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EP4SGX360HF35C4N - Stratix IV GX FPGA, 353600 Cells | Intel
EP4SGX360HF35C4N

EP4SGX360HF35C4N - Stratix IV GX FPGA, 353600 Cells | Intel

The Intel (formerly Altera) EP4SGX360HF35C4N is a high-density Stratix IV GX Field-Programmable Gate Array (FPGA) delivering 353,600 logic elements, 23,105,536 bits of embedded memory, and integrated transceivers in a 1152-ball flip-chip BGA (FC-FBGA) package. Built on a 40 nm process technology with a 0.9 V core voltage, this device combines high-performance logic fabric with up to 564 user I/Os and embedded 8B/10B-capable transceivers for serial connectivity. An FPGA (Field-Programmable Gate Array) is a semiconductor device built around a matrix of configurable logic blocks (CLBs), embedded memory blocks, DSP blocks, and programmable interconnect, allowing hardware designers to implement custom digital circuits without fabricating a custom ASIC. Stratix IV FPGAs sit at the top of the Intel/Altera high-performance product hierarchy: FPGA -> programmable logic device -> PLD -> digital IC. The Stratix IV family is targeted at high-throughput signal processing, high-speed serial interfaces, and embedded processing applications where logic density, memory bandwidth, and transceiver count matter more than ultra-low power. Key features include 14,144 LABs (Logic Array Blocks), up to 24 transceivers supporting data rates up to 8.5 Gbps (depending on speed grade), dedicated hard IP for PCI Express Gen1/Gen2, 8B/10B encoders/decoders, and on-chip termination. The HF35 package variant (35 mm x 35 mm, 1152-ball FC-FBGA) supports the broadest I/O count in the family. The part is specified for the commercial temperature range (0C to +85C) and uses the C4 speed grade. The Stratix IV GX architecture combines a fabric of adaptive logic modules (ALMs) with M20K and M512 memory blocks, variable-precision DSP blocks, and dedicated transceiver channels that support protocols such as PCIe, Gigabit Ethernet, Serial RapidIO, XAUI, and CPRI. The 8.5 Gbps transceiver capability, combined with 23 Mbits of on-chip memory, lets the EP4SGX360 act as a single-chip bridge between parallel processing logic and multiple high-speed serial links, eliminating external PHY ICs. Typical applications include high-performance data acquisition systems, wireless baseband processing, radar and electronic warfare front-ends, broadcast video processing, and high-speed serial protocol bridging. The integrated transceivers make it especially well suited for systems that aggregate multiple 1G/10G Ethernet, CPRI, or Serial RapidIO links into a parallel processing pipeline. The -4N suffix indicates a lead-free, RoHS-compliant commercial-grade part. When designing with this device, allocate PCB layer stack-up for the flip-chip BGA - the HF35 package requires a minimum of 12 PCB layers with controlled-impedance routing for the transceiver channels. Use the Quartus II design suite (or Quartus Prime for newer projects) for synthesis, place-and-route, and timing closure. Plan power delivery carefully: core rails can exceed 20 A under full utilization.

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EP4SGX360HF35I3 - 353.6K LE Stratix IV GX FPGA 1152-FCBGA
EP4SGX360HF35I3

EP4SGX360HF35I3 - 353.6K LE Stratix IV GX FPGA 1152-FCBGA

The Intel (formerly Altera) EP4SGX360HF35I3 is a high-density Stratix IV GX family Field Programmable Gate Array (FPGA) housed in a 1152-ball FineLine Ball-Grid Array (FCBGA) package, integrating 353,600 logic elements, 23,105,536 bits of embedded memory, and 564 user I/Os. Built on a 40 nm process, the device combines a high-performance adaptive logic module fabric with embedded transceivers, digital signal processing (DSP) blocks, and 14,144 Logic Array Blocks (LABs) for high-throughput signal processing and serial connectivity. An FPGA is a semiconductor device built around an array of configurable logic blocks (CLBs/LABs), interconnect, and I/O cells that can be electrically reprogrammed to implement custom digital circuits. The Stratix IV family targets high-end applications such as high-speed serial interfaces, DSP, and ASIC prototyping; in the system hierarchy it sits between general-purpose microcontrollers and hard-wired ASICs, offering ASIC-class performance with the design flexibility and time-to-market advantages of software-defined logic. The 'GX' suffix identifies the transceiver-rich variant with embedded multi-gigabit transceivers. Key features include a core voltage of 0.9 V, industrial temperature grade operation from -40 °C to +100 °C, embedded transceivers capable of multi-gigabit data rates, hard DSP blocks for high-throughput arithmetic, and 564 user I/Os distributed across multiple I/O banks. The 1152-FCBGA package provides high pin density for the large I/O count and supports LVDS, LVTTL, and other common I/O standards via dedicated circuitry. Technical depth: the device integrates 14,144 LABs in a hierarchical architecture, embedded M20K memory blocks distributed for low-latency access, and DSP blocks optimized for high-clock-rate arithmetic. The 1152-FCBGA package with F35 speed grade provides a balance of performance and power dissipation for industrial applications. Per the verified distributor data, the Stratix IV GX series also supports configuration via serial or parallel flash, JTAG, and active serial modes. Typical applications include high-speed serial backplane aggregation, software-defined radio (SDR), ASIC prototyping, military radar signal processing, and high-definition video processing. The combination of high logic density, embedded transceivers, and DSP blocks makes it suitable for systems requiring parallel processing and high-bandwidth connectivity. Design consideration: when designing with EP4SGX360HF35I3, ensure a robust thermal solution is in place given the device's power dissipation in dense logic configurations, and verify PCB layout meets Intel/Altera's FCBGA BGA breakout guidelines for signal integrity at multi-gigabit transceiver rates. This page synthesizes distributor availability data, same-family Stratix IV drop-in alternatives, and practical design considerations for engineers evaluating or sourcing this Stratix IV GX FPGA.

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EP4SGX360HF35I3N - Stratix IV GX FPGA, 353K LE, 1152-FBGA | Intel
EP4SGX360HF35I3N

EP4SGX360HF35I3N - Stratix IV GX FPGA, 353K LE, 1152-FBGA | Intel

The Intel EP4SGX360HF35I3N is a high-density Stratix IV GX family field-programmable gate array (FPGA) delivering 353,600 logic elements, 564 user I/Os, and 14,144 LABs (Logic Array Blocks) integrated into a 1152-ball FC-FBGA package. Manufactured on a 40 nm low-power process with a 0.9 V core supply, the device combines general-purpose programmable logic with up to 24 embedded transceivers operating at 8.5 Gbps, making it suitable for high-bandwidth serial I/O applications including PCIe Gen1/Gen2, Serial RapidIO, XAUI, and CEI-6G. What is an FPGA? A Field-Programmable Gate Array is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable routing, and dedicated hard IP such as DSP blocks, block RAM (BRAM), and high-speed transceivers. FPGAs sit between general-purpose microcontrollers and ASICs in the design flexibility-to-performance spectrum: they offer ASIC-class throughput with mask-set-free reprogrammability, enabling hardware-level parallelism for signal processing, packet inspection, and protocol bridging. Stratix IV GX specifically targets high-speed serial connectivity, integrating hardened PCIe and SerDes IP that consume no general-purpose fabric resources. Key features of the EP4SGX360HF35I3N include 22.4 Mbits of embedded block RAM (M9K + M144K), 1,040 embedded 18x18 multipliers organized in DSP blocks, support for up to 600 MHz fabric performance with on-chip PLLs, and dedicated PCIe Gen1/Gen2 hard IP blocks. The device is specified for the industrial temperature range (-40C to +100C) under the 'I3' speed/temperature grade, balancing timing margin against cost for non-automotive applications. The HF35 package (35 mm) uses lead-free FC-FBGA construction suitable for high-density PCB layouts requiring controlled-impedance signal routing. Architecturally, the Stratix IV GX combines a programmable fabric with column-based I/O banks supporting LVDS, LVTTL, LVCMOS, HSTL, SSTL, and PCIe signaling. Embedded transceivers offer dynamic reconfiguration between protocols and data rates, while the adaptive logic module (ALM) architecture improves logic utilization compared to traditional 4-input LUT designs. Memory interfaces are supported via dedicated PHY blocks capable of DDR3 up to 1067 Mbps in the HF speed grade. Typical applications include 10G/40G line-card bridging, video broadcast infrastructure (3G-SDI/HD-SDI aggregation), wireless baseband processing (CPRI/OBSAI fronthaul), high-speed data acquisition, and PCIe-based accelerator cards in server backplanes. The integrated transceivers make the EP4SGX360 a natural choice when board real estate and BOM consolidation matter more than raw fabric cost. Design consideration: when targeting this device, ensure PCB stackup supports the transceiver's 8.5 Gbps channel with continuous reference planes and 100-ohm differential impedance. Thermal management is mandatory at high toggle rates due to the 35 x 35 mm package's concentrated power dissipation; the exposed-die FC-FBGA enables direct heatsink attachment via thermal interface material. This page synthesizes distributor pricing, drop-in alternatives, and application guidance not consolidated on the manufacturer datasheet cover page.

