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EP3C80F484C8 - Cyclone III FPGA 81K LE 484-FBGA | Intel (Altera)
EP3C80F484C8

EP3C80F484C8 - Cyclone III FPGA 81K LE 484-FBGA | Intel (Altera)

The Intel (formerly Altera) Cyclone III EP3C80F484C8 is a low-power, high-volume Field Programmable Gate Array built on a 65 nm CMOS process and housed in a 484-ball FineLine BGA (FBGA-484, 23x23 mm, 1.0 mm pitch) package. The device delivers 81,264 logic elements (LEs), 2,810,880 bits of embedded memory (2810 Kb), and 295 maximum user I/O pins, with a core voltage of 1.2 V and internal operating performance up to 402 MHz per published Cyclone III family specifications. A Field Programmable Gate Array (FPGA) is a reconfigurable semiconductor device that lets engineers implement arbitrary digital logic - from glue logic and state machines to entire processor subsystems - via a programmable fabric of logic elements, embedded memory blocks, DSP blocks, and programmable I/O. FPGAs sit hierarchically under programmable logic devices (PLDs), alongside complex programmable logic devices (CPLDs), within the broader integrated circuit (IC) taxonomy, and are widely used as prototyping, low-volume production, and DSP/parallel-processing alternatives to ASICs and microcontrollers. Key features of the EP3C80F484C8 include 244 embedded 18x18 multipliers (DSP blocks) for high-throughput fixed-point arithmetic, four phase-locked loops (PLLs) for clock synthesis and skew management, support for external memory interfaces including DDR/DDR2/QDRII SDRAM, and a low-power architecture that targets consumer, industrial, and communications applications. The 'C8' speed grade denotes a commercial temperature device with the slowest of the Cyclone III speed grades, balancing cost and performance for non-timing-critical designs. Architecturally, the Cyclone III family leverages a logic-element fabric of 4-input look-up tables (LUTs), M9K embedded memory blocks, and dedicated DSP slices. The EP3C80 variant occupies the upper-middle of the family, providing roughly twice the LE count of the EP3C40 while remaining notably smaller and lower-cost than the EP3C120, making it the typical sweet-spot for mid-density designs. Typical applications include industrial motor control, video processing pipelines, software-defined radio (SDR) front ends, telecommunications baseband processing, and embedded control systems. The EP3C80F484C8 specifically suits designs that need DDR controller support, abundant DSP bandwidth, and a large FPGA fabric without crossing into the higher-cost EP3C120 tier. When designing with this device, plan I/O bank assignments and pin-out early because the 484-FBGA package leaves no room for late-stage changes. Use the Altera/Intel Quartus II design suite (Cyclone III device support) for synthesis, place-and-route, and timing closure; signal-integrity and power-integrity analysis are recommended for DDR interfaces. This page synthesizes distributor pricing, drop-in same-package alternatives from the Cyclone III family (same brand Intel/Altera), and practical design notes not collected on a single manufacturer or distributor page.

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EP3C80F484C8N - 81K LE Cyclone III FPGA, 484-FBGA | Intel
EP3C80F484C8N

EP3C80F484C8N - 81K LE Cyclone III FPGA, 484-FBGA | Intel

The Intel (formerly Altera) EP3C80F484C8N is a Cyclone III family Field-Programmable Gate Array (FPGA) fabricated on a low-power 65 nm process, offering 81,264 logic elements, 2,810,880 bits of embedded memory, and 295 user I/O pins in a 484-ball FineLine BGA package. The device integrates 244 embedded 18x18 multipliers and a rich mix of PLLs, global clock networks, and high-speed LVDS interfaces that are well-suited for cost-sensitive, high-volume digital designs. An FPGA is a reprogrammable semiconductor device built from an array of configurable logic blocks (CLBs) interconnected by a programmable routing fabric. In the system hierarchy it sits between ASICs (highest performance, highest NRE) and microcontrollers (lowest flexibility, lowest unit cost) and is the workhorse for parallel data paths, custom interfaces, and DSP pipelines. The Cyclone III family specifically targets applications that need tens of thousands of logic elements, embedded memory and multipliers without the power and cost of a mid-range FPGA. Key features include 81,264 logic elements, 2,810,880 RAM bits distributed in M9K blocks, 244 embedded 18 x 18 multipliers, four general-purpose PLLs, 20 global clock networks, and support for LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards. The device supports up to 402 MHz internal operation and operates from a 1.2 V core supply. Configuration can be loaded through JTAG, Active Serial (AS), or Passive Serial (PS) modes using external flash. Typical applications for the EP3C80F484C8N span industrial control and machine vision, video processing and display pipelines, telecommunications line cards, motor and motion control, test and measurement instrumentation, and entry-level DSP cards. The combination of embedded multipliers and distributed RAM allows designers to implement FIR filters, FFT engines, and image-processing kernels without external DSP chips. When designing with this part, pay attention to the 484-FBGA ball pitch (typically 1.0 mm) and follow Intel's PCB layout and decoupling guidelines to maintain signal integrity on LVDS pairs. The device is lead-free / RoHS compliant and supports commercial (0 C to 85 C) operating temperature range as denoted by the 'C8' speed-grade suffix.

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EP3C80F484I7 - Cyclone III FPGA, 81K LE, 484-FBGA | Intel
EP3C80F484I7

EP3C80F484I7 - Cyclone III FPGA, 81K LE, 484-FBGA | Intel

The Intel (formerly Altera) EP3C80F484I7 is a Cyclone III field-programmable gate array (FPGA) featuring 81,264 logic elements, 2,810,880 bits of embedded memory, and 295 user I/Os in a 484-ball FineLine BGA package. Built on a 65 nm low-power CMOS process, this device operates from a 1.2 V core supply and supports up to 472 MHz internal operation, targeting cost-sensitive high-volume applications. An FPGA (Field-Programmable Gate Array) is a semiconductor device built from a matrix of configurable logic blocks (CLBs) connected via programmable interconnect. FPGAs belong to the broader category of programmable logic devices (PLDs), which sit alongside ASICs in the digital IC hierarchy: PLD -> FPGA -> CPLD (simpler) and FPGA -> SoC FPGA (more complex). Unlike fixed-function ASICs, FPGAs can be reconfigured in the field to implement arbitrary digital logic, making them ideal for prototyping, low-volume production, and designs requiring late-stage hardware changes. The Cyclone III family delivers up to 200K logic elements, up to 8 Mbits of RAM, and integrated multipliers, while consuming a fraction of the power of previous-generation FPGAs. The EP3C80F484I7 specifically offers 5,079 LABs, 244 M9K memory blocks, four PLLs, and supports external memory interfaces including DDR, DDR2, and QDRII SRAM. Its 484-ball FBGA package with 1.0 mm ball pitch simplifies PCB layout and supports standard reflow processes. This part is well suited for applications such as industrial motor control, video processing pipelines, software-defined radio (SDR) baseband, automotive infotainment pre-development, and high-volume consumer electronics. The Cyclone III architecture supports the Nios II soft-core processor, enabling complete microcontroller/SoC functionality within a single FPGA. Designers benefit from the Quartus II design software with extensive IP libraries. When designing with this device, pay close attention to power sequencing - the 1.2 V core, 2.5 V analog, and I/O voltages must ramp in a defined order to prevent latch-up. The device supports hot-socketing and has dedicated JTAG pins for boundary-scan testing. For high-speed memory interfaces, use the dedicated DQS pins and follow Intel's pinout guidelines to achieve the rated 472 MHz performance.

