EPF8282ATC100-3
EPF8282ATC100-3 - FLEX 8000 FPGA 2.5K Gates 78 I/O TQFP-100 | Intel
The Intel / Altera EPF8282ATC100-3 is a member of the FLEX 8000 family of CMOS SRAM-based Field Programmable Gate Arrays (FPGAs), delivering 2,500 usable gates, 208 logic cells (LEs), and 78 user I/Os in a 100-pin Thin Quad Flat Pack (TQFP) package. It is built on a 0.42-micron CMOS SRAM process with 5V supply tolerance and operates up to 125 MHz system frequency, supporting -3 speed grade timing. The architecture integrates fast track interconnect, embedded array blocks (EABs), and logic array blocks (LABs) that combine register-rich logic with on-chip RAM.
An FPGA (Field Programmable Gate Array) is a type of programmable logic device (PLD) that sits within the broader integrated circuit hierarchy of semiconductor devices. It uses look-up tables, flip-flops, and programmable interconnect to implement arbitrary digital logic, allowing engineers to reconfigure hardware functionality in-circuit via SRAM configuration memory. FPGAs bridge the gap between fixed-function ASICs and discrete logic, offering high integration, fast time-to-market, and in-system reconfigurability.
Key features of the EPF8282ATC100-3 include 2,500 usable gates, 208 logic elements, 12,000 typical gates equivalent, 78 I/O pins, multiVolt I/O support for 3.3V/5V mixed-voltage interfacing, in-circuit reconfigurability (ICR), and JTAG boundary-scan test support. The device is configured at system power-up via industry-standard parallel EPROM, Altera serial configuration devices (EPC1, EPC1064, EPC1213, EPC1441), or a microprocessor.
The FLEX 8000 architecture employs a segmented fast-track interconnect that links LABs horizontally and vertically with predictable delay, simplifying timing closure. Each EAB provides up to 2 Kbits of dual-port RAM or ROM, useful for FIFO buffers, lookup tables, and DSP datapaths. Designers can implement 32-bit buses and integrate glue logic around microprocessors without external bus drivers.
Typical applications include telecommunications switching equipment, industrial control systems, test and measurement instrumentation, glue logic around microprocessors and microcontrollers, peripheral bus interfacing, and legacy embedded system retrofits. The wide I/O count and 5V tolerance make it useful for replacing discrete TTL/CMOS logic on 5V backplanes.
When designing with this device, ensure configuration data is available at power-up using a compatible EPC series configuration device or microcontroller-driven configuration. Decoupling capacitors should be placed within 0.5 cm of each VCC pin, and unused I/O pins must be configured as outputs driving ground to minimize switching noise.
This page synthesizes distributor pricing, drop-in alternatives, application notes, and design considerations for the EPF8282ATC100-3, supplementing the manufacturer datasheet with engineering guidance and cross-brand equivalents sourced from current distributor data.
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