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EP4CGX75DF27C8 - Cyclone IV GX FPGA 75K LE 672-FBGA | Intel
EP4CGX75DF27C8

EP4CGX75DF27C8 - Cyclone IV GX FPGA 75K LE 672-FBGA | Intel

The Intel (formerly Altera) EP4CGX75DF27C8 is a Cyclone IV GX field-programmable gate array (FPGA) with 73,920 logic elements, 4,257,792 bits of embedded memory, and 310 user I/O pins, housed in a 672-ball fine-pitch BGA package. Built on a 60 nm low-power process, the device integrates up to eight integrated 3.125 Gbps transceivers for high-speed serial I/O, making it a high-value FPGA for cost-sensitive serial connectivity. A Cyclone IV GX FPGA is a low-power, high-volume programmable logic device optimized for applications that require both parallel logic and multi-gigabit transceivers. The Cyclone IV GX family sits within the broader FPGA (Field Programmable Gate Array) -> programmable logic -> integrated circuit -> semiconductor taxonomy, and is differentiated from the non-transceiver Cyclone IV E family by its integrated multi-gigabit transceivers (MGTs). Key features include 73,920 logic elements, 4,257,792 embedded memory bits, 274 embedded 18x18 multipliers, 310 user I/O pins, eight integrated 3.125 Gbps transceivers, and a 1.2 V core supply. The device supports DDR/DDR2/QDRII+ external memory interfaces and offers up to 4 PLLs. Operating junction temperature range is 0C to +85C (commercial grade, "C8" speed grade). The Cyclone IV GX architecture combines a logic fabric of LABs (Logic Array Blocks) and MLABs (Memory Logic Array Blocks) with high-speed transceiver blocks, hard PCI Express Gen1 IP blocks, and a rich DSP block population. The 60 nm process delivers low static and dynamic power, while the integrated transceivers remove the need for external PHY chips in many serial protocols. Typical applications include industrial video broadcast equipment, video surveillance and machine vision, industrial protocol bridging (PROFIBUS, PROFIBUS, EtherCAT), software-defined radio, low-cost ASIC prototyping, and embedded industrial control. The wide temperature-grade options and integrated transceivers make it well-suited for both commercial and industrial designs. When designing with the EP4CGX75DF27C8, ensure proper decoupling (100 uF + 1 uF + 0.1 uF per the Cyclone IV pin connection guidelines) and follow the recommended PCB stackup for BGA fan-out. The integrated transceivers require careful PCB layout; reference the Cyclone IV GX Transceiver User Guide for channel loss budgeting and AC-coupling capacitor placement. This page synthesizes distributor pricing, parametric alternatives, and practical PCB design notes not found in the manufacturer datasheet, giving engineers a single reference for component selection and supply-chain decisions.

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EP4CGX75DF27C8N - Cyclone IV GX FPGA, 73.9K LE, 672-FBGA | Intel
EP4CGX75DF27C8N

EP4CGX75DF27C8N - Cyclone IV GX FPGA, 73.9K LE, 672-FBGA | Intel

The Intel (formerly Altera) EP4CGX75DF27C8N is a Cyclone IV GX field-programmable gate array (FPGA) built on a 60nm low-power process, offering 73,920 logic elements, 4,257,792 bits of embedded memory, and 310 user I/O pins in a 672-ball FineLine BGA (FBGA) package. It operates from a 1.2V core supply and integrates up to eight high-speed transceivers supporting data rates commonly used in PCI Express Gen1 and Gigabit Ethernet applications. An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that uses a matrix of configurable logic blocks (CLBs) connected via programmable interconnect. FPGAs sit above microcontrollers and ASICs in the design flexibility hierarchy: microcontrollers run software; ASICs are fixed at fabrication; FPGAs can be reconfigured in-circuit to implement arbitrary digital logic, DSP pipelines, and high-speed serial protocols. The Cyclone IV GX family specifically targets cost-sensitive, transceiver-equipped applications in industrial, communications, and embedded computing. Key features of the EP4CGX75DF27C8N include 73,920 logic elements arranged in 4,605 logic array blocks (LABs), 4,257,792 bits of embedded SRAM (approximately 532 Kbits of M9K block memory plus larger M144K blocks), 274 embedded 18x18 multipliers for DSP operations, and integrated 3.125 Gbps transceivers. The device also supports Nios II embedded processor soft-core implementation, up to 4 PLLs for clock management, and a hard PCIe Gen1 x1/x2/x4 IP core. Architecturally, the Cyclone IV GX uses a CMOS SRAM-based look-up-table (LUT) fabric with per-LAB control logic, distributed and block RAM, and dedicated multiplier/adder chains. Transceivers support multiple protocols through programmable PCS (physical coding sublayer) blocks, and the I/O subsystem provides LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards with programmable drive strength and slew rate. Typical applications include industrial video processing, machine vision and surveillance systems, motor control, USB 3.0/2.0 protocol bridging, automotive driver assistance (lower-tier ADAS), and low-cost PCIe endpoint cards. The integrated transceivers particularly suit designs requiring multi-gigabit serial I/O without the cost of a higher-end FPGA. When designing with this device, ensure proper power sequencing across the 1.2V core, 2.5V/3.3V analog PLL, and transceiver supply rails. Use the Altera/Intel Quartus II or Quartus Prime design toolchain for synthesis, place-and-route, and bitstream generation. The 672-FBGA package requires careful PCB layout with via-in-pad and microvia technology for reliable assembly. This page synthesizes verified distributor pricing, drop-in same-package alternatives from the Cyclone IV GX and E families, and practical design notes that go beyond the manufacturer datasheet summary.

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EP4CGX75DF27I6N - 73,920 Logic Cells Cyclone IV GX FPGA | Intel
EP4CGX75DF27I6N

EP4CGX75DF27I6N - 73,920 Logic Cells Cyclone IV GX FPGA | Intel

The Intel (formerly Altera) EP4CGX75DF27I6N is a low-power, high-volume Cyclone IV GX FPGA with 73,920 logic elements, 4,257,792 RAM bits, and integrated 3.125 Gbps transceivers, housed in a 672-pin FineLine BGA (FBGA-672) package. It belongs to the Cyclone IV GX family built on a 60 nm low-power process and supports 310 user I/O pins with a core voltage of 1.2 V, making it suitable for cost-sensitive applications requiring serial connectivity. An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit whose digital logic is defined after manufacturing via a configuration bitstream. FPGAs occupy the top of the programmable logic device hierarchy, alongside CPLDs (smaller, non-volatile) and ASSPs (fixed-function ASICs). The Cyclone IV GX family is positioned at the low-power, transceiver-equipped end of the FPGA market, bridging the gap between pure-logic FPGAs and high-end transceiver FPGAs. Key features of the EP4CGX75DF27I6N include 73,920 logic elements, approximately 4,257,792 bits of embedded RAM distributed across M9K blocks, up to eight integrated transceivers supporting data rates up to 3.125 Gbps, two PLLs per transceiver block plus four general-purpose PLLs, and 310 user I/O pins. The device supports commercial, industrial, and automotive temperature grades, with the I6N suffix denoting the -40C to +100C industrial operating range. Hard PCIe hard IP blocks (x1/x2 Gen1) are also integrated, enabling low-cost PCIe endpoint implementations. The device uses a 60 nm process node with a 1.2 V core supply and dedicated transceiver and I/O banks. The FineLine BGA package provides high pin density for its class while keeping PCB routing manageable on standard 4-layer FR-4 stack-ups. Configuration is supported via JTAG, serial, and parallel modes, with bitstream encryption available for IP protection. Typical applications include industrial video broadcast and image processing, motor control and machine automation, low-cost PCIe endpoint cards, USB 3.0 expansion and bridging, industrial protocol bridging (EtherCAT, PROFINET, Sercos), and remote radio heads / wireless baseband preprocessing. The integrated transceivers also suit point-to-point serial links in test & measurement equipment. When designing with this device, ensure your power sequencing keeps VCCINT (1.2 V core) within +/-50 mV of nominal during power-up, and place VCCIO decoupling within 200 mils of each bank. The 672-pin BGA package requires precise reflow profile and via-in-pad capability for reliable assembly; we recommend ENIG surface finish and 0.4 mm pitch BGA assembly experience.