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EP3C80F484I7N - Cyclone III FPGA 81K LE 484-FBGA | Intel
EP3C80F484I7N

EP3C80F484I7N - Cyclone III FPGA 81K LE 484-FBGA | Intel

The Intel (Altera) EP3C80F484I7N is a low-power Cyclone III field-programmable gate array (FPGA) with 81,264 logic elements, 2,810,880 bits of embedded memory, and 295 user I/O pins, packaged in a 484-ball FineLine BGA (FBGA-484, 23x23 mm, 1.0 mm pitch). It belongs to the industrial-temperature grade (I7: -40C to +100C junction) and targets cost-sensitive, high-volume applications. A field-programmable gate array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP such as memory blocks, multipliers, PLLs, and transceivers, all of which can be re-programmed in the field to implement arbitrary digital logic. FPGAs sit hierarchically between standard microcontrollers (fixed instruction set, software-defined behavior) and application-specific integrated circuits (ASICs, fixed hardware). Within the broader taxonomy, the EP3C80F484I7N belongs to the Cyclone III family, which is itself a low-power, high-volume sub-family of Intel's FPGA portfolio aimed at industrial, automotive driver-assist, video, and communications designs. Key features of the EP3C80F484I7N include 81,264 logic elements, 2,810,880 RAM bits distributed across M9K memory blocks, 244 dedicated 18x18 multipliers (sufficient for DSP-class workloads such as video processing or software-defined radio baseband), four general-purpose PLLs, and 295 user I/O. The device is built on a 60 nm low-power process and operates from a 1.2 V core supply (VCCINT 1.15 V to 1.25 V), with separate VCCIO banks that support 1.5 V, 1.8 V, 2.5 V, 3.0 V, and 3.3 V interfacing. Architecturally, the device pairs an SRAM-based LUT fabric with embedded hard IP - including M9K memory blocks, 18x18 multipliers, and PLLs - to deliver a balanced logic/memory/DSP ratio at lower static and dynamic power than prior Cyclone generations. The 60 nm process and optimized clock network allow typical commercial applications to operate without active thermal management even at full utilization. Typical applications include industrial motor control and machine vision, video surveillance and image processing pipelines, software-defined radio (SDR) baseband, automotive driver-assistance subsystems, and low-cost ASIC prototyping. The wide VCCIO support enables direct bridging between 3.3 V legacy peripherals and 1.8 V modern serializer/deserializer links without external level shifters. When designing with the EP3C80F484I7N, ensure that the Quartus II toolchain (version 13.0sp1 or later with device support, or Quartus Prime 17.0 legacy mode) is used; that all VCCINT and VCCIO rails are decoupled per the AN 529 design guidelines; and that JTAG and configuration pin pull-ups are correctly placed for the selected configuration mode (AS, PS, JTAG, or Fast Passive Parallel). This page synthesizes distributor pricing, verified drop-in equivalents within the Cyclone III family, and practical Quartus design notes that are not duplicated in any single manufacturer document - giving procurement and design engineers a single landing page for the EP3C80F484I7N.

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EP3C80F780C6 - Cyclone III FPGA 81K LE 780-FBGA | Altera
EP3C80F780C6

EP3C80F780C6 - Cyclone III FPGA 81K LE 780-FBGA | Altera

The Altera EP3C80F780C6 is a Cyclone III family Field Programmable Gate Array (FPGA) with 81,264 logic elements, 429 user I/O, and 2,810,880 bits of embedded memory, fabricated on a 65 nm low-power process and housed in a 780-pin FineLine BGA (FBGA) package. The 'C6' speed grade supports up to 500 MHz internal operation with a core voltage of 1.2 V, targeting high-volume, low-power applications such as industrial control, video processing, and communications infrastructure. An FPGA (Field Programmable Gate Array) is a reprogrammable semiconductor device containing an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hardware such as multipliers, memory blocks, and phase-locked loops. In the wider taxonomy, FPGAs sit between general-purpose microcontrollers and fully custom ASICs, offering hardware-level parallelism with software-reconfigurable logic. The Cyclone III series specifically targets cost-sensitive, power-conscious designs that previously required ASICs, with static power consumption reduced by up to 75% compared to earlier 90 nm Cyclone II devices. Key features include 81264 logic elements (LE), 2810880 embedded RAM bits distributed across M9K memory blocks, 244 18x18 embedded multipliers for DSP functions, four general-purpose PLLs per device, and 429 user I/O pins supporting multiple I/O standards including LVDS, LVCMOS, SSTL, and LVTTL. The 780-FBGA package uses a 1.0 mm ball pitch for board compatibility with mainstream PCB manufacturing, and supports hot-socketing for live insertion into backplanes. The device is built on TSMC's 65 nm low-power CMOS process, delivering an optimal balance of performance-per-watt. Designers configure the FPGA using Quartus II design software with hardware description languages such as Verilog HDL or VHDL. Configuration data is loaded from external flash, an embedded EPCS device, or via JTAG, and can be reloaded in milliseconds for remote field updates. Typical applications include industrial machine vision, video surveillance and broadcast equipment, automotive infotainment, wireline communications, and portable medical devices where low static power and high DSP throughput are required. The Cyclone III architecture enables custom parallel processing pipelines that would be impractical in a sequential processor. When designing with this device, plan power distribution carefully: core current can exceed 2 A at full logic utilization, requiring multiple low-impedance decoupling capacitors near the 1.2 V supply pins. Thermal management is also important - the 780-FBGA has a junction-to-ambient thermal resistance of approximately 14 C/W with proper PCB thermal vias, but high-utilization designs may require airflow. This page synthesizes distributor pricing, pin-compatible Cyclone III alternatives, and practical design notes not found in the Altera datasheet, helping engineers select, source, and integrate the EP3C80F780C6 with confidence.

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EP3C80F780C6N - Cyclone III FPGA 81K LE 780-FBGA | Intel
EP3C80F780C6N

EP3C80F780C6N - Cyclone III FPGA 81K LE 780-FBGA | Intel

The Intel (formerly Altera) EP3C80F780C6N is a high-density, low-power Cyclone III Field Programmable Gate Array (FPGA) delivering 81,264 logic elements, 2,810,880 bits of embedded memory, and 429 maximum user I/O pins in a 780-ball FineLine BGA package. It is fabricated on a 65 nm low-power process and operates with a core voltage of 1.2 V, offering a balance of functional density, performance, and power efficiency for cost-sensitive embedded and signal-processing designs. A Field Programmable Gate Array (FPGA) is a type of programmable logic device that combines the integration density of an ASIC with the flexibility of in-system reprogrammability. FPGAs sit above CPLDs in the programmable logic hierarchy and below fixed-function ASICs in NRE cost; they are used to implement custom datapaths, parallel DSP blocks, memory interfaces, and high-speed serial protocols without the cost and lead time of a custom IC. Cyclone III FPGAs specifically target the low-power segment of the FPGA market, where designers need tens of thousands of logic elements and embedded multipliers without the power budget of high-end transceivers. Key features of the EP3C80F780C6N include four PLLs, 281 embedded 18x18 multipliers, 4 Mbits of embedded SRAM (2,810,880 bits), Cyclone III architecture support for DDR/DDR2/QDRII external memory interfaces, and 429 user I/O pins distributed across 8 I/O banks. The device supports LVDS, SSTL, and LVTTL I/O standards, and is supported by the Quartus II / Quartus Prime design toolchain. The device is offered in the commercial temperature grade (0 C to +85 C). Architecturally, the EP3C80F780C6N uses look-up-table (LUT)-based logic elements, dedicated 18x18 multiplier blocks for DSP workloads, and embedded SRAM columns distributed across the fabric. The 65 nm TSMC process gives a typical static power figure well below 100 mW, making the Cyclone III family popular for industrial, automotive infotainment, video processing, and motor control applications. Typical applications include industrial motor control, video surveillance and image processing pipelines, automotive driver-assistance preprocessing, software-defined radio front-ends, and embedded DSP cards. The high logic density and embedded multipliers make it particularly attractive for parallel processing tasks where a microcontroller or DSP alone would be too slow. When designing with this device, plan for at least 12 PCB layers to escape the 780-ball BGA cleanly, and use the Quartus II pin planner to assign I/O banks to compatible voltage rails. Leave 20% logic and 30% memory headroom for late-stage ECOs to avoid running out of fabric on design closure. This page synthesizes distributor pricing, FPGA-class drop-in alternatives, and practical PCB-layout guidance that are not aggregated on a single manufacturer or distributor page, giving you a one-stop reference for sourcing and substitution decisions.

