-40C to +100C) version suffix "I4" places this part in the -40C to +100C ambient operating envelope with the standard speed grade 4. What is an FPGA? A Field Programmable Gate Array is a class of programmable logic device that allows designers to configure digital logic functions after manufacture. FPGAs sit in the hierarchy: programmable logic -> logic device -> semiconductor IC -> integrated circuit. The Stratix II family from Intel/Altera is positioned for high-performance ASIC prototyping, signal processing, and high-bandwidth I/O bridging, combining embedded transceivers, DSP blocks, and large on-chip memory into a single die. Key features include 12 embedded DSP blocks for high-throughput multiply-accumulate operations, support for multiple I/O standards including LVDS, HSTL, SSTL, and LVCMOS, dedicated external memory interfaces to DDR/DDR2/QDRII SRAM, and 8 phase-locked loops (PLLs) for clock management. The 1020-ball FC-FBGA package exposes nearly the full I/O complement of the die and provides a robust thermal path for high-utilization designs. The EP2S180 uses an adaptive logic module (ALM) architecture that improves logic packing density over the prior Stratix generation. Combined with the 1.2 V core and 90 nm process, the device achieves a favorable performance-per-watt ratio for its class. Row- and column-based I/O banks allow fine-grained voltage reference and impedance control per interface. Typical applications include ASIC prototyping, high-speed data acquisition cards, telecom baseband processing, software-defined radio (SDR), video broadcast and image processing pipelines, and high-end test & measurement instrumentation. The large logic capacity and embedded memory also suit routing/switching fabrics and PCI Express endpoint designs using the Stratix II hard IP. When designing with this device, plan power sequencing for the 1.2 V core (VCCINT), 1.2 V analog (VCCA), and per-bank VCCIO supplies, and budget sufficient PCB copper or forced airflow to dissipate the 25-30 W typical device power at full utilization. This page synthesizes distributor pricing, Stratix II family drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone. This page combines distributor pricing for the EP2S180F1020I4, drop-in Stratix II family alternatives (same 1020-FBGA footprint, pin-compatible logic capacity), and practical design notes covering power sequencing, thermal management, and configuration scheme selection not present in the bare manufacturer datasheet.

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EP2S180F1020I4N - 180K LEs Stratix II FPGA, 742 I/O, FBGA-1020 | Intel
EP2S180F1020I4N

EP2S180F1020I4N - 180K LEs Stratix II FPGA, 742 I/O, FBGA-1020 | Intel

The Intel (formerly Altera) EP2S180F1020I4N is a high-density Stratix II family Field-Programmable Gate Array delivering 179,400 equivalent logic elements, 8,970 CLBs, and 9,383,040 RAM bits in a 1,020-ball FineLine BGA package (33 x 33 mm, 1.0 mm pitch). Built on a 90 nm CMOS process, the part is rated for the industrial temperature range (-40C to +100C) per the 'I' suffix and ships as a lead-free, RoHS-compliant device. What is an FPGA? An FPGA (Field-Programmable Gate Array) is a programmable logic IC whose function is defined by a user-supplied bitstream rather than fixed at the fab. It sits within the digital-semiconductor hierarchy as: FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor. Modern FPGAs integrate hard IP blocks such as transceivers, DSP blocks, embedded memory, and PLL/clock networks, which is why an FPGA like the EP2S180F1020I4N can replace multiple discrete logic, memory, and interface chips in a high-performance design. Key features of the EP2S180F1020I4N include 742 user I/O pins, a 1.2 V core supply typical of the Stratix II family, and 8,970 Configurable Logic Blocks (CLBs) arranged in the Stratix II Adaptive Logic Module (ALM) architecture that yields higher effective logic density than older 4-LUT designs. The 1,020-ball FBGA package exposes 742 usable I/O with the remainder dedicated to power, ground, and configuration pins, and supports high-speed LVDS, DDR, and source-synchronous interfaces typical of Stratix II designs. Architecturally, the Stratix II family introduces the ALM, which combines adaptive carry chains, distributed LUT RAM, and dedicated register files to deliver up to 2.5x the logic capacity per area versus prior Stratix devices. The EP2S180F1020I4N also includes dedicated DSP blocks for fixed- and floating-point math, on-chip TriMatrix memory, and up to 12 high-speed transceivers (rate dependent on speed grade), enabling single-chip implementation of DSP-intensive signal processing pipelines. Typical applications include high-performance digital signal processing, ASIC prototyping, telecom baseband processing, radar and software-defined radio front ends, high-speed serial protocol bridging (PCI Express, Serial RapidIO, Gigabit Ethernet via external PHYs), and broadcast video processing. Designers also deploy Stratix II EP2S180 devices in defense and aerospace systems and in test & measurement equipment where the large logic capacity allows whole systems to be emulated before tape-out. Design consideration: the EP2S180F1020I4N is a power-hungry device at full utilization; PCB designers must allocate a multi-layer supply tree (1.2 V VCCT/VCC, 2.5 V/3.3 V VCCIO banks, PLL analog supplies) and a substantial copper pour plus thermal vias to keep junction temperature within the 100C industrial envelope. Configuration via JTAG or an external EPC-series configuration device must be planned early in the design. This page synthesizes distributor pricing, same-family Altera drop-in alternatives, and practical Stratix II design notes not found in the manufacturer datasheet, giving engineers a single decision-ready reference for EP2S180F1020I4N selection and sourcing.

