EPM2210GF324I5N
EPM2210GF324I5N - MAX II CPLD, 2210 LE, 272 I/O, 324-FBGA | Intel
The Intel (formerly Altera) EPM2210GF324I5N is a member of the MAX II family of Complex Programmable Logic Devices (CPLDs), delivering 2210 logic elements (LEs) equivalent to 1700 macrocells, manufactured on a low-power 6-layer-metal flash process. It is housed in a 324-ball FineLine BGA (FBGA-324) package measuring 19 x 19 mm with a 1.0 mm pitch, and supports up to 272 user I/O lines with MultiVolt core and I/O voltage operation between 1.5 V and 3.3 V. The device is rated for the industrial temperature range of -40 °C to +100 °C TJ and provides non-volatile storage of 8 Kbits via an on-chip User Flash Memory (UFM) block. Per the manufacturer datasheet, the EPM2210GF324I5N variant suffix denotes the RoHS-compliant, lead-free, tray-packaged industrial grade offering.
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that combines multiple PAL/GAL-style macrocell arrays with a programmable interconnect matrix, sitting hierarchically between simple SPLDs and higher-density FPGAs. MAX II devices specifically target glue-logic, interface bridging, power-up sequencing, and I/O expansion roles where instant-on non-volatile behavior, low standby current, and high I/O count matter more than raw logic density. They retain configuration on power loss without an external boot PROM, which is a key architectural advantage over SRAM-based FPGAs in cost-sensitive and rugged designs.
The EPM2210GF324I5N offers 272 user I/O, 2210 logic elements, an 8 Kbit UFM block, MultiVolt I/O supporting 1.5 V / 1.8 V / 2.5 V / 3.3 V interfaces, enhanced in-system programmability (ISP) via JTAG, and a fast tPD propagation delay suitable for high-speed control-plane glue logic. These differentiating features allow a single device to consolidate what would otherwise require multiple 74-series logic packages, lowering BOM cost and PCB area.
Architecturally, the EPM2210GF324I5N is built on a 0.18 µm 6-layer-metal flash process, integrating four Logic Array Blocks (LABs) interconnected by a MultiTrack interconnect fabric. Each LAB contains 16 Logic Elements (LEs) with 4-input look-up tables, programmable registers, and a product-term matrix supporting both combinatorial and registered logic. The flash-based configuration cell provides instant-on (< 1 ms) wake-up, eliminating the configuration time penalty of SRAM FPGAs. The integrated UFM block can store user data such as serial numbers, calibration constants, or bootloader code, replacing an external EEPROM in many designs.
Typical applications include digital design glue logic, timing control and reset sequencing, custom shift registers, parity generators, state machine controllers, bus interface bridging (e.g., 8-bit to 32-bit, SPI to parallel, I2C to GPIO), LED display drivers, industrial control panels, and consumer electronics I/O expansion. The 272 I/O count makes it well-suited to high-pin-count bridging tasks.
When designing with this device, ensure the JTAG chain is correctly terminated with the TCK TMS TDI TDO pull-resistor scheme recommended in the MAX II handbook. Decoupling requires at least one 0.1 µF ceramic capacitor per VCCIO/VCCINT pin group placed within 5 mm of the BGA ball, plus bulk 10 µF tantalum or ceramic capacitors on each supply rail. Because the FBGA-324 package has a 1.0 mm pitch, reflow profile must comply with JEDEC J-STD-020 MSL3 or better, and PCB land patterns should follow the FineLine BGA recommended footprint with non-solder-mask-defined (NSMD) pads.
This page synthesizes distributor pricing, same-brand drop-in alternatives, and practical FBGA-324 layout notes not found in a single manufacturer datasheet, and is structured for engineers who need to compare and qualify a MAX II CPLD for production.
询价
联系我们