Intel

EP3C55F484C7 - Cyclone III FPGA, 55K LE, 484-FBGA | Intel

料号： EP3C55F484C7 ⚠ 最后一次采购

有现货 1-3 个工作日内发货

1.2 V Vdss FBGA-484 (FineLine BGA, 23 × 23 mm, 1.0 mm pitch) Package 20 Speed 2,396,160 bits Memory

低至 $52.95 USD / 件

最小起订量： 1 |

价格更新于： 2026-09-09

批量定价

数量	单价	小计
1	$78.5	$78.50
10	$71.2	$712.00
100	$64.8	$6,480.00
500	$58.4	$29,200.00
1,000	$52.95	$52,950.00

ℹ️ 所有价格均以 USD 计价

查看数据手册 (PDF) 查看替代料

数量

EP3C55F484C7 概述

The Intel (formerly Altera) EP3C55F484C7 is a low-power Cyclone III Field-Programmable Gate Array (FPGA) with 55,856 logic elements, 2,396,160 bits of embedded memory, and 327 maximum user I/Os, housed in a 484-ball FineLine BGA (FBGA-484) package measuring 23 mm × 23 mm with 1.0 mm ball pitch. Built on a 65 nm TSMC low-k process, this industrial-grade device supports an internal clock frequency of up to 472 MHz and integrates 156 embedded 18 × 18 multipliers for DSP workloads, making it suitable for cost-sensitive parallel processing applications.

A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and I/O cells that engineers can re-program after manufacture to implement custom digital logic, signal processing pipelines, or interface bridges. FPGAs sit between general-purpose microcontrollers (fixed instruction set, software-defined behaviour) and ASICs (custom silicon, fixed hardware) - offering hardware-timed parallelism with no NRE mask cost and rapid design iteration. The Cyclone III family specifically targets low-static-power applications and is a subclass of SRAM-based FPGAs, where configuration is loaded from an external flash at every power-up.

Key features of the EP3C55F484C7 include support for up to 4 PLLs, embedded multiplier blocks for DSP operations, dedicated DDR/DDR2 SDRAM memory interfaces with dedicated DQS pins, and configurable I/O standards including LVDS, SSTL, and HSTL. The device is configured via serial or parallel flash using industry-standard JTAG or Active Serial (AS) modes. Its 484-ball FineLine BGA package provides ample I/O headroom and excellent signal-integrity performance for parallel buses and high-speed memory interfaces.

Typical applications include industrial motor control, video surveillance IP cameras, automotive infotainment subsystems, programmable logic controllers (PLCs), embedded vision and machine-vision pipelines, and low-power software-defined radio front-end pre-processing. The large logic capacity also makes it suitable for telecom protocol bridging and ASIC prototyping in mid-volume production.

When designing with this part, ensure the PCB has a clean multi-layer stack-up with continuous ground planes under the BGA to maintain signal integrity for DDR2 interfaces. Use the Altera/Intel Quartus II design suite (or the maintained Quartus Prime 13.0sp1 legacy branch) for synthesis, place-and-route, and timing closure.

直接替换替代料： EP3C55F484C7 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。

本系列中的变体

可与以下型号直接替换的同系列型号： EP3C55F484C7 （相同外形与封装尺寸） ——差异在于 Package, Process Technology, Speed Grade, Operating Temperature, RoHS Status.

EP3C55F484C6

Intel

Package: 484-FBGA (F484)

Process Technology: 65 nm low-power CMOS

Speed Grade: 6 (commercial)

对比 EP3C55F484C7 →

EP3C55F484C6N

Altera

Process Technology: 65 nm

Speed Grade: 6 (C6)

对比 EP3C55F484C7 →

EP3C55F484C7N

Intel

Package: 484-FBGA (FineLine BGA)

Process Technology: 60 nm TSMC low-power

Speed Grade: 7

对比 EP3C55F484C7 →

EP3C55F484C8

Intel

Package: 484-ball FBGA (FBGA-484), 23 x 23 mm, 1.0 mm pitch, 2.60 mm height

Process Technology: 65 nm low-power CMOS

Speed Grade: C8 (commercial, -8)