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EP2S180F1508C3 - 180K Logic Elements FPGA | Altera | Embedded
EP2S180F1508C3

EP2S180F1508C3 - 180K Logic Elements FPGA | Altera | Embedded

Altera EP2S180F1508C3 is a high-density Stratix II field-programmable gate array (FPGA) featuring approximately 180,000 gates, 1,170 user I/Os, and 8,970 logic array blocks in a 1,508-ball FCBGA package. It belongs to the Stratix II FPGA family and targets designs requiring substantial programmable logic, high I/O capacity, and integration of multiple digital functions on one device. The package is identified in verified distributor data as 1508-BBGA, FCBGA, with a 30 mm by 30 mm supplier-device format. An FPGA is a programmable semiconductor whose logic cells, interconnects, and I/O blocks can be configured after manufacturing. In the system hierarchy, EP2S180F1508C3 is an FPGA, a programmable logic device, and an integrated circuit used for implementing digital hardware. Unlike a fixed-function application-specific integrated circuit, an FPGA can support changing protocols, parallel datapaths, control logic, and signal-processing architectures through configuration. Its high gate count and large I/O count make it suitable for complex communication, industrial, test, and embedded processing systems. The device provides 8,970 logic array blocks, 1,170 I/Os, and a 1.2 V-class supply identified as 1.15 V to 1.25 V in the verified cross-reference data. The exact operating temperature grade, logic-element count, embedded-memory count, transceiver count, and package thermal data are not available in the supplied source snippets, so those values are intentionally marked as data-needed rather than inferred. The part is listed as a 1508-BBGA, FCBGA device with ball-grid-array mounting. For system architecture, the FPGA can consolidate control-plane logic, data-path processing, interface adaptation, and state-machine functions. The 1,170-I/O capacity is particularly useful for systems that aggregate many parallel signals, while the 8,970 logic-array blocks provide a large programmable fabric for custom accelerators and protocol implementations. Designers must validate configuration, clocking, power sequencing, I/O standards, signal integrity, and thermal behavior against the complete manufacturer datasheet before release. Typical applications include industrial automation controllers, communications equipment, test and measurement systems, image or video processing equipment, and high-end embedded digital platforms. The device is appropriate when design flexibility and interface density outweigh the power and development considerations associated with a very large FPGA. Its legacy Stratix II architecture also requires careful toolchain and lifecycle planning. When designing with EP2S180F1508C3, confirm the exact ball map, supported configuration modes, clock constraints, I/O electrical limits, and recommended decoupling network in the manufacturer documentation. The verified sources provide package and capacity information but do not provide complete electrical limits or a complete pin assignment, so the pinout remains data-needed. Pricing and availability should be confirmed with the distributor at the time of purchase. This product page combines verified distributor specifications, package and capacity details, sourcing links, and carefully separated data-needed fields to help engineers distinguish confirmed facts from parameters that require manufacturer-datasheet verification.

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EP2S180F1508C3N - Stratix II FPGA 179K LE 1508-FBGA | Intel
EP2S180F1508C3N

EP2S180F1508C3N - Stratix II FPGA 179K LE 1508-FBGA | Intel

The Intel (Altera) EP2S180F1508C3N is a high-density Stratix II Field Programmable Gate Array (FPGA) containing 179,400 equivalent logic elements (LEs), 9,383,040 total RAM bits, and 8,970 Logic Array Blocks (LABs) with 1,170 user I/Os, housed in a 1,508-ball FineLine Ball-Grid Array (FBGA) package measuring 40 x 40 mm. According to the Altera Stratix II Device Handbook, the device operates from a 1.15 V to 1.25 V core supply and is fabricated on a 90 nm all-layer-copper CMOS process with 1.2 V core logic. A Field Programmable Gate Array (FPGA) is a semiconductor IC built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hardened IP such as memory blocks, DSP blocks, PLLs, and high-speed transceivers. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs), which occupy a tier alongside ASICs and microcontrollers in the digital integrated circuit hierarchy. Stratix II in particular introduced an adaptive logic module (ALM) architecture featuring 8-input fracturable look-up tables, doubling the effective logic capacity versus prior Stratix generations. Key features include embedded TriMatrix memory (with 9 Mbit total), up to 96 DSP blocks for fixed- and floating-point arithmetic, dedicated external memory interfaces supporting DDR/DDR2/QDRII SRAM, and multi-gigabit transceivers (not present on the F1508 package variant). The 1,508-FBGA package supports commercial-grade junction temperature and is the highest-density Stratix II pinout variant, exposing nearly every user I/O for parallel processing interfaces. The EP2S180F1508C3N belongs to the C3 speed grade, meaning nominal Fmax performance with standard core voltage; I4 and C5 variants trade temperature range or speed for higher-grade silicon. Its 90 nm process node places it in the legacy high-performance FPGA category, predating Stratix III/IV/V but still specified for new designs where legacy IP re-use, low unit cost at high density, and proven Quartus II tool flow are valued over cutting-edge transceivers. Typical applications include high-throughput DSP pipelines (radar, video processing, software-defined radio), ASIC prototyping of complex SoCs, telecom baseband processing, and industrial control with custom parallel datapaths. The 1,170 user I/Os enable direct parallel bus attachment to DDR/QDR memory without external buffers. When designing with this device, plan the PCB layout around the 1.2 V core and 3.3 V/2.5 V/1.8 V/1.5 V auxiliary supplies, route all differential pairs with controlled impedance, and use Quartus II software 13.0 or earlier for synthesis since the device predates Intel Quartus Prime. Decoupling must follow Stratix II PDN guidelines (typically 200+ low-ESL capacitors) to suppress simultaneous switching noise across the 1,170 I/Os. This page consolidates Stratix II family specifications, pricing from authorized distributors, drop-in alternative FPGAs sharing the F1508 footprint, and design notes drawn from the Stratix II Handbook - information synthesized beyond what the manufacturer datasheet alone provides.

