EP2C20F256C8N - Cyclone II FPGA, 18,752 LEs, 256-FBGA | Intel
料号： EP2C20F256C8N ⚠ 最后一次采购| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $34.2 | $342.00 |
| 100 | $28.95 | $2,895.00 |
| 500 | $24.4 | $12,200.00 |
| 1,000 | $20.85 | $20,850.00 |
EP2C20F256C8N 概述
What is a Cyclone II FPGA? A Field-Programmable Gate Array (FPGA) is a semiconductor IC whose logic function is defined after manufacturing via a hardware description language (HDL) bitstream. The Cyclone II family sits in the low-cost (non-volatile configuration, external SRAM-based) tier of programmable logic, hierarchically classified as: FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor. Compared with CPLDs (which are typically non-volatile and smaller), FPGAs offer higher logic density, embedded multipliers, and block RAM, but require an external configuration memory at power-up.
Key features include 18,752 four-input look-up tables (4-input LUTs), 52 M9K memory blocks (~ 52 x 9 Kbit = 468 Kbit raw, with parity overhead yielding 239,616 usable RAM bits), 152 dedicated 18 x 18 hardware multipliers for DSP, four phase-locked loops (PLLs) for clock management, and support for external memory interfaces including DDR/DDR2 SDRAM and QDRII SRAM. The 256-ball FBGA package exposes the device's high-I/O capability with fine-pitch surface-mount routing.
Architecture-wise, the Cyclone II device uses a 90 nm CMOS process, 1.15 V to 1.25 V core (VCCINT), and separate VCCIO banks that allow mixed-voltage I/O (1.5 V, 1.8 V, 2.5 V, 3.3 V) on the same die. Embedded multipliers are physically arranged in column blocks adjacent to the LAB (Logic Array Block) rows, enabling deterministic DSP performance independent of routing congestion. The four PLLs support clock multiplication, division, phase shifting, and external feedback for zero-delay buffering.
Typical applications include industrial motor control, video processing pipelines, low-cost software-defined radio, consumer display controllers, factory automation, and educational / prototyping platforms. The mid-density 18,752 LE capacity makes it well suited to designs that outgrow CPLDs but do not require the cost of higher-density Cyclone IV or Cyclone V devices.
When designing with this device, plan for an external EPCS or EPCQ configuration flash to load the bitstream at power-up, provide proper decoupling on every VCCINT and VCCIO pin per the pin connection guidelines, and verify the package thermal envelope against expected toggle activity. Quartus II Web Edition (legacy) or the latest Quartus Prime Lite Edition supports Cyclone II device compilation. The part is widely available on the secondary market; new designs targeting Intel's modern portfolio should evaluate Cyclone IV E, Cyclone 10 LP, or MAX 10 instead.
This page synthesizes distributor pricing, drop-in alternatives from the same Cyclone II family (EP2C20F256C6N, EP2C20F256C7N, EP2C20F256C8) plus verified web-data cross-references (EP2C20F484C6N, EP2C20F484C8), and practical design notes that go beyond the manufacturer handbook.
直接替换替代料： EP2C20F256C8N ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP2C20F256C8N （相同外形与封装尺寸） ——差异在于 Speed Grade, Package, Process Technology, Total RAM Bits, Family.
快速对比工具——选择替代料号进行并排对比：
EP2C20F256C7N
✅ 直接替换✓ 有现货
$38.5 / 个
查看数据手册 →EP2C20F256C6N
✅ 直接替换✓ 有现货
$41.5 / 个
查看数据手册 →EP2C20F256C8
✅ 直接替换✓ 有现货
$24.8 / 个
查看数据手册 →EP2C20F256C7
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$55.28 / 个
查看数据手册 →EP2C15AF256C8N
✅ 直接替换✓ 有现货
$8.75 / 个
查看数据手册 →EP2C15AF256I8N
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$17.26 / 个
查看数据手册 →EP2C20F256C8N 最大额定值与电气特性
| Series | Cyclone II |
| Family | Cyclone II FPGA |
| Logic Elements (LEs) | 18,752 |
| Total RAM Bits | 239,616 bits |
| Embedded Multipliers (18x18) | 152 |
| Maximum User I/O Pins | 315 (device maximum, package-dependent) |
| Number of PLLs | 4 |
| Global Clock Networks | 16 |
| Process Technology | 90 nm CMOS |
| Core Voltage (VCCINT) | 1.2 V (1.15 V to 1.25 V range) |
| I/O Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent) |
| Speed Grade | C8 |
| 封装 | 256-ball FineLine BGA (FBGA-256, F256) |
| 工作温度 | Commercial (0C to +85C) |
| 安装类型 | Surface Mount |
| Lead-Free (Pb-Free) | Yes (N suffix) |
| RoHS 状态 | Compliant |
EP2C20F256C8N 256-ball fineline bga (fbga-256, f256) 引脚配置指南
EP2C20F256C8N（256-ball fineline bga (fbga-256, f256) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP2C20F256C8N.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP2C20F256C8N 适用于 6 应用s: Industrial Motor Control, Video Processing Pipeline, Software-Defined Radio Front-End, Consumer Display Controller, Factory Automation Logic, FPGA Prototyping and Education.
