EP2S60F672C4 - Stratix II FPGA, 60K LE, 672-FBGA | Altera/Intel
料号： EP2S60F672C4 ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $1334.33 | $1,334.33 |
| 10 | $1280 | $12,800.00 |
| 50 | $1210 | $60,500.00 |
| 100 | $1155 | $115,500.00 |
| 500 | $1080 | $540,000.00 |
EP2S60F672C4 概述
A field-programmable gate array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks, programmable interconnect, and I/O cells that can be re-programmed to implement custom digital hardware. FPGAs sit in the broader hierarchy of programmable logic devices (PLD) -> programmable logic -> digital IC -> semiconductor. Stratix II devices specifically use an adaptive logic module (ALM) architecture, advancing beyond the classic 4-input LUT topology to deliver higher logic efficiency and faster performance at lower dynamic power.
Key features of the EP2S60F672C4 include up to 36 embedded DSP blocks for high-speed fixed- and floating-point arithmetic, support for multiple I/O standards (LVDS, LVTTL, LVCMOS, PCI, PCI-X, HSTL, SSTL) on its 492 user I/Os, and dedicated high-speed serial interfaces. The Stratix II fabric uses 90 nm process technology with 1.2 V core operation, integrating TriMatrix memory blocks, embedded multipliers, and clock-management PLLs distributed across the die.
Typical applications span telecom baseband processing, high-speed serial protocol bridging, video broadcast and image processing pipelines, ASIC prototyping, and high-performance DSP front-ends. Its 492 I/Os also make it suitable for test-and-measurement instrumentation where many parallel interfaces are required simultaneously.
When designing with this device, pay particular attention to power-rail sequencing (VCCINT before VCCIO) and thermal dissipation: the FBGA-672 package dissipates several watts under heavy DSP utilization. Use the Quartus II design toolchain (or newer Intel Quartus Prime with Stratix II device support) for synthesis, place-and-route, and timing closure.
This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes not found in the standalone manufacturer datasheet - enabling faster engineering decisions on a legacy Stratix II design.
直接替换替代料： EP2S60F672C4 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP2S60F672C4 （相同外形与封装尺寸） ——差异在于 Speed Grade, Package, RoHS Status, Operating Temperature, PLLs.
快速对比工具——选择替代料号进行并排对比：
EP2S60F672C3
✅ 直接替换✓ 有现货
$1033.14 / 个
查看数据手册 →EP2S60F672C3N
✅ 直接替换✓ 有现货
$1175 / 个
查看数据手册 →EP2S60F672C3NGA
✅ 直接替换✓ 有现货
$1150 / 个
查看数据手册 →EP2S60F672C4N
✅ 直接替换✓ 有现货
$325 / 个
查看数据手册 →EP2S60F672I4
✅ 直接替换✓ 有现货
$1050 / 个
查看数据手册 →EP2S60F672C4 最大额定值与电气特性
| Family | Stratix II |
| Logic Elements (LE) | 60440 |
| Embedded Memory Bits | 2544192 |
| Logic Array Blocks (LAB) | 3022 |
| User I/Os | 492 |
| 封装 | 672-BBGA, FCBGA |
| 安装类型 | Surface Mount |
| 工作温度 | 0C to +85C (commercial) |
| Speed Grade | C4 |
| Process Technology | 90 nm |
| Core Voltage | 1.2 V (typical) |
EP2S60F672C4 引脚配置
| 引脚 B1 | I/O Bank 1 — User I/O ball in bank 1 (refer to Stratix II pin-out file for exact function) |
| 引脚 B2 | I/O Bank 1 — User I/O ball in bank 1 |
| 引脚 A1 | VCCINT — Core voltage supply (1.2 V typical) |
| 引脚 A2 | VCCIO1 — I/O bank 1 reference voltage |
| 引脚 GND | GND — Multiple GND balls distributed across FBGA array (refer to device handbook for ball map) |
典型应用
EP2S60F672C4 适用于 6 应用s: ASIC Prototyping and Emulation, Telecom Baseband and Protocol Processing, High-Speed Video and Image Processing, Industrial Test and Measurement Instrumentation, DSP Front-End and Software-Defined Radio, Military and Aerospace Legacy Systems.
ASIC Prototyping and Emulation
The EP2S60F672C4 is widely deployed as an ASIC prototyping vehicle because 60,440 logic elements, 2,544,192 bits of embedded RAM, and 492 user I/Os comfortably fit mid-complexity SoC designs. Engineers map partitioned ASIC RTL to multiple Stratix II devices using Quartus II incremental compilation, achieving MHz-level verification before tape-out. The 672-FBGA package exposes enough I/O for parallel board-to-board interconnect and DDR-style memory interfaces typical in prototypes.
推荐
Telecom Baseband and Protocol Processing
Stratix II devices including the EP2S60F672C4 deliver the logic density and DSP throughput needed for telecom baseband, framer, and protocol-bridging designs. The 36 embedded DSP blocks and TriMatrix memory support high-speed FFT, FEC, and channelization arithmetic at line rates. With 492 user I/Os, designers can run multiple SFI / SPI / UTOPIA interfaces in parallel without external bridging logic, simplifying board layout and BOM.