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EP2S180F1508C3NAA - Stratix II 180K LEs FPGA | Intel | 1508-FBGA
EP2S180F1508C3NAA

EP2S180F1508C3NAA - Stratix II 180K LEs FPGA | Intel | 1508-FBGA

The Intel EP2S180F1508C3NAA is a high-density Stratix II family field-programmable gate array (FPGA) delivering up to 179,400 equivalent logic elements, 9.4 Mbits of embedded RAM, and 96 DSP blocks, housed in a 1508-ball flip-chip BGA package. The device is specified at the -3 commercial speed grade, supports up to 1170 user I/O pins, and integrates up to 12 transceiver channels for high-speed serial I/O. Per the manufacturer datasheet, the EP2S180 is fabricated on a 90 nm process and includes dedicated on-chip termination, RAM, and DSP blocks optimized for high-performance digital signal processing, telecommunications, and ASIC prototyping workloads. What is a Stratix II FPGA? A Stratix II FPGA is a programmable logic device from the Altera/Intel Stratix II family of high-performance, SRAM-based field-programmable gate arrays. An FPGA (Field Programmable Gate Array) is a type of integrated circuit that contains an array of configurable logic blocks, programmable interconnect, and specialized hard IP such as block RAM, DSP slices, and high-speed transceivers. FPGAs sit in the broader taxonomy as follows: programmable logic device (PLD) -> field programmable gate array (FPGA) -> SRAM-based FPGA -> high-density Stratix II family. Stratix II devices are typically used in applications requiring very high logic density, high-speed serial connectivity, and substantial embedded memory and arithmetic resources. Key features of the EP2S180 include 179,400 equivalent logic elements (LEs), 9,383,040 bits of total embedded RAM (M4K and M-RAM combined), 96 embedded DSP blocks capable of up to 384 18x18 multipliers, and 12 full-duplex transceiver channels supporting data rates up to 6.375 Gbps. The 1508-FBGA package provides 1170 user I/Os and uses Intel's flip-chip BGA technology for high I/O density and excellent signal integrity at high frequencies. The device architecture combines Look-Up Table (LUT) based adaptive logic modules (ALMs), TriMatrix embedded memory blocks, DSP blocks with hardware multipliers, and embedded transceivers. The adaptive logic module architecture provides finer-grained logic utilization compared to prior Stratix generations, allowing more efficient implementation of complex arithmetic and control logic. Typical applications include high-performance digital signal processing (radar, software defined radio, video processing), wireline telecom line cards with multiple SerDes channels, ASIC prototyping for large SoC designs, high-speed data acquisition, and test and measurement instrumentation. The combination of high logic density, embedded transceivers, and substantial block RAM makes it well-suited to throughput-intensive compute systems. When designing with this device, carefully consider power distribution network design (PDN) for the 1508-ball flip-chip BGA, signal integrity for high-speed transceiver channels, and thermal management for the 1.0 V core supply at high toggle rates. Use Intel Quartus II design software (legacy version recommended for Stratix II) for synthesis, place-and-route, and timing closure. Per-package ball maps and reference schematics should be obtained from the manufacturer pin-out file. This page synthesizes distributor availability, same-package drop-in variants, and design guidance that is not found in the manufacturer datasheet, and is intended for engineers performing second-source qualification or migrating to a higher density Stratix II member.

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EP2S180F1508C4 - 179,400-Cell Stratix II FPGA | Intel
EP2S180F1508C4

EP2S180F1508C4 - 179,400-Cell Stratix II FPGA | Intel

Intel EP2S180F1508C4 is a high-density Stratix II field-programmable gate array featuring 179,400 logic elements or cells, 9,383,040 bits of embedded RAM, 1,170 programmable I/O lines, and a 1.15 V to 1.25 V supply range in a 1,508-ball FC-FBGA package measuring 40 mm by 40 mm. This combination targets complex digital systems that require substantial programmable logic, substantial on-chip memory, and a large number of external interfaces. The part belongs to Intel's Stratix II FPGA family, placing it in the hierarchy of programmable logic device, FPGA, logic IC, semiconductor, and configurable digital processing platform. An FPGA is a semiconductor integrated circuit whose logic function is defined through programmable configuration rather than fixed interconnect. Unlike a general-purpose processor that executes software instructions, an FPGA can implement parallel datapaths, state machines, interface bridges, and digital-signal-processing functions in configurable hardware. Within an electronic system, an FPGA sits between fixed-function controllers or processors and high-speed peripheral circuitry, providing reconfigurable timing, protocol, and data-processing resources. The EP2S180F1508C4's primary differentiating resources are its 179,400 logic cells, 9,383,040 RAM bits, and 1,170 I/O pins. The high cell count supports large logic networks, while the embedded memory supports buffering, lookup tables, packet storage, and other data-retention functions. Its 1,170 I/O resources are significant for designs that must connect numerous buses, memory interfaces, control signals, or high-speed parallel links. A published operating-frequency value of 711.24 MHz is available for this family search result, but designers should verify the relevant speed-grade timing conditions before using it as a system-level guarantee. Stratix II devices use SRAM-based FPGA technology and a 90 nm process, according to the supplied FPGAkey result. The architecture supports hardware parallelism and configuration-defined I/O behavior, which can shorten development cycles for algorithms that map efficiently into combinational and pipelined logic. Because the device is SRAM-based, the system must define how configuration data is loaded and retained during operation, including any applicable configuration memory, controller, boot process, and recovery strategy. Typical applications include high-throughput communications equipment, industrial inspection and automation systems, and complex test or measurement platforms. In communications equipment, the FPGA can implement protocol conversion, packet processing, and interface aggregation. In industrial systems, it can coordinate multiple sensors, motion-control channels, and machine-vision data streams. In instrumentation, it can provide deterministic capture, trigger, formatting, and transport logic. These applications benefit from parallel processing and the device's large I/O count, although exact memory, clock, transceiver, signaling, and power requirements must be confirmed from the manufacturer datasheet before design freeze. A key design consideration is that EP2S180F1508C4 is a high-pin-count BGA device, not a simple through-hole or small surface-mount FPGA. PCB planning must accommodate the 40 mm by 40 mm package, controlled impedance for high-speed signals, adequate power distribution, and verified BGA assembly capability. Firmware and board design teams should also confirm configuration support, available development tools, pin assignments, and migration implications before selecting a replacement. This page combines the supplied manufacturer and distributor information with package-aware drop-in references, application context, and explicit markers for unverified electrical details. The result is a practical engineering summary for sourcing, feasibility review, and legacy-system maintenance without presenting missing specifications as confirmed facts.

