EP3C55F780C6 - Cyclone III FPGA, 55K LEs, 780-BGA | Intel (Altera)
料号： EP3C55F780C6 ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $321.88 | $321.88 |
| 10 | $289.69 | $2,896.90 |
| 100 | $257.5 | $25,750.00 |
| 250 | $231.75 | $57,937.50 |
| 500 | $209.22 | $104,610.00 |
EP3C55F780C6 概述
A Field-Programmable Gate Array (FPGA) is a semiconductor device containing configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP such as block RAM and DSP slices. FPGAs sit in the programmable-logic tier of the digital semiconductor hierarchy: ASIC < structured ASIC < FPGA < CPLD < microcontroller. Designers use HDL (Verilog or VHDL) to describe the desired digital function, then synthesize, place, and route the design with vendor tools (Quartus II for the Cyclone III family). Unlike fixed-function ASICs, FPGAs allow in-system reconfiguration, making them ideal for prototyping, low-volume production, and designs that must evolve in the field.
Key features of the EP3C55F780C6 include a 4-Mbit embedded memory subsystem, four general-purpose PLLs for clock synthesis, and support for multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL on user I/Os. The