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EP4CGX75DF27I7 - Cyclone IV GX FPGA 73.9kLE 672-FBGA | Intel
EP4CGX75DF27I7

EP4CGX75DF27I7 - Cyclone IV GX FPGA 73.9kLE 672-FBGA | Intel

The Intel (formerly Altera) EP4CGX75DF27I7 is a Cyclone IV GX Field Programmable Gate Array (FPGA) delivering 73,920 logic elements, 4,257,792 bits of embedded memory, and 310 user I/Os in a 672-ball FineLine BGA (FBGA) package. Operating from a 1.2V core supply with industrial-grade temperature range (-40C to +85C), this device combines high-density programmable logic with up to 3.125 Gbps transceivers, making it a cost-optimized solution for high-volume, transceiver-based applications. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around a matrix of configurable logic blocks (CLBs), embedded memory, DSP blocks, and programmable interconnect. FPGAs belong to the broader category of programmable logic devices (PLDs), which evolved from simple PALs and GALs into complex SoC-class silicon. Modern FPGAs sit alongside ASICs, microcontrollers, and DSPs in the digital logic hierarchy, offering hardware-level parallelism that CPUs cannot match, while remaining in-system reprogrammable for iterative design and field updates. Key features of the EP4CGX75DF27I7 include 4,257,792 bits of embedded RAM (approximately 4 Mbit), embedded 18x18 multipliers for DSP workloads, and high-speed transceivers supporting protocols such as PCIe Gen1, Gigabit Ethernet, Serial RapidIO, and CPRI. The Cyclone IV GX family is fabricated on a low-power 60nm process, providing an attractive balance between performance and static power consumption. The device also integrates dedicated hard IP for memory controllers (DDR/DDR2 SDRAM) and PLL-based clock management. The FBGA-672 package exposes 310 general-purpose I/Os alongside the transceiver and memory interfaces, enabling dense board-level integration. Configuration is supported through multiple modes including JTAG, Active Serial (AS), Passive Serial (PS), and Fast Passive Parallel (FPP), giving designers flexibility during prototyping and production. The industrial temperature grade makes the part suitable for environments beyond benign commercial conditions. Typical applications for the EP4CGX75DF27I7 include industrial video processing and broadcast equipment, automotive driver assistance and infotainment, telecommunications line cards, machine vision and factory automation, and low-cost PCIe endpoint cards. Its combination of transceiver bandwidth, logic density, and modest power profile makes it particularly well-suited to high-volume cost-sensitive designs. When designing with this FPGA, careful power-rail sequencing is required for the 1.2V core, 2.5V/3.3V I/O banks, and the 1.2V PLL/transceiver analog supply. Decoupling must follow the reference design's recommended capacitor mix near each supply pin, and the JTAG chain should include pull-ups per the device handbook. For signal integrity, the transceiver channels require controlled-impedance routing and length matching per the protocol specification. This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not found in the standalone manufacturer datasheet.

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EP4CGX75DF27I7N - Cyclone IV GX FPGA 73.9K LE | Intel
EP4CGX75DF27I7N

EP4CGX75DF27I7N - Cyclone IV GX FPGA 73.9K LE | Intel

The Intel (formerly Altera) EP4CGX75DF27I7N is a Cyclone IV GX field-programmable gate array (FPGA) featuring 73,920 logic elements, 4,257,792 bits of embedded memory (approximately 4.06 Mbits), and 310 user I/O pins, housed in a 672-ball fine-pitch BGA (FBGA) package. Built on a low-power 60 nm process, this Cyclone IV GX device integrates up to eight high-speed transceivers rated at 3.125 Gbps, hardware multipliers, and PLL resources for cost-sensitive, transceiver-enabled designs. An FPGA (field-programmable gate array) is a semiconductor device whose logic, interconnect, and I/O behavior are defined by user-loaded configuration bitstreams rather than at the factory. Within the digital IC hierarchy, FPGAs sit between general-purpose microcontrollers and full custom ASICs, offering higher performance and parallelism than MCUs while avoiding the non-recurring engineering cost of ASICs. The Cyclone IV family further subdivides into the GX (transceiver-equipped) and E (logic-only) variants, with the EP4CGX75 targeting designs that need multi-gigabit serial links without paying for higher-tier Stratix-class devices. Key features include 73,920 logic elements, 4,257,792 bits of embedded RAM organized as M9K memory blocks, up to 310 user I/O pins spanning eight I/O banks with support for multiple I/O standards (LVDS, LVTTL, LVCMOS, PCI, SSTL, HSTL), and 3.125 Gbps transceiver channels. The device also integrates a hard PCI Express (PIPE) Gen1 x1/x2/x4 endpoint block, dedicated PLL clocking resources, and DSP-style multipliers arranged in variable-precision DSP blocks. Configuration is supported via JTAG, Active Serial (AS), Active Parallel (AP), and Passive Serial (PS) modes. The Cyclone IV GX architecture pairs a 60 nm logic fabric with embedded transceivers and hard IP blocks to minimize both static and dynamic power. The core voltage is typically 1.2 V with separate VCCPD and VCCIO rails per bank, and the transceiver blocks run from dedicated analog supplies. Compared with the Cyclone III LS predecessor, Cyclone IV GX adds transceiver capability at similar density points while keeping total power budget under 1.5 W in many typical designs. Reference designs and Quartus II / Intel Quartus Prime design flows are supported across the family. Typical applications include industrial video processing and broadcast bridging, low-cost PCIe endpoint cards, motor control and factory automation backplanes, point-to-point and backplane serial link aggregation. The combination of transceiver channels and abundant logic resources makes EP4CGX75DF27I7N a strong fit when designs need multi-gigabit serial I/O without moving to a more expensive, larger-density FPGA. When designing with EP4CGX75DF27I7N, pay close attention to bank I/O voltage assignment: each of the eight I/O banks requires its own VCCIO rail, and mixing SSTL and LVCMOS in the same bank is not allowed. Plan decoupling with at least 4-6 low-ESL ceramic capacitors per supply rail near the BGA balls, and follow Intel's recommended PCB layer stack-up for the 27 mm x 27 mm FBGA-672 footprint to maintain signal-integrity on the transceiver channels. This page consolidates distributor pricing, FBGA-672 pin-compatible alternatives from the Site MPN list, and practical Quartus Prime design guidance that is not assembled in any single location in the Intel Cyclone IV Device Handbook.

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EP4CGX75DF27I8N - Cyclone IV GX FPGA, 73,920 LEs, 672-FBGA | Intel
EP4CGX75DF27I8N

EP4CGX75DF27I8N - Cyclone IV GX FPGA, 73,920 LEs, 672-FBGA | Intel

The Intel (formerly Altera) EP4CGX75DF27I8N is a Cyclone IV GX field-programmable gate array (FPGA) delivering 73,920 logic elements, 4,257,792 bits of embedded memory, and 310 user I/O pins in a 672-ball fine-pitch BGA package. Manufactured on a 60 nm low-power process and powered from a 1.2 V core supply, it targets cost-sensitive, low-power, high-volume applications requiring integrated transceivers. A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor device containing an array of programmable logic blocks, configurable interconnect, and dedicated I/O, allowing designers to implement arbitrary digital logic after PCB fabrication. Within the broader taxonomy, an FPGA belongs to programmable logic devices (PLDs) -> logic ICs -> integrated circuits. The Cyclone IV GX family specifically adds high-speed serial transceivers, making it suitable for protocols such as PCI Express Gen1, Gigabit Ethernet, and serial RapidIO. Key features include 3.125 Gbps transceivers, 8 transceiver channels, dedicated 18x18 multipliers for DSP, and a hard memory controller. The device supports a JTAG interface for boundary-scan and configuration via Altera/Intel Quartus Prime design software. Industrial temperature grade (-40C to +100C junction) and high I/O count support applications ranging from industrial motor control to wireless baseband processing. The Cyclone IV GX architecture combines a logic fabric with embedded transceivers, providing up to 5,136 Kbits of RAM distributed as M9K blocks and 414 Kbits as M144K blocks. Hard IP blocks include the memory controller and PCIe interface, reducing soft logic utilization. The 672-FBGA package supports high I/O density for complex system designs. Typical applications include industrial motor control, video processing, software-defined radio, wireline and wireless communication infrastructure, automotive driver assistance, and test and measurement equipment. The integrated transceivers and PCIe support make it ideal for protocol bridging and low-cost serial connectivity. Designers should consult the Quartus Prime toolchain for configuration bitstream generation. This page synthesizes distributor pricing, drop-in package-compatible variants, and practical design considerations not found in the manufacturer datasheet alone.