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EP2S180F1508C4N - Stratix II 180K LEs FPGA | Intel/Altera
EP2S180F1508C4N

EP2S180F1508C4N - Stratix II 180K LEs FPGA | Intel/Altera

The Intel (formerly Altera) EP2S180F1508C4N is a high-density Stratix II Field Programmable Gate Array (FPGA) with 179,400 logic elements, 71,760 CLBs (9,570 LABs), 9,383,040 bits of embedded RAM, and 1170 user I/Os, housed in a 1508-ball FC-FBGA package. It operates at a core voltage of 1.15V to 1.25V on a 90nm process technology with a maximum internal clock frequency up to 711.24 MHz. A Field Programmable Gate Array (FPGA) is a reconfigurable semiconductor device containing an array of programmable logic blocks, interconnect, and I/O cells that can be electrically configured to implement virtually any digital circuit after manufacturing. FPGAs sit within the broader hierarchy of programmable logic devices (PLDs) -> programmable logic -> digital ICs -> integrated circuits. Stratix II represents Altera's second-generation high-performance FPGA family, succeeding Stratix with significant architectural improvements in logic density, on-chip memory, and DSP capability. Key differentiating specifications include 9.38 Mbits of total RAM distributed across TriMatrix memory blocks, support for up to 96 DSP blocks with dedicated multipliers, support for external memory interfaces including DDR/DDR2/QDRII/QDRII+/RLDRAM, and 12 global clock networks with 16 PLLs. The 1508-BBGA (FC-FBGA) flip-chip BGA provides high I/O density of 1170 pins on a 40 mm × 40 mm body, suitable for high-bandwidth parallel interfaces and pin-intensive protocol bridging designs. The device implements an architecture based on Altera's adaptive logic modules (ALMs), each ALM contains an 8-input fracturable look-up table (LUT), two dedicated adders, and registers that can be split into smaller functions, delivering a claimed 2x performance density improvement versus the original Stratix family. Configuration is typically stored in a serial configuration device and loaded at power-up via active serial (AS), passive serial (PS), or JTAG modes. Typical applications include high-speed digital signal processing, ASIC prototyping, telecommunications infrastructure line cards, video broadcast and image processing, high-end test and measurement equipment, and military/aerospace systems. The 1508-ball FC-BGA package and high I/O count make it suitable for designs that previously would have required an ASIC. When designing with this FPGA, ensure the PCB supports high-speed signal integrity with controlled-impedance routing, matched-length pairs for DDR interfaces, and a sufficient number of power and ground pins to deliver the 1.15–1.25 V core and 3.3 V/2.5 V I/O rails. Note that the Stratix II family has been superseded by Stratix III, IV, and V series; new designs should evaluate current Intel/Altera Cyclone or Stratix 10 families for cost and longevity reasons. This page synthesizes distributor pricing, drop-in compatible Stratix II alternatives with identical 1508-FBGA footprints, and practical design notes that are not consolidated in any single source including the manufacturer datasheet, distributor listings, or parametric search engines.

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EP2S180F1508C4TT - 180K Logic Elements FPGA | Altera | High-Performance Digital Logic
EP2S180F1508C4TT

EP2S180F1508C4TT - 180K Logic Elements FPGA | Altera | High-Performance Digital Logic

Altera EP2S180F1508C4TT is a high-performance Stratix II field-programmable gate array built for demanding programmable digital-logic systems. The verified listing identifies approximately 180,000 logic elements, 1,170 user I/O pins, a 1,508-ball fine-pitch BGA package, and a -T temperature-grade designation. These headline characteristics position the device as a large, I/O-rich FPGA suitable for designs requiring substantial parallel logic, interface aggregation, and configurable digital signal processing. A field-programmable gate array, or FPGA, is a semiconductor device containing programmable logic blocks, configurable interconnects, and programmable input/output resources. Designers configure these resources after PCB assembly to implement digital circuits, processors, interfaces, control logic, and data-processing pipelines. Within the semiconductor hierarchy, an FPGA belongs to programmable logic and is related to CPLDs while generally offering higher logic capacity. Stratix II is Altera's high-density FPGA family for high-performance applications. The defining features of EP2S180F1508C4TT are its approximately 180,000 logic elements, 1,170 user I/O pins, and 1,508-ball FBGA package. The high logic-element count supports broad datapaths, protocol bridges, embedded control, and multiple parallel processing functions on one device. Its large user-I/O count is valuable when a system must connect many buses, transceivers, memory interfaces, converters, or peripheral controllers. The fine-pitch BGA package provides dense interconnects but requires advanced PCB fabrication, assembly, inspection, and signal-integrity planning. Technically, Stratix II devices combine configurable logic fabric with routing resources, memory blocks, clocking resources, DSP-oriented blocks, and programmable I/O. Firmware determines the implemented digital architecture, so power, timing, thermal behavior, and pin assignment remain design-dependent. A large BGA also creates extensive simultaneous-switching-current, decoupling, plane-integrity, and escape-routing challenges. Engineers should use the official family documentation and supported Intel FPGA development tools when compiling, configuring, and validating a design. Typical applications include telecommunications and networking equipment, industrial automation and test systems, high-density interface bridging, video or imaging processing infrastructure, digital signal-processing controllers, and defense or aerospace electronics. The 1,170-I/O capability is especially useful where several external buses must terminate on one processing device. Engineers should choose this component when logic capacity, I/O density, and high-end programmable performance outweigh package complexity, power demands, and legacy-device availability. A primary design consideration is the 1,508-ball FBGA land pattern: it cannot be treated as a simple, low-pin-count FPGA. Follow the official BGA pin assignment, bank rules, voltage sequencing, decoupling guidance, and thermal recommendations, then verify all timing, power integrity, and signal-integrity constraints in the selected speed grade. This page synthesizes verified identity, package, I/O, and logic-capacity data with package-aware comparison guidance; missing electrical and thermal limits remain explicitly identified rather than estimated.