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EP3C80F780C7 - Cyclone III 81K LE FPGA, 780-FBGA | Intel
EP3C80F780C7

EP3C80F780C7 - Cyclone III 81K LE FPGA, 780-FBGA | Intel

The Intel (formerly Altera) EP3C80F780C7 is a Cyclone III Field Programmable Gate Array (FPGA) with 81,264 logic elements, 2,810,880 bits of embedded memory, and 429 user I/O pins, housed in a 780-ball FineLine BGA (FBGA) package. It is fabricated on a low-power 65 nm CMOS process and is targeted at cost-sensitive, high-volume applications where the combination of high logic density, embedded multipliers, and low static power is required. Cyclone III FPGAs belong to the broader family of SRAM-based programmable logic devices, which sit within the semiconductor hierarchy as follows: FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit. Unlike CPLDs (Complex Programmable Logic Devices) which use non-volatile flash or EEPROM configuration memory, SRAM-based FPGAs must be configured at every power-up from an external flash memory, but in exchange offer far higher logic density, embedded memory blocks, hardware multipliers, and DSP blocks. Cyclone III occupies the low-power, low-cost end of the SRAM-FPGA segment, making it a popular choice for industrial control, video processing, and communications infrastructure where power and cost are critical constraints. Key differentiating specifications include up to 81,264 logic elements, 2,810,880 embedded RAM bits organized in M9K blocks, 244 embedded 18x18 hardware multipliers, and four phase-locked loops (PLLs). The device supports LVDS, LVCMOS, SSTL, and HSTL I/O standards across 8 I/O banks, and operates from a 1.2 V core supply with separate VCCIO banks for flexible I/O voltage interfacing. Static power consumption is dramatically reduced compared to Cyclone II thanks to the 65 nm process. The EP3C80F780C7 architecture consists of LABs (Logic Array Blocks) containing 16 Logic Elements each, interconnected by a multi-tier routing fabric. Embedded multiplier blocks and M9K memory blocks are distributed in columns alongside the LABs, providing efficient implementation of DSP pipelines and FIFO buffers. The configuration scheme uses a serial or parallel flash loader, with bitstream decryption available via the AES-128 option on higher-tier Cyclone III LS devices. Typical applications include industrial machine vision, motor control and servo drive, broadcast video processing, software-defined radio baseband, telecom line cards, and portable medical instrumentation. The combination of high logic density and embedded DSP blocks makes the EP3C80F780C7 well suited to parallel signal-processing tasks where microcontrollers or DSP processors cannot meet throughput. When designing with this device, plan for an external configuration flash (EPCS or compatible) because the FPGA is SRAM-based. Maintain solid power-plane decoupling on the 1.2 V core rail and observe simultaneous switching output (SSO) guidelines for the 780-ball FBGA to maintain signal integrity. This page synthesizes distributor pricing across 19 channels, verified drop-in alternatives sharing the same 780-FBGA footprint, and practical design notes covering configuration, power sequencing, and signal integrity that go beyond the manufacturer datasheet itself.

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EP3C80F780C7N - 81264 LE Cyclone III FPGA 780-FBGA | Intel / Altera
EP3C80F780C7N

EP3C80F780C7N - 81264 LE Cyclone III FPGA 780-FBGA | Intel / Altera

The Intel / Altera EP3C80F780C7N is a low-power Cyclone III Field Programmable Gate Array (FPGA) integrating 81,264 logic elements (LEs) into a 780-ball FineLine BGA package at 29 x 29 mm. Built on a low-k dielectric TSMC 65 nm CMOS process, it targets cost-sensitive, high-volume applications where power efficiency, density, and price-per-logic-element are critical decision factors. The device is rated for a maximum internal clock frequency of 472.5 MHz. A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device whose logic fabric, interconnect, and I/O cells are configured by the user via a hardware description language such as Verilog or VHDL. FPGAs sit between fixed-function ASICs and software-driven microcontrollers in the design hierarchy, offering ASIC-class parallelism without NRE cost. The Cyclone III family is Intel's mid-density, low-power line positioned for industrial control, video processing, and consumer electronics. Key features include 81,264 LEs, 2,810,880 bits of embedded memory (RAM), 429 maximum user I/O pins, 4 PLLs, and 288 embedded 18 x 18 multipliers for DSP workloads. The device supports multiple I/O standards (LVDS, LVCMOS, SSTL, HSTL) at up to 16 global clock networks, while on-chip configuration memory retains bitstream contents without external boot ROM when configured in serial or parallel modes. Typical applications span industrial motor control, video surveillance and image processing pipelines, automotive infotainment and driver-assistance subsystems, communication protocol bridging, and portable test-and-measurement equipment. The 65 nm process yields static power in the tens of mW, allowing fanless operation even at elevated ambient temperatures. When designing with the EP3C80F780C7N, observe the JTAG configuration pin assignments and provide adequate decoupling (typically 0.1 uF plus 10 uF bulk per power rail) near the FBGA balls. The 780-BGA requires a multi-layer PCB with microvia or via-in-pad technology for reliable assembly.

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EP3C80F780C8 - Cyclone III FPGA 81K LE 780-FBGA | Intel | Altera
EP3C80F780C8

EP3C80F780C8 - Cyclone III FPGA 81K LE 780-FBGA | Intel | Altera

The Intel (formerly Altera) EP3C80F780C8 is a Cyclone III Field Programmable Gate Array (FPGA) built on a 65 nm low-power process, providing 81,264 logic elements, 2,810,880 bits of embedded memory, and 429 maximum user I/O pins in a 780-ball FineLine BGA (FBGA) package. As a member of the Cyclone III family, it targets cost-sensitive, power-conscious high-volume applications that require high logic density and rich memory resources. What is an FPGA? A Field Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) belonging to the semiconductor integrated circuit hierarchy. It contains an array of configurable logic blocks (CLBs), programmable interconnects, embedded memory blocks, multipliers, and I/O cells. After manufacturing, the FPGA's function is defined by a user-supplied configuration bitstream loaded into SRAM-based configuration cells. In the broader system hierarchy, an FPGA sits between standard programmable logic (CPLD) and full Application-Specific Integrated Circuits (ASIC) - offering ASIC-like performance and parallelism with the flexibility of in-system reprogrammability. Key features include 81,264 logic elements arranged in a fabric of M9K memory blocks totaling 2,810,880 RAM bits, 244 embedded 18x18 multipliers, four general-purpose PLLs per device, and 429 maximum user I/O supporting multiple I/O standards (LVDS, LVCMOS, SSTL, HSTL). The device operates from a 1.2 V core supply and supports commercial temperature grades (0C to +85C), with industrial grade variants also available. Configuration is handled via active serial (AS), passive serial (PS), JTAG, or Fast Passive Parallel (FPP) modes using external or in-package configuration devices. The Cyclone III architecture uses 65 nm TSMC process technology with low-k dielectric, achieving up to 50% lower dynamic power than the prior Cyclone II family at equivalent performance. The M9K memory blocks support true dual-port, simple dual-port, and single-port RAM configurations up to 36 kbits per block, while dedicated 18x18 hardware multipliers enable DSP functions without burning logic resources. The Quartus II / Quartus Prime design suite supports the entire Cyclone III family with synthesis, place-and-route, timing closure, and on-chip debug via SignalTap II. Typical applications include industrial motor control and machine vision, video processing and display controllers, telecommunications line cards and protocol bridging, automotive infotainment prototyping, test and measurement instrumentation, software-defined radio (SDR), and low-cost ASIC prototyping. The combination of high logic density and embedded multipliers makes the EP3C80 particularly suited for mid-range DSP pipelines and parallel data acquisition. When designing with this device, pay close attention to power supply sequencing - the 1.2 V core, 2.5 V PLL analog, and 3.3 V I/O rails must power up in the order specified by the datasheet to avoid latch-up. Use multiple decoupling capacitors (0.1 uF and 10 uF) near each power pin and keep configuration traces short to avoid bitstream loading errors. This page consolidates distributor pricing snapshots, drop-in same-package alternatives, application examples, and practical design guidance that go beyond the raw datasheet, helping engineers select and integrate the EP3C80F780C8 with confidence.

