EP3C55F484I7 - 55K LE Cyclone III FPGA 484-BGA | Intel / Altera
料号： EP3C55F484I7 ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $292.57 | $292.57 |
| 10 | $263.31 | $2,633.10 |
| 100 | $234.05 | $23,405.00 |
| 500 | $204.8 | $102,400.00 |
| 1,000 | $175.54 | $175,540.00 |
EP3C55F484I7 概述
A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs / ALMs), programmable interconnect, and dedicated hard IP such as block RAM, DSP blocks, PLLs, and high-speed transceivers. FPGAs sit in the broader hierarchy of programmable logic devices (PLD) -> programmable logic -> digital ICs -> semiconductors. Unlike a fixed ASIC, an FPGA is reprogrammed in-system via a configuration bitstream, making it the platform of choice for design prototyping, low-volume production, and applications requiring late-stage hardware changes.
Key Cyclone III features include up to 4 Mbits of embedded memory, up to 156 embedded 18 × 18 multipliers, and 20 global clock networks with up to 4 PLLs per device. The EP3C55 variant specifically offers 55,856 logic elements (3,491 ALMs), 2,340 Kbits of RAM, 156 multipliers, and 4 PLLs. Configuration is supported via active serial (AS), passive serial (PS), fast passive parallel (FPP), and JTAG modes, allowing flexible boot from EPCS configuration devices or external microprocessors.
Typical applications include industrial motor control, video processing pipelines, telecom line cards, automotive infotainment prototypes, and cost-sensitive DSP front-ends. The 484-BGA package provides ample signal integrity margin for DDR/DDR2 memory interfaces and LVDS signaling commonly required in display and image-processing designs.
When designing with this device, plan power sequencing for the 1.2 V core and the I/O bank supplies independently, and follow Altera's decoupling guidelines (typically 0.1 µF + bulk decoupling per VCC pin group). The 1.0 mm-pitch FBGA-484 requires 4–6 layer PCB with microvia or via-in-pad for reliable assembly. Use the Quartus II / Quartus Prime design software for synthesis, place-and-route, and timing closure.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design considerations beyond the Altera Cyclone III handbook.
直接替换替代料： EP3C55F484I7 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP3C55F484I7 （相同外形与封装尺寸） ——差异在于 Package, Process Technology, Embedded Multipliers (18x18), Operating Temperature, Speed Grade.
快速对比工具——选择替代料号进行并排对比：
EP3C55F484I7N
✅ 直接替换✓ 有现货
$205.4 / 个
查看数据手册 →EP3C55F484C8N
✅ 直接替换✓ 有现货
$58.5 / 个
查看数据手册 →EP3C55F484C7N
✅ 直接替换✓ 有现货
$52.75 / 个
查看数据手册 →EP3C55F484C6N
✅ 直接替换✓ 有现货
$148.7 / 个
查看数据手册 →EP3C120F484I7N
✅ 直接替换✓ 有现货
$84.7 / 个
查看数据手册 →EP3C40F484I7N
✅ 直接替换✓ 有现货
$118.5 / 个
查看数据手册 →EP3C55F484I7 最大额定值与电气特性
| Series | Cyclone III |
| Manufacturer | Intel (formerly Altera) |
| Device Type | FPGA - Field Programmable Gate Array |
| Logic Elements / Cells | 55,856 |
| Adaptive Logic Modules (ALMs) | 3,491 |
| Number of Logic Array Blocks (LABs) | 3,491 |
| Number of I/O | 327 |
| Embedded Memory (bits) | 2,396,160 (2,340 Kbits) |
| Number of Logic Blocks / CLBs | 55856 |
| Embedded Multipliers (18 × 18) | 156 |
| PLLs | 4 |
| Global Clock Networks | 20 |
| Internal Maximum Frequency | 472.5 MHz |
| Core Voltage | 1.2 V |
| 工作温度 | -40 °C to +100 °C (Industrial grade, I-suffix) |
| 封装 | 484-FBGA (F484), 23 × 23 mm, 1.0 mm pitch |
| 安装类型 | Surface Mount (BGA) |
| RoHS 状态 | Lead-Free, RoHS Compliant |
| Process Technology | CMOS (Cyclone III low-power 65 nm family) |
EP3C55F484I7 484-fbga (f484), 23 × 23 mm, 1.0 mm pitch 引脚配置指南
EP3C55F484I7（484-fbga (f484), 23 × 23 mm, 1.0 mm pitch 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP3C55F484I7.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP3C55F484I7 适用于 6 应用s: Industrial Motor Control, Video Processing & Display Pipelines, Telecom Line Cards & Backplane Bridging, Portable Test & Measurement Equipment, Automotive Infotainment Prototyping, Cost-Sensitive DSP Front-End Designs.