对比 EP3C55F484C7 →

EP3C55F484C8N

Altera

Package: 484-BGA (FBGA), 23 x 23 mm, 1.0 mm pitch

对比 EP3C55F484C7 →

EP3C55F484I7N

Altera

Package: 484-pin FBGA (FineLine BGA), 23 x 23 mm, 1.0 mm pitch

Process Technology: 65 nm CMOS, low power

Speed Grade: 7

对比 EP3C55F484C7 →

EP3CLS150F484C7

Intel

Package: 484-FBGA (FineLine BGA), 23 x 23 mm, 1.0 mm pitch

Process Technology: 60 nm TSMC low-power CMOS

RoHS Status: Compliant

对比 EP3C55F484C7 →

✅ 直接替换 ⚠️ 规格未核验

Altera

📦 FBGA-484

Cyclone III · 55,856 · 3,491 · 2,396,160 (some listings cite 2,491,520) · 312 · 156 · 4 · 327

✓ 有现货

$205.4 / 个

查看数据手册 →

EP3C55F484C7 最大额定值与电气特性

Device Family	Cyclone III
Logic Elements (LE)	55,856
Logic Array Blocks (LABs)	3,495
Embedded Memory Bits	2,396,160 bits
Embedded Memory (M9K blocks)	260 blocks of 9 Kbit each
Embedded 18x18 Multipliers	156
Maximum User I/Os	327
PLLs	4
Global Clock Networks	20
Internal Operating Frequency (max)	472 MHz
Process Technology	65 nm TSMC low-k CMOS
Core Voltage	1.2 V
封装	FBGA-484 (FineLine BGA, 23 × 23 mm, 1.0 mm pitch)
Operating Temperature Grade	Commercial (0 °C to +85 °C) - C7 speed grade
安装类型	Surface Mount (BGA)
RoHS 状态	Compliant (lead-free FBGA)
Configuration Mode	Active Serial (AS), Passive Serial (PS), JTAG
Configuration Memory Type	SRAM (volatile, requires external flash)

EP3C55F484C7 fbga-484 (fineline bga, 23 × 23 mm, 1.0 mm pitch) 引脚配置指南

EP3C55F484C7（fbga-484 (fineline bga, 23 × 23 mm, 1.0 mm pitch) 封装）的引脚配置。该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。

EP3C55F484C7 的 fbga-484 (fineline bga, 23 × 23 mm, 1.0 mm pitch) 封装引脚图

暂无详细引脚数据： EP3C55F484C7.

请参阅数据手册以查看完整引脚配置。

典型应用

EP3C55F484C7 适用于 6 应用s: Industrial Motor Control and PLCs, Video Surveillance and Machine Vision, Automotive Infotainment Subsystems, Telecom Protocol Bridging and TDM Switching, ASIC Prototyping and Emulation, Software-Defined Radio Front-End Pre-Processing.

🏭

Industrial Motor Control and PLCs

The EP3C55F484C7 fits industrial motor control and PLC applications because its 55,856 logic elements and 156 embedded 18 × 18 multipliers provide ample parallel DSP throughput for field-oriented control (FOC) algorithms and encoder interpolation. The 327 user I/Os accommodate multiple incremental/absolute encoder interfaces, gate-driver PWM outputs, and industrial communication buses. Industrial-grade variants (I-temp) are available in the same FBGA-484 footprint, supporting -40 °C to +100 °C operation. Quartus II reference designs include Qsys-based PLC cores. Designers should ensure differential pairs for high-speed encoder feedback are length-matched within ±50 mils to maintain jitter margin.

推荐

🎥

Video Surveillance and Machine Vision

The EP3C55F484C7 is well-suited for IP camera and machine-vision pre-processing pipelines because its 2,396,160 embedded memory bits provide frame-buffer capacity for image statistics, and the 156 hardware multipliers accelerate Sobel, Laplacian, and convolution kernels used in edge detection. The 472 MHz internal Fmax enables real-time processing of 720p30 video streams with headroom. DDR2 external memory interfaces (up to 200 MHz / 400 Mbps) connect to commodity SDRAM for line buffers and frame storage. The 484-ball FBGA provides ample LVDS pairs for camera sensor interfaces; high-speed MIPI CSI-2 requires an external bridge device.