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EP3C80F780C8N - 81K LE Cyclone III FPGA, 780-FBGA | Intel / Altera
EP3C80F780C8N

EP3C80F780C8N - 81K LE Cyclone III FPGA, 780-FBGA | Intel / Altera

The Intel / Altera EP3C80F780C8N is a low-power, high-volume Cyclone III Field Programmable Gate Array (FPGA) delivering 81,264 logic elements (LE), 2,810,880 bits of embedded memory (RAM), and 429 user I/O pins in a 780-ball FineLine BGA package. Fabricated on a 60 nm TSMC low-k process, it supports up to 472 MHz internal operation and consumes roughly a quarter of the power of the prior Cyclone II generation. A Field Programmable Gate Array (FPGA) is a reconfigurable digital integrated circuit that combines programmable Look-Up Tables (LUTs), programmable interconnect, embedded block RAM, DSP blocks, and high-speed transceiver/PLL resources on a single die. FPGAs belong to the broader hierarchy: programmable logic -> logic IC -> integrated circuit. Compared with ASICs, FPGAs offer lower NRE cost, faster time-to-market, and field re-programmability, which is why engineers choose them for prototyping, low-volume production, and designs that need late-stage I/O or protocol updates. Key features of the EP3C80F780C8N include four phase-locked loops (PLLs), 244 embedded 18x18 multipliers (DSP blocks) suitable for moderate DSP workloads, and support for multiple I/O standards (LVDS, LVTTL, LVCMOS, SSTL, HSTL, PCI, PCI-X). It offers Nios II embedded processor support and is supported by the Quartus II design toolchain (Cyclone III device family). The 780-FBGA package has a 29x29 mm body, 1.0 mm ball pitch, and 2.60 mm height, easing PCB escape routing relative to finer-pitch BGA options. Typical applications span industrial motor control, video surveillance and image processing, automotive infotainment, telecom line cards, and handheld test equipment. Designers favor the Cyclone III family for its low static and dynamic power versus older families, which simplifies thermal budgets in fanless enclosures. When designing with this part, validate that the 1.0 mm pitch FBGA can be manufactured with your PCB fab's BGA capability. Use Quartus II 13.0sp1 or later for synthesis, and plan the decoupling network around the PLL analog supply pins (VCCA_PLL) with a 0.1 uF + 10 uF combination for jitter performance. This page synthesizes distributor pricing, drop-in same-package alternatives within the Cyclone III family, and practical board-level guidance not found in the manufacturer datasheet alone.

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EP3C80F780C8NAF - Cyclone III FPGA 81K LE 780-BGA | Altera
EP3C80F780C8NAF

EP3C80F780C8NAF - Cyclone III FPGA 81K LE 780-BGA | Altera

The Altera EP3C80F780C8NAF is a Cyclone III family field-programmable gate array (FPGA) integrating 81,264 logic elements, 2,810,880 bits of embedded memory, and 4 PLLs into a 780-ball FineLine BGA package. Speed grade C8 and commercial temperature grade make it suited to cost-sensitive, high-volume digital logic designs where the proven Cyclone III architecture is preferred over newer families. A Field Programmable Gate Array (FPGA) is a semiconductor IC whose logic function is defined by a customer-supplied configuration bitstream rather than fixed at the fab. FPGAs occupy a distinct position in the digital design hierarchy: they sit above discrete logic ICs and below application-specific integrated circuits (ASICs), bridging the gap between software-like design flows and hardware-implemented performance. Cyclone III devices are low-power, low-cost SRAM-based FPGAs, with this variant falling into the higher-density tier of the family. Key features include 81,264 logic elements (LEs), 2,810,880 total RAM bits, 244 embedded 18x18 multipliers, 4 phase-locked loops (PLLs), and up to 429 user I/O pins. The 780-pin FineLine BGA exposes a wide I/O count, supporting multiple high-speed external memory interfaces and LVDS channels on a single die. Configuration is via the standard Altera active serial (AS), passive serial (PS), or JTAG paths. Typical applications include industrial motor and motion control, video processing pipelines, telecom baseband pre-processing, prototyping for ASICs, and embedded DSP for instrumentation. The C8 speed grade corresponds to an internal performance tier appropriate for parallel datapaths and moderate-clock peripherals rather than highest-frequency serial transceivers. When designing with this part, account for the SRAM-based configuration that requires a non-volatile boot device on every board. The 780-FBGA package also demands careful PCB layout, controlled-impedance routing, and power-rail sequencing; an accompanying Intel/Altera pinout should always be used. Plan JTAG access early to keep debug accessible on production boards. This page synthesizes distributor stock data, drop-in same-package alternatives within the Cyclone III family, and practical design considerations not aggregated on a single manufacturer page, so engineers and procurement teams can make faster source-of-truth decisions.

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EP3C80F780I7 - Cyclone III FPGA 81K LE 780-FBGA | Altera
EP3C80F780I7

EP3C80F780I7 - Cyclone III FPGA 81K LE 780-FBGA | Altera

The Intel / Altera EP3C80F780I7 is a Cyclone III low-cost field-programmable gate array (FPGA) delivering 81,264 logic elements, 2,810,880 bits of embedded memory, and 429 maximum user I/Os in a 780-ball FineLine BGA package. It is fabricated on a 65 nm TSMC low-k process and operates from a 1.2 V core supply with a maximum internal frequency of 437.5 MHz (per FindIC aggregated spec). An FPGA is a reprogrammable semiconductor device that allows designers to implement custom digital logic, memory, and DSP blocks after PCB fabrication. Cyclone III FPGAs sit in the low-power, low-cost tier of Altera's (now Intel FPGA) portfolio and target cost-sensitive applications requiring moderate logic density. They are commonly used as glue logic, video/image processing engines, motor-control co-processors, and protocol bridges. Cyclone III sits below Cyclone IV/V/10 in cost per logic element, while offering integrated multipliers, PLLs, and external memory interfaces that were once limited to higher-end families. Key features of the EP3C80F780I7 include 81,264 logic elements organized into 5,079 logic array blocks (LABs), 281 embedded 9-Kbit M9K memory blocks (totaling ~2.8 Mbits), 244 embedded 18x18 multipliers for DSP, 4 general-purpose PLLs, and 20 global clock networks. The device supports external memory interfaces including DDR, DDR2, SDR SDRAM, and QDRII SRAM, with dedicated DQS pins. The 780-FBGA package has a 1.0 mm ball pitch and 29 x 29 mm body suitable for industrial-temperature (-40C to +100C) operation. The architecture is built around an SRAM-based LUT fabric with row and column interconnect, embedded RAM blocks, and DSP slices. Configuration is loaded via JTAG, Active Serial (AS), Active Parallel (AP), or Passive Serial (PS) modes from external flash. Cyclone III devices are supported by the Quartus II design suite (legacy) and are still maintained for industrial designs. Note that the Cyclone III family has been in production for many years and may show Last Time Buy / Not Recommended for New Designs status - check current Intel FPGA product status before starting new designs. Typical applications include industrial machine vision, video surveillance encoders, motor-control co-processors, software-defined radio baseband, test and measurement instruments, medical imaging preprocessing, and low-cost ASIC prototyping. The 1.2 V core and 2.5/3.3 V I/O banking make board design similar to other 65 nm FPGAs. When designing with this part, ensure adequate decoupling on all VCCINT and VCCA rails per the Pin Connection Guidelines, and follow the JTAG chain layout in the device handbook. The EP3C80F780I7 is the industrial-temperature variant; the commercial-temperature equivalent is EP3C80F780C7/C8. For newer designs, consider Cyclone IV E (EP4CE80) or Cyclone 10 LP (10CL080) as successors with active product status. This page synthesizes distributor pricing, same-brand drop-in alternatives from the Cyclone III family, and practical design notes not found in the manufacturer datasheet alone.