Industrial Motor Control
The EP3C55F484I7's 156 18×18 hardware multipliers and 4 PLLs make it a strong fit for field-oriented control (FOC) loops of 3-phase AC induction and PMSM motors. The 327 user I/Os accept multi-encoder inputs (QEI, SSI, BiSS, EnDat) and produce 6-channel PWM plus fault inputs within a single device. Industrial -40 to +100 °C qualification eliminates external thermal conditioning in cabinet installations. Compared with a DSP+MCU architecture, the FPGA consolidates the controller, the PFC front-end logic, and the safety watchdog in one part, reducing BOM cost by 20–30%.
推荐
Video Processing & Display Pipelines
The EP3C55F484I7 delivers the throughput needed for mid-resolution video format conversion, scaling, alpha blending, and color-space conversion at 1080p60. The 2,340 Kbits of embedded RAM function as line buffers for deinterlacing and frame-rate conversion without external SDRAM for simpler pipelines. The 327 I/Os support LVDS input pairs for direct camera-sensor capture or DVI/HDMI bridge chips. Industrial temperature rating suits digital signage, medical imaging front-ends, and broadcast auxiliary displays.
推荐
Telecom Line Cards & Backplane Bridging
The EP3C55F484I7 is widely deployed in low-density telecom line cards for TDM-to-packet conversion, E1/T1/J1 framer bridging, and protocol-aware traffic shaping. The 4 PLLs provide independent clock domains for backplane recovery, line-rate adaptation, and CPU-side packet interfaces. Industrial temperature qualification matches outdoor cabinet and central-office environments. The 1.0 mm-pitch FBGA-484 also supports DDR/DDR2 interfaces commonly needed for packet buffering at line rate.
推荐
Portable Test & Measurement Equipment
The Cyclone III family's low static power (typical core < 0.5 W at 1.2 V) makes the EP3C55F484I7 suitable for handheld oscilloscopes, logic analysers, and protocol analysers where battery life matters. The 156 hardware multipliers accelerate FFT, FIR, and correlation computations for real-time signal analysis. Industrial -40 to +100 °C allows field deployment in harsh environments. The 327 I/Os provide direct probing channels without external muxing.
推荐
Automotive Infotainment Prototyping
The EP3C55F484I7 is widely used in pre-production automotive infotainment and ADAS prototyping platforms where engineers need flexible logic before committing to an ASIC. The 327 I/Os directly interface LVDS displays, MOST or CAN-FD bridges, and surround-view camera pre-processors. Industrial -40 to +100 °C matches in-cabin environments. Production vehicles typically migrate to Cyclone IV/V SoC or dedicated automotive ASSPs after design freeze.
推荐
Cost-Sensitive DSP Front-End Designs
With 156 18×18 multipliers and 472.5 MHz internal Fmax, the EP3C55F484I7 functions as a high-throughput DSP front-end for audio beamforming, software-defined radio (SDR) baseband, and biometric signal processing. Compared with discrete DSP ICs, the FPGA integrates glue logic, host interface (PCIe, SPI, parallel), and accelerator pipelines in one device. Industrial temperature supports outdoor and medical-device deployments, while the 484-FBGA provides ample I/O for high-bandwidth ADC/DAC interfaces.