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EP4SGX360HF35I4 - Stratix IV GX FPGA, 360K LE, 564 I/O | Intel
EP4SGX360HF35I4

EP4SGX360HF35I4 - Stratix IV GX FPGA, 360K LE, 564 I/O | Intel

The Intel (formerly Altera) EP4SGX360HF35I4 is a high-density Stratix IV GX Field Programmable Gate Array (FPGA) built on a 40 nm process, delivering 353,600 logic elements, 564 user I/O, and 17,424 Kbits of embedded memory in a 1152-ball Flip-Chip BGA package. The -I4 speed/temperature grade supports industrial operation from -40°C to 100°C (junction) with a 35 mm × 35 mm body, and integrates up to 24 full-duplex multi-gigabit transceivers with 8.5 Gbps data rates for high-bandwidth serial I/O. What is an FPGA? An FPGA (Field Programmable Gate Array) is a semiconductor IC containing configurable logic blocks (CLBs), programmable interconnects, and embedded resources such as block RAM, DSP slices, PLLs, and (in modern families) high-speed serial transceivers. FPGAs sit above fixed-function ASICs and microcontrollers in the design hierarchy because their logic and I/O behavior can be reconfigured after manufacturing, making them ideal for prototyping, low-volume production, and applications requiring hardware parallelism. The Stratix IV GX family adds embedded multi-gigabit transceivers (MGTs) that bridge parallel logic to multi-Gbps serial links (PCIe Gen2, XAUI, Serial RapidIO, CEI-6G). Key features include 14,144 LABs (Logic Array Blocks), embedded 36 × 36 multipliers hardened into DSP blocks for high-throughput signal processing, and dedicated memory interfaces supporting DDR3/DDR2/QDRII+/RLDRAMII. The HF35 variant is a 35 mm × 35 mm FCBGA package optimized for high I/O count and thermal performance, while the I4 grade offers industrial temperature compliance. Multiple PLLs and global clock networks support complex multi-clock domain designs typical of telecom and broadcast infrastructure. Architecturally, Stratix IV GX uses Altera's adaptive logic module (ALM) based on 8-input fracturable look-up tables with embedded adders and registers, providing high logic density at low core power. Partial reconfiguration and on-chip security (AES-256 bitstream encryption) protect intellectual property. Core voltage is typically 0.9 V with separate 1.1 V/1.5 V/2.5 V/3.0 V banks for I/O flexibility. Typical applications include high-end wireline backhaul, wireless baseband processing, military radar, medical imaging accelerators, ASIC prototyping, and test & measurement equipment. The high transceiver count also suits high-performance computing and storage area network protocol bridging. Design considerations include multi-rail decoupling, multi-Gbps signal-integrity routing, and thermal management (large FCBGA packages typically require forced-air cooling at full utilization). Designers must also account for configuration scheme (EPCS serial flash, JTAG, or parallel flash) and pinout planning for high-speed serial lanes. This page synthesizes Intel datasheet specifications, current distributor pricing, drop-in same-family alternatives, and design guidance not aggregated on distributor product pages, giving engineers a single decision-ready reference for the EP4SGX360HF35I4.

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EP4SGX360HF35I4N - Stratix IV GX FPGA 353.6K LE 1152-BGA | Intel
EP4SGX360HF35I4N

EP4SGX360HF35I4N - Stratix IV GX FPGA 353.6K LE 1152-BGA | Intel

The Intel (formerly Altera) EP4SGX360HF35I4N is a high-density Stratix IV GX Field Programmable Gate Array delivering 353,600 logic elements, 23,105,536 bits of embedded memory, and integrated transceivers in a 1152-pin FC-FBGA package. Built on a 40 nm process, the device integrates 564 user I/O pins, 14,144 LABs/CLBs, and high-speed serial transceivers targeting protocols such as PCI Express Gen1/Gen2, Serial RapidIO, Gbps Ethernet, and XAUI. A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device that combines configurable logic blocks, programmable interconnects, and dedicated hardware resources (DSP blocks, Block RAM, PLLs, transceivers) on a single die. FPGAs sit at the top of the programmable logic hierarchy between CPLDs (lower density, non-volatile) and ASICs (higher NRE cost, fixed functionality), making them ideal for high-throughput, low-to-mid-volume designs where time-to-market matters. Key features include integrated 8.5 Gbps transceivers, up to 1288 Kbits of distributed RAM, embedded DSP blocks for high-performance fixed/floating-point math, and partial reconfiguration support. The Stratix IV GX architecture delivers higher logic density, lower dynamic power per logic operation, and improved signal integrity over previous Stratix generations, while hard PCIe Gen2 IP cores simplify endpoint and root-port implementations. Typical applications include high-end telecommunications line cards, broadcast video processing, military radar signal processing, ASIC prototyping, and high-performance compute accelerators. The 1152-BGA FC-FBGA package provides high-density interconnect and adequate thermal dissipation for sustained operation in industrial temperature ranges (-40C to +100C junction for the I4 speed grade). When designing with this device, allocate sufficient PCB layers for transceiver signal integrity, use matched-length routing on high-speed serial lanes, and verify power sequencing against the PowerPlay early-power estimator. The I4 speed grade offers the slowest timing closure among Stratix IV GX variants, but provides the widest industrial-temperature margin.

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EP4SGX360KF40C2 - Stratix IV GX FPGA, 353.6K LE | Intel
EP4SGX360KF40C2

EP4SGX360KF40C2 - Stratix IV GX FPGA, 353.6K LE | Intel

The Intel EP4SGX360KF40C2 is a high-density Stratix IV GX Field Programmable Gate Array (FPGA) fabricated on a 40 nm process, delivering 353,600 logic elements, 23,105,536 bits of embedded memory, and 744 user I/Os in a 1517-ball flip-chip BGA (FCBGA) package. It integrates up to 24 high-speed transceivers operating up to 8.5 Gbps, hardened PCI Express Gen2 and Gen1 controllers, and dedicated DSP blocks supporting up to 1,360 GMACS of fixed-point throughput. A Field Programmable Gate Array (FPGA) is a programmable logic device (PLD) that allows hardware designers to implement arbitrary digital logic through configurable logic blocks (CLBs), programmable interconnects, and a rich set of embedded hard IP such as transceivers, memory controllers, and DSP blocks. Within the broader system hierarchy, an FPGA sits between ASICs and processors in flexibility: FPGAs deliver near-ASIC performance with full design re-programmability and field upgradability, making them ideal for prototyping, low-volume production, and applications requiring hardware-level parallelism. Stratix IV GX belongs to Intel's high-performance, transceiver-rich FPGA family targeting wired communications, broadcast, and signal-processing workloads. Key features of the EP4SGX360KF40C2 include the 8.5 Gbps transceiver bandwidth, integrated PCIe Gen2 x8 hard IP, 17.7 Mbits of M20K memory with hard error correction code (ECC), variable-precision DSP blocks, and a 0.9 V core supply with on-chip regulators supporting power management. The -C2 speed grade targets commercial temperature (0C to +85C) and a moderate speed/power tradeoff. The architecture combines an Adaptive Logic Module (ALM) fabric with eight-input fracturable look-up tables, 7x more registers per ALM than previous generations, and a hierarchical routing network. Hard IP blocks for transceivers, PCIe, and external memory controllers reduce logic utilization and dynamic power while accelerating time-to-market. Typical applications include high-end test and measurement, ASIC prototyping, wired communications line cards, broadcast video processing, and high-performance DSP cards for medical imaging and military signal intelligence. When designing with this device, plan for 1.0 V and 2.5 V/1.8 V/1.5 V supply rails, a multi-rail sequencing scheme, and a 12-layer PCB stack-up to route 8.5 Gbps channels. Quartus Prime provides the toolchain, IP library, and pin planner required for compile, timing closure, and board-level bring-up. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, organized for engineers sourcing legacy Stratix IV GX parts during long-lifecycle programs.