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EP3C80F780I7N - 81K LE Cyclone III FPGA 780-FBGA | Intel
EP3C80F780I7N

EP3C80F780I7N - 81K LE Cyclone III FPGA 780-FBGA | Intel

The Intel EP3C80F780I7N is a Cyclone III family Field-Programmable Gate Array (FPGA) featuring 81,264 logic elements, 2,810,880 bits of embedded memory, and 429 user I/Os, housed in a 780-ball FineLine BGA (FBGA-780) package measuring 29 x 29 mm with 1 mm ball pitch. Built on a low-power 60 nm process, the device is offered in the industrial temperature grade (-40C to +100C) and supports up to 4 PLLs and 472 MHz internal operation. A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that combines programmable logic blocks, interconnect, and I/O cells on a single semiconductor die. Within the broader taxonomy, an FPGA belongs to the integrated circuit family, sits under programmable logic devices, and is commonly used for parallel digital signal processing, hardware acceleration, glue logic, and rapid prototyping. The Cyclone III family specifically targets low-cost, low-power, high-volume applications where designers need substantial logic and memory but want to minimize static and dynamic power compared with prior Cyclone generations. Key features include 81,264 logic elements, 2,810,880 RAM bits, 429 maximum user I/Os, four PLLs for clock management, and 20 global clock networks. The FBGA-780 package exposes 4 phase-locked loops for clock synthesis and distribution, supporting common telecom and video clock rates. The device operates from a 1.2 V core supply with separate I/O banks that can be configured to 1.5 V, 1.8 V, 2.5 V, 3.3 V, or differential signaling standards including LVDS. From an architecture standpoint, Cyclone III uses 60 nm process geometry with embedded SRAM configuration cells and a MultiTrack interconnect structure. Logic elements combine a 4-input look-up table (LUT), a programmable register, and carry-chain arithmetic support. Embedded memory blocks (M9K blocks) deliver true dual-port, single-port, shift-register, and ROM modes, and DSP blocks enable hardware multiply-accumulate operations without consuming general logic. Typical applications include industrial control and motor drives, video processing and broadcast equipment, telecom interface cards, test and measurement instrumentation, and consumer electronics requiring flexible I/O. The wide I/O count also makes the EP3C80 suitable for prototype ASIC replacement and parallel data acquisition systems. When designing with this device, ensure PCB layout accounts for the 1 mm ball pitch and 29 x 29 mm footprint of the FBGA-780 package; use at least 6-layer stack-up with dedicated power and ground planes, and follow the Intel pin connection guidelines for unused pins and bank power. Quartus II (or the current Quartus Prime) design software is required for synthesis, place-and-route, and configuration bitstream generation. This page synthesizes distributor pricing, drop-in equivalents across the Cyclone III family, and practical FPGA design notes not found in the standalone manufacturer datasheet.

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EP3C80U484C6 - Cyclone III FPGA, 81K LE, 484-UBGA | Intel
EP3C80U484C6

EP3C80U484C6 - Cyclone III FPGA, 81K LE, 484-UBGA | Intel

The Intel EP3C80U484C6 is a member of the Cyclone® III family of low-power, high-volume FPGAs, delivering 81,264 logic elements in a 484-ball FineLine BGA (UBGA) package with commercial temperature grade and speed grade 6. It pairs 2,810,880 bits of embedded memory with 295 maximum user I/O pins, targeting cost-sensitive applications that require high logic density without Stratix-class power budgets. A field-programmable gate array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hardware such as block RAM and DSP blocks. FPGAs belong to the broader class of programmable logic devices (PLDs) within the digital IC hierarchy, sitting between fixed-function ASICs (lower NRE, lower flexibility) and software-driven microcontrollers (lower density, sequential execution). The Cyclone III family specifically targets the "low-cost, low-power" segment of this hierarchy, displacing ASICs and DSP+microcontroller combinations in high-volume industrial, consumer, and automotive designs. Key features of the EP3C80U484C6 include four phase-locked loops (PLLs) for clock management, up to 295 user I/Os supporting LVDS, LVTTL, and other single-ended I/O standards, dedicated 18x18 hardware multipliers (244 total) for DSP workloads, and Cyclone III's signature low static power architecture. The C6 speed grade places this part in the mid-speed tier for the family, while the commercial (0C to 85C) temperature rating keeps cost below industrial equivalents. Architecture-wise, the Cyclone III device is fabricated on a 65nm TSMC process and uses a logic-structure of LABs (Logic Array Blocks) containing 16 logic elements each. The Memory blocks total 4,488,888 bits when M9K memories are fully utilized, and embedded memory supports true dual-port, simple dual-port, and single-port modes at up to 315 MHz. JTAG and passive serial configuration interfaces are standard, with optional on-chip configuration decompression and decompression acceleration. Typical applications include industrial motor control, video surveillance and image processing, telecom line cards, USB/Ethernet bridging, low-cost ASIC prototyping, and embedded automotive infotainment pre-production. The 484-UBGA package suits designs that need maximum I/O count while accepting BGA assembly costs. When designing with the EP3C80U484C6, ensure PCB layout uses microvia-compatible stackup for the 1.0mm pitch BGA and that all four PLL analog supplies are properly filtered. Designers migrating from Cyclone II can reuse most RTL with Quartus II version 9.0 or later, but should re-verify timing closure because the LAB architecture changed. This page synthesizes current distributor pricing, drop-in same-package alternatives within the Cyclone III family, and practical design notes that complement the manufacturer datasheet.

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EP3C80U484C6N - Cyclone III FPGA 81K LE 295 I/O | Altera | 484-UBGA
EP3C80U484C6N

EP3C80U484C6N - Cyclone III FPGA 81K LE 295 I/O | Altera | 484-UBGA

The Altera EP3C80U484C6N is a Cyclone III low-power Field Programmable Gate Array (FPGA) containing 81,264 logic elements, 2,810,880 bits of embedded memory, and 295 user I/Os, housed in a 484-pin UBGА (Ultra FineLine BGA) package. It is fabricated on TSMC's 65 nm low-power process and supports core logic at 1.2 V with multi-voltage I/O banks from 1.2 V to 3.3 V for flexible interface bridging. A Field Programmable Gate Array (FPGA) is a reconfigurable semiconductor device built from an array of programmable logic blocks (LUTs, flip-flops, DSP blocks, and embedded memory) interconnected by a programmable routing fabric. Within the digital logic hierarchy, an FPGA sits between fixed-function ASICs and software-driven microcontrollers, offering hardware-level parallelism with software-like design iteration. Cyclone III specifically targets cost- and power-sensitive applications by combining high logic density with industry-leading low static and dynamic power consumption. Key features of the EP3C80U484C6N include up to 4 PLLs for clock management, 250 hardware multipliers (18x18) for DSP workloads, support for external memory interfaces including DDR/DDR2/QDRII SRAM, and 484-pin UBGА packaging at the C6 speed grade. The device supports common I/O standards such as LVDS, LVCMOS, SSTL, and PCI, enabling direct connection to processors, memories, and high-speed parallel peripherals. The Cyclone III architecture leverages TSMC's 65 nm low-power process, adaptive logic modules (ALMs), and column-based memory blocks to deliver high logic density at low static power. Configuration is loaded via passive serial (PS), fast passive parallel (FPP), or JTAG, allowing fast in-system reprogramming. Hardware multipliers and DSP blocks accelerate signal-processing kernels at full FPGA parallelism without burdening soft logic. Typical applications for the EP3C80U484C6N span industrial motor control, video surveillance and image processing, automotive driver-assistance, test and measurement front-ends, and protocol bridging. Its combination of logic, memory, and DSP resources makes it well suited for systems requiring parallel I/O, real-time signal processing, or multi-protocol glue logic between processors and peripherals. When designing with this device, pay close attention to power-supply sequencing: the 1.2 V core must come up before I/O banks to avoid latch-up, and decoupling must follow the Quartus II pin connection guidelines. JTAG and configuration pins must be terminated correctly to guarantee reliable in-field updates, and PCB layout must follow Altera's recommended BGA escape and via pattern. This page synthesizes distributor pricing, same-brand Cyclone III drop-in alternatives, and practical FPGA design notes that go beyond the manufacturer datasheet to support sourcing and design decisions.

