EP2C8F256CXN - Cyclone II FPGA, 8K LEs, 256-FBGA | Altera
料号： EP2C8F256CXN ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $24.5 | $24.50 |
| 10 | $22.1 | $221.00 |
| 100 | $19.75 | $1,975.00 |
| 500 | $17.4 | $8,700.00 |
| 1,000 | $15.2 | $15,200.00 |
EP2C8F256CXN 概述
A Field-Programmable Gate Array (FPGA) is a programmable logic IC containing an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells, all fabricated on a single silicon die. FPGAs occupy a position in the broader hierarchy of digital semiconductors: programmable logic > logic ICs > integrated circuits > semiconductors. They are typically deployed as glue logic, signal-processing engines, or prototyping platforms where ASIC NRE costs cannot be justified.
Key features include 18 embedded 18x18 multipliers, two PLLs for clock management, and configuration support via active serial (AS), passive serial (PS), and JTAG modes. The device operates from a 1.15 V to 1.25 V core supply with separate VCCIO banks for I/O standard flexibility. The 256-FBGA package offers a compact footprint suitable for space-constrained designs while maintaining sufficient pin count for high-I/O applications.
The Cyclone II architecture is built on SRAM-based configuration memory, requiring an external configuration device for standalone operation. The device family is positioned as a low-cost, low-power alternative to ASICs in volume production for applications such as industrial control, video processing, and communications infrastructure.
Typical applications include motor control, video bridging, industrial Ethernet gateways, and educational/hobbyist development. The 182 user I/O count makes it well-suited for designs that aggregate multiple peripheral interfaces (UART, SPI, I2C, parallel buses) onto a single programmable device.
When designing with this FPGA, ensure the configuration scheme is selected based on the number of devices on the JTAG chain and whether in-system programmability is required. The 256-FBGA package requires careful PCB layout with appropriate via-in-pad or microvia technology to avoid solder joint defects during reflow.
This page synthesizes distributor stock levels, parametric drop-in alternatives from the same Cyclone II family, and PCB layout guidance not typically consolidated on a single manufacturer product page.
直接替换替代料： EP2C8F256CXN ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP2C8F256CXN （相同外形与封装尺寸） ——差异在于 Package, RoHS Status, Process Technology, Speed Grade, Mounting Type.
快速对比工具——选择替代料号进行并排对比：
EP2C8F256C8N
✅ 直接替换✓ 有现货
联系询价
查看数据手册 →EP2C8F256C7N
✅ 直接替换✓ 有现货
$8.31 / 个
查看数据手册 →EP2C8F256C6N
✅ 直接替换✓ 有现货
$31.2 / 个
查看数据手册 →EP2C8AF256A7N
✅ 直接替换✓ 有现货
$41.5 / 个
查看数据手册 →EP2C8AF256I8N
✅ 直接替换✓ 有现货
$21.4 / 个
查看数据手册 →EP2C8F256CXN 最大额定值与电气特性
| Series | Cyclone II |
| Logic Elements (LEs) | 8,256 |
| Total RAM Bits | 165,888 |
| Embedded 18x18 Multipliers | 18 |
| User I/O Count | 182 |
| PLLs | 2 |
| Core Voltage (VCCINT) | 1.15 V to 1.25 V |
| 工作温度 | 0C to +85C (commercial) |
| 封装 | 256-FBGA |
| 安装类型 | Surface Mount |
| Configuration Mode | AS / PS / JTAG |
| Process Technology | 90 nm SRAM |
| RoHS 状态 | Compliant |
EP2C8F256CXN 256-fbga 引脚配置指南
EP2C8F256CXN（256-fbga 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP2C8F256CXN.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP2C8F256CXN 适用于 6 应用s: Industrial Motor Control, Video Format Conversion / Bridging, Industrial Ethernet Gateway, Digital Signal Processing Front-End, Educational / Hobbyist Development Platform, Legacy Peripheral Aggregation / Glue Logic.
Industrial Motor Control
The EP2C8F256CXN fits industrial motor-control designs where the 8,256 logic elements and 18 dedicated 18x18 multipliers can implement field-oriented control (FOC) algorithms, PWM generation, and encoder decoding in a single chip. Its 182 user I/Os comfortably accommodate multi-axis quadrature encoder inputs, Hall-sensor feedback, and gate-driver interfaces, while the two PLLs provide the deterministic clock synthesis required for high-resolution PWM at 50-100 kHz switching frequencies. The commercial-grade 0C to +85C operating range suits factory-floor control cabinets; choose EP2C8AF256I8N when wider temperature is needed.
推荐
Video Format Conversion / Bridging
The EP2C8F256CXN is well suited to video bridging applications that convert between parallel RGB, BT.656, BT.1120, and HDMI-style TMDS interfaces. The 165,888 bits of embedded RAM (organized as M9K blocks) buffer scan-line data efficiently, while the 18 hardware multipliers accelerate chroma resampling and scaling arithmetic. With 182 user I/Os and LVDS support, the 256-FBGA package can drive multi-lane flat-panel interfaces directly without external serializer chips, reducing BOM cost in consumer A/V equipment.
推荐
Industrial Ethernet Gateway
The EP2C8F256CXN supports industrial Ethernet protocols such as PROFINET, EtherCAT, and Modbus TCP by implementing the protocol stack in soft logic alongside a hard Ethernet PHY. The 8,256 LEs are sufficient for medium-complexity MAC implementations and TCP/IP offload, while the 18 hardware multipliers handle wire-speed CRC computation and encryption accelerators. The 256-FBGA package and commercial temperature grade suit DIN-rail-mounted industrial gateways; the embedded PLLs synchronize PHY reference clocks and PTP timestamps.