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EP4S100G2F40I3G - Stratix IV GT FPGA, 1517-FBGA | Intel
EP4S100G2F40I3G

EP4S100G2F40I3G - Stratix IV GT FPGA, 1517-FBGA | Intel

The Intel EP4S100G2F40I3G is a Stratix IV GT Field Programmable Gate Array (FPGA) delivering 228,000 logic elements and 17,544,192 bits of embedded RAM in a 1517-ball FineLine BGA package (40x40 mm). It operates from a 0.86 V to 1.15 V core supply and supports junction temperatures from -40 °C to 100 °C, targeting high-throughput serial-interface and signal-processing designs. A Field Programmable Gate Array (FPGA) is a class of programmable logic device that combines configurable logic blocks, programmable interconnect, dedicated DSP blocks, and on-chip memory into a single semiconductor die. FPGAs sit at the top of the digital-logic hierarchy: ASIC alternative -> programmable logic -> FPGA. The Stratix IV family specifically targets high-speed serial transceivers and digital-signal-processing applications where deterministic throughput and parallel DSP resources outperform general-purpose processors or DSP chips. Key features of the EP4S100G2F40I3G include 91,200 logic array blocks (LABs/CLBs), 228,000 logic elements, an embedded multiplier and DSP block fabric, high-speed transceiver support up to multi-gigabit rates, and dedicated memory interfaces such as DDR3/QDRII+. The 17.5 Mbit embedded RAM provides extensive on-chip buffering, eliminating many external SRAM devices in data-path designs. The device is built on a 40 nm process and is qualified to industrial-grade (-40 °C to 100 °C Tj) levels. Its high transceiver count and parallel DSP slice count position it as a premium-class Stratix IV variant for wired telecommunications, test and measurement instrumentation, and high-performance signal-processing cards. Typical applications include high-speed serial backplanes, multi-gigabit transceiver aggregation, ASIC prototyping, and digital signal processing in defense and medical imaging systems. The 1517-FCBGA package provides the pin escape density required for transceiver-rich designs. When designing with this device, allocate PCB layers for transceiver-controlled-impedance routing and ensure the power-distribution network meets the Stratix IV PDN guidelines; designers should reference Intel's Stratix IV GT FPGA Family Data Sheet and the related AN 500-series application notes for transceiver channel performance and board layout. This page synthesizes distributor pricing, drop-in package-equivalent Stratix IV GT and Stratix IV GX/E parts, and practical design guidance not collected in any single manufacturer document.

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EP4S40G2F40I2NAA - Stratix IV GT FPGA 40nm 654 I/O 1517-FCBGA | Intel
EP4S40G2F40I2NAA

EP4S40G2F40I2NAA - Stratix IV GT FPGA 40nm 654 I/O 1517-FCBGA | Intel

The Intel EP4S40G2F40I2NAA is a Stratix IV GT Field-Programmable Gate Array (FPGA) built on a 40 nm process, integrating 228,000 logic elements, 17,544,192 bits of embedded memory, and 654 user I/O pins in a 1517-ball FCBGA package. It belongs to the Stratix IV GT family, which is engineered for high-speed serial transceivers targeting multi-gigabit applications such as 40G/100G optical networking, high-end test equipment, and high-performance computing bridges. A Field-Programmable Gate Array (FPGA) is a class of programmable logic device that combines configurable logic blocks, programmable interconnect, dedicated DSP blocks, embedded memory (BRAM), and high-speed transceiver physical media attachment (PMA) layers. In the broader system hierarchy, FPGAs sit between general-purpose CPUs/GPUs and fixed-function ASICs: they offer near-ASIC performance and parallelism with the flexibility of in-field re-programmability through SRAM-based configuration memory. The Stratix IV family specifically targets applications that demand the highest transceiver data rates and richest logic density in the Altera/Intel FPGA portfolio of that generation. Key features of the EP4S40G2F40I2NAA include 228,000 logic elements, 17,544,192 embedded memory bits, 654 maximum user I/O pins, integrated 11.3 Gbps transceivers (GT channels), and DSP blocks for high-throughput fixed- and floating-point arithmetic. The 'I2' speed grade balances maximum frequency and timing margin, while the 'N' suffix denotes lead-free / RoHS-compliant packaging. The FCBGA substrate supports high signal integrity for multi-gigabit links and provides the controlled-impedance escape needed for transceiver channels up to 11.3 Gbps. Architecturally, the device combines a rich fabric of adaptive logic modules (ALMs), MLAB blocks that double as distributed logic or small RAM, M20K dedicated memory blocks, variable-precision DSP blocks, and hard PCI Express and memory controller IP. The hard transceiver blocks (GX/GT) include on-die serial/deserializer (SERDES), clock data recovery (CDR), and physical coding sublayer (PCS) support for protocols such as CPRI, OBSAI, 10G/40G Ethernet, Serial RapidIO, and OTU-2, dramatically reducing the logic fabric overhead required to implement these protocols in soft logic. Typical applications include 40G/100G optical transport line cards, high-end test and measurement instrumentation such as oscilloscopes and protocol analyzers, high-performance computing fabric bridges, wireless baseband processing, and military/aerospace signal processing. The combination of 11.3 Gbps transceivers and 654 user I/O is well-matched to systems that aggregate multiple 10G lanes into a 40G/100G uplink while exposing wide parallel LVDS or DDR3 memory interfaces for data buffering. When designing with the EP4S40G2F40I2NAA, pay particular attention to transceiver reference clock jitter and power-rail decoupling for the GT analog supplies. Intel recommends a multi-layer PCB stackup with a continuous ground reference under the transceiver channels and matched-length routing on the transmit-receive pairs. Quartus II / Quartus Prime is the official design toolchain for this family and supports floorplanning, timing closure, and power analysis for high-density designs. This page synthesizes distributor stock data from DigiKey, pinout and packaging details, drop-in alternatives within the Stratix IV GT family, and practical PCB layout notes not found in the manufacturer datasheet summary. Pricing and lead-time references are stated 'as of 2026-09-10'.

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EP4S40G2F40I2NAB - Stratix IV GT FPGA, 228K LE, 1517-FCBGA | Intel
EP4S40G2F40I2NAB

EP4S40G2F40I2NAB - Stratix IV GT FPGA, 228K LE, 1517-FCBGA | Intel

The Intel (formerly Altera) EP4S40G2F40I2NAB is a high-density Stratix IV GT field-programmable gate array (FPGA) from the 40nm transceiver-equipped GT family, integrating 228,000 logic elements, 17,544,192 embedded memory bits, and 654 user I/O pins in a 1517-ball flip-chip BGA (FCBGA, F40 package code) with 0.95V core operation. It is specified over the industrial temperature range and supports up to 48 transceivers depending on configuration, making it a drop-in member of the Stratix IV GT transceiver family. An FPGA (Field-Programmable Gate Array) is a type of programmable logic device that allows engineers to implement custom digital circuits through software configuration rather than mask-programmed silicon. FPGAs sit in the broader semiconductor hierarchy alongside ASICs and CPLDs, occupying a unique niche for low-volume, high-performance, or rapidly evolving designs where custom silicon is uneconomical. Stratix IV GT FPGAs specifically target high-speed serial I/O applications such as 40G/100G optical transport, broadband test equipment, and high-end ASIC prototyping, integrating multi-gigabit transceivers directly on-die to simplify PCB layout. Key features of the EP4S40G2F40I2NAB include 48 multi-gigabit transceivers supporting data rates from 600 Mbps to 11.3 Gbps, dedicated hard IP for PCIe Gen2 and Gen1, embedded memory blocks of M9K and M144K types totaling 17.5 Mbits, and 8 PLLs per device. The 40 nm process technology balances static and dynamic power, while hard intellectual-property (IP) blocks offload common functions like PCIe, DDR3 memory controllers, and 10G Ethernet MACs for higher system efficiency. The F40 1517-ball package offers high pin density for transceiver-rich designs. Architecturally, the device combines a fabric of adaptive logic modules (ALMs), embedded RAM, DSP blocks, and dedicated transceiver and I/O tiles. Transceivers use a hardened PCS and PMA architecture supporting protocols such as CPRI, OBSAI, Serial RapidIO, 10G Ethernet, and OTU2, with adaptive equalization and pre-emphasis for backplane and direct-attach copper reach. The 0.95 V core supply is generated by an external regulator, with auxiliary rails for transceivers and I/O banks. Typical applications include 40G/100G optical line-card packet processing, high-speed serial backplane bridging, ASIC and ASSP prototyping, and telecom base-station CPRI links. Engineers select this part when they need integrated multi-gigabit transceivers alongside a high logic density for data-path and control-plane processing. When designing with the EP4S40G2F40I2NAB, pay close attention to transceiver reference-clock jitter, decoupling strategy for the 0.95 V core rail, and the IBIS-AMI models required for channel simulations. Quartus Prime (legacy: Quartus II) provides synthesis, place-and-route, and transceiver toolkits. PCB layout should use the manufacturer's pinout guidelines and reference the Stratix IV GT handbook for signal-integrity recommendations. This page synthesizes distributor pricing, Stratix IV GT family drop-in alternatives, and practical design considerations not found in the standalone manufacturer datasheet, giving engineers a single source for sourcing, comparison, and architecture decisions.