Industrial Motor Control
The EP2C20F256C8N is well suited to industrial motor control loops where 152 dedicated 18x18 hardware multipliers accelerate field-oriented control (FOC) math and Park/Clarke transforms at 10 to 50 kHz PWM rates. Its 4 PLLs generate the precise carrier frequencies needed for space-vector PWM, while the 18,752 LEs implement the state machine and encoder interface logic. With 239,616 bits of block RAM, the device buffers lookup tables for sinusoidal commutation without external memory. Compared to a microcontroller-only solution, the FPGA offloads deterministic control math and frees the MCU for supervisory tasks. Verified application reference: Cyclone II motor-control reference design in the device handbook.
推荐
Video Processing Pipeline
The EP2C20F256C8N implements cost-sensitive video processing such as scalers, deinterlacers, and color-space converters at SD/HD resolutions. Its 152 18x18 multipliers handle chroma upsampling and FIR filtering in real time, while the 52 M9K blocks (239,616 RAM bits) implement line buffers and pixel pipelines. The 4 PLLs generate pixel clock frequencies up to 148.5 MHz for 1080p timing. Compared with an ASSP video processor, the Cyclone II allows customization of custom overlay or region-of-interest logic. Source: Altera video reference design AN 484.
推荐
Software-Defined Radio Front-End
The EP2C20F256C8N enables low-cost software-defined radio (SDR) front-ends where the FPGA performs channelization, decimation, and digital down-conversion. The 152 hardware multipliers implement polyphase filter banks and NCOs, while the 4 PLLs generate sample-clock and IF-clock trees. Its 1.2 V core keeps power consumption manageable for portable SDR platforms, and the 315 max I/O count supports parallel ADC interfaces. The device has been used in ham-radio and low-cost research SDRs. Compare to EP3C10 or EP3C25 for higher density.
推荐
Consumer Display Controller
The EP2C20F256C8N drives custom LCD/TFT panels with timing controllers, gamma correction, and image enhancement in consumer appliances. The 18,752 LEs implement panel-specific LVDS timing and backlight PWM control, while the 4 PLLs synthesize the pixel clock from a low-frequency reference. Multi-standard VCCIO banks (1.5/1.8/2.5/3.3 V) interface directly to legacy LCD interfaces without level shifters. Cost advantage over ASSP timing controllers is customization. Reference: Altera Cyclone II display reference design.
推荐
Factory Automation Logic
The EP2C20F256C8N serves as the programmable logic core in factory automation systems, executing custom protocols, sensor fusion, and PLC-style I/O handling. Its 152 multipliers support signal conditioning math, while 16 global clock networks synchronize multi-axis machine control loops. The industrial-grade variants (I7, I8 speed grades) extend the operating temperature range for harsh factory environments. Compare to discrete 5 V TTL logic: the Cyclone II integrates thousands of gates into a single BGA.
推荐
FPGA Prototyping and Education
The EP2C20F256C8N appears on many university and developer boards (e.g., Altera DE2, Terasic DE2-70 variants) because the 18,752 LE capacity supports full RISC-V or Nios II soft-core implementations along with peripheral logic. The 152 multipliers and 239,616 RAM bits enable practical exercises in DSP and SoC design. The C8 commercial speed grade is sufficient for academic timing closure, and Quartus II Web Edition (free) supports the device. Migration path to active silicon: Cyclone IV E EP4CE15F256C8N.