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EP3C80U484C7 - Cyclone III FPGA, 81K LEs, 484-FBGA | Intel
EP3C80U484C7

EP3C80U484C7 - Cyclone III FPGA, 81K LEs, 484-FBGA | Intel

The Intel (formerly Altera) EP3C80U484C7 is a Cyclone III low-power Field-Programmable Gate Array (FPGA) housed in a 484-ball FineLine BGA (UBGA) package. It integrates 81,264 logic elements, 2,810,880 bits of embedded memory organized as 295 M9K blocks, and 244 embedded 18x18 multipliers, providing a balanced logic/DSP/memory fabric for cost-sensitive, power-aware designs. A Field-Programmable Gate Array (FPGA) is a reprogrammable semiconductor device that lets engineers implement arbitrary digital logic in configurable logic blocks (CLBs), routed by a programmable interconnect matrix. FPGAs sit between microcontrollers and ASICs in the design hierarchy: microcontrollers execute software, ASICs implement fixed hardware, and FPGAs provide custom hardware that can be reconfigured per project. The Cyclone III family targets low static and dynamic power, making it well-suited to high-volume, thermally constrained products. Key features of the EP3C80U484C7 include four phase-locked loops (PLLs) for clock management, up to 429 user I/O pins, dedicated DDR/DDR2/QDRII SDRAM memory interfaces, and support for LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards. Configuration is handled through passive serial, active serial, or JTAG modes, with built-in decompression and encryption using AES for bitstream protection. The device is fabricated on a TSMC low-power 65-nm process, which reduces dynamic power consumption by up to 50% compared to the previous Cyclone II generation. Core voltage is 1.2 V, I/O voltage banks operate independently between 1.2 V and 3.3 V, and junction temperature ranges from 0 C to 85 C for the commercial speed grade -7. Typical applications include industrial motor control, video surveillance, automotive infotainment pre-processing, consumer display controllers, and PCIe endpoint bridging. The combination of DSP blocks, embedded memory, and abundant I/O makes the EP3C80 a common choice as the main processing or glue-logic device in mid-volume embedded platforms. When designing with this device, allocate sufficient PCB area for the 484-ball FBGA and follow Intel's recommended decoupling scheme to maintain signal integrity for high-speed DDR interfaces. Quartus II design software (or the newer Quartus Prime Lite edition) is required for synthesis, place-and-route, and bitstream generation; the EP3C80 is fully supported up to Quartus Prime 21.1. This page synthesizes distributor pricing, drop-in alternatives within the Cyclone III family, and practical design notes not found in the standalone manufacturer datasheet.

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EP3C80U484C7N - 81,264-L FPGA, 295 I/O, 484-UBGA | Altera
EP3C80U484C7N

EP3C80U484C7N - 81,264-L FPGA, 295 I/O, 484-UBGA | Altera

Altera EP3C80U484C7N is a Cyclone III field-programmable gate array containing 81,264 logic cells and 2,810,880 bits of embedded memory, with 295 programmable I/O, in a 484-pin UBGA package. Verified distributor data identifies a 437.5 MHz maximum clock, 1.2 V supply, 65 nm process technology, and a commercial temperature grade. The device is listed for sale by DigiKey and Mouser, while the verified search snapshot reports same-day shipping from DigiKey. An FPGA is a programmable semiconductor whose logic, interconnects, and I/O behavior can be configured after manufacturing. Within the component hierarchy, it belongs to programmable logic devices and field-programmable gate arrays. Unlike a fixed-function application-specific integrated circuit, an FPGA supports iterative logic changes without fabricating a new integrated circuit, making it useful for digital design, prototyping, interface bridging, and configurable control systems. The headline resources are 81,264 cells, 2,810,880 embedded-memory bits, and 295 I/O. These resources support datapaths, state machines, communications controllers, and peripheral interfaces. The 437.5 MHz value represents a verified maximum-clock listing and should be interpreted within the device's stated configuration and operating conditions. The 1.2 V core supply reflects the listed Cyclone III architecture. The part uses a 65 nm process and is supplied in a rectangular 484-terminal FBGA, also identified as UBGA or BGA-484 by distributor and comparison sources. The high terminal count supports 295 user I/O plus dedicated power, configuration, clock, and other device functions. Surface-mount assembly, controlled-impedance routing, and appropriate decoupling are therefore central to reliable implementation. Typical applications include industrial control, communications equipment, video or imaging interfaces, test equipment, and embedded processing systems. Its logic capacity suits multiple control blocks and interface functions, while the large I/O count helps connect memories, converters, network transceivers, and application-specific peripherals. Engineers must confirm timing closure, configuration storage, power sequencing, and supported I/O standards in the manufacturer datasheet. A key design trade-off is that adding programmable logic does not remove implementation effort. Clock budgets, pin assignments, power integrity, signal integrity, and thermal behavior must be analyzed for the final design. Logic capacity and I/O count alone do not guarantee a particular maximum system clock, because routing, constraints, tool settings, and peripheral interfaces affect timing. This page consolidates the verified distributor specifications, commercial availability, package identity, datasheet location, applications, and cross-reference evidence. Because no verified five-item set of same-footprint, pin-to-pin FPGA replacements was provided, alternatives are limited to candidates that can be supported without fabricating cross-brand or cross-package claims.

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EP3C80U484C8 - Cyclone III FPGA, 81K LE, 484-FBGA | Intel / Altera
EP3C80U484C8

EP3C80U484C8 - Cyclone III FPGA, 81K LE, 484-FBGA | Intel / Altera

The Intel (formerly Altera) Cyclone III EP3C80U484C8 is a low-power 65 nm SRAM-based Field Programmable Gate Array (FPGA) in the Cyclone III family, delivering 81,264 logic elements (LEs) and 2,810,880 bits of embedded memory in a 484-ball FineLine BGA package. It combines a high logic density with low static and dynamic power consumption, targeting cost- and power-sensitive applications across industrial, communications, and consumer markets. Key features include 81,264 LEs, 295 configurable I/O pins, 2.81 Mbits of embedded RAM, 244 embedded 18x18 multipliers, four phase-locked loops (PLLs), and a commercial operating temperature grade (0 C to +85 C). The device supports multiple I/O standards including LVDS, SSTL, and LVCMOS, and includes hard IP blocks such as memory controllers and high-speed transceivers (none on this die) to accelerate common system functions. The Cyclone III family is a programmable logic device that belongs to the broader category of FPGAs (Field Programmable Gate Arrays) within the semiconductor hierarchy: FPGA -> programmable logic -> digital IC -> integrated circuit. Cyclone III parts succeed the Cyclone II family with 65 nm process geometry, lower static power (~40% reduction), and higher logic density per dollar. They are widely used as glue logic, co-processors, and rapid-prototyping platforms before ASIC migration. Architecturally, the EP3C80U484C8 is built on Altera's classic Logic Array Block (LAB) and Adaptive Logic Module (ALM) fabric, with embedded MultiTrack interconnect that routes signals across rows and columns of the device. The 484-ball U484 package is a 1.0 mm pitch FineLine BGA suitable for multilayer PCBs with moderate layer-count designs. Typical applications include industrial motor control and factory automation, video processing and image aggregation, telecommunications line cards, low-cost software-defined radio front ends, and consumer display controllers. The 81K-LE density comfortably supports mid-complexity state machines, soft processor cores such as Nios II, and hardware-accelerated DSP pipelines. When designing with the EP3C80U484C8, ensure that the Quartus II design tool (version 13.1 or earlier - newer Quartus versions support it via device support files) is used for synthesis, place-and-route, and timing closure. Decoupling capacitors, multi-phase PLL filtering, and BGA fanout routing should follow Altera's Cyclone III Handbook recommendations for signal integrity. This page synthesizes distributor pricing, drop-in alternative MPNs from the same Cyclone III family, and practical design notes that are not found in a single manufacturer datasheet, giving procurement and design engineers a single source of decision-grade information.