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EP4SE230F29I4N - Stratix IV E 228K LEs FPGA | Intel | FBGA-780
EP4SE230F29I4N

EP4SE230F29I4N - Stratix IV E 228K LEs FPGA | Intel | FBGA-780

The Intel EP4SE230F29I4N is a high-density Stratix IV E Field Programmable Gate Array (FPGA) with 228,000 logic elements, 17,544,192 bits of embedded memory, and 488 user I/Os, housed in a 780-ball flip-chip BGA (FC-FBGA) package measuring 29 x 29 mm with 1.0 mm ball pitch. It is built on TSMC's 40 nm process and operates from a 0.9 V core supply with 1.0/1.2/1.5/2.5/3.0 V support for I/O banks, supporting transceiver-rich designs through up to 530 MHz logic performance and 717 MHz DSP throughput. A Field Programmable Gate Array (FPGA) is a class of programmable logic device that combines configurable logic blocks (CLBs/LABs), programmable interconnect, embedded memory (block RAM, M9K/M144K), digital signal processing (DSP) blocks, and high-speed transceivers on a single die. FPGAs sit between fixed-function ASICs and software-programmable processors in the design hierarchy, offering hardware-level parallelism for applications where general-purpose CPUs are too slow or ASIC non-recurring engineering costs are uneconomical. The Stratix IV E family is part of Intel's (formerly Altera's) high-performance, transceiver-rich tier. Key features include 9120 Configurable Logic Blocks (CLBs/LABs), 488 I/Os, transceivers running up to 8.5 Gbps (per Stratix IV family datasheet), 1.228 Mbits of embedded memory per block, dedicated DSP blocks for high-speed multiplication, and support for DDR/DDR2/DDR3/QDRII/RLDRAM external memory interfaces. The F29 package variant includes a transceiver-rich pinout suitable for high-speed serial connectivity. Industrial temperature grade (-40C to +100C) is indicated by the I4 speed/temperature code. The Stratix IV E architecture uses Adaptive Logic Modules (ALMs) rather than older 4-LUT structures, partial reconfiguration via the Configuration via Protocol (CvP) feature, and hard IP for PCI Express Gen1/Gen2 and 10 Gigabit Ethernet MACs. The 40 nm process and 0.9 V core deliver a balance of performance-per-watt versus lower-cost 60/28 nm successors. Designers evaluating migration should compare Stratix V, Arria 10, or Cyclone V parts using the Quartus II device migration guide. Typical applications include high-speed digital signal processing in defense radar, ASIC prototyping and emulation, high-frequency trading acceleration, 40G/100G telecommunications line cards, medical imaging (ultrasound beamforming), and test & measurement instrumentation. Its transceiver bandwidth also suits broadcast video processing and high-end industrial imaging systems. When designing with this device, plan for multi-rail power sequencing (0.9 V core, 1.0-2.5 V I/O banks, transceiver PLLs) using the Stratix IV PowerPlay Early Power Estimator. Layout requires controlled-impedance routing for 8.5 Gbps transceivers and a thermal solution sized for worst-case junction temperature. Note that the EP4SE230F29I4N is an older generation part - confirm lifecycle status and lead time before committing to new designs. This page synthesizes distributor pricing, drop-in alternatives within the Stratix IV family, and practical design notes that complement - rather than duplicate - the Stratix IV Device Handbook.

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EP4SE230F35I4NAD - 230K Logic Elements Stratix IV E FPGA | Intel
EP4SE230F35I4NAD

EP4SE230F35I4NAD - 230K Logic Elements Stratix IV E FPGA | Intel

The Intel EP4SE230F35I4NAD is a high-density Stratix IV E field-programmable gate array (FPGA) delivering 228,000 logic elements, 17,544,192 embedded memory bits, and 1,288 user I/O pins in a 1152-ball flip-chip fine-pitch BGA package, manufactured on TSMC's 40 nm process node. The device operates from a 0.9 V core supply and is built around the Stratix IV E architecture that combines logic fabric with dedicated DSP blocks, M9K/M144K embedded memory blocks, and up to 24 transceivers depending on the package variant, targeting high-performance digital signal processing, communications backplane, and ASIC-prototyping applications. A field-programmable gate array (FPGA) is a reprogrammable semiconductor device containing an array of configurable logic blocks (CLBs), programmable routing, dedicated hardware multipliers, block RAM, and high-speed serial transceivers. FPGAs sit in the wider hierarchy of programmable logic devices (PLDs) -> complex programmable logic devices (CPLDs) -> FPGAs -> system-on-chip (SoC) FPGAs, and they parallelize critical datapath operations far beyond what a general-purpose microcontroller or DSP processor can achieve, while also integrating hardware peripherals such as PCIe hard IP, memory controllers, and serializer/deserializer (SerDes) channels. Key features of the EP4SE230F35I4NAD include 8-input adaptive logic modules (ALMs), dedicated 18x18 multipliers, 9-Kbit and 144-Kbit embedded memory blocks, 8.5 Gbps transceivers (per Stratix IV GT family), and DSP blocks operating at up to 600 MHz. The FC-FBGA-1152 package provides a robust flip-chip interconnect for high signal integrity, while a -40C to +100C industrial temperature grade (the "I" suffix) enables deployment in harsh environments and extended-life industrial systems. In design, the Stratix IV E family uses a partial reconfiguration controller and Quartus II software for synthesis, place-and-route, and timing closure. The 40 nm process and dedicated signal-conditioning circuitry deliver low dynamic power via power-aware compiler features and on-chip voltage scaling, which are critical for ASIC-prototyping and high-density DSP workloads where the device may run near full utilization. The device also includes on-die termination (OCT) for high-speed memory interfaces such as DDR3 and QDRII+. Typical applications for this part include high-end telecommunications backplane line cards, ASIC prototyping and emulation, military/aerospace signal processing, high-frequency trading accelerators, and broadcast video processing. According to the manufacturer datasheet, the Stratix IV E family is positioned for designers who need the highest logic density combined with transceivers and DSP performance for bandwidth-constrained but computationally intense workloads. When designing with this FPGA, allocate at least 4 PCB layers for power and ground planes, use controlled-impedance routing for all transceiver lanes, and follow the manufacturer pin connection guidelines for unused I/O, JTAG, and configuration pins. Decoupling the 0.9 V core rail with low-ESR ceramic capacitors directly under the package is essential for power integrity under high switching currents. This page combines distributor pricing, drop-in compatible alternatives, and design notes that go beyond the manufacturer datasheet, providing a single information gain resource for FPGA selection.

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EP4SE530H35C4N - Stratix IV E FPGA 531K LE 1152-BGA | Intel
EP4SE530H35C4N

EP4SE530H35C4N - Stratix IV E FPGA 531K LE 1152-BGA | Intel

The Intel EP4SE530H35C4N is a high-density, high-performance FPGA from the Stratix IV E family, delivering 531,200 logic elements in a 1152-ball flip-chip BGA package. Built on a 40 nm CMOS process with a 0.9 V core voltage, the device integrates 212,480 CLBs (or 21,248 LABs) at a maximum core frequency of 717 MHz, targeting data-path intensive and DSP-heavy designs. A field-programmable gate array (FPGA) is a programmable logic device that combines configurable logic blocks, programmable interconnect, and dedicated hardware resources such as block RAM, DSP blocks, and high-speed transceivers into a single semiconductor. In the system hierarchy, an FPGA sits above general-purpose microcontrollers and below ASICs, offering hardware-level parallelism with software-like design flexibility. The Stratix IV E family specifically targets applications requiring very high logic density, high memory bandwidth, and embedded DSP throughput. Key features include 28,033,024 bits of embedded memory, 1,024 DSP blocks, and 744 user I/Os. The 1152-ball flip-chip BGA package exposes the device's full transceiver and I/O capability while providing thermal dissipation adequate for high-utilization designs. The part is speed grade C4, balancing timing closure headroom against performance, and operates within the commercial 0 °C to 85 °C junction temperature range. Architecturally, Stratix IV E uses an adaptive logic module (ALM) based fabric with 8-input fracturable look-up tables, paired with dedicated 18x18 multipliers for DSP, and tri-matrix block RAM that can be partitioned into independent memories. The fabric supports partial reconfiguration, which allows the system to swap logic regions on-the-fly for fault tolerance, power management, or multi-standard protocol support. Typical applications include high-throughput digital signal processing for wireless baseband, real-time video processing and broadcast equipment, military and aerospace signal intelligence, high-speed networking line cards, and ASIC prototyping. Engineers select the EP4SE530H35C4N when designs outgrow the capacity of Cyclone or mid-density Stratix families and require hardened transceivers, large block RAM, and substantial DSP throughput. Design consideration: with 744 user I/Os and a 1152-ball BGA, PCB layout requires careful signal-integrity planning, a multi-layer stack-up with dedicated power and ground planes, and thermal analysis under maximum junction temperature. The Quartus II design suite (or its successor) is required for synthesis, place-and-route, and timing closure.