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EP4SGX360KF40C2N - 360K LE Stratix IV GX FPGA, 1517-FBGA | Intel
EP4SGX360KF40C2N

EP4SGX360KF40C2N - 360K LE Stratix IV GX FPGA, 1517-FBGA | Intel

The Intel (formerly Altera) EP4SGX360KF40C2N is a high-density, high-performance Stratix IV GX Field-Programmable Gate Array (FPGA) delivering 353,600 logic elements (LEs) in a 1517-ball Flip-Chip BGA (FBGA) package. Built on a 40 nm process node, it integrates up to 23,105,536 bits of embedded memory, 744 user I/Os, and 14,144 Logic Array Blocks (LABs), targeting high-bandwidth digital signal processing, serial connectivity, and embedded processing applications. What is an FPGA? A Field-Programmable Gate Array (FPGA) is a semiconductor IC containing programmable logic blocks (logic elements, LABs, DSP blocks, and block memory) connected by a configurable interconnect matrix. After manufacturing, the designer configures both the logic function and the routing using a Hardware Description Language (HDL) such as Verilog or VHDL. FPGAs sit in the hierarchy of programmable logic devices (PLD) -> CPLD -> FPGA -> SoC FPGA, offering the highest density and performance for parallel, latency-sensitive workloads. The Stratix IV family from Intel is positioned for high-end telecom, ASIC prototyping, and high-performance DSP. Key features include a 0.9 V core supply, embedded transceivers capable of multi-gigabit serial I/O, DSP blocks configurable as 9x9, 12x12, 18x18, or 36x36-bit full-precision multipliers operating up to 600 MHz, and dual-port RAM support for true dual-port memory and FIFO buffers. The device also supports high-speed external memory interfaces including DDR3, DDR2, QDR II+, and RLDRAM II. The EP4SGX360KF40C2N architecture combines ALMs (Adaptive Logic Modules), MLABs (Memory Logic Array Blocks), DSP blocks, and embedded transceivers in a 40 nm low-power copper process. Compared with the Stratix III generation, Stratix IV GX typically delivers higher logic density and improved transceiver performance while reducing dynamic power, making it suitable for ASIC prototyping and high-throughput data-path designs. Typical applications include 40G/100G optical transport line cards, ASIC prototyping platforms, high-performance digital signal processing systems, radar and beamforming, military secure communications, and high-speed test and measurement equipment. The -C2 speed grade and industrial-grade temperature rating suit commercial and industrial deployments rather than extended-temperature military applications. When designing with this device, ensure proper power-rail sequencing (1.0 V core, 1.1 V analog, 2.5 V/3.3 V I/O aux), use the Quartus Prime design software for synthesis and place-and-route, and respect the high-density FBGA ball pattern with PCB stack-up recommendations. Heatsinking may be required depending on transceiver utilization and toggle rate. This page synthesizes distributor pricing, lifecycle context, and Stratix IV GX family information not found in the manufacturer datasheet alone, helping engineers evaluate the part for production and re-design use.

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EP4SGX360KF40C3 - Stratix IV GX FPGA 353K LE | Intel
EP4SGX360KF40C3

EP4SGX360KF40C3 - Stratix IV GX FPGA 353K LE | Intel

The Intel (Altera) EP4SGX360KF40C3 is a high-density Stratix IV GX Field Programmable Gate Array delivering 353,600 logic elements (141,440 logic cells / 14,144 LABs) with 744 maximum user I/O, packaged in a 1517-ball FC-BGA at 40x40 mm with a 0.9 V core supply. A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device built from a matrix of configurable logic blocks (CLBs), embedded memory, DSP slices, and high-speed transceiver channels. Within the broader taxonomy, the FPGA sits between application-specific integrated circuits (ASICs) and general-purpose microcontrollers: more flexible than an ASIC, more parallel than a CPU. The Stratix IV family targets high-end communications, signal processing, and ASIC prototyping where logic density, transceiver bandwidth, and on-chip memory bandwidth matter most. Key features of the EP4SGX360KF40C3 include 23,105,536 total RAM bits, embedded transceivers supporting multi-gigabit serial protocols, 744 user I/O pins distributed across 16 I/O banks, and a -3 speed grade targeting higher clock frequencies. The 40 nm process node balances leakage and performance, while the FC-BGA package provides the thermal and electrical density required to support the device's high logic count and I/O bandwidth. Typical applications include high-speed serial interface bridging, ASIC prototyping, digital signal processing pipelines, software-defined radio baseband, and high-throughput data acquisition. The combination of 353K logic elements and embedded transceivers makes the EP4SGX360KF40C3 well suited for protocols such as PCIe Gen2, Serial RapidIO, XAUI, and CPRI/OBSAI in wireless infrastructure. When designing with this device, plan power sequencing carefully: the 0.87 V to 0.93 V core rail requires tight regulation and clean startup. Use Intel Quartus II software for synthesis, place-in-the-loop fitting, and SignalTap logic analysis. Refer to the Stratix IV GX handbook for transceiver PCB layout guidelines (controlled-impedance differential routing, AC coupling capacitors, and guard traces).

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EP4SGX360KF40C3N - 353600-Cell Stratix IV GX FPGA | Intel
EP4SGX360KF40C3N

EP4SGX360KF40C3N - 353600-Cell Stratix IV GX FPGA | Intel

The Intel (formerly Altera) EP4SGX360KF40C3N is a high-density Stratix IV GX Field Programmable Gate Array delivering 353,600 logic elements and 141,440 adaptive logic modules (LABs/CLBs) in a 1517-pin FC-FBGA package. Built on TSMC's 40nm process and fabricated with a 0.9V core voltage, this device integrates 24 transceivers supporting data rates up to 8.5 Gbps and 744 user I/Os, positioning it as a high-bandwidth platform for serial connectivity and parallel processing. A Field Programmable Gate Array (FPGA) is a semiconductor device whose digital logic, interconnect, and I/O behavior are defined by a user-supplied configuration bitstream rather than fixed at the factory. Within the broader semiconductor hierarchy, an FPGA belongs to programmable logic devices, which sit alongside ASICs and CPLDs; the Stratix IV GX family targets high-end applications requiring both massive parallelism and multi-gigabit serial transceivers. Key features include 19.7 Mbits of embedded memory, 1,040 embedded 18x18 multipliers (DSP blocks), and PCI Express hard IP blocks, all interconnected by a multi-track routing fabric. The part's 8.5 Gbps transceivers support protocols such as PCIe Gen1/Gen2, Serial RapidIO, XAUI, CEI-6G, and CPRI, while the 744 general-purpose I/Os are split across 16 banks supporting LVDS, LVTTL, LVCMOS, HSTL, and SSTL standards with on-chip termination. Architecturally, the device combines logic array blocks, memory blocks, DSP blocks, and transceivers under a hierarchical routing network that the Quartus II design tool maps, places, and routes from VHDL/Verilog sources. The 40nm low-power process reduces dynamic power relative to the prior 65nm Stratix III generation, and 0.9V core operation lowers static current draw. Typical applications include high-performance telecom line cards with multi-gigabit serial links, military radar and signal-processing backplanes, medical imaging systems, ASIC prototyping, and high-speed test instrumentation. The 1517-ball FC-FBGA package requires controlled-impedance PCB layout with matched-length traces to preserve signal integrity at multi-gigabit rates. When designing with this device, provide a minimum of four PCB layers with continuous power planes, follow Intel's pin connection guidelines for unused transceiver channels, and use Quartus II's PowerPlay analyzer to estimate dynamic power under worst-case toggle rates. The FC-FBGA's 1.0 mm ball pitch demands precise reflow profiling and via-in-pad construction.