推荐
推荐产品汇总
工程参考数据： EP2C20F256C8N ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP2C20F256C7N | EP2C20F256C6N | EP2C20F256C8 | EP2C15AF256C8N | EP2C15AF256I8N |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 256-ball FBGA (F256) | 256-ball FBGA (F256) - same | 256-ball FBGA (F256) - same | 256-ball FBGA (F256) - same | 256-ball FBGA (F256) - same | 256-ball FBGA (F256) - same |
| Speed Grade | C8 | C7 (faster) | C6 (slowest) | C8 | C8 | I8 (industrial) |
| Logic Elements | 18,752 | 18,752 (same) | 18,752 (same) | 18,752 (same) | 15,408 (-18%) | 15,408 (-18%) |
| Embedded Multipliers (18x18) | 152 | 152 (same) | 152 (same) | 152 (same) | 112 (-26%) | 112 (-26%) |
| Total RAM Bits | 239,616 bits | 239,616 (same) | 239,616 (same) | 239,616 (same) | 239,616 (same) | 239,616 (same) |
| Operating Temperature | Commercial (0C to +85C) | Commercial | Commercial | Commercial | Commercial | Industrial (-40C to +100C) |
| Lead-Free (Pb-Free) | Yes (N suffix) | Yes | Yes | No (leaded) | Yes | Yes |
关键差异点
- Same-package speed-grade flexibility （对比 EP2C20F256C7N)
- RoHS Pb-free termination for new designs （对比 EP2C20F256C8 (non-N suffix))
- Higher LE and multiplier density in same footprint （对比 EP2C15AF256C8N)
设计说明
Estimated: Decouple every VCCINT pin with a 0.1 uF X7R ceramic capacitor placed within 3 mm of the ball, and add four bulk capacitors (10 uF to 47 uF tantalum or polymer) distributed across the BGA footprint. The Cyclone II device handbook specifies VCCINT tolerance of 1.15 V to 1.25 V; verify ripple stays below 30 mV peak-to-peak under maximum toggle activity (typically 50% LE utilization at 100 MHz) to avoid logic errors. Add separate filtering for PLL analog supplies (VCCA_PLL) with a ferrite bead and 10 uF + 0.1 uF decoupling.
Estimated: At full LE utilization (90%) toggling at 100 MHz, the EP2C20F256C8N typically dissipates 0.5 W to 1.5 W depending on logic density and clock rate. The 256-ball FBGA has a junction-to-ambient thermal resistance (theta_JA) of approximately 18 C/W with 4-layer JEDEC PCB. Designers should provide a 4-layer PCB with a continuous ground plane under the BGA and adequate via-array thermal relief for any application above 1 W sustained. Use the Quartus PowerPlay Early Power Estimator to confirm margins.
The 256-ball FBGA has 1.0 mm ball pitch, requiring PCB microvia technology (laser-drilled or plasma vias in stacked configuration). Use 0.4 mm to 0.5 mm diameter pads with non-solder-mask-defined (NSMD) land pattern for reliable BGA assembly. Plan escape routing on the top signal layer using 0.1 mm trace/space (4-mil) to escape between ball rows. Refer to Cyclone II Handbook Chapter 6 for the official F256 land pattern dimensions.
Do not confuse the EP2C20F256C8N (256-ball FBGA, C8 speed) with the EP2C20F484C8 (484-ball FBGA) - they share silicon but have different ball maps and are NOT pin-compatible. PCB redesign is required to migrate. Also note that the N suffix indicates Pb-free termination; the non-N variant EP2C20F256C8 uses leaded solder and may not comply with RoHS for new designs. Always verify configuration mode (AS, AP, PS, JTAG) and CONF_DONE behavior at power-up by tying nCONFIG through a 10 kohm pull-up to VCCIO.
合规信息
N suffix denotes Pb-free / RoHS-compliant lead-free termination per Altera/Intel product naming convention. Commercial temperature grade (0C to +85C); industrial variants available under I7/I8 suffixes. AEC-Q100 not applicable - this is a logic IC, not an automotive-grade qualified part. Halogen-free and conflict-mineral declarations should be requested from Intel directly for full documentation.