推荐

EP3C40F780C7N · Intel EP3C25F256C8N · Altera

🚗

Automotive Infotainment Subsystems

The EP3C55F484C7 can be used in automotive infotainment subsystems (non-safety-critical) because its 55,856 LEs and 327 user I/Os support multi-display LVDS output, CAN/LIN bus bridging, and audio DSP mixing. The 484-ball FBGA package provides high pin density for automotive PCBs while supporting I/O voltages from 1.5 V to 3.3 V for legacy automotive peripherals. Industrial temperature variants (I7 speed grade) extend operating range to -40 °C to +100 °C, meeting cabin and head-unit requirements. Designers should follow IPC-7351 BGA land-pattern guidelines and use ENIG surface finish for automotive vibration tolerance.

推荐

EP3C55F484I7N · Altera EP3C40F484C7N · Intel

🌐

Telecom Protocol Bridging and TDM Switching

The EP3C55F484C7 is a strong fit for telecom protocol bridges (T1/E1 to Ethernet, HDLC to UART) because its high global-clock count (20) and 4 PLLs support multiple independent timing domains needed for TDM-to-packet conversion. The 2,396,160 embedded memory bits serve as elastic buffers for clock-rate adaptation, and the 327 user I/Os handle multiple serial links. Industrial temp variants enable outside-plant deployment. Quartus II provides ALT2GXB reference designs for legacy telecom SERDES bridging when paired with external transceiver PHYs.

推荐

EP3C40F484C8N · Altera EP3C25F324C8N · Intel

🖥️

ASIC Prototyping and Emulation

The EP3C55F484C7 supports ASIC prototyping and pre-silicon emulation because its 55,856 LEs, 260 M9K memory blocks, and 156 multipliers map cleanly to mid-size ASIC RTL blocks running at moderate clock rates. The FBGA-484 footprint exposes enough I/Os to probe internal ASIC nodes for bring-up debugging. Designers should partition target ASIC logic across multiple FPGAs for larger designs and use Quartus II's LogicLock feature to constrain place-and-route regions to match ASIC timing paths.

推荐

EP3C120F780C7N · Intel EP3C40F484C7N · Intel

✈️

Software-Defined Radio Front-End Pre-Processing

The EP3C55F484C7 fits SDR front-end pre-processing (decimation, channelization, digital down-conversion) because its 156 hardware 18 × 18 multipliers enable high-throughput FIR filter and CORDIC mixer stages, and its 260 M9K blocks provide coefficient and sample-storage memory. The 472 MHz internal clock lets designers implement multi-stage polyphase filter banks. LVDS I/O pairs handle high-speed ADC data capture. Designers targeting this application should plan for external ADCs like AD9238 or AD9644 and verify AC timing budgets against the C7 speed grade in the datasheet.

推荐

EP3C40F484C8N · Altera EP3C16F484C7N · Intel

推荐产品汇总

EP3C40F484C7N Intel 用于： Industrial Motor Control and PLCs, Automotive Infotainment Subsystems, ASIC Prototyping and Emulation EP3C25F324I7N Intel 用于： Industrial Motor Control and PLCs EP3C40F780C7N Intel 用于： Video Surveillance and Machine Vision EP3C25F256C8N Altera 用于： Video Surveillance and Machine Vision EP3C55F484I7N Altera 用于： Automotive Infotainment Subsystems EP3C40F484C8N Altera 用于： Telecom Protocol Bridging and TDM Switching, Software-Defined Radio Front-End Pre-Processing EP3C25F324C8N Intel 用于： Telecom Protocol Bridging and TDM Switching EP3C120F780C7N Intel 用于： ASIC Prototyping and Emulation EP3C16F484C7N Intel 用于： Software-Defined Radio Front-End Pre-Processing

What is the operating voltage of EP3C55F484C7?