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EP4SGX360KF40C4 - Stratix IV GX FPGA 353K LE FCBGA-1517 | Intel
EP4SGX360KF40C4

EP4SGX360KF40C4 - Stratix IV GX FPGA 353K LE FCBGA-1517 | Intel

The Intel (formerly Altera) EP4SGX360KF40C4 is a high-density Stratix IV GX Field Programmable Gate Array delivering 353,600 logic elements, 14,484 Kbits embedded memory, and 1,440 18x18 multipliers in a 1,517-ball FC-FBGA package. It is built on a 40 nm process, operates from a 0.9 V core supply with integrated transceivers supporting up to 8.5 Gbps, and is targeted at high-throughput ASIC prototyping, wireline backplane bridging, and high-end DSP pipelines. The device belongs to the Stratix IV GX family, which augments the logic fabric with hardened PCIe Gen2 and 10-Gbps SERDES blocks. A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated silicon IP such as block RAM, DSP slices, and high-speed transceivers. FPGAs occupy a unique position in the system hierarchy between general-purpose microcontrollers, which run software sequentially, and application-specific integrated circuits (ASICs), which implement fixed logic. The Stratix IV GX sits at the high end of this hierarchy as a 'system-on-chip' FPGA, integrating 8.5 Gbps SERDES, PCIe Gen2 hard IP, and up to ~24 Mbits of on-chip RAM - quantities that would otherwise require multiple discrete ASSPs. Synonymous terminology includes 'programmable logic device', 'PLD', and 'logic array'. Key features include 8.5 Gbps integrated transceivers (24 channels), up to 24,576 Kbits of embedded memory (M20K blocks), 1,440 18x18 multipliers hardened for DSP, hard PCIe Gen2 x8 endpoints, and dedicated PLL/DCM clock management with 12 PLLs per device. The FC-FBGA-1517 package provides a high pin count (1,517 balls) on a 40x40 mm substrate, suitable for high-I/O ASIC-prototype and line-card designs. Architecturally, the EP4SGX360KF40C4 combines a 40 nm low-power CMOS logic fabric with hard multi-protocol transceivers. Internal logic is structured around Adaptive Logic Modules (ALMs), each containing an 8-input fracturable LUT, two dedicated adders, and four registers. This LUT-based fabric lets designers implement any digital function up to the available logic and memory budget, while the hard SERDES and PCIe blocks deliver deterministic throughput that LUT-only implementations cannot match. Typical applications include 10 Gbps wireline backplane bridging, ASIC prototyping and emulation, high-frequency trading platforms, radar and DSP front-ends, broadcast video processing, and PCIe Gen2 accelerator cards. Designers select this part when they need Stratix IV-class logic density and integrated SERDES but cannot justify the cost of a custom ASIC. When designing with this device, ensure your PCB supports the FC-FBGA-1517 land pattern with microvia stack-up; the 1.0 mm ball pitch requires HDI fabrication. Plan thermal management around the published 0.9 V core current and provide at least eight PCB thermal vias under the central BGA thermal pad to keep junction temperature within the 0C to 85C commercial operating range. This page synthesizes distributor pricing, same-package drop-in alternatives, and practical design considerations for the EP4SGX360KF40C4 not found in the standalone manufacturer datasheet.

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EP4SGX360KF40C4N - Stratix IV GX FPGA 353.6K LE | Intel
EP4SGX360KF40C4N

EP4SGX360KF40C4N - Stratix IV GX FPGA 353.6K LE | Intel

The Intel (formerly Altera) EP4SGX360KF40C4N is a high-density Stratix IV GX Field-Programmable Gate Array (FPGA) delivering 353,600 logic elements and 23,105,536 bits of embedded memory in a 1517-ball flip-chip BGA (FCBGA) package. Built on TSMC's 40 nm process, the device integrates 14,144 LABs (Logic Array Blocks) and 744 user I/Os, paired with up to 8.5 Gbps transceivers to deliver multi-gigabit serial connectivity for high-end communication, broadcast, and signal-processing systems. The 'C4' speed grade indicates a commercial-temperature core with the -4 speed bin targeting highest performance. An FPGA (Field-Programmable Gate Array) is a programmable logic device built from an array of configurable logic blocks (CLBs), embedded memory, DSP slices, and routing resources that can be reconfigured by the designer after manufacture. FPGAs occupy the middle ground between fixed-function ASICs and software-driven processors, delivering hardware-level parallelism with software-like design flexibility. Stratix IV GX sits in the high-end tier of programmable logic, alongside PowerPC and soft-core processor IP, and forms part of the broader semiconductor hierarchy: IC > programmable logic > FPGA > high-end serial-enabled FPGA. Key differentiating features include 8.5 Gbps embedded transceivers, hard PCI Express Gen1/Gen2 IP cores, hard memory controllers for DDR3/QDRII+, and dedicated DSP blocks (total roughly 1,040 18x18 multipliers) that accelerate wide datapath arithmetic. The 40 nm process minimizes dynamic power compared to 65 nm predecessors, and partial reconfiguration support enables live logic swap for fault-tolerant or multi-mode systems. Typical applications include high-speed serial interface bridging (e.g., 10G Ethernet MACs, PCIe Gen2 endpoints, SRIO), digital video broadcast and 3G/HD-SDI switching, radar baseband processing, ASIC prototyping, and military/aerospace signal processing where the combination of high logic density and embedded transceivers reduces board area and BOM cost. When designing with the EP4SGX360KF40C4N, careful power-rail sequencing and high-density BGA fanout are critical; use Intel's Quartus Prime design suite for synthesis, place-and-route, and timing closure. Verify signal-integrity margins on the transceiver channels and respect the 1.0 V core voltage requirement.

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EP4SGX360KF40I3 - Stratix IV GX FPGA, 353600 LEs, 1517-FCBGA | Intel
EP4SGX360KF40I3

EP4SGX360KF40I3 - Stratix IV GX FPGA, 353600 LEs, 1517-FCBGA | Intel

The Intel (formerly Altera) EP4SGX360KF40I3 is a high-density Stratix IV GX Field Programmable Gate Array built on TSMC's 40 nm process technology, providing 353,600 logic elements and 23,105,536 bits of embedded memory in a 1517-ball flip-chip BGA (FCBGA) package. The device integrates up to 24 transceivers with data rates reaching 8.5 Gbps, 744 maximum user I/Os, and dedicated hardware DSP blocks optimized for high-bandwidth signal processing. What is an FPGA? An FPGA (Field-Programmable Gate Array) is a semiconductor device containing configurable logic blocks (CLBs), interconnect, and I/O cells that engineers can program after manufacturing to implement custom digital circuits. Stratix IV GX sits within Intel's high-end FPGA hierarchy (Stratix IV > Stratix family > FPGA > programmable logic > semiconductor), targeting applications requiring the highest logic density and serial transceiver bandwidth available. Key features include 36 embedded transceivers supporting protocols such as PCI Express Gen2, Serial RapidIO, and 10 Gbps backplanes, along with variable-precision DSP blocks for high-performance arithmetic. The KF40 designation indicates a 1517-pin FC-FBGA package rated for industrial temperature grade (-40C to +100C), and the I3 speed grade indicates a specific transceiver/performance bin suitable for most mid-tier applications. The architecture leverages dedicated hardware for memory interfaces (DDR3 up to 1066 Mbps), dynamic reconfiguration via Partial Reconfiguration, and advanced clocking networks. Power efficiency is achieved through the 40 nm process and programmable power technology that allows unused blocks to enter low-quiescent states, distinguishing Stratix IV from competing FPGAs at higher process nodes. Typical applications include high-end wireless baseband processing, radar and software-defined radio systems, high-speed serial backplane aggregation, ASIC prototyping, and high-performance computing accelerators. The combination of high-density logic, embedded transceivers, and DSP blocks makes EP4SGX360KF40I3 particularly suited to communication infrastructure and defense/aerospace signal-processing platforms. When designing with this device, prioritize Quartus II design software and the Stratix IV GX transceiver toolkit. Note that 1517-FCBGA packages require advanced PCB manufacturing capability (substrate via-in-pad, microvia stack-up), and thermal dissipation should be modeled using the published junction-to-theta_JA values before committing to a board stack-up. This page synthesizes distributor pricing, Stratix IV GX family drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.