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EP3C80U484C8N - Cyclone III FPGA, 81K LE, 484-FBGA | Intel / Altera
EP3C80U484C8N

EP3C80U484C8N - Cyclone III FPGA, 81K LE, 484-FBGA | Intel / Altera

The Intel (formerly Altera) EP3C80U484C8N is a low-power Cyclone III Field-Programmable Gate Array (FPGA) built on a 65nm TSMC process, integrating 81,264 logic elements (LEs), 2,810,880 bits of embedded memory, and 295 maximum user I/Os in a 484-pin FineLine BGA (UBGA) package. The 'U' package designation indicates a lead-free, RoHS-compliant ultra-fine-pitch BGA optimized for industrial cost-sensitive applications. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnect, and embedded memory/DSP blocks that can be re-programmed after manufacturing to implement virtually any digital logic function. FPGAs occupy a unique position in the digital design hierarchy: above Application-Specific Integrated Circuits (ASICs) in flexibility but below microcontrollers and DSPs in per-unit cost, they serve as the prototypical programmable logic device (PLD) for parallel processing, hardware acceleration, and glue-logic bridging in modern electronic systems. Key features of the EP3C80U484C8N include up to 295 user I/Os, 4 embedded PLLs for clock management, dedicated DSP blocks for high-speed multiplication, and support for external memory interfaces including DDR, DDR2, and QDRII SRAM. The Cyclone III architecture consumes up to 50% less power than the previous Cyclone II generation while delivering comparable logic density, making it attractive for power-constrained embedded designs. At 1.2V core voltage and a maximum core frequency in the 200-400 MHz range (logic-dependent), the device balances performance and static power. The 484-FBGA package provides high-density I/O access with thermal-enhanced characteristics suitable for industrial temperature operation. Typical applications include industrial motor control, video processing pipelines, telecom infrastructure bridges, ASIC prototyping, and embedded vision systems. The Cyclone III family is also widely deployed in test & measurement equipment and low-cost development platforms. When designing with this device, ensure proper decoupling with 100nF + 10uF capacitors near each VCC pin, follow Intel's pin connection guidelines for unused I/Os, and configure configuration scheme (AS, PS, or JTAG) carefully for production boards. This page synthesizes distributor pricing, drop-in alternatives from the same Cyclone III family, and practical design notes not aggregated on a single manufacturer page.

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EP3C80U484I7 - 81K LE Cyclone III FPGA, 484-FBGA | Intel
EP3C80U484I7

EP3C80U484I7 - 81K LE Cyclone III FPGA, 484-FBGA | Intel

The Intel (formerly Altera) EP3C80U484I7 is a Cyclone III field-programmable gate array (FPGA) delivering 81,264 logic elements, 2,810,880 bits of embedded memory, and 295 user I/O pins in a 484-ball FineLine BGA (UBGA-484) package. As the largest device in the Cyclone III family, it targets low-cost, low-power, high-volume applications including digital signal processing, video processing, and industrial control. The industrial temperature grade (-40C to +85C) and 1.2 V core operation make it well suited for fanless embedded designs. A Field-Programmable Gate Array (FPGA) is a semiconductor device built around a matrix of configurable logic blocks (CLBs) connected via programmable interconnect. The hierarchy is: FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit. Unlike fixed-function ASICs, FPGAs are reprogrammed in-circuit to implement custom digital logic, DSP pipelines, or soft-processor cores. Cyclone III sits at the low-power, low-cost end of Intel's FPGA portfolio, balancing density with low static and dynamic power consumption. Key features of the EP3C80U484I7 include 4 embedded PLL blocks (with up to 4 outputs per PLL) for clock synthesis and skew management, dedicated 18x18 hardware multipliers supporting DSP operations, 274 M9K memory blocks for distributed RAM and FIFO buffers, and a rich set of high-speed LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards. The device also provides a complete configuration subsystem including JTAG (IEEE 1149.1), Active Serial (AS), Passive Serial (PS), and Fast Passive Parallel (FPP) interfaces. Per the Altera Cyclone III Device Handbook, the device supports 1.0 V, 1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V LVCMOS/LVTTL I/O standards with hot-socketing capability. Typical applications span industrial motor control, video surveillance encoders, software-defined radio (SDR) baseband, telecom line cards, automotive infotainment pre-processing, medical imaging front-ends, and military/aerospace signal processing prototypes. The 484-FBGA FineLine BGA package provides a 19 x 19 mm footprint with 0.8 mm ball pitch, enabling dense PCB layouts with multiple signal layers. When designing with this device, ensure the JTAG chain is correctly terminated and that configuration flash (such as EPCS16 or EPCS64) is selected to match the bitstream size of the EP3C80. Quartus II (legacy) or Intel Quartus Prime Lite (current) software is the required design toolchain.

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EP3C80U484I7N - 81K Logic Elements Cyclone III FPGA | Intel
EP3C80U484I7N

EP3C80U484I7N - 81K Logic Elements Cyclone III FPGA | Intel

The Intel (formerly Altera) EP3C80U484I7N is a low-power, high-volume Cyclone III Field Programmable Gate Array (FPGA) delivering 81,264 logic elements, 2,810,880 bits of embedded memory, and 295 user I/O pins in a 484-ball FineLine BGA (UBGA-484) package. It operates from a 1.2 V core supply, supports maximum internal frequencies up to 437 MHz, and is rated for the industrial temperature range (-40 C to +100 C, I7 speed grade). An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP such as multipliers and memory blocks. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs) and are widely used to implement parallel processing, custom digital interfaces, and glue logic without the cost of an ASIC. Cyclone III specifically targets cost- and power-sensitive high-volume applications by combining 65 nm process technology with a low static power architecture. Key features of the EP3C80U484I7N include 81,264 logic elements, 2,810,880 RAM bits (approx. 3.4 Mbit) of M9K embedded memory blocks, 244 embedded 18 x 18 multipliers (suitable for DSP functions), four Phase-Locked Loops (PLLs), and 295 user I/O. The device supports multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O, and includes dedicated high-speed serial interfaces for external memory controllers such as DDR/DDR2 SDRAM. Configuration is typically via active serial (AS), passive serial (PS), or JTAG. The Cyclone III architecture is built on a 65 nm TSMC low-power process and uses a low-K dielectric to reduce interconnect capacitance. Eight input LUTs feed dedicated adder/subtractor/carry chains, and M9K memory blocks can be configured as RAM, ROM, shift registers, or FIFO buffers. The result is a balance of logic density, DSP throughput, and static power consumption optimized for cost-driven applications rather than maximum performance. Typical applications for the EP3C80U484I7N include industrial motor control and factory automation, video surveillance and image processing pipelines, telecom line cards, automotive infotainment and driver assistance prototypes, portable medical instrumentation, and embedded DSP systems. Designers often pair it with DDR/DDR2 SDRAM and flash configuration memory on a multi-layer PCB. When designing with this device, ensure proper decoupling on every VCCINT and VCCA power pin, follow the Cyclone III pin connection guidelines for unused pins (tie them to a defined logic level, do not float), and respect the 1.2 V core supply tolerance. JTAG and AS configuration pins should be accessible for in-system programming and board-level debug using Quartus II. This page synthesizes distributor pricing, drop-in same-package Cyclone III alternatives, and practical design notes not found in the manufacturer datasheet alone.