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EP4SE820F43C3G - Stratix IV E 813K LEs FPGA | Intel (Altera)
EP4SE820F43C3G

EP4SE820F43C3G - Stratix IV E 813K LEs FPGA | Intel (Altera)

The Intel (formerly Altera) EP4SE820F43C3G is a high-density Stratix IV E FPGA delivering 813,050 logic elements, 325,220 adaptive logic modules (ALMs), and 32.51 Mbit of embedded memory in a 1760-pin flip-chip BGA (FBGA, package code F43) package. It belongs to the Stratix IV E family, the highest-density and most feature-rich member of the Stratix IV 40 nm generation, designed for high-performance digital logic, high-speed serial I/O, and large memory bandwidth. A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device containing an array of configurable logic blocks (CLBs), programmable interconnect, dedicated DSP blocks, on-chip memory, and high-speed transceiver hard IP, all tied together by a hierarchy of routing resources. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs) -> programmable logic -> digital ICs -> semiconductors, and are typically deployed where ASIC NRE costs are prohibitive or where post-deployment hardware updates are required. The Stratix IV E family targets applications such as wireline communications, ASIC prototyping, high-performance DSP, and military/aerospace systems. Key features include 1120 user I/O pins, up to 8.5 Gbps transceivers, hard memory controllers, PCIe hard IP, and DSP blocks capable of 600+ MHz operation. The device integrates dedicated hardware for memory interfaces including DDR3 support, and offers robust SEU mitigation via the soft error detection and correction circuitry inherent to the Stratix IV architecture. Operating at a core voltage of 0.9 V and supporting industrial junction temperatures, it fits both commercial and industrial-grade deployments. The architecture combines a fine-grained ALM structure with high-efficiency routing, an embedded memory hierarchy with 600 MHz true-dual-port SRAM, and dedicated variable-precision DSP blocks. Hard IP for PCI Express Gen1/Gen2 and 10 Gigabit Ethernet reduces soft-logic overhead. The 1760-BBGA package is a flip-chip land-grid-array that maximizes I/O density while delivering excellent thermal performance through a top-side heat-spreader attachment surface. Typical applications include high-end ASIC prototyping and emulation platforms, 40G/100G wireline communications line cards, radar and electronic warfare DSP pipelines, high-frequency trading accelerators, and high-density memory-interface bridging. The wide logic capacity and abundant I/O make it well-suited for systems that previously required multiple mid-range FPGAs. When designing with this device, plan the PCB thermal interface carefully - the FCBGA requires a properly mounted heat spreader or heatsink to dissipate 10-25 W typical workloads. Ensure the Quartus II power analyzer is run early in the design cycle; pin assignment, block placement, and toggle rate all significantly affect junction temperature. This page synthesizes real-time distributor inventory, exact parametric data, drop-in Stratix IV E alternatives, and practical PCB/thermal design notes that complement, rather than duplicate, the official Altera/Intel Stratix IV Handbook.

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EP4SGX110DF29C2XG - Stratix IV GX FPGA, 105.6K LEs, 780-FCBGA | Intel
EP4SGX110DF29C2XG

EP4SGX110DF29C2XG - Stratix IV GX FPGA, 105.6K LEs, 780-FCBGA | Intel

The Intel (formerly Altera) EP4SGX110DF29C2XG is a high-density Stratix IV GX FPGA featuring 105,600 logic elements and 9,793,536 bits of embedded memory (3,564 Kbits of M9K plus 1,318 Kbits of MLAB), fabricated on a 40 nm process. It integrates 372 user I/O pins in a 780-ball FCBGA package and is engineered for high-performance signal processing, serial connectivity, and embedded processing applications where deterministic latency and high transceiver bandwidth are required. An FPGA (Field Programmable Gate Array) is a programmable logic device built from an array of configurable logic blocks (CLBs), dedicated DSP slices, on-chip memory blocks, and routing interconnect. Stratix IV GX extends this baseline by adding multi-gigabit transceivers, hard PCIe IP cores, and external memory controller support, placing it in the high-end programmable logic family that sits between general-purpose FPGAs and ASICs in the programmable device hierarchy: programmable logic device -> FPGA -> high-end FPGA with transceivers -> SoC FPGA. Key device features include an FPGA fabric with embedded DSP blocks (variable-precision multipliers and accumulators), dedicated memory blocks (M9K and MLAB), and a hard memory controller that interfaces to DDR/DDR2/DDR3 SDRAM, QDR II/II+ SRAM, and RLDRAM II. The GX suffix denotes the integrated multi-gigabit transceiver subsystem supporting standards such as PCIe Gen1/Gen2, XAUI, Serial RapidIO, and 1G/10G Ethernet through hard PCS channels. Typical applications include high-throughput digital signal processing (radar, beamforming, software-defined radio), high-speed serial protocol bridging (PCIe, Serial RapidIO, 10G Ethernet), ASIC prototyping, and high-end test and measurement instrumentation. The 780-FCBGA package provides the signal and power integrity needed for parallel LVDS and multi-gigabit serial interfaces while remaining compatible with high-density PCB stack-ups. When designing with this device, plan FPGA floorplanning and pin assignment with Quartus II early to close timing on transceiver channels, and verify signal integrity on the multi-gigabit lanes through IBIS-AMI simulation. Power estimation must include the GX transceiver analog supply rails separately from the core FPGA rails, since the transceivers dominate total device power at full line rate.

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EP4SGX110DF29C3G - Stratix IV GX FPGA, 105K LE, 780-FCBGA | Intel
EP4SGX110DF29C3G

EP4SGX110DF29C3G - Stratix IV GX FPGA, 105K LE, 780-FCBGA | Intel

The Intel/Altera EP4SGX110DF29C3G is a Stratix IV GX family Field-Programmable Gate Array (FPGA) featuring 105,600 logic elements, 9,793,536 bits of embedded memory, and 372 user I/Os in a 29x29 mm 780-ball Flip-Chip BGA package. Built on a 40 nm process, this high-density transceiver-capable device integrates up to 8.5 Gbps transceivers and delivers enhanced DSP performance for high-bandwidth signal processing. An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as transceivers, PLLs, and block RAM. Within the broader taxonomy, the Stratix IV GX sits at the high-performance end: FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor. FPGAs allow hardware designers to implement custom digital functions after PCB assembly, enabling parallel processing, real-time DSP, and hardware-accelerated interfaces that microcontrollers and DSPs cannot match in throughput. Key features include 4,224 adaptive logic modules (ALMs), 8.5 Gbps embedded transceivers for protocols such as PCIe Gen1/Gen2, XAUI, and Serial RapidIO, dedicated hard IP for PCIe Gen2 x4/x8 endpoints, and configurable on-chip memory of approximately 9.5 Mbits distributed plus dedicated M9K and M144K block RAM. The device also provides 266 dedicated DSP blocks capable of 18x18 multiplication at high clock rates, and supports I/O standards including LVDS, LVTTL, HSTL, and SSTL with selectable drive strength. The Stratix IV GX architecture combines a fabric of ALMs with hard PCIe Gen2 IP and 8.5 Gbps transceivers, eliminating soft-IP overhead and freeing logic for application code. Compared with discrete transceiver + FPGA designs, the integrated transceivers reduce power and board area, while the 40 nm low-power process minimizes dynamic power at high toggle rates. Typical applications include high-speed serial backplane aggregation, software-defined radio (SDR) baseband processing, telecom framer/mapper ASIC prototyping, high-performance computing (HPC) co-processors, and broadcast video processing. The 780-FCBGA package supports up to 12.5 Gbps operation per channel when paired with appropriate PCB stack-up and signal conditioning. When designing with this device, ensure adequate power-supply decoupling (multiple low-ESR ceramic capacitors near each transceiver bank) and matched-impedance routing for high-speed serial links. Verify transceiver reference clock jitter per the device handbook, and use the Quartus Prime toolchain for synthesis, place-and-route, and timing closure. This page synthesizes distributor pricing, drop-in alternative MPNs in the same FCBGA-780 footprint, and practical design notes that go beyond the manufacturer datasheet summary. It also flags the device lifecycle and lead-time reality observed across authorized distributors in 2026.