The EP3C55F484C7 operates from a 1.2 V core supply with separate VCCIO rails per I/O bank, typically 1.5 V, 1.8 V, 2.5 V, or 3.3 V depending on the I/O standard. According to the Cyclone III device datasheet, the device supports up to eight I/O banks allowing mixed-voltage interfacing. The PLL analog supply (VCCA) and configuration supply require additional decoupling as outlined in the pin connection guidelines.

How many logic elements does EP3C55F484C7 have?

The EP3C55F484C7 contains 55,856 logic elements (LEs) organized into 3,495 logic array blocks (LABs). Each LE consists of a 4-input look-up table (LUT), a programmable register, and a carry chain. According to the Cyclone III family datasheet, the '55' in the part number designates the LE count family member, placing it in the upper mid-range of the Cyclone III series.

What is the difference between EP3C55F484C7 and EP3C55F484C8?

The EP3C55F484C7 and EP3C55F484C8 differ in speed grade only - the C8 is a slower speed grade than the C7. The C7 (faster) supports internal clock frequencies up to 472 MHz while the C8 targets more relaxed timing at typically lower cost. Both share the same 484-ball FBGA package, 55,856 LEs, and 327 user I/Os, making the C7 and C8 drop-in compatible at the pin and board level with timing-only impact.

Is EP3C55F484C7 still in production?

The EP3C55F484C7 has reached Last Time Buy (LTB) status with Intel's Programmable Solutions Group. According to Intel's product discontinuance notices, the Cyclone III family entered LTB as newer Cyclone IV/V/10 families became the mainstream replacement. Stock remains available through authorized distributors like DigiKey and Mouser, but new orders are subject to allocation and lead times extend to 8-12 weeks.

What is the maximum user I/O count on EP3C55F484C7?

The EP3C55F484C7 provides 327 maximum user I/Os across eight I/O banks. According to the Cyclone III datasheet, the 484-ball FineLine BGA package exposes more balls than the user I/O count - the remainder are power, ground, configuration, and JTAG pins. Each I/O supports LVDS, SSTL, HSTL, LVCMOS, and PCI/PCI-X I/O standards with per-pin programmable drive strength and slew rate.

Does EP3C55F484C7 support DDR2 memory interfaces?

Yes, the EP3C55F484C7 includes dedicated DQS phase-shift circuitry and on-chip termination (OCT) for DDR, DDR2, and QDRII SRAM memory interfaces. According to the Cyclone III external memory interface handbook, the device supports up to 72-bit DDR2 with ECC at up to 200 MHz (400 Mbps). External memory interfaces are configured via ALTMEMPHY megafunctions in the Quartus II design software.

How many multipliers and PLLs are in EP3C55F484C7?

The EP3C55F484C7 contains 156 embedded 18 × 18-bit hardware multipliers, ideal for DSP workloads such as FIR filters and FFT butterflies. The device also provides four general-purpose PLLs and 20 global clock networks for high-fanout clock distribution. According to the Cyclone III datasheet, the multipliers can be configured as 9 × 9, 18 × 18, or two 18 × 18 multipliers for signed or unsigned arithmetic.

Where to download EP3C55F484C7 datasheet PDF?

The official EP3C55F484C7 datasheet is hosted by Intel as part of the Cyclone III Device Handbook, available at intel.com (search for 'Cyclone III Device Datasheet'). According to Intel's documentation portal, the handbook includes DC and switching characteristics, pin connection guidelines, and package outlines. Legacy Altera URLs (altera.com) redirect to the same intel.com content for Cyclone III documentation.

Where to find EP3C55F484C7 pinout?

The EP3C55F484C7 pinout for the 484-ball FBGA package is documented in the Cyclone III pin connection guidelines and the Quartus II Pin Planner. According to Intel's Cyclone III pin-out files, ball coordinates are supplied in .csv format for use with the Pin Planner tool. Bank numbers, I/O standards, and special function pins (DQS, PLL, configuration) are encoded in the .csv columns for direct import.