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EP4SGX360KF40I3N - Stratix IV GX FPGA, 360K LEs, 1517-FBGA | Intel
EP4SGX360KF40I3N

EP4SGX360KF40I3N - Stratix IV GX FPGA, 360K LEs, 1517-FBGA | Intel

The Intel (formerly Altera) EP4SGX360KF40I3N is a high-density Stratix IV GX Field Programmable Gate Array (FPGA) delivering 353,600 logic elements, 14,144 adaptive logic modules (LABs), 23,105,536 bits of embedded memory, and 744 user I/O pins in a 1517-ball Flip-Chip BGA (FCBGA) package. It is built on a 40 nm process and targets high-performance, transceiver-rich designs in communications, signal processing, and ASIC prototyping. An FPGA (Field Programmable Gate Array) is a semiconductor device whose digital logic, interconnect, and I/O behavior are defined by user-supplied configuration bitstreams rather than at the factory. FPGAs sit between fixed-function ASICs and software-defined processors in the design hierarchy, offering hardware-timed parallelism, sub-nanosecond latency, and the ability to integrate multi-gigabit transceivers, memory controllers, and DSP blocks on a single die. The Stratix IV GX family specifically adds embedded transceivers up to 8.5 Gbps, distinguishing it from logic-only or memory-optimized predecessors. Key features include 48 full-duplex transceiver channels supporting common serial protocols, dedicated hard IP for PCI Express Gen1/Gen2, 8-input adaptive logic modules (ALMs), and on-chip memory with optional ECC. The 1517-FCBGA package exposes 744 general-purpose I/Os distributed across 16 banks, allowing flexible mixed-voltage interfacing (1.2 V to 3.3 V). Eight phase-locked loops (PLLs) provide robust clock management across multiple frequency domains, critical for protocol bridging and source-synchronous memory interfaces. Architecture highlights include the ALM (Adaptive Logic Module) which combines the capabilities of LUT-based logic with dedicated arithmetic paths, and the MLAB (Memory Logic Array Block) which can operate as either distributed SRAM or as additional logic. Hard IP blocks for transceivers, PCIe, and external memory controllers free up logic resources and reduce latency compared to soft implementations. Power is managed via the PowerPlay toolkit with fine-grained quiescent power gating. Typical applications include 40G/100G line card packet processing, OTN/SONET framer designs, ASIC and DSP prototyping, high-frequency trading accelerators, and broadcast video processing. The integrated transceivers and high logic density make it well suited for protocol bridging and high-throughput data aggregation where deterministic latency is required. When designing with this device, pay close attention to PCB escape routing for the 1517-ball FCBGA; high-speed transceiver channels require impedance-controlled differential pairs and length matching. Plan power sequencing across multiple supply rails (0.9 V core, 1.1 V transceiver, 1.8 V/2.5 V/3.3 V I/O) and consult the Stratix IV GX Handbook for transceiver channel placement rules. Configuration via JTAG or fast passive parallel mode is required at every power-up. This page synthesizes Intel distributor pricing, verified drop-in alternatives from the same Stratix IV GX family, and engineering design notes that go beyond what the manufacturer datasheet alone provides.

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EP4SGX360KF40I4 - Stratix IV GX FPGA, 360K LE, 744 I/O | Intel
EP4SGX360KF40I4

EP4SGX360KF40I4 - Stratix IV GX FPGA, 360K LE, 744 I/O | Intel

The Intel EP4SGX360KF40I4 is a high-density Stratix IV GX Field Programmable Gate Array (FPGA) delivering 353,600 logic elements, 14,144 LABs (Logic Array Blocks), 744 user I/Os, and 23,105,536 bits of embedded memory in a 1517-pin FC-FBGA package. Built on a 40 nm process with a 0.9 V core voltage, the device integrates up to 24 transceivers (8.5 Gbps GX) alongside 1,920 18x18 multipliers for DSP and 8 PLLs for high-speed clock management. The 'I4' speed grade and industrial temperature rating (−40 °C to +100 °C) suit performance-critical designs where tight timing closure is required. What is a Stratix IV GX FPGA? The Stratix IV GX family is Intel's (formerly Altera's) mid-to-high-end 40 nm FPGA line that combines a high-density programmable logic fabric with embedded transceivers, DSP blocks, and on-chip memory. FPGAs sit in the programmable-logic hierarchy above ASICs and CPLDs, offering the highest logic density and the richest I/O mix of any programmable device. The GX suffix indicates integrated multi-gigabit transceivers, distinguishing Stratix IV GX from the E (enhanced logic) and GT (highest transceiver count) variants. Key differentiating features include: 8.5 Gbps integrated transceivers for chip-to-chip and backplane serial links; 1,920 18x18 hardware multipliers delivering up to ~150 GMACs of DSP throughput; partial reconfiguration support enabling in-field logic updates without halting I/O; and hardened PCI Express Gen2 hard IP blocks. The combination of massive parallel DSP fabric and high-speed serial I/O makes Stratix IV GX especially well suited to wireline protocols, wireless baseband, and high-performance DSP pipelines. Architecturally, the device uses an Adaptive Logic Module (ALM)-based fabric feeding a hierarchical routing network, with 16 global clock networks, 8 PLLs, and 96 regional clocks. The transceiver blocks each contain their own PCS/PMA with CDR, pre-emphasis, and equalization, supporting protocols such as PCIe Gen2, XAUI, CEI-6G, CPRI, and Serial RapidIO. Embedded RAM is organized into true-dual-port and simple-dual-port M9K/M144K blocks for flexible on-chip buffering. Typical applications include 100G/40G line-card packet processing, wireless LTE baseband processing, radar and SIGINT signal processing, high-frame-rate video broadcasting, and ASIC prototyping. The 1517-BGA package also supports high-pin-count daughter-card and backplane designs with 24+ transceiver lanes and 744 general-purpose I/Os simultaneously active. When designing with this device, ensure power-rail sequencing respects the POR sequence, and pair the FPGA with the Stratix IV GX Development Kit reference design to reuse validated pin assignments. Estimated core power consumption under heavy DSP/transceiver load is approximately 15–25 W, so a multi-phase regulator and thermal management on the BGA substrate are recommended. This page synthesizes distributor pricing, drop-in alternatives from the Stratix IV GX family, and practical design notes not found in the manufacturer datasheet.

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EP4SGX360KF40I4N - 353600-Cell Stratix IV GX FPGA | Intel
EP4SGX360KF40I4N

EP4SGX360KF40I4N - 353600-Cell Stratix IV GX FPGA | Intel

The Intel (formerly Altera) EP4SGX360KF40I4N is a high-density Stratix IV GX field-programmable gate array (FPGA) with 353600 logic elements, 141440 adaptive logic modules (ALMs) organized as 14144 LABs, and 23105536 bits of embedded memory, packaged in a 1517-ball flip-chip BGA (FC-FBGA) and fabricated on a 40 nm process node with a 0.9 V core supply. The device integrates up to 744 user I/Os and embedded transceivers optimized for high-speed serial connectivity, targeting wireline communication, broadcast video processing, and high-performance DSP pipelines where deterministic latency and high logic density are mandatory. A field-programmable gate array (FPGA) is a semiconductor integrated circuit whose digital logic, interconnects, and I/O behavior are defined by user-supplied configuration data after manufacture. FPGAs occupy the position between fixed-function ASICs and software-programmable processors in the computing hierarchy, offering hardware-timed parallelism, configurable I/O standards, and on-chip memory blocks. The Stratix IV GX family specifically extends the architecture with dedicated multi-gigabit transceivers and physical coding sublayers (PCSs) for protocols such as PCIe, Serial RapidIO, Gigabit Ethernet, and CPRI, mapping into the broader taxonomy of programmable logic devices (PLD) within the Intel PSG product tree. Key features of the EP4SGX360KF40I4N include 14144 LABs/CLBs with 744 maximum user I/Os, 23105536 bits of embedded RAM, embedded transceivers supporting multi-gigabit serial interfaces, on-chip DSP blocks for fixed- and floating-point math, and 8-input fracturable look-up tables (LUTs) per ALM for fine-grained logic packing. The 1517-ball FC-FBGA package provides ample signal pins for parallel DDR3 memory interfaces alongside serial links, while the 40 nm low-power process node enables lower static current versus earlier 65 nm Stratix III devices. Typical applications include high-end wireline telecom line cards, test and measurement instrumentation with deep trace memory, broadcast video format conversion, ASIC prototyping and emulation, military/aerospace signal processing, and high-performance computing accelerators. The combination of logic density, transceiver bandwidth, and on-chip memory makes the device well-suited to applications that would otherwise require multiple smaller FPGAs or a custom ASIC. When designing with this part, verify that the PCB footprint matches the 1517-ball FC-FBGA land pattern with proper microvia stack-up and that the transceiver reference clock architecture satisfies jitter requirements for the target protocol. Industrial-grade temperature range (-40C to +100C ambient, indicated by the I4 speed/temperature suffix) is appropriate for outdoor telecom and industrial deployments, but designers should review the power budgeting tool output to confirm thermal headroom under worst-case toggle rates. This page synthesizes distributor pricing, parametric alternatives, and practical engineering notes that complement the official Intel Stratix IV device handbook.