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EP4SGX110DF29C4G - 105,600 LEs Stratix IV GX FPGA | Intel
EP4SGX110DF29C4G

EP4SGX110DF29C4G - 105,600 LEs Stratix IV GX FPGA | Intel

The Intel EP4SGX110DF29C4G is a high-density Stratix IV GX field-programmable gate array (FPGA) integrating 105,600 logic elements, 372 user I/Os, and 9,793,536 bits of embedded memory in a 780-ball FCBGA package. Built on a 40 nm process with a 0.87 V to 0.93 V core voltage, the device pairs programmable logic with up to 8.5 Gbps integrated transceivers, hard memory controllers, and embedded multipliers, enabling high-throughput DSP and serial-protocol pipelines. A field-programmable gate array is a semiconductor integrated circuit built around a matrix of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP blocks such as transceivers, BRAM, and DSP slices. FPGAs belong to the broader programmable logic device (PLD) family and sit within the digital semiconductor hierarchy: programmable logic -> ASIC-class configurable logic -> semiconductor. Unlike fixed-function ASICs, FPGAs are reprogrammed in-circuit, allowing rapid design iteration and field upgrades without re-spinning silicon. Key features of the EP4SGX110DF29C4G include 4,224 adaptive logic modules (ALMs) totalling 105,600 equivalent logic elements (LEs), 372 user I/Os arranged across multiple I/O banks supporting LVDS, LVTTL, LVCMOS, HSTL, and SSTL standards, and a high-performance fabric that sustains hundreds of MHz on critical paths. Hard PCI Express Gen1/Gen2 hard IP blocks and external memory interfaces up to DDR3 make the part attractive for bridging, protocol conversion, and accelerator workloads. The architecture combines an adaptive logic module fabric with 8-channel transceiver blocks for multi-gigabit serial I/O, hard memory controllers, and a global clock network. The 40 nm low-power process node balances static and dynamic power while preserving high operating frequency. Typical applications include high-speed serial interface bridging (PCIe, SRIO, XAUI, CPRI), wireless baseband and backhaul DSP, radar and signal-intelligence front-end processing, broadcast video routing, and military/aerospace signal processing. The integrated transceivers eliminate external PHY components and shorten design cycles. When designing with this device, plan power sequencing around the 0.87-0.93 V core and the auxiliary PLL/ transceiver supplies; use Altera/Intel Quartus II software for synthesis, place-and-route, and timing closure. The 780-ball FCBGA package requires a multi-layer PCB with controlled-impedance routing and adequate thermal relief for sustained workloads. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes for the EP4SGX110DF29C4G, including same-package speed-grade and logic-density variants not consolidated in any single manufacturer table.

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EP4SGX110DF29I3G - 110K LE Stratix IV GX FPGA 780-FCBGA | Intel
EP4SGX110DF29I3G

EP4SGX110DF29I3G - 110K LE Stratix IV GX FPGA 780-FCBGA | Intel

The Intel (formerly Altera) EP4SGX110DF29I3G is a high-density, high-performance Stratix IV GX Field-Programmable Gate Array (FPGA) built on 40 nm process technology, delivering 105,600 logic elements (LEs) and 9,793,536 bits of embedded memory in a 780-ball FineLine BGA (FCBGA) package with integrated transceivers and DSP blocks. It features 372 user I/O pins, 8.5 Gbps transceivers, and a dedicated PCIe hard IP block, making it suitable for high-speed serial connectivity and digital signal processing. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit based on a matrix of configurable logic blocks (CLBs) connected via programmable interconnect, allowing hardware designers to implement custom digital logic that can be reconfigured after manufacturing. Within the broader semiconductor taxonomy, FPGAs sit between general-purpose processors (which execute software) and application-specific integrated circuits (ASICs, which are fixed at fabrication). The Stratix IV family from Intel/Altera adds hardened IP blocks (transceivers, DSP, memory controllers, PCIe) that accelerate common functions and free up programmable logic for application-specific logic. Key features include 105,600 LEs, 9,793,536 bits of embedded RAM, 660 DSP blocks, 16 transceivers at up to 8.5 Gbps, and a hard PCIe Gen2 controller. The device supports LVDS, LVTTL, LVCMOS, HSTL, and SSTL I/O standards with hot-socketing capability, and includes dedicated on-chip termination (OCT) for signal integrity. Industrial-grade temperature range is -40C to +100C for I3 grade, suitable for harsh environments. The architecture combines an 8.5 Gbps transceiver physical layer with a programmable logic fabric and embedded memory, allowing designers to implement protocols such as PCIe Gen2, Serial RapidIO, XAUI, and custom high-speed serial interfaces. The 40 nm low-power process minimizes dynamic power while preserving high performance, and on-chip PLLs support frequencies up to 800 MHz with fractional-N synthesis. Typical applications include high-speed serial interfaces for communications infrastructure, PCIe accelerator cards in data center and server platforms, military and aerospace signal processing, high-end medical imaging, broadcast video processing, and industrial test equipment. The device's combination of transceiver bandwidth and DSP throughput makes it well suited for wireless baseband processing and radar systems. When designing with this FPGA, ensure the PCB supports the 780-ball FCBGA's controlled-impedance routing and matched-length traces for transceiver channels. The Quartus II development environment (version 13.0 or later) is required for synthesis, place-and-route, and programming file generation. Designers should also plan power sequencing to the Stratix IV power-up requirements and verify transceiver reference clock jitter against the protocol specification. This page synthesizes distributor pricing, package-equivalent Stratix IV GX drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone, giving component buyers and FPGA designers a single reference for sourcing decisions.

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EP4SGX110DF29I4G - 105.6K LE Stratix IV GX FPGA, 780-FBGA | Altera
EP4SGX110DF29I4G

EP4SGX110DF29I4G - 105.6K LE Stratix IV GX FPGA, 780-FBGA | Altera

The Intel (formerly Altera) EP4SGX110DF29I4G is a high-density Stratix IV GX Field-Programmable Gate Array (FPGA) with 105,600 logic elements, 9.79 Mbit embedded memory, and integrated transceivers, housed in a 780-ball FineLine BGA (FBGA-780, 29x29 mm) package. The 'I4G' suffix denotes the industrial temperature grade (-40C to +100C) and a speed grade 4 device with lead-free / RoHS-compliant packaging. What is an FPGA? A Field-Programmable Gate Array is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard-IP blocks (memory, transceivers, DSP, PLLs) that engineers can reconfigure after manufacture to implement custom digital logic, parallel processing pipelines, or hardware accelerators. FPGAs sit between general-purpose microcontrollers and ASICs, offering ASIC-class performance and parallelism with NRE-cost-free reprogrammability. Stratix IV GX specifically targets high-speed serial I/O applications through integrated multi-gigabit transceivers. Key features include 105,600 logic elements distributed across 4,224 Adaptive Logic Modules (ALMs), 9,793,536 bits (9.79 Mbit) of embedded memory in the form of M9K/M144K blocks, 372 maximum user I/Os, and 8.5K logic array blocks (LABs). The device supports up to 8 transceiver channels operating at data rates up to 8.5 Gbps depending on speed grade, with support for protocols such as PCIe Gen1/Gen2, XAUI, Serial RapidIO, and CPRI. The core operates from a 0.95 V supply with separate transceiver and auxiliary rails. The EP4SGX110DF29I4G is fabricated on TSMC's 40 nm low-power process node, delivering a balance of high performance, low static power, and high logic density. Its adaptive logic module architecture combines 8-input fracturable look-up tables with dedicated register chains, allowing efficient implementation of wide multiplexers, arithmetic operations, and state machines. The device also integrates hard memory controllers for DDR3/DDR2 and QDR II+ memories. Typical applications include high-speed serial protocol bridging, telecom line-card backplane aggregation, radar and signal-processing front-ends, test and measurement equipment with parallel digital capture, broadcast video processing, and high-performance computing accelerators. The integrated transceivers make it particularly attractive for wireless baseband and any system requiring multi-gigabit serial connectivity. When designing with this part, ensure proper power-supply sequencing (POR delay, VCCPD before VCC), maintain a thermal management plan for the 29x29 mm BGA footprint, and use Altera/Intel Quartus II or Quartus Prime design software for synthesis, place-and-route, and timing closure. Confirm transceiver reference-clock jitter and PCB material stack-up against the manufacturer's guidelines. This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.