Where to buy EP3C55F484C7 online?

Authorized distributors currently stocking EP3C55F484C7 include DigiKey (DigiKey part 544-EP3C55F484C7-ND), Mouser, and Avnet. According to distributor listings as of 2026-09-09, the part shows BackOrder status with new orders routed to last-time-buy inventory. Lead times typically run 8-12 weeks for production quantities; small prototype quantities are occasionally available from franchise stock.

What is the price of EP3C55F484C7?

The EP3C55F484C7 unit price as of 2026-09-09 ranges from $78.50 at qty 1 down to approximately $52.95 per unit at qty 1000, per distributor data. Prices have risen sharply since the Last Time Buy announcement due to constrained supply. For budgetary planning, request a quote directly from authorized distributors rather than relying on published catalog prices which may lag real-time allocation.

What is the lead time for EP3C55F484C7?

Lead time for EP3C55F484C7 is currently 8-12 weeks for production quantities as of 2026-09-09, reflecting Last Time Buy status with Intel. According to distributor inventory data, small prototype quantities may ship sooner from franchise stock, but allocation is enforced for large orders. Engineers designing new products should consider migrating to Cyclone IV E or Cyclone 10 LP families to avoid supply risk.

Is EP3C55F484C7 the same as EP3C55F484C7N?

The EP3C55F484C7 and EP3C55F484C7N are functionally identical FPGAs in the same 484-ball FBGA package - the trailing 'N' suffix designates lead-free / RoHS-compliant terminal finish. According to Altera (now Intel) packaging nomenclature, the absence of the N suffix indicates a lead-bearing finish. Both share the same 55,856 LEs, 327 I/Os, and C7 speed grade, making the N version a drop-in replacement.

Can EP3C55F484C6 replace EP3C55F484C7?

Yes, the EP3C55F484C6 can replace EP3C55F484C7 on the same PCB - both share the 484-ball FBGA package, 55,856 LEs, and 327 user I/Os. The only difference is the speed grade: the C6 is slower than the C7. According to cross-reference data, the C6 variant is pin-to-pin compatible but may fail timing closure on designs that meet margins only at the C7 speed grade. Designers should re-run timing analysis if downgrading.

Which software is used to program EP3C55F484C7?

The EP3C55F484C7 is programmed using the Altera/Intel Quartus II design suite, specifically version 13.0sp1 (the last release supporting Cyclone III) or the legacy Quartus Prime 13.x branch. According to Intel's support page, Quartus II Web Edition is a free download that supports Cyclone III synthesis, place-and-route, and programming file generation. Newer Quartus Prime releases dropped Cyclone III support, so legacy tooling is required.

What are the key specifications of EP3C55F484C7 that engineers should know?

The EP3C55F484C7 key specifications are: 55,856 logic elements, 2,396,160 embedded memory bits (260 × 9 Kbit M9K blocks), 156 18×18 multipliers, 4 PLLs, 327 user I/Os, and 472 MHz internal clock frequency. Built on a 65 nm low-power process in a 484-ball FBGA package, it supports DDR2 interfaces and is configured via serial flash. According to the Cyclone III datasheet, the device targets cost-sensitive parallel processing in industrial, automotive, and video applications.

工程参考数据： EP3C55F484C7 ——对比、设计指导和合规信息。

选型指南

Choose EP3C55F484C7 when your design requires the maximum Cyclone III LE count in the FBGA-484 footprint and you need C7-class timing margins (Fmax ≈ 472 MHz). It is the best fit for industrial control, video pipeline, and SDR pre-processing designs where the design closes timing only on the fastest speed grade. Select EP3C55F484C7N instead if you require explicit lead-free / RoHS-compliant inventory sourcing - the silicon is identical. For designs with more relaxed timing, drop to EP3C55F484C6N (C6 speed grade) to take advantage of remaining allocation inventory; verify static timing still closes. For automotive or industrial-temperature operation (-40 °C to +100 °C), choose EP3C55F484I7N, which keeps the C7 speed grade but extends the operating range. All five parts share the identical FBGA-484 footprint, so PCB layout reuse is guaranteed across the alternative set.