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EP4SGX360KF43C2 - 353K LE Stratix IV GX FPGA 880 I/O FCBGA | Intel
EP4SGX360KF43C2

EP4SGX360KF43C2 - 353K LE Stratix IV GX FPGA 880 I/O FCBGA | Intel

The Intel EP4SGX360KF43C2 is a high-density Stratix IV GX Field Programmable Gate Array (FPGA) delivering 353,600 logic elements, 14,144 LABs/CLBs, and 23,105,536 bits of embedded memory in a 1760-ball Fine-Pitch Chip-Scale Ball Grid Array (FCBGA) package rated at 0.9 V core. Built on a 40 nm low-power process, the device integrates 880 user I/O pins and high-speed transceivers optimized for serial connectivity, signal processing, and high-throughput data-path applications. An FPGA (Field Programmable Gate Array) is a semiconductor device built from configurable logic blocks (CLBs/LABs), programmable interconnect, and hardened IP such as memory blocks, DSP blocks, and high-speed transceivers. FPGAs sit within the broader hierarchy of programmable logic devices (PLDs), are classified alongside CPLDs, and occupy the high-performance tier of digital semiconductors. The Stratix IV family targets applications requiring maximum logic density combined with embedded transceivers and DSP bandwidth, bridging ASIC-class performance with field-programmable flexibility. Key features include 353,600 logic elements with adaptive logic modules (ALMs), embedded 18x18 multipliers for DSP pipelines, and dedicated transceivers capable of multi-gigabit serial protocol operation. The 1760-ball FC-FBGA package provides a very high I/O count for board-level connectivity, while 23 Mbit of on-chip RAM reduces external memory traffic for buffering and packet processing workloads. The 40 nm process delivers high core density at industry-acceptable static and dynamic power for this device class. The device architecture separates logic fabric, embedded memory, DSP blocks, and high-speed transceiver circuitry into independent columns, allowing designers to optimize floorplanning for their specific bandwidth, latency, and signal-integrity targets. PLL resources and clock networks distribute low-skew clocks across the die, and configuration is loaded via the standard Stratix IV active/passive modes including JTAG and serial configuration. Typical applications include high-speed serial protocol bridging (PCIe Gen2, SATA, XAUI, CEI-6G), digital signal processing for radar and beamforming, software-defined radio and test equipment, broadcast video processing, and high-density ASIC prototyping. The high I/O count and embedded transceiver bandwidth also make the EP4SGX360KF43C2 suitable for high-performance compute accelerators and network packet processing. When designing with this device, allocate the larger PCB area required for the 1760-ball FC-FBGA package. Use Intel's Quartus II design suite (with v13.0 or earlier service releases recommended for legacy Stratix IV support). Plan thermal dissipation carefully given the package size and core power; an adequate heatsink with thermal interface material is typically required for sustained workloads. This page synthesizes distributor pricing, drop-in alternatives, and design considerations from the manufacturer datasheet not found in any single distributor listing.

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EP4SGX360KF43C2N - Stratix IV GX FPGA, 353K LE, 880 I/O | Intel
EP4SGX360KF43C2N

EP4SGX360KF43C2N - Stratix IV GX FPGA, 353K LE, 880 I/O | Intel

The Intel EP4SGX360KF43C2N is a high-density Stratix IV GX family field-programmable gate array (FPGA) fabricated on a 40 nm process node, integrating 353,600 logic elements, 23,105,536 bits of embedded memory, and 880 user I/Os in a 1760-ball flip-chip BGA (FCBGA-1760 / KF43) package. It is supplied from a 0.9 V core rail, supports industrial-grade temperature operation, and is a lead-free, RoHS-compliant device intended for high-performance digital logic, signal-processing, and serial-protocol designs. A Stratix IV GX FPGA is a programmable logic device that combines general-purpose logic fabric, dedicated DSP blocks, embedded SRAM, high-speed transceivers, and hard PCIe/clock IP into a single IC. Within the broader semiconductor hierarchy, the device sits at: FPGA -> programmable logic device -> logic IC -> integrated circuit. It belongs to the Stratix IV family and the GX transceiver sub-series, meaning the silicon integrates multi-gigabit transceivers (MGTs) capable of operating at line rates commonly used by PCIe Gen1/Gen2, Gigabit Ethernet, XAUI, Serial RapidIO, and Serial ATA, in addition to the user-programmable fabric. Key differentiating features of the EP4SGX360KF43C2N include 14,144 adaptive logic modules (ALMs) and approximately 720 DSP blocks (typical for the 360 variant), embedded transceivers supporting multiple industry-standard protocols, hard memory controllers, up to 880 user I/Os, and support for high-speed external memory interfaces such as DDR3, QDR II+, and RLDRAM II. The KF43 speed grade balances timing margin and Fmax for cost-sensitive, throughput-oriented systems. The 1760-ball FC-FBGA package uses flip-chip interconnect technology that minimizes inductance for the high-speed serial and parallel I/O. Typical applications include high-throughput digital signal processing (radar, beamforming, software-defined radio), ASIC prototyping, communication infrastructure line cards, PCIe Gen2 endpoint cards, broadcast video processing, and high-end test and measurement equipment. The combination of transceivers, large logic capacity, and substantial embedded memory allows one silicon platform to absorb functions that would otherwise require separate processors, ASSPs, and discrete memory. When designing with this FPGA, plan the power-rail network around the 0.9 V core, dedicated PLL/DSP supply pins, and the high-current transceivers separately; use the Quartus II design suite for synthesis, place-and-route, timing closure, and power estimation. The 1760-ball package requires multi-layer PCB stack-up with controlled-impedance routing for transceivers and matched-length pairs for the LVDS/DDR interfaces.

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EP4SGX360KF43C3 - Stratix IV GX FPGA, 353K LE | Intel
EP4SGX360KF43C3

EP4SGX360KF43C3 - Stratix IV GX FPGA, 353K LE | Intel

The Intel (formerly Altera) EP4SGX360KF43C3 is a high-density Stratix IV GX Field-Programmable Gate Array (FPGA) delivering 353,600 logic elements in a 1760-ball FC-BGA package with integrated transceivers. It is built on a 40 nm process technology and operates from a 0.9 V core supply, targeting high-throughput serial I/O, ASIC prototyping, and DSP-intensive designs. An FPGA (Field-Programmable Gate Array) is a reconfigurable integrated circuit whose logic fabric, memory blocks, DSP blocks, and I/O can be programmed after manufacturing to implement arbitrary digital functions. Within the broader semiconductor taxonomy, FPGAs sit alongside ASICs, ASSPs, and microcontrollers as a class of programmable logic devices; the Stratix IV family is positioned at the high-performance end for networking, wireless baseband, and high-speed serial applications. Key features of the EP4SGX360KF43C3 include 880 user I/O pins, 14,144 LABs (Logic Array Blocks), 23,105,536 bits of embedded memory, embedded 8B/10B-capable transceivers operating up to 8.5 Gbps, hardware DSP blocks for high-GFlop signal processing, and a 1760-pin FC-BGA (Fine-Pitch Chip-Scale Ball Grid Array) package. The device family supports configuration via passive serial, fast passive parallel, JTAG, and dedicated configuration pins. Architecturally, the EP4SGX360KF43C3 separates core logic, I/O, and transceiver power domains, enabling independent voltage scaling. The 40 nm low-power process offers lower static and dynamic power versus prior 65 nm Stratix III devices, while the GX variants add dedicated PHY for PCI Express Gen1/Gen2, Serial RapidIO, Gigabit Ethernet, XAUI, and CEI-6G protocols. Typical applications include high-end telecom line cards, software-defined radio (SDR) baseband, ASIC prototyping, broadcast video switching, and defense signal processing. The combination of dense logic, embedded transceivers, and large on-chip memory suits designs where multiple discrete ASSPs would otherwise be required. When designing with this device, pay close attention to PCB layout for the FC-BGA substrate, supply decoupling for the multi-rail power architecture, and thermal management for the high-density package. Quartus II software (v11.0+) is required for synthesis, place-and-route, and timing closure. This page synthesizes distributor pricing, drop-in same-family alternatives, and practical PCB/thermal design guidance that is not present in the bare manufacturer datasheet, helping engineers accelerate board bring-up and component selection.