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EP3CLS100F484C7 - Cyclone III LS FPGA 100K LE 484-FBGA | Intel
EP3CLS100F484C7

EP3CLS100F484C7 - Cyclone III LS FPGA 100K LE 484-FBGA | Intel

The Intel (formerly Altera) EP3CLS100F484C7 is a low-power Cyclone III LS family field-programmable gate array (FPGA) with 100,448 logic elements, 4,451,328 bits of embedded memory, and 278 user I/Os, fabricated on a 65 nm process and housed in a 484-ball fine-pitch BGA (FBGA-484) package. Operating from a 1.2 V core supply, the device supports up to 437.5 MHz internal operation and is targeted at cost-sensitive, power-conscious applications where traditional Cyclone III performance is not required. An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable routing, and dedicated hardware such as block RAM, DSP blocks, and high-speed transceivers. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs) and bridge the gap between fixed-function ASICs and software-driven microcontrollers, offering hardware-level parallelism with infinite reprogrammability. The Cyclone III LS family specifically targets low-static-power designs by adding power-management features and a lower-leakage silicon option versus the standard Cyclone III lineup. Key features include 100,448 logic elements, 4,451,328 embedded memory bits, four phase-locked loops (PLLs), 278 maximum user I/O pins, and dedicated hardware multipliers that accelerate DSP workloads. The device supports external memory interfaces including DDR, DDR2, and QDR II, and integrates Cyclone III LS low-power enhancements suitable for thermally constrained boards. The EP3CLS100F484C7 uses a 65 nm copper process with a 1.2 V core voltage rail and auxiliary supplies for I/O banks and phase-locked loops. Configuration is supported through Altera (now Intel) Quartus II design software, which provides synthesis, place-and-route, timing analysis, and bitstream generation. Designers can leverage pre-verified IP cores from the Altera IP library to shorten development time across common interfaces such as DDR controllers, Ethernet MACs, and PCI Express soft cores. Typical applications include industrial motor control, video processing bridges, low-power wireless baseband preprocessing, and embedded display controllers. The 278 user I/Os and large logic capacity also make the device suitable for test-and-measurement front ends, factory automation I/O expansion, and prototyping bridges between legacy parallel buses and modern serial protocols. When designing with this FPGA, ensure the FPGA fabric junction temperature is computed from actual toggle rates and ambient temperature. The 484-ball FBGA package requires a multi-layer PCB with controlled-impedance traces and matched-length routing for DDR interfaces. Quartus II software is the supported design toolchain; migrate projects to Quartus Prime for ongoing support on newer OS versions. This page synthesizes Intel/authorized-distributor pricing, drop-in compatible Cyclone III LS variants, and engineering design notes not found in the standalone manufacturer datasheet.

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EP3CLS100F484C7N - Cyclone III LS FPGA 100K LE | Intel | 484-FBGA
EP3CLS100F484C7N

EP3CLS100F484C7N - Cyclone III LS FPGA 100K LE | Intel | 484-FBGA

The Intel (formerly Altera) EP3CLS100F484C7N is a Cyclone III LS family Field Programmable Gate Array (FPGA) built on TSMC's 65 nm low-power process, integrating 100,448 logic elements, 4,451,328 bits of embedded memory, and 278 user I/O pins in a 484-ball FineLine BGA package. According to the manufacturer datasheet, the device supports a commercial junction temperature grade (C7 speed grade, 0°C to +85°C operating range) and runs from a 1.2 V core supply, while offering low static and dynamic power that the Cyclone III LS family was specifically designed to minimize. What is an FPGA? An FPGA (Field Programmable Gate Array) is a reprogrammable digital IC containing a matrix of configurable logic blocks (CLBs), programmable routing, dedicated hardware multipliers, block RAM, and I/O cells. FPGAs sit in the broader hierarchy of programmable logic devices (PLD) within the semiconductor category, parallel to and often competing with ASICs for low-to-medium volume designs. Cyclone III LS adds additional security features such as configuration bitstream encryption and JTAG-based tamper protection, distinguishing it from the standard Cyclone III family. Key features of the EP3CLS100F484C7N include a logic element count of 100,448 (giving roughly 100K LE), 4,451,328 bits (~4.4 Mbit) of embedded SRAM organized into M9K blocks, embedded 18x18 multipliers for DSP operations, and four general-purpose PLLs per device for clock management. The 'F484' suffix denotes the 484-pin FineLine BGA package, 'C7' denotes the commercial speed grade 7, and 'N' indicates lead-free / RoHS compliance. Compared with the older Cyclone II family, Cyclone III LS cuts core voltage to 1.2 V and adds security features while retaining the low-cost positioning that the family is known for. Typical applications include industrial motor control, video processing pipelines, software-defined radio front ends, automotive infotainment (where the LS security features matter), test and measurement equipment, and low-cost protocol bridging. Designers choose this part when they need >100K LE of logic plus DSP blocks in a BGA that can be assembled with standard 1.0 mm-pitch PCB processes. The device is supported by Quartus II (and later Intel Quartus Prime) design software, which provides synthesis, place-and-route, timing analysis, and bitstream generation. When designing with this part, plan for the 484-ball FBGA land pattern carefully - the package uses 1.0 mm ball pitch and requires microvia or via-in-pad PCB technology for reliable assembly. Decoupling follows the Cyclone III LS Hardware Reference manual recommendations with multiple bulk and high-frequency caps across the 1.2 V core and each bank VCCIO rail. Finally, designers must provision a configuration source (EPCS serial flash, JTAG, or parallel flash) because the SRAM-based configuration memory is volatile. This page synthesizes distributor pricing, drop-in package-compatible alternatives from the Cyclone III LS family, and practical design notes not found in the manufacturer datasheet alone.

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EP3CLS100F484C8 - Cyclone III LS FPGA | Altera / Intel
EP3CLS100F484C8

EP3CLS100F484C8 - Cyclone III LS FPGA | Altera / Intel

The Altera EP3CLS100F484C8 is a Cyclone III LS field-programmable gate array (FPGA) with 100,448 logic elements, 4,451,328 RAM bits, and 278 user I/O pins, supplied in a 484-ball FBGA package. This commercial-temperature, speed-grade-8 device operates from a 1.2V core supply and is part of the low-power Cyclone III LS family built on a 65nm process. An FPGA is a semiconductor device whose logic fabric and interconnects are reconfigured by the user after manufacturing. FPGAs occupy the programmable-logic portion of the integrated circuit hierarchy: FPGA -> programmable logic device -> integrated circuit. Unlike ASICs, they can be updated in the field, which makes them useful for prototyping, low-to-medium production, and systems where standards change quickly. The EP3CLS100F484C8 is the 100,000-logic-element-class member of the Cyclone III LS series, designed for applications that need high logic density without the cost or power of an ASIC. Key features include 100,448 logic elements, 4,451,328 RAM bits, and 278 user I/Os. The device is a commercial-grade part in the Altera/Intel ordering code, where C indicates commercial temperature and 8 indicates speed grade 8. According to distributor and cross-reference data, the FPGA is built on a 65nm process and is rated for 1.2V core operation, with an FPGA performance indicator of 402MHz in the Cyclone III LS family. The 484-ball FBGA package provides enough pins for wide memory buses and many parallel I/O channels. The Cyclone III LS family is distinguished from the standard Cyclone III family by lower power and the LS security-related features; the exact feature set and I/O standard support are defined in the Cyclone III and Cyclone III LS device handbooks. From a system perspective, the EP3CLS100F484C8 provides a reconfigurable parallel computing fabric that can implement RTL logic, soft processors, DSP datapaths, and state-machine controllers in one device. It requires an external configuration device or JTAG download at power-up because it is SRAM-based. Typical applications for this FPGA include industrial motor control and factory automation, networking and Ethernet bridging, machine vision and video processing, medical imaging equipment, high-performance test-and-measurement instruments, and compute/network acceleration. The high I/O count and 100K logic capacity allow designers to integrate multiple discretely implemented functions onto one programmable platform, reducing total system component count. A key design consideration is that the EP3CLS100F484C8 requires a clean 1.2V core supply and correct power-up configuration sequencing. Use a serial configuration device such as the EPCS or EPCQ family, or download the bitstream through JTAG during development. Thermal dissipation from an FPGA this size also requires proper BGA layout, sufficient copper planes, and air flow in the final enclosure. This page synthesizes distributor pricing, availability, drop-in family alternatives, and practical design guidance not found in a single datasheet chapter, making it a useful engineering research resource before committing to a full Intel/Altera documentation review.

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