推荐
Digital Signal Processing Front-End
The EP2C8F256CXN handles modest DSP workloads such as FIR filtering, FFT pre-processing, and digital down-conversion through its 18 dedicated 18x18 multipliers running at up to ~250 MHz. The 165,888 bits of embedded RAM (M9K blocks) hold coefficients and circular sample buffers, allowing real-time filtering of multi-MHz-bandwidth signals. With 182 user I/Os the device can ingest parallel ADC data at LVDS rates and emit processed streams to downstream DSPs or DACs in instrumentation and SDR front-ends.
推荐
Educational / Hobbyist Development Platform
The EP2C8F256CXN and its commercial-temperature siblings are widely adopted in university digital-logic courses and hobbyist projects because the Quartus II Web Edition toolchain is free and the device offers a meaningful 8K-LE capacity for teaching Verilog/VHDL, state machines, and embedded soft-core processors. With 182 user I/Os, students can wire up to 7-segment displays, switches, character LCDs, and parallel buses on a single dev board. The 256-FBGA package and abundant I/O flexibility support FPGA-based soft-core CPU labs (Nios II, RISC-V).
推荐
Legacy Peripheral Aggregation / Glue Logic
The EP2C8F256CXN is frequently deployed as a programmable bridge in legacy industrial systems where it consolidates UART, SPI, I2C, parallel GPIO, and custom timing logic onto a single 182-I/O device. Replacing dozens of 74-series TTL chips, the Cyclone II's 8,256 LEs implement address decoding, bus arbitration, and protocol conversion while the 165 Kbits of embedded RAM support FIFOs and lookup tables. The 256-FBGA package provides a small footprint compared to the equivalent discrete-logic board area, making it ideal for form-factor-constrained retrofits.
推荐
推荐产品汇总
工程参考数据： EP2C8F256CXN ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP2C8F256C8N | EP2C8F256C7N | EP2C8AF256I8N |
|---|---|---|---|---|
| Package | 256-FBGA | 256-FBGA - same | 256-FBGA - same | 256-FBGA - same |
| Brand | Altera | Altera | Altera | Altera |
| Logic Elements | 8,256 | 8,256 | 8,256 | 8,256 |
| Total RAM Bits | 165,888 | 165,888 | 165,888 | 165,888 |
| User I/O | 182 | 182 | 182 | 182 |
| Embedded 18x18 Multipliers | 18 | 18 | 18 | 18 |
| PLLs | 2 | 2 | 2 | 2 |
| Speed Grade | Industrial | -8 (fastest) | -7 | -8 industrial temperature |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C | 0C to +85C | -40C to +100C |
| Lifecycle Status | NRND | NRND | NRND | NRND |
关键差异点
- Industrial temperature-grade Cyclone II option with same exact bitstream （对比 EP2C8F256C8N)
- Higher logic density than Cyclone II 5K-LE siblings in same package （对比 EP2C5F256C8N)
- Bitstream-compatible with all EP2C8F256-family FPGAs （对比 EP2C8AF256I8N)
设计说明
The 256-ball FBGA package on the EP2C8F256CXN requires either microvia (laser-drilled) or via-in-pad PCB technology for reliable solder joint formation during reflow. According to the Cyclone II handbook, the BGA ball pitch is 1.0 mm; designers should use ENIG or OSP surface finish, ensure 4-6 mil trace/space rules, and place decoupling capacitors (0.1 uF and 10 uF) within 100 mils of every VCCINT/VCCIO pin. Thermal vias under the central BGA balls help dissipate the ~1-2 W typical operating power.
The EP2C8F256CXN requires three independent supply rails: VCCINT (1.15-1.25 V, up to ~500 mA), VCCIO (1.5/1.8/2.5/3.3 V per bank, up to ~200 mA per bank), and VCCA_PLL (1.2 V for PLL analog). Per the Cyclone II handbook, all three rails must ramp monotonically and reach stable regulation within 100 ms of each other to avoid configuration errors. A common failure mode is powering VCCIO before VCCINT, which can trigger latch-up on the I/O drivers - sequence VCCINT first, then VCCIO.
Do not attempt to substitute a Cyclone IV (e.g. EP4CE8F256C8N) for the EP2C8F256CXN without recompiling in Quartus. According to Intel's migration document, Cyclone IV uses a different bitstream format and requires re-synthesis, re-fitting, and timing closure - it is NOT a drop-in replacement despite the similar ball-map. For new designs, start with Cyclone IV; for legacy Cyclone II production, stick within the same family (EP2C8F256C8N is the closest speed-grade drop-in).
JTAG chain layout must include the TCK pull-down and TMS pull-up resistors (4.7 kohm typical) recommended by IEEE 1149.1. Per the Cyclone II handbook, JTAG signals should be length-matched within 1 inch and isolated from switching power and clock traces with a ground guard to prevent programming failures. The MSEL[3..0] pins must be tied to fixed logic levels (typically via 4.7 kohm pull-ups to VCCIO) to select active serial vs JTAG configuration at power-up.
合规信息
RoHS and lead-free per Altera/Intel PSG product page. Not AEC-Q100 qualified - choose EP2C8AF256I8N for near-automotive. Lifecycle is NRND (Not Recommended for New Designs) - last-ship dates and contractual support continue per Intel PSG FPGA product longevity program.