推荐
推荐产品汇总
工程参考数据： EP3C55F484I7 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP3C55F484I7N | EP3C55F484C8N | EP3C55F484C7N | EP3C55F484C6N | EP3C120F484I7N | EP3C40F484I7N |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-FBGA | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same |
| Logic Elements | 55,856 | 55,856 | 55,856 | 55,856 | 55,856 | 119,088 | 39,600 |
| Embedded RAM (Kbits) | 2,340 | 2,340 | 2,340 | 2,340 | 2,340 | 3,888 | 1,161 |
| 18×18 Multipliers | 156 | 156 | 156 | 156 | 156 | 288 | 126 |
| PLLs | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| User I/O | 327 | 327 | 327 | 327 | 327 | 288 | 331 |
| Operating Temperature | -40 to +100 °C (Industrial, -7 speed) | -40 to +100 °C (Industrial, -7 speed) | 0 to +85 °C (Commercial, -8 speed) | 0 to +85 °C (Commercial, -7 speed) | 0 to +85 °C (Commercial, -6 speed) | -40 to +100 °C (Industrial, -7 speed) | -40 to +100 °C (Industrial, -7 speed) |
| Internal Max Frequency | 472.5 MHz | 472.5 MHz | 402.5 MHz (-8 speed grade, ~15% slower) | 472.5 MHz (-7 speed grade) | 404 MHz (-6 speed grade, ~15% slower) | 472.5 MHz | 472.5 MHz |
| Lead-Free / RoHS | Yes | Yes (N-suffix explicitly lead-free) | Yes (N-suffix) | Yes (N-suffix) | Yes (N-suffix) | Yes (N-suffix) | Yes (N-suffix) |
关键差异点
- Higher logic density + same 484-FBGA footprint （对比 EP3C40F484I7N)
- More multipliers for DSP workloads （对比 EP3C40F484I7N)
- Same package, lower cost when industrial rating is not required （对比 EP3C55F484C7N)
- Lower-density same-footprint option for cost-sensitive designs （对比 EP3C25F324I7N)
设计说明
Estimated: The 484-FBGA uses 1.0 mm ball pitch and 23 × 23 mm body, which requires 4–6 PCB layers with 0.5 mm via-in-pad or microvia technology for reliable assembly. Per Cyclone III Device Handbook recommendations, route signal escapes on the top layer with a fan-out pattern that keeps adjacent ball vias on 2 mm centre-to-centre spacing. Maintain continuous reference planes under the BGA to control impedance and avoid signal-integrity violations on DDR/LVDS pairs.
Provide at least 4 × 10 µF bulk + 0.1 µF decoupling per VCC/VCCINT/VCCIO pin group on the Cyclone III device. Power-up sequencing must bring VCCINT (1.2 V core) up before or simultaneously with VCCIO bank supplies to avoid latch-up. The Cyclone III Device Handbook specifies a maximum VCCINT rise time of 100 ms; slower ramps may cause configuration failures. Use a dedicated power supervisor (e.g., MAX811) to gate the CONF_DONE signal.
At typical 1.2 V core operation with 50–70% logic utilisation, the EP3C55F484I7 dissipates approximately 1.5–2.5 W. The 484-FBGA's bottom-side thermal pad must be soldered to a 6 × 6 mm copper pour on the top layer and stitched to inner ground planes with a 4 × 4 thermal-via array (0.3 mm vias, 1.2 mm pitch). Without thermal pad soldering, junction temperature can rise 20–25 °C above ambient at full load.
Configuration mode pins (MSEL0–MSEL2) must be tied to VCCPD (3.3 V tolerant) or GND via 1 kΩ resistors to select AS/PS/FPP/JTAG boot mode. Do not leave MSEL floating — this is the #1 cause of 'device not detected' issues in prototype bring-up. Also ensure CONFIG_DONE has a 10 kΩ pull-up to VCCIO (bank 8) to allow Quartus programmer to sense successful configuration.
合规信息
RoHS compliant and lead-free per verified DigiKey, Mouser, and Heisener listings. The N-suffix variant EP3C55F484I7N explicitly denotes lead-free assembly. Not AEC-Q100 qualified — not an automotive-grade part per the vendor specifications. Halogen-free status not stated in the verified data and marked as unknown.