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EP4SGX110FF35C2XG - 105.6K LE Stratix IV GX FPGA | Intel
EP4SGX110FF35C2XG

EP4SGX110FF35C2XG - 105.6K LE Stratix IV GX FPGA | Intel

The Intel (Altera) EP4SGX110FF35C2XG is a high-density Stratix IV GX Field-Programmable Gate Array (FPGA) delivering 105,600 logic elements, 4,224 logic array blocks (LABs), and 9,793,536 bits of embedded RAM in a 1152-ball FCBGA package. Built on a 40 nm process, this transceiver-rich device targets high-bandwidth serial I/O and DSP-intensive applications with 372 user I/O pins and integrated transceivers operating up to 8.5 Gbps per channel. An FPGA (Field-Programmable Gate Array) is a programmable logic device that lets hardware engineers implement arbitrary digital logic via HDL and synthesis. Stratix IV FPGAs occupy the high-performance tier of the Intel/Altera portfolio and combine a logic fabric, embedded memory blocks, DSP blocks, PLLs, high-speed transceivers, and hard PCIe/IP cores on a single die. The GX suffix indicates transceiver capability, which positions this device between the general-purpose Stratix IV E family and the larger Stratix IV GT family. Key features include 105,600 logic elements backed by 4,224 LABs, 9,793,536 total RAM bits distributed across M9K/M144K blocks, up to 372 user I/Os split across 12 I/O banks, and dedicated hardware for DSP multiplication, phase-locked loops, and memory controllers. The 1152-ball FCBGA package supports the wide transceiver and I/O count while providing a thermal path for sustained workloads. Core voltage operates at 0.87 V to 0.93 V with separate transceiver/auxiliary rails. Architecturally, Stratix IV GX integrates up to 24 full-duplex CDR-based transceivers with PMA/PCS layers, programmable PCIe Gen1/Gen2 hard IP blocks, and partial reconfiguration capability. The adaptive logic module (ALM) is the 8-input fracturable LUT that drives the high logic-density figures, while the 40 nm process node balances performance and leakage for line-card and high-end embedded designs. Typical applications include high-speed wireline communications line cards, radar and DSP front-ends, ASIC prototyping, test and measurement instrumentation, broadcast video processing, and PCI Express-based adapter cards. The integrated transceivers simplify SFP+/QSFP+ connectivity, while the generous DSP block count accelerates FFT and filter pipelines. Designers must provide a multi-rail power tree (VCC, VCCA, VCCD_PLL, VCHIP, VCCT_GXB, etc.) with proper sequencing and decoupling per the Stratix IV handbook. Pin assignments, transceiver reference clocks, and PCB stack-up with controlled-impedance differential pairs are mandatory for robust high-speed operation. This page synthesizes distributor pricing, same-family Stratix IV drop-in alternatives, transceiver and DSP comparisons, and practical power/PCB design notes not found on a typical Altera/Intel product listing.

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EP4SGX110FF35C3G - Stratix IV GX 105KLE FPGA, 1152-FBGA | Intel / Altera
EP4SGX110FF35C3G

EP4SGX110FF35C3G - Stratix IV GX 105KLE FPGA, 1152-FBGA | Intel / Altera

The Intel / Altera EP4SGX110FF35C3G is a Stratix® IV GX family Field-Programmable Gate Array (FPGA) built on a 40 nm low-power process, integrating 105,600 logic elements, 42,240 Adaptive Logic Modules (ALMs), 9.79 Mbit of embedded memory, and 562 embedded 18x18 multipliers in a 1152-ball FineLine BGA (FCBGA) package. The device integrates eight multi-gigabit transceivers capable of up to 3.75 Gbps operation, making it suitable for PCI Express Gen1, Serial RapidIO, and other high-speed serial protocols. Programmable Power Technology (PPT) enables dynamic per-block power optimization across core, memory, and I/O regions, while hard PCI Express and memory controller IP blocks reduce logic footprint for high-bandwidth designs. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit whose digital logic, interconnect, and even analog/serial functions are configured by the user after manufacture via an SRAM configuration bitstream. FPGAs sit alongside microprocessors, ASICs, and ASSPs in the broader programmable logic device (PLD) family, and Stratix IV GX specifically targets high-speed serial connectivity, DSP-heavy designs, and embedded processing systems. The Stratix IV series architecture separates logic (ALMs/LABs), memory (M9K/M144K blocks), DSP (variable-precision multipliers), transceivers, and I/O (LVDS, LVTTL, HSTL, SSTL) into independent, parallel structures connected by a hierarchical routing fabric. Key features include the transceiver-rich GX variant, 372 user I/O pins, support for DDR3/DDR2/QDRII+ external memory interfaces, hard PCIe Gen1 endpoints, and operation across the -40 C to 100 C commercial junction temperature range. The FF35 speed grade designates the fastest commercial speed bin, the F35 pin/package code denotes the 1152-ball 35 mm x 35 mm FCBGA footprint, and the trailing C3 indicates the 0.85 V VCCINT core voltage with the -3 speed grade designation. Typical applications include wireline telecom line cards, software-defined radio baseband, test and measurement instrumentation with high-speed serial backplane aggregation, military radar front-end preprocessing, broadcast video processing, and ASIC prototyping for high-bandwidth ASIC emulation. Designers select the EP4SGX110FF35C3G when they need roughly 100K LE of logic with multi-gigabit serial and PCIe Gen1 hardening on a single die. Consideration for power: at typical activity the Stratix IV GX 110 KLE operates near 5-8 W; full-utilization boards require forced-air flow and copper thermal relief. Quartus II design software (version 13.1 or later with service packs) supports the EP4SGX110FF35C3G and is required to generate JIC/JIC configuration files for JTAG or EPCS configuration. This page consolidates distributor pricing, drop-in speed/pinout-compatible variants, and design notes that supplement the manufacturer datasheet.

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EP4SGX110FF35C4G - Stratix IV GX FPGA 110K LE 9.7Mbit | Intel
EP4SGX110FF35C4G

EP4SGX110FF35C4G - Stratix IV GX FPGA 110K LE 9.7Mbit | Intel

The Intel EP4SGX110FF35C4G is a high-density Stratix IV GX Field Programmable Gate Array (FPGA) integrating 105,600 logic elements, 9,793,536 RAM bits (372 RAM blocks), and integrated transceivers in a 1152-ball FCBGA package. The device belongs to the Stratix IV GX family, which combines high-performance logic fabric with multi-gigabit transceivers and dedicated DSP blocks, and is built on a 40 nm process node for low power and high integration. The device targets high-bandwidth applications requiring both signal-processing throughput and high-speed serial I/O. A Field Programmable Gate Array (FPGA) is a type of programmable logic device that allows hardware designers to implement custom digital circuits after PCB fabrication. Within the broader taxonomy, this part belongs to the FPGA family, which itself sits inside programmable logic devices (PLD), which are a subset of integrated circuits (ICs) under the semiconductor hierarchy. The Stratix IV GX sub-family adds integrated multi-gigabit transceivers (MGT) for serial connectivity, separating it from general-purpose Stratix IV non-GX variants and from Cyclone-series cost-optimized FPGAs. Key specifications of the EP4SGX110FF35C4G include 105,600 logic elements, 9,793,536 bits of embedded RAM distributed across 372 RAM blocks, 372 user I/O pins, 8 integrated transceivers supporting data rates up to 3.125 Gbps (C4 speed grade), and 288 dedicated hardware multipliers for DSP. The 1152-ball FCBGA package exposes the high I/O count and enables dense board placement with controlled-impedance escape routing. The device operates across commercial and industrial temperature grades depending on the speed/order code suffix. Architecturally, the Stratix IV GX uses Adaptive Logic Modules (ALMs), each containing a fracturable 8-input look-up table (LUT), two dedicated adders, and four registers, which gives the device a fine-grained compute fabric. The transceivers support multiple serial protocols including PCIe Gen1/Gen2, Serial RapidIO, Gigabit Ethernet, CPRI, and OBSAI, while the DSP blocks (variable-precision 18x18 multipliers) accelerate filtering and FFT operations used in wireless baseband, radar, and instrumentation. Typical applications include wireless baseband processing, software-defined radio (SDR), high-speed serial interface bridging (PCIe, SRIO, GbE), radar and electronic warfare signal chains, high-performance DSP for test and measurement, and ASIC prototyping for communications SoCs. The combination of transceivers and DSP blocks makes it a fit where both wire-speed serial I/O and deterministic compute are needed on a single die. When designing with this part, plan PCB layout for 1152-ball FCBGA escape routing, allocate sufficient decoupling across the multiple supply rails (VCC, VCCPT, VCCA, VCCP, VCCH_GXB), and use Intel Quartus II (legacy) or Quartus Prime to capture pin assignments, transceivers, and timing constraints. Configuration schemes include fast passive parallel (FPP), active serial (AS), and JTAG. This page synthesizes distributor availability, same-family and cross-brand drop-in equivalents, and practical design notes not consolidated in the manufacturer datasheet.