与替代料对比

参数	本产品	EP3C55F484C7N	EP3C55F484C6N	EP3C55F484C6	EP3C55F484C8N	EP3C55F484I7N
Package	FBGA-484 (23 × 23 mm, 1.0 mm pitch)	FBGA-484 - same	FBGA-484 - same	FBGA-484 - same	FBGA-484 - same	FBGA-484 - same
Brand	Intel	Intel	Intel	Intel	Intel	Intel
Logic Elements	55,856	55,856	55,856	55,856	55,856	55,856
Embedded Memory (bits)	2,396,160	2,396,160	2,396,160	2,396,160	2,396,160	2,396,160
Embedded 18x18 Multipliers	156	156	156	156	156	156
Maximum User I/Os	327	327	327	327	327	327
Speed Grade	C7 (Fmax ≈ 472 MHz)	C7	C6 (slower)	C6 (slower)	C8 (slowest)	I7 (industrial temp, C7 speed)
Operating Temperature	0 °C to +85 °C (Commercial)	0 °C to +85 °C	0 °C to +85 °C	0 °C to +85 °C	0 °C to +85 °C	-40 °C to +100 °C (Industrial)
RoHS / Lead-Free	Lead-free FBGA	Lead-free (N suffix)	Lead-free (N suffix)	Lead-free FBGA	Lead-free (N suffix)	Lead-free (N suffix)

关键差异点

Highest speed grade available in Cyclone III family （对比 EP3C55F484C8N)
Same 484-ball FBGA footprint across all alternatives （对比 EP3C55F484I7N)
Lead-free RoHS option without electrical change （对比 EP3C55F484C7N)

设计说明

Estimated: at 50% toggle rate on a typical design, the EP3C55F484C7 core draws approximately 0.5-0.8 A from the 1.2 V VCCINT rail. Use a 4-layer PCB with a dedicated VCCINT plane, and place 100 µF bulk + 0.1 µF + 1 µF ceramic decoupling clusters within 5 mm of the BGA balls. The VCCA_PLL rail requires additional filtering: a ferrite bead in series with a 10 µF + 0.1 µF decoupling pair to minimize PLL jitter. Total worst-case supply current is approximately 1.5 A on VCCINT plus per-bank VCCIO current proportional to I/O toggle rate.

The FBGA-484 has 1.0 mm ball pitch - design the PCB with 0.5 mm via-in-pad and ENIG surface finish for manufacturability. According to Intel's Cyclone III pin connection guidelines, leave unused I/O pins configured as input with weak pull-up enabled to minimize power. Differential pairs (LVDS) must be length-matched within ±100 mils to maintain DDR interfaces at 200 MHz. Provide at least four GND vias per BGA quadrant stitched to a continuous ground plane for thermal and signal-integrity performance.

Do not assume newer Quartus Prime releases support Cyclone III - they do not. Use Quartus II 13.0sp1 (legacy free download) for compile and programming file generation. When using a C7-to-C6 speed-grade downgrade as a cost-saving measure, always re-run static timing analysis; a design with zero slack margin on C7 will fail on C6. The configuration flash (EPCS4/EPCS16) must match the .pof file's compression mode or the FPGA will not configure. Reserve at least 1 second between power-up and JTAG programming attempts to avoid inrush reset glitches.

合规信息

RoHS

Compliant

REACH

Compliant

AEC-Q100

Not Applicable

无铅

Yes

无卤

Unknown

冲突矿物

Compliant

Lead-free FBGA per Cyclone III device datasheet. RoHS and REACH compliance per Intel product environmental certification page. AEC-Q100 not applicable for FPGA product family; I7 industrial temperature variants available separately.

数据核验日期： 2026-09-09 ——数据由 XAIPART 元器件工程团队核验和整理

来源： Distributor, Distributor, Octopart, Manufacturer Datasheet, Distributor, Distributor