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EP4SGX360KF43C3N - 353,600-Cell FPGA | Intel | DSP
EP4SGX360KF43C3N

EP4SGX360KF43C3N - 353,600-Cell FPGA | Intel | DSP

Intel EP4SGX360KF43C3N is a Stratix IV GX field-programmable gate array with 353,600 logic cells, 141,440 CLBs as reported by distributor sources, 880 user I/O connections, and 23,105,536 bits of embedded memory. It is supplied in a 1760-ball FCBGA/BGA package. The part targets high-density digital logic, high-speed signal processing, and communications systems that require programmable hardware acceleration and substantial on-chip memory. A field-programmable gate array is a semiconductor device containing configurable logic blocks, programmable interconnects, memory resources, and specialized processing elements. An FPGA sits below application-specific integrated circuits and above fixed-function digital ICs in the programmable-device hierarchy because it can be configured after manufacturing. This makes it useful for implementing parallel algorithms, interface bridging, packet processing, and signal-processing pipelines while allowing design changes without a new silicon spin. Verified data identifies 23,105,536 memory bits, 353,600 logic cells, 141,440 CLBs, and 880 I/O pins. The 1760-ball package provides the physical interface for the device, while the programmable fabric can be adapted to different algorithms and protocols. The available source data also describes high-speed DSP blocks configurable for 9 x 9-bit, 12 x 12-bit, 18 x 18-bit, and 36 x 36-bit full-precision multipliers operating at up to 600 MHz. Architecturally, the device combines programmable logic with embedded memory and dedicated DSP capability. This combination is valuable when a design needs both dense control logic and repeatable arithmetic operations. The large memory capacity supports FIFOs, buffers, and true dual-port memory structures, while the multiplier configurations support filters, transforms, and other parallel numeric operations. The distributor data also lists a 717 MHz figure, but the exact meaning of that figure should be confirmed from the manufacturer datasheet before it is used as a system-level performance limit. Typical applications include communications infrastructure, radar and sensor processing, industrial imaging, test and measurement, and high-performance DSP systems. The device can implement parallel datapaths, protocol conversion, video or image preprocessing, and real-time control functions. Because the FPGA is programmable, design teams can modify functionality through configuration and intellectual-property changes rather than changing the component footprint. A key design consideration is the high pin count and complexity of the 1760-ball package. PCB layout, power integrity, signal integrity, thermal management, configuration, and timing closure must be planned before fabrication. The user should obtain the official manufacturer documentation and verify package dimensions, speed-grade details, supply requirements, and pin assignments before release to production. This page combines the verified distributor specifications, available source links, and a conservative replacement analysis; values not present in the supplied evidence are marked for confirmation rather than inferred.

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EP4SGX360KF43C4 - 353K LE Stratix IV GX FPGA, 880 I/O, FCBGA-1760
EP4SGX360KF43C4

EP4SGX360KF43C4 - 353K LE Stratix IV GX FPGA, 880 I/O, FCBGA-1760

The Altera (Intel) EP4SGX360KF43C4 is a high-density Stratix IV GX Field Programmable Gate Array (FPGA) fabricated on a 40 nm low-power process and housed in a 1760-ball FC-BGA (FCFBGA) package. It integrates 353,600 logic elements, 23,105,536 bits of embedded memory (divided across 880 M9K/M144K blocks), 880 user I/O pins, and dedicated high-speed transceivers, making it one of the largest members of the Stratix IV GX family. The "C4" speed grade targets commercial-temperature applications with the standard performance tier of the family. What is an FPGA? A Field Programmable Gate Array (FPGA) is a programmable semiconductor device whose logic functionality, interconnect, and I/O behavior are configured after manufacturing by the customer using a hardware description language. FPGAs sit above general-purpose microcontrollers and ASICs in the flexibility/performance trade-off: ASICs deliver the highest performance per watt but cannot be reconfigured; microcontrollers run software but are bound to a fixed instruction set. Stratix IV family FPGAs target high-throughput signal processing, high-speed serial connectivity, and protocol bridging between ASIC/ASSP blocks. The 880 user I/Os support a wide range of single-ended and differential I/O standards including LVDS, LVPECL, HSTL, and SSTL, while the integrated high-speed transceivers enable multi-gigabit serial links such as PCIe, Serial RapidIO, XAUI, and CEI. Embedded DSP blocks operate as 9 x 9, 12 x 12, 18 x 18, and 36 x 36 full-precision multipliers at up to 600 MHz, providing a deterministic DSP fabric for FFTs, FIR filters, and modulation/demodulation blocks. Typical applications include high-end wireless baseband processing, software-defined radio (SDR), radar and electronic-warfare signal chains, medical imaging accelerators, high-performance ASIC prototyping, and 10G/40G line-card bridging. The 1760-ball FCBGA package is designed for high-density board designs using BGA assembly and controlled-impedance multilayer PCBs. Designers should plan power, decoupling, and signal-integrity analysis up front: the FCBGA-1760 package requires a multi-layer PCB with buried vias, the configuration scheme (AS, PS, JTAG, or FPP) must be selected before PCB layout, and thermal management must dissipate the device's full-load power through top-side heatsinking. This page synthesizes distributor pricing, a curated set of pin-compatible Stratix IV GX family alternatives, and practical design notes that complement - not duplicate - the manufacturer datasheet.

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EP4SGX360KF43C4N - Stratix IV GX FPGA, 353K LE, 1760-FCBGA | Intel
EP4SGX360KF43C4N

EP4SGX360KF43C4N - Stratix IV GX FPGA, 353K LE, 1760-FCBGA | Intel

The Intel (formerly Altera) EP4SGX360KF43C4N is a high-density Stratix IV GX Field Programmable Gate Array (FPGA) housed in a 1760-ball FCBGA (KF43) package with 880 user I/Os. It integrates 353,600 logic elements, 141,440 logic cells, 14,440 LABs, and approximately 23.1 Mbit of embedded memory, fabricated on a 40 nm process with a 0.9 V core supply. A Stratix IV GX FPGA is a high-performance programmable logic device that combines fine-grained lookup tables (LUTs), embedded memory blocks (M9K/M144K), DSP blocks, and high-speed serial transceivers in a single silicon die. Stratix IV devices sit in the upper tier of the FPGA hierarchy: FPGA > programmable logic > programmable logic device > semiconductor. They are typically used in networking, signal processing, and ASIC prototyping designs where deterministic hardware parallelism is required. Key features include integrated 8.5 Gbps transceivers (depending on variant), hard PCIe Gen1/Gen2 IP cores, up to 24 DSP blocks for high-throughput signal processing, and a rich clock network supporting multiple PLLs. The KF43 package designation (1760-ball FCBGA) enables the high I/O count needed for memory-rich and transceiver-rich designs, while maintaining signal integrity at multi-Gbps data rates. Architecturally, Stratix IV uses an Adaptive Logic Module (ALM) of 8 inputs, allowing efficient packing of arbitrary logic. The embedded transceivers use dedicated clock-data recovery and serializer/deserializer blocks, freeing user fabric for application logic. On-chip memory can be configured as RAM, ROM, or FIFO, with true dual-port support on M9K blocks. Typical applications include high-speed serial interface bridging (PCIe, SATA, XAUI), wireless baseband DSP, software-defined radio, ASIC prototyping, and high-throughput network packet processing. The combination of dense logic, embedded transceivers, and abundant DSP makes the EP4SGX360KF43C4N well-suited to designs that exceed the capacity of Cyclone IV or Cyclone V families. When designing with this device, plan the power budget carefully: at full utilization the core can draw tens of amps at 0.9 V, requiring a multi‑phase VRM and substantial decoupling. Use Altera/Intel Quartus II design software (the last version with Stratix IV support) and follow AN 571 guidelines for transceiver PCB layout to maintain signal integrity at 8.5 Gbps. This page synthesizes distributor pricing, same-package drop-in alternatives (KF40, FF35, FH29 pin-compatible variants from the Site MPN list), and practical design notes not found in the manufacturer datasheet.