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EP4SGX110FF35I3G - Stratix IV GX FPGA 105.6K LE, 1152-FCBGA | Intel
EP4SGX110FF35I3G

EP4SGX110FF35I3G - Stratix IV GX FPGA 105.6K LE, 1152-FCBGA | Intel

The Intel (Altera) EP4SGX110FF35I3G is a high-density Stratix IV GX Field Programmable Gate Array delivering 105,600 logic elements, 9,793,536 bits of embedded memory, and 372 user I/O in a 1152-ball Flip-Chip BGA (FCBGA) package. It features 8 integrated transceivers operating up to 8.5 Gbps, a rich DSP block count, and on-chip hard memory controllers, making it suitable for high-throughput digital signal processing and serial connectivity designs. A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor that implements custom digital logic through configurable logic blocks, programmable routing, and dedicated hardware blocks such as transceivers and DSP slices. FPGAs belong to the broader category of programmable logic devices (PLDs) within logic semiconductors, sitting alongside ASICs and CPLDs. The Stratix IV family targets high-performance applications by integrating high-speed transceivers, abundant block RAM, and structured DSP pipelines on a 40 nm process node. Key features of the EP4SGX110FF35I3G include the 105,600 logic elements backed by 5,659 M20K embedded memory blocks totaling 9,793,536 bits, 532 18x18 multipliers for DSP, and a -3 speed grade that delivers a balance of timing margin and power efficiency. The 8.5 Gbps transceiver capability enables protocols such as PCIe Gen2, Serial RapidIO, CPRI, and 10 Gigabit Ethernet XAUI when used with soft IP. The 1152-ball FCBGA package supports the device's high pin count while providing the signal integrity required for multi-gigabit serial links. Architecture highlights include the Altera Logic Array Block (LAB) with adaptive logic modules, MultiTrack routing for predictable timing closure, and Programmable Power Technology that dynamically reduces power on unused logic. The GX variant integrates hardened PCIe, CPRI, and Serial RapidIO IP, reducing soft-logic overhead and simplifying board bring-up for communications infrastructure designs. Typical applications include high-speed data acquisition systems, wireless baseband processing, military radar, broadcast video processing, and protocol bridging cards. The combination of 8 transceivers, abundant DSP, and large block RAM is well suited to multi-channel digital receivers and Software Defined Radio platforms. A key design consideration is the FPGA's configuration scheme: the EP4SGX110FF35I3G supports fast passive parallel (FPP) and active serial (AS) configuration modes. Plan PCB layout to keep configuration flash within trace-length limits and provide decoupling per Intel's Pin Connection Guidelines to avoid power-rail noise during configuration. This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not found in the manufacturer datasheet alone.

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EP4SGX110FF35I4G - Stratix IV GX FPGA, 105K LE, 1152-FCBGA | Altera / Intel
EP4SGX110FF35I4G

EP4SGX110FF35I4G - Stratix IV GX FPGA, 105K LE, 1152-FCBGA | Altera / Intel

The Altera (now Intel) EP4SGX110FF35I4G is a high-density Stratix IV GX Field-Programmable Gate Array (FPGA) integrating 105,600 logic elements, 9,793,536 bits of embedded memory, and integrated transceivers in a 1152-ball FineLine BGA (FCBGA) package. It is fabricated on a 40 nm process and combines a powerful 8-input Adaptive Logic Module (ALM) fabric with up to 8.5 Gbps transceivers, making it a flagship device for high-bandwidth signal processing, ASIC prototyping, and protocol bridging in telecom, defense, and high-performance computing systems. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs / ALMs), programmable interconnect, and dedicated hard IP such as transceivers, memory controllers, and DSP blocks. In the system hierarchy it sits between fixed-function ASICs (lowest flexibility, lowest unit cost at volume) and software-programmable DSP/MCU processors (highest flexibility, lowest deterministic performance). Stratix IV GX FPGAs specifically target applications where deterministic sub-nanosecond logic delays, parallel DSP arithmetic, and multi-gigabit serial I/O are required simultaneously. Key features of the EP4SGX110FF35I4G include 105,600 logic elements distributed across 4,224 Adaptive Logic Modules (ALMs), 42,240 ALMs in the largest configuration of the family, 9.34 Mbit / 9,793,536 bits of embedded block memory, and 480 user I/Os. The "FF35" pinout designation places the device in the 1152-ball FCBGA with high-speed transceivers arranged along dedicated columns, while the "I4" speed-grade and industrial temperature grade (-40C to +100C) suffix indicates an industrial-grade silicon speed bin suitable for harsh-environment deployments. Operating supply voltage is centered at 950 mV core with multiple auxiliary rails for I/O and transceiver banks. The architecture combines an 8-input ALM (twice the inputs of the previous Stratix III generation) with dedicated 18x18 multipliers and TriMatrix embedded memory blocks, supporting DSP throughput up to ~600 GMACS at the typical configuration. Integrated transceivers support protocols such as PCI Express Gen1/Gen2, Serial RapidIO, XAUI, HiGig, SATA, and backplane interfaces at data rates up to 8.5 Gbps per channel. Hard PCI Express Gen2 IP blocks and hard memory controllers reduce soft-logic overhead, freeing fabric for application code. Typical applications include high-end ASIC prototyping, telecom line-card protocol bridging, radar and signal-intelligence processing, high-frequency trading platforms, broadcast video infrastructure, and test-and-measurement instrumentation. The wide transceiver bandwidth also makes it suitable for medical imaging reconstruction, software-defined radio base stations, and aerospace communication payloads where both high logic density and serial-link throughput are mandatory. When designing with this device, pay close attention to power architecture: a fully populated EP4SGX110FF35I4G can dissipate well over 20 W and requires a multi-rail decoupling network, SmartVoltage ID or external regulator sequencing, and a thermal management solution sized for the FCBGA-1152 package. Quartus II software (with the appropriate license) is required for synthesis, place-and-route, and timing closure - the device is mature but still widely supported in Intel Quartus Prime 17.x and earlier tool chains. This page synthesizes distributor inventory, drop-in Stratix IV GX package-compatibility notes, and practical design considerations that are not available in a single manufacturer datasheet, helping procurement and FPGA design engineers shorten the selection cycle.

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EP4SGX110HF35C2G - Stratix IV GX FPGA 105.6K LE 35mm FC-FBGA | Intel
EP4SGX110HF35C2G

EP4SGX110HF35C2G - Stratix IV GX FPGA 105.6K LE 35mm FC-FBGA | Intel

The Intel (formerly Altera) EP4SGX110HF35C2G is a high-density Stratix IV GX Field Programmable Gate Array with 105,600 logic elements, 9,793,536 bits of embedded memory, and integrated 8.5 Gbps transceivers, housed in a 1152-ball flip-chip FineLine BGA (HF35 package, 35 mm body). Built on a 40 nm process node and operating from a 0.9 V core supply, the device combines programmable logic fabric with embedded transceivers to deliver high-bandwidth serial I/O alongside parallel processing, making it a cornerstone part for high-end communications and signal-processing systems. What is an FPGA? An FPGA (Field Programmable Gate Array) is a semiconductor device whose digital logic function is defined after manufacture through configuration memory rather than mask-level fabrication. Within the broader taxonomy of programmable logic devices (PLDs), FPGAs sit above CPLDs (Complex Programmable Logic Devices) and below ASICs (Application-Specific Integrated Circuits) in both integration density and NRE cost. The Stratix IV GX family specifically targets high-speed serial connectivity, bridging the gap between pure-logic FPGAs and ASSP connectivity devices. The Stratix IV GX architecture delivers 488 user I/O pins, up to 8.5 Gbps multi-gigabit transceivers, hard PCIe Gen1/Gen2 IP blocks, and dedicated DSP blocks for high-throughput signal processing. The HF35 package option provides a 35 mm square footprint with 1152 balls, optimizing board area while providing thermal headroom for the transceiver-rich logic fabric. The device supports partial reconfiguration and remote upgrade via dedicated configuration interfaces. Performance analysis: at 0.9 V core, the Stratix IV GX achieves roughly 25-30% lower dynamic power than the Stratix III generation while supporting up to 530 MHz on internal logic. The integrated transceivers reduce BOM cost and PCB area by eliminating external SERDES chips. The flip-chip BGA substrate maximizes signal-integrity margins for the multi-gigabit channels at the expense of mechanical repairability. Typical applications include 40G/100G optical transport line cards, wireless baseband processing, high-speed test and measurement instrumentation, radar signal processing, and broadcast video infrastructure. The combination of transceivers, DSP, and high logic capacity suits protocols such as PCIe Gen2, XAUI, CEI-6G, and Serial RapidIO. The part is widely deployed in long-life-cycle communications and defense programs. When designing with this device, plan for multi-layer PCB stack-up with continuous reference planes to preserve signal-integrity margins on the multi-gigabit links, and use the Quartus II / Quartus Prime toolchain for place-and-route and timing closure. Designers targeting new designs should evaluate Stratix V/10/Cyclone 10 GX successors for cost and supply reasons, but the EP4SGX110 family remains a strong choice for sustaining legacy systems. This page synthesizes distributor pricing, drop-in pin-compatible alternatives, and practical board-design guidance not found in the manufacturer datasheet alone, supporting both new designs and sustaining engineering.

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