推荐
High-Speed Video and Image Processing
Broadcast video routers, real-time image-processing pipelines, and display controllers fit comfortably within the EP2S60F672C4's 60K LE fabric and 2.5 Mbit of embedded RAM. The 672-FBGA package supports LVDS and HSTL I/O standards needed for high-resolution video serializers and DDR memory interfaces. Quartus II video IP cores accelerate development of color-space converters, scalers, and frame-rate converters on this part.
推荐
Industrial Test and Measurement Instrumentation
The EP2S60F672C4's 492 user I/Os and abundant DSP resources make it well suited to multi-channel test instruments such as ATE pin-electronics, logic analyzers, and high-channel oscilloscope front-ends. Commercial C4 temperature grade (0C to +85C) covers most lab and factory-floor environments; industrial I4 variants are required only for outdoor or extreme-temperature deployments. The 672-FBGA package and Quartus II toolchain shorten development cycles.
推荐
DSP Front-End and Software-Defined Radio
With up to 36 embedded DSP blocks delivering 18x18 multiplies with accumulation, the EP2S60F672C4 handles digital down-conversion, channelization, and baseband processing common in software-defined radio designs. The 672-FBGA device supports LVDS connections to high-speed ADCs and DACs, while the 60K-LE fabric implements control logic and custom peripherals. Stratix II is well documented for SDR reference designs in the Altera/Intel handbook library.
推荐
Military and Aerospace Legacy Systems
Although not qualified to MIL-PRF or MIL-STD-883 by default, the EP2S60F672C4 is used in many legacy defense and aerospace programs that pre-date newer FPGA generations. Its commercial C4 grade is typically acceptable in temperature-controlled avionic enclosures; the industrial I4 variant extends coverage. Designers should verify the specific lot's traceability and conformal-coating requirements before field deployment in defense programs.
推荐
推荐产品汇总
工程参考数据： EP2S60F672C4 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP2S60F672C3 | EP2S60F672C3N | EP2S60F672C3NGA | EP2S60F672C4N | EP2S60F672I4 |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 672-FBGA | 672-FBGA - same | 672-FBGA - same | 672-FBGA - same | 672-FBGA - same | 672-FBGA - same |
| Speed Grade | C4 | C3 (faster) | C3 (faster) | C3 (faster) | C4 (same) | I4 (slower, industrial) |
| Temperature Grade | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C | Industrial -40C to +100C |
| Logic Elements | 60440 | 60440 | 60440 | 60440 | 60440 | 60440 |
| Embedded RAM Bits | 2544192 | 2544192 | 2544192 | 2544192 | 2544192 | 2544192 |
| User I/Os | 492 | 492 | 492 | 492 | 492 | 492 |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
关键差异点
- Drop-in compatibility with same-die Stratix II variants （对比 EP2S60F672C3)
- Industrial temperature drop-in option available （对比 EP2S60F672I4)
- Pb-free terminal-finish variants for modern compliance （对比 EP2S60F672C4N)
设计说明
Estimated: Stratix II devices typically consume 5-15 W under realistic workloads. Use Quartus II PowerPlay analyzer with your actual switching activity for accurate budgeting. Sequence VCCINT (1.2 V core) before VCCIO rails; failure to sequence can cause long-term reliability degradation or I/O contention. Decouple each supply with bulk + 0.1 uF + 0.01 uF capacitors placed adjacent to the FBGA balls per the device handbook reference decoupling schematic.
The 672-FBGA package dissipates several watts under high DSP utilization. Reference the Stratix II device handbook thermal resistance section; theta_JA depends heavily on PCB stack-up and airflow. For typical 4-layer boards with moderate airflow, plan for theta_JA in the 10-15 C/W range. Use thermal vias beneath the FBGA thermal balls to spread heat into internal copper planes; without adequate thermal vias the junction temperature can exceed 100C under load.
Route all 672 FBGA balls on a high-density interconnect (HDI) PCB stack-up with microvias and 0.4-0.5 mm pitch escape routing. Matched-length differential pairs are required for LVDS interfaces; use length tuning per the I/O standard. Reference the Altera Stratix II device handbook board-design guidelines for via-in-pad recommendations, layer stack-up, and decoupling placement specific to the 672-FBGA package.
Common pitfalls: (1) configuring unused I/O banks without proper VCCIO - leave them tied to a valid voltage or set as inputs with weak pull-up; (2) using MSEL pins incorrectly during configuration - the configuration scheme (AS, PS, JTAG, FPP) depends on MSEL pin states per the device handbook; (3) ignoring configuration CRC errors due to noisy JTAG chains. Always include the CONF_DONE and nSTATUS signals on test points for bring-up debugging.
合规信息
RoHS, REACH, lead-free, and halogen-free status not explicitly confirmed in the provided distributor data. The 'N' suffix on EP2S60F672C4N indicates a Pb-free variant per industry convention; verify against the device datasheet for definitive compliance claims.