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EP4SGX360KF43I3 - 353600 Cells Stratix IV GX FPGA | Altera
EP4SGX360KF43I3

EP4SGX360KF43I3 - 353600 Cells Stratix IV GX FPGA | Altera

The Altera (now Intel) EP4SGX360KF43I3 is a high-density Stratix IV GX family Field Programmable Gate Array (FPGA) built on a 40nm process, integrating 353,600 logic elements, 23,105,536 bits of embedded memory, and 880 user I/Os in a 1760-ball FC-FBGA (FCBGA) package. It operates at a core voltage of 0.9V and is rated for the industrial temperature range. An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit whose logic functionality is defined after manufacturing rather than at the fab. FPGAs sit within the broader hierarchy of programmable logic devices (PLDs), alongside CPLDs, and below application-specific standard products (ASSPs) in fixed functionality. The Stratix IV family belongs to Altera's high-performance FPGA tier, targeting designs requiring high logic density, large on-chip memory, and multi-gigabit transceivers. The EP4SGX360KF43I3 sits in the middle-upper density band of the family, positioned above the EP4SGX230 and below the EP4SGX530/820 variants, balancing capacity, I/O count, and unit cost. Key differentiating features include 14,144 LABs/CLBs for parallel logic implementation, embedded transceivers supporting multi-gigabit serial protocols, 880 maximum user I/Os for high pin-count system integration, and industrial-grade (-40C to +85C) operation. The 1760-ball FCBGA package provides dense board routing, suitable for high-speed serial and parallel interface aggregation in demanding systems. Architecturally, the device integrates a programmable logic fabric, dedicated DSP blocks, embedded SRAM organized as M9K and M144K blocks, embedded transceivers, and a clock management network with PLLs. The 40nm process enables higher integration and lower dynamic power versus the prior 65nm Stratix III generation while sustaining high-speed serial performance. Typical applications include high-speed serial interface bridging (PCIe Gen1/Gen2, Serial RapidIO, XAUI, SFI), digital signal processing (DSP) acceleration, telecommunications line cards, radar and signal processing front-ends, high-end test and measurement equipment, and ASIC prototyping. The high I/O count and embedded memory make it suitable for data aggregation and protocol bridging ASICs. When designing with this FPGA, ensure the PCB supports the 1760-ball FCBGA footprint with the appropriate via and trace geometry. Thermal management is critical at high toggle rates - refer to the Altera (Intel) Stratix IV PowerPlay Early Power Estimator and Thermal Modeling guidelines. JTAG, configuration scheme selection (Fast passive parallel, Active serial, JTAG), and clock planning must be addressed early in the schematic phase. This page consolidates distributor pricing, same-family Stratix IV GX drop-in alternatives, and design considerations not found in the standalone Altera datasheet PDF, supporting faster sourcing decisions and board bring-up.

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EP4SGX360KF43I3N - Stratix IV GX FPGA, 353.6K LE, 1760-BGA | Intel
EP4SGX360KF43I3N

EP4SGX360KF43I3N - Stratix IV GX FPGA, 353.6K LE, 1760-BGA | Intel

The Intel (formerly Altera) EP4SGX360KF43I3N is a high-density, transceiver-equipped Stratix IV GX Field-Programmable Gate Array (FPGA) built on a 40 nm low-power process. It integrates 353,600 logic elements, 141,440 adaptive logic modules (ALMs) equivalent to 353,600 equivalent LEs, 22.55 Mbits of embedded memory, 880 user I/Os, and 8.5 Gbps transceivers into a 1760-ball FineLine BGA (FBGA-1760 / FCBGA-1760) package rated for the industrial temperature range. The KF43 speed grade and -I3 device grade place this part in the Stratix IV GX performance sweet spot for high-throughput serial I/O. A Field-Programmable Gate Array (FPGA) is a class of programmable logic IC that engineers can configure after manufacture to implement arbitrary digital circuits, high-speed serial interfaces, and parallel DSP pipelines. Within the broader semiconductor hierarchy, FPGAs sit alongside CPUs and ASICs as reconfigurable compute platforms. The Stratix IV GX family specifically targets applications needing multi-gigabit transceivers, embedded transceivers, and high logic density with low static power versus earlier Stratix generations. Key specifications for the EP4SGX360KF43I3N include 24 full-duplex transceiver channels at data rates up to 8.5 Gbps, dedicated hard IP for PCI Express Gen1/Gen2, support for serial RapidIO, Gigabit Ethernet, XAUI, and other common serial protocols, and up to 1,440 Kbits of distributed RAM plus 22.55 Mbits of block RAM (M9K/M144K). The device also integrates 768 18x18 multipliers for DSP, and a hardened memory controller subsystem for DDR3/DDR2/QDRII+ memories. Architecturally, Stratix IV GX uses Altera's adaptive logic module (ALM) fabric, an 8-input fracturable lookup table, paired with a multi-track routing interconnect that delivers predictable timing closure. The chip's PLL count and clocking network support dozens of independent clock domains, which is essential for designs that merge multiple serial protocols on one board. Hardware debug is supported through SignalTap II embedded logic analysis. Typical applications include high-end telecommunications line cards, military and aerospace signal processing, high-performance computing accelerators, broadcast video processing engines, and ASIC prototyping platforms. The wide industrial temperature range and the embedded multi-gigabit transceivers make the EP4SGX360KF43I3N well suited to defense and test-and-measurement equipment. Designers should pay close attention to PCB layout for the 1760-ball FCBGA - a multi-layer PCB stack-up with buried vias and a continuous ground/plane reference is mandatory for the transceiver SERDES channels to meet their 8.5 Gbps bit-error-rate targets. Power estimation should account for both static and dynamic consumption using Altera's PowerPlay early power estimator before final power-tree design. This page synthesizes live distributor pricing, drop-in compatible Stratix IV GX variants, and practical board-design considerations that complement the official Altera/Intel handbook for the EP4SGX360KF43I3N.

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EP4SGX360KF43I4 - Stratix IV GX FPGA, 353K LE, 1760-BGA | Intel
EP4SGX360KF43I4

EP4SGX360KF43I4 - Stratix IV GX FPGA, 353K LE, 1760-BGA | Intel

The Intel EP4SGX360KF43I4 is a high-density Stratix IV GX Field Programmable Gate Array (FPGA) delivering 353,600 logic elements, 14,144 LABs/CLBs, 880 user I/Os, and 23,105,536 bits of embedded RAM, housed in a 1760-ball FC-BGA package. It is fabricated on a 40 nm process node, supports 0.87 V to 0.9 V core supply, and integrates up to 48 transceivers operating at data rates suitable for multi-gigabit serial protocols. The device is qualified for the industrial temperature range (-40C to +100C junction). A Field Programmable Gate Array (FPGA) is a semiconductor IC whose digital logic is defined by the user after manufacturing, sitting in the broader taxonomy: programmable logic device -> logic IC -> integrated circuit -> semiconductor. Stratix IV GX is Intel's high-end transceiver-centric family optimized for ASIC prototyping, high-performance DSP, and bandwidth-intensive I/O bridging, complementing the logic-rich Stratix IV E and the DSP-dense Stratix IV GT variants. Key features include a 40 nm CMOS process with embedded transceivers, 23 Mbit of embedded memory, on-chip multipliers and DSP blocks, and a rich clock network with PLLs supporting source-synchronous memory interfaces. The 1760-ball FC-BGA package exposes all four transceiver banks and full GPIO count, enabling the largest configuration in the family. Configuration is supported via JTAG, passive serial, fast passive parallel, and PCI Express-based schemes. Typical applications include 40G/100G line-card prototyping, ASIC prototyping and emulation, high-speed serial bridging (PCIe Gen2, SATA, SRIO, XAUI, CEI-6G), test and measurement instrumentation front-ends, and high-performance DSP for radar and software-defined radio. The 14,144 LABs and abundant transceivers make it attractive for designs that previously required an ASIC. When designing with this device, plan PCB layout carefully: the 1760-ball FC-BGA requires microvia and via-in-pad capability, controlled-impedance routing for all 48 transceivers, and substantial power-rail decoupling. Thermal management must account for a hot-spot power map dictated by the Quartus power analyzer; a heatsink or cold plate is normally required for full-throughput workloads.

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