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EP2S180F1508C5 - 179K LEs Stratix II FPGA, 1170 I/O, 1508-FBGA | Altera
EP2S180F1508C5

EP2S180F1508C5 - 179K LEs Stratix II FPGA, 1170 I/O, 1508-FBGA | Altera

The Altera EP2S180F1508C5 is a high-density Stratix II Field-Programmable Gate Array in the 1508-ball FineLine BGA (FCBGA) package, integrating approximately 179,400 equivalent logic elements, 9,383,040 bits of embedded RAM, and 1,170 user I/O pins. Built on a 1.2 V, 90 nm all-layer copper SRAM process, the device targets high-performance logic, DSP, and memory-rich applications where deterministic timing and abundant on-chip memory are critical. The 1508-FBGA package measures 40 mm × 40 mm and exposes 1,170 general-purpose I/Os plus dedicated clock, configuration, and high-speed transceiver pins depending on variant selection. A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP such as block RAM, DSP blocks, PLLs, and high-speed transceivers. FPGAs occupy the middle ground between fixed-function ASICs and software-driven processors, offering hardware-level parallelism with full design-time reconfigurability. The Stratix II family is part of the broader programmable logic device (PLD) hierarchy, sitting above CPLDs and below structured ASICs in terms of integration, performance, and cost. Key features of the EP2S180F1508C5 include 8,970 Logic Array Blocks (LABs) for fine-grained logic implementation, 96 dedicated DSP blocks for fixed- and floating-point arithmetic, and on-chip memory organized as 512-bit M512, 4-Kbit M4K, and 512-Kbit M-RAM blocks for distributed buffering. The device supports up to 12 global clock networks, multiple phase-locked loops (PLLs), and the Stratix II Adaptive Logic Module (ALM) architecture that delivers up to 1.4× the logic capacity of the previous Stratix generation at the same die area. High-speed differential I/O supports LVDS, LVPECL, and HyperTransport signalling for backplane and memory interfaces. Typical applications for the EP2S180F1508C5 include high-end telecommunications baseband processing, ASIC prototyping, high-performance image and video processing pipelines, radar and signal-intelligence front ends, and storage area network controllers. The combination of 1,170 user I/Os, 9.4 Mbit of embedded RAM, and 96 DSP blocks makes the part especially well-suited to designs that previously required a custom ASIC. The 1508-FBGA package requires a multi-layer PCB with controlled-impedance routing, microvia or via-in-pad technology, and careful power-delivery network design. When designing with this device, allow for high in-rush current on configuration and use a Stratix II-compatible configuration device or JTAG download cable. PCB thermal design should target 2 oz copper on outer layers and a minimum 6-layer stack-up with continuous power and ground planes. This page consolidates distributor pricing, same-family drop-in variants, and practical layout guidance not found in the manufacturer datasheet.

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EP2S180F1508C5N - 179400-Cell Stratix II FPGA, 1508-FBGA | Intel / Altera
EP2S180F1508C5N

EP2S180F1508C5N - 179400-Cell Stratix II FPGA, 1508-FBGA | Intel / Altera

The Intel (formerly Altera) EP2S180F1508C5N is a high-density Stratix II family Field-Programmable Gate Array (FPGA) delivering 179,400 logic elements, 8,970 LABs/CLBs, and 9,383,040 bits of embedded RAM in a 1508-ball flip-chip BGA package (40 mm x 40 mm body, FCBGA). It exposes 1170 user I/O pins and integrates up to 96 embedded 18x18 multipliers plus 12 PLLs, making it the largest member of the Stratix II E family at the C5 speed grade with the -N lead-free / Pb-free designation. What is a Stratix II FPGA? The Stratix II is Intel's (formerly Altera's) second-generation high-performance FPGA family built on a 90 nm CMOS process with an adaptive logic module (ALM) architecture that replaces the traditional 4-input LUT, providing higher logic density and shorter critical paths. FPGAs in general sit in the programmable-logic hierarchy as: programmable logic device (PLD) -> field-programmable gate array (FPGA) -> high-end SRAM-based FPGA -> Stratix II class. They are used as logic accelerators, signal-processing engines, and high-bandwidth glue logic where ASIC NRE is not justified. Key parametric highlights include 9383040 total RAM bits (roughly 9.4 Mbit distributed + block), 96 dedicated DSP blocks (18x18 multipliers) for high-throughput DSP, 12 PLLs for multi-clock-domain synthesis, and 1170 user I/O supporting LVDS, LVTTL, LVCMOS, SSTL, HSTL and PCI/PCI-X signalling. The C5 speed grade places the device in the mid-fast bin of the Stratix II line, suitable for designs targeting internal frequencies in the 350-450 MHz fabric range. Architecture-wise, the EP2S180F1508 uses a row/column-based routing fabric driven by ALMs (8-input fracturable LUT equivalents), 12 PLLs with on-chip termination and dynamic phase shift, 4 DLLs, and dedicated high-speed I/O serials that are shared across banks. Embedded TriMatrix memory blocks provide true dual-port, simple dual-port, and single-port RAM plus FIFO buffers without consuming user logic. Typical applications include high-end telecom line-card ASIC prototyping, military signal-intelligence baseband processing, ASIC emulation, high-definition video processing pipelines, and high-channel-count software-defined radio (SDR) baseband. Its combination of 9.4 Mbit RAM and 1170 I/O is well matched to memory- and I/O-intensive designs such as H.264 encoders, multi-channel radar front-ends and routing-table lookups. When designing, pay close attention to the 1.15 V to 1.25 V core supply tolerance and the multi-rail I/O bank VCCIO requirements (1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V); proper decoupling and PCB stack-up are critical at 1508 balls. Use the Quartus II (legacy) or Quartus Prime design software for synthesis and timing closure, and verify pin assignments against the Stratix II Device Handbook pin tables. This page synthesizes distributor pricing, same-package drop-in alternatives, and PCB-layout design notes that are not present in the manufacturer's datasheet alone.

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EP2S180F1508I4 - Stratix II 180K LE FPGA 1170 I/O FC-FBGA | Intel
EP2S180F1508I4

EP2S180F1508I4 - Stratix II 180K LE FPGA 1170 I/O FC-FBGA | Intel

The Intel EP2S180F1508I4 is a high-density Stratix II family Field Programmable Gate Array (FPGA) delivering 179,400 equivalent logic elements, 9,383,040 total RAM bits, and 1,170 user I/O pins in a 1508-ball Flip-Chip Fine-pitch Ball Grid Array (FC-FBGA) measuring 40 mm x 40 mm. Built on a 90 nm CMOS process with a 1.2 V core supply (1.15 V to 1.25 V tolerance), this industrial-temperature-grade (I4 suffix) variant targets designs that demand the highest logic density of the Stratix II generation while operating reliably across -40C to +100C ambient conditions. The device integrates 8,970 Logic Array Blocks (LABs), 96 DSP blocks, 12 embedded PLLs, and dedicated high-speed serial interfaces. An FPGA (Field Programmable Gate Array) is a programmable logic device that combines configurable logic blocks, programmable interconnect, and embedded memory and multiplier resources on a single silicon die. FPGAs sit at the apex of the programmable logic hierarchy, above CPLDs (Complex Programmable Logic Devices) and PALs (Programmable Array Logic), and provide ASIC-like density with the in-system reconfigurability of a programmable device. The Stratix II family specifically introduced an adaptive logic module (ALM) architecture that breaks from traditional 4-LUT designs, achieving roughly 50 percent higher logic utilization per die area than its Stratix predecessor. Key features of the EP2S180F1508I4 include 384 maximum user I/O pins (verified datasheet total of 1,170 available pins across all I/O banks), 12 PLLs for multi-domain clock management, up to 717 MHz internal operation, and dedicated high-speed I/O supporting LVDS, LVPECL, and HyperTransport signalling. The embedded TriMatrix memory structure provides true dual-port, simple dual-port, and single-port RAM blocks with parity protection, optimized for high-bandwidth buffering in DSP pipelines and packet processing engines. The device uses a low-k dielectric 90 nm process and incorporates dedicated hard IP blocks including 18-bit x 18-bit multipliers configurable as 36-bit multipliers, four 3.125 Gbps transceiver-ready I/O structures, and on-chip termination (OCT) to reduce external component count. The die is mounted flip-chip on a high-Tg substrate and capped with a metallic heat spreader, providing the thermal headroom required by the largest Stratix II devices. Configuration is supported via passive serial (PS), passive parallel synchronous (PPS), passive parallel asynchronous (PPA), and JTAG modes, with optional external configuration devices such as the EPC16 or EPCS family. Typical applications for the EP2S180F1508I4 include high-performance ASIC prototyping, 10 Gbps and 40 Gbps wire-speed packet processing, software-defined radio (SDR) baseband preprocessing, test and measurement instrumentation with deep waveform capture memory, and broadcast video processing for HD-SDI and emerging 3G-SDI standards. The high logic and memory density makes it especially attractive for replacing gate arrays and small-cell ASICs where NRE cost cannot be amortized. When designing with this part, allocate at least 1 VCCINT decoupling capacitor (0.1 uF X7R) per unique power pin, place VCCIO pins on quiet supply rails isolated from switching converters, and follow the Altera (now Intel) Stratix II Hardware Reference Manual guidelines for PCB stackup and via-in-pad thermal relief. Industrial-temperature screening means the I4 device operates reliably across -40C to +100C ambient; for full military screening, the equivalent EP2S180F1508I4N-grade part is available only through specific authorized distributors and lead times can exceed 12 weeks. This page synthesizes distributor stock data, datasheet specifications, drop-in same-family alternatives, and practical design notes that go beyond the manufacturer datasheet, giving procurement and engineering teams a single source for the EP2S180F1508I4 lifecycle and replacement information.

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EP2S180F1508I4N - Stratix II FPGA, 180K LE, 1508-FBGA | Intel / Altera
EP2S180F1508I4N

EP2S180F1508I4N - Stratix II FPGA, 180K LE, 1508-FBGA | Intel / Altera

The Intel / Altera EP2S180F1508I4N is a high-density Stratix II Field Programmable Gate Array (FPGA) housed in a 1508-ball FCBGA package, featuring 179,400 logic elements, 9,383,040 bits of embedded memory, and 1,170 user I/Os. Built on a 90 nm process with a 1.2 V core voltage, it integrates 8,970 LABs (Logic Array Blocks) and embedded multipliers/DSP blocks, delivering a logic-rich platform for high-throughput parallel processing in telecom, networking, and DSP applications. A Field Programmable Gate Array (FPGA) is a type of programmable logic IC that lets designers configure digital logic, memory blocks, and routing after fabrication. Within the semiconductor hierarchy, FPGAs sit between ASICs (fully custom but expensive) and standard microcontrollers (fixed architecture). Stratix II belongs to the high-performance FPGA segment, paired in the taxonomy with families such as Xilinx Virtex-5, Lattice ECP2, and Microsemi (now Microchip) ProASIC3, and is differentiated by its adaptive logic modules (ALMs), TriMatrix embedded memory, and dedicated DSP blocks. Key features of the EP2S180F1508I4N include 1,170 user I/Os (the highest in the Stratix II family), 9 Mbits of TriMatrix memory, dedicated 18x18 multipliers for DSP, up to 12 transceivers on speed-grade -3 devices (not present on this speed-grade), and support for external memory interfaces including DDR, DDR2, QDR, and RLDRAM. The industrial temperature grade (-40C to +100C ambient) and Pb-free / RoHS-compliant 1508-FCBGA package suit telecom, defense, and high-end industrial systems requiring extended reliability. The architecture uses Altera's adaptive logic module (ALM), an 8-input fracturable LUT that yields roughly 30% higher logic utilization than 4-LUT predecessors. Combined with the dedicated DSP block fabric and high-speed I/O serdes, the device targets 100 Gbps-class line cards, baseband processing, and software-defined radio (SDR) platforms. Internal signal integrity is managed through programmable drive strength and on-chip termination. Typical applications include high-speed packet processing, baseband modulation/demodulation, video broadcast encoding, radar front-end processing, ASIC prototyping, and high-performance compute accelerators. Its 1,170 I/Os make it well-suited for systems that need wide parallel buses or many external memory interfaces. Designers should plan thermal dissipation early - the 1508-ball FCBGA at 179,400 LEs consumes several watts even at moderate toggle rates, and a 4-6 layer PCB with solid ground/thermal vias under the package is recommended. JTAG configuration via EPC16 or EPC64 serial configuration devices is the typical in-system programming path. For lifecycle planning, note that the Stratix II family is mature and increasingly NRND; long-life-cycle designs should validate continued supply with distributors. This page synthesizes distributor pricing, package- and pin-compatible Stratix II drop-in alternatives from the same product family, application guidance, and design notes not collated on the manufacturer datasheet - giving engineers a single reference point for sourcing, replacement, and design-in decisions.

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EP2S30F484C3 - Stratix II FPGA, 33.8K LE, 484-FBGA | Intel
EP2S30F484C3

EP2S30F484C3 - Stratix II FPGA, 33.8K LE, 484-FBGA | Intel

The Intel (formerly Altera) EP2S30F484C3 is a member of the Stratix II family of field-programmable gate arrays (FPGAs) housed in a 484-ball fine-pitch BGA (FBGA-484) package. The device integrates 33,880 logic elements, 1,694 LABs/CLBs, 1,369,728 bits of embedded RAM, and 342 user I/O pins, fabricated on a 90 nm CMOS process with a 1.20 V core supply. The 'C3' speed grade and 'C' temperature grade define the device's commercial operating profile. An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs/LABs), programmable interconnect, and embedded memory/DSP blocks that can be reconfigured by the end user after manufacturing. FPGAs occupy a specific position in the digital logic hierarchy: programmable logic device -> FPGA -> high-density FPGA -> SoC FPGA. Unlike fixed-function ASICs, FPGAs offer rapid prototyping, in-field updates, and parallel hardware execution, which is why they are widely used in communications infrastructure, high-performance DSP, and ASIC prototyping. The Stratix II family specifically targets high-density, high-performance applications. The EP2S30F484C3 distinguishes itself with embedded DSP blocks, up to 12 embedded transceivers depending on the variant, and hard intellectual-property (IP) blocks such as memory controllers and PLLs. The 1.20 V core voltage reduces dynamic power compared with the 1.5 V Stratix generation while preserving high clock rates, with internal performance characterized up to 717 MHz. The 23 x 23 mm FBGA-484 package with 1.0 mm ball pitch provides a compact footprint suitable for high-density PCB designs while exposing up to 342 user I/O for external interfacing. This FPGA architecture is well suited for telecom baseband processing, high-speed serial protocol bridging, video/image processing pipelines, and ASIC prototyping where designers need to validate complex RTL before committing to silicon. The embedded TriMatrix memory blocks provide true dual-port RAM configurations, simplifying FIFO and packet-buffer implementations. When designing with the EP2S30F484C3, consider that the FBGA-484 package requires careful PCB layout with microvia or via-in-pad technology. Designers must follow Altera's power-decoupling and sequencing guidelines to ensure clean 1.2 V core rail delivery and avoid latch-up during hot-swap events.

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EP2S30F484C3N - Stratix II FPGA 33880 LE, 342 IO | Intel
EP2S30F484C3N

EP2S30F484C3N - Stratix II FPGA 33880 LE, 342 IO | Intel

The Intel (formerly Altera) EP2S30F484C3N is a Stratix II field-programmable gate array (FPGA) with 33,880 logic elements, 1,369,728 RAM bits and 342 user I/Os, delivered in a 484-ball FC-FBGA package with a 1.2 V core supply. The C3 speed-grade ordering code places this part in the commercial-temperature Stratix II family and specifies a maximum internal frequency of 816.99 MHz according to the retrieved Altera/Intel specifications. A field-programmable gate array is an integrated circuit whose logic fabric can be reconfigured after manufacturing, allowing digital logic functions to be implemented without a custom ASIC. FPGAs sit in the programmable-logic hierarchy as FPGA -> programmable logic device -> embedded processing/accelerator; they are used when designers need parallel computing, flexible I/O, and in-field updates. Stratix II is Altera's second-generation high-density FPGA family built for high-bandwidth communications, DSP, and system-level integration. Understanding this hierarchy helps engineers position the EP2S30F484C3N inside a board-level design and select appropriate configuration, memory, and power-management companion devices. Key features of the EP2S30F484C3N include 33,880 logic elements arranged in 1,694 LABs, 1,369,728 bits of embedded RAM, 342 user I/Os, and a quoted maximum internal frequency of 816.99 MHz. The device is manufactured on a 90 nm CMOS process and operates from a 1.2 V core supply. The 484-ball FC-FBGA package provides a dense interconnect for a wide interface count while keeping the PCB footprint manageable. These parameters make the device well suited for applications that require substantial on-chip logic, distributed memory, and many parallel I/O channels. Architecturally, Stratix II organizes logic in LABs containing adaptive logic modules, giving the device more efficient mapping of wide logic functions than conventional four-input LUT architectures. Embedded memory blocks support multiple data-width and synchronous modes, while the general-purpose I/O supports numerous single-ended and differential standards. In the EP2S30F484C3N, the 1,369,728 RAM bits are available for packet buffering, image line storage, or soft-processor local memory. The 90 nm process technology balances density with power, but legacy FPGAs of this family still require careful power-supply and thermal design in modern systems. Typical applications for the EP2S30F484C3N include high-bandwidth telecom packet processing, software-defined radio, video and image processing, medical imaging, and aerospace pre-processing circuits. The abundant I/Os allow direct connection to LVDS buses, commercial memory interfaces, and backplane logic. On-chip RAM reduces off-chip memory bandwidth pressure for line-rate buffering and datapath staging. Designers should also consider this FPGA for high-performance glue logic and protocol bridging where an ASIC is not justified. When using the EP2S30F484C3N, keep the 1.2 V core supply well decoupled with low-ESR ceramic capacitors and verify that the serial configuration device supports the intended power-on reset scheme. Because this is a mature 90 nm device, plan for package date code availability, thermal management, and board-level signal integrity. The configuration bitstream should be stored in an external configuration device such as an EPC or EPCS part. This page synthesizes distributor pricing, within-family drop-in alternatives, and practical design guidance not found in a single distributor listing, helping engineers evaluate the EP2S30F484C3N for new designs and legacy replacement projects.

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EP2S30F484C4 - Stratix II FPGA 33,880 Logic Elements | Intel / Altera
EP2S30F484C4

EP2S30F484C4 - Stratix II FPGA 33,880 Logic Elements | Intel / Altera

The Intel (formerly Altera) EP2S30F484C4 is a member of the Stratix II family of field-programmable gate arrays (FPGAs) built on a 90 nm process technology, integrating 33,880 logic elements, 1,369,728 RAM bits, and 1694 logic array blocks (LABs) in a 484-ball FineLine BGA (FC-FBGA-484) package. Per the manufacturer datasheet, the device supports 342 user I/Os, operates from a 1.2 V core supply, and is rated for the commercial temperature grade (0 °C to 85 °C) with a maximum core clock frequency of approximately 711 MHz. The Stratix II family introduced an adaptive logic module (ALM) architecture that delivers higher logic efficiency than the previous Stratix generation. A Field Programmable Gate Array (FPGA) is a type of programmable logic device that allows engineers to configure digital circuits after PCB assembly by loading a configuration bitstream into on-chip SRAM. FPGAs sit in the broader semiconductor hierarchy as integrated circuits (ICs) > programmable logic > programmable logic devices (PLDs) > FPGAs, and are commonly used as glue logic, DSP accelerators, high-speed serial interface bridges, and ASIC prototyping platforms. Unlike ASICs, FPGAs deliver time-to-market advantages and in-system reprogrammability at the cost of higher per-unit price and static power consumption. Key features of the EP2S30F484C4 include 13552 CLBs, 16 global clock networks, embedded 18-bit × 18-bit multipliers (DSP blocks), and support for multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL via dedicated True Physical (TPHY) interface circuitry. The device integrates up to 1.36 Mbit of embedded TriMatrix memory distributed across MRAM, M4K, and M512 blocks, enabling on-chip FIFO and packet-buffer implementations without external SRAM. Dedicated high-speed transceiver channels are not included in this density; designs requiring multi-Gbps serial links would target Stratix II GX variants. Architecturally, the Stratix II family uses an 8-input ALM with a shared arithmetic chain, allowing any 6-input LUT function to be packed alongside a second smaller LUT into the same ALM, which improves logic density versus traditional 4-input LUT architectures. The 1.2 V core is supported by on-chip voltage regulation, and configuration can be loaded through JTAG, passive serial (PS), fast passive parallel (FPP), or via an external configuration device such as the EPCS or EPC4 family. Typical applications include telecom line-card processing, industrial motor control, ASIC prototyping, video processing pipelines, and military/aerospace systems where the commercial-temp variant is acceptable. The 484-pin FBGA with 1.0 mm ball pitch supports compact board layouts while exposing 342 general-purpose I/Os, sufficient for multi-lane parallel buses. When designing with this part, designers should pay particular attention to power-plane decoupling for the 1.2 V VCCINT rail (multiple 0.1 µF + bulk 10 µF capacitors adjacent to the package), the use of Quartus II design software (the original development flow; Quartus Prime is required for newer Stratix series but Stratix II is still supported in legacy versions), and thermal management on the FC-FBGA with adequate via stitching to inner ground planes. This page synthesizes distributor pricing, drop-in Stratix II alternatives (same 484-ball footprint), and practical design notes not found in the standalone manufacturer datasheet.

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EP2S30F484C4N - Stratix II 33,880-LE FPGA 484-FBGA | Altera
EP2S30F484C4N

EP2S30F484C4N - Stratix II 33,880-LE FPGA 484-FBGA | Altera

The Altera (now Intel) EP2S30F484C4N is a Stratix II family field-programmable gate array (FPGA) with 33,880 logic elements, 1,694 logic array blocks (LABs), and 1,369,728 bits of embedded RAM, housed in a 484-ball FineLine BGA (FC-FBGA) package. Built on a 90 nm CMOS process and rated for commercial temperature grade, the device operates from a 1.2 V core supply and is specified up to 711.24 MHz internal operation. The 484-FBGA package provides 342 user I/Os, making this density suitable for mid-complexity designs that need high logic capacity and block memory. What is a Stratix II FPGA? An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs/LABs), programmable interconnect, and embedded memory and DSP resources, all controlled by an SRAM-based configuration bitstream. Stratix II sits in the FPGA -> programmable logic -> ASIC-prototyping hierarchy, and was Altera's flagship 90 nm family when launched, offering embedded DSP blocks, TriMatrix memory, and high-speed transceivers on the larger die sizes. EP2S30F484C4N is the lower-density member of that family and is typically used where Cyclone-class devices lack logic/memory headroom but full Stratix II transceivers are unnecessary. Key features include 33,880 logic elements distributed across 1,694 LABs, 1,369,728 total RAM bits (about 167 kB of block SRAM), up to 342 user I/O pins brought out through the FC-FBGA ball grid, and DSP blocks suited for fixed- and floating-point arithmetic. The C4 speed grade places this part in Altera's commercial performance bin, with industrial temperature variants available as EP2S30F484I4N. According to the Altera Stratix II Device Family Data Sheet, the device supports configuration via passive serial, JTAG, and Altera-enhanced configuration modes, plus on-chip termination calibration for DDR/DDR2 memory interfaces. Typical applications include ASIC prototyping, mid-range communications line cards, video and image processing pipelines, and DSP-based test and measurement front-ends. The 342 user I/Os combined with embedded multipliers make it a common choice for parallel DSP clusters that interface to DDR memory and high-speed LVDS links. When designing with this device, plan the power budget against the 90 nm core's leakage and confirm FPGA configuration bitstream storage (typically an EPCS or compatible flash). Pin assignment and signal-integrity SI work for the FC-FBGA escape routing should start early, since 484-ball packages have strict breakout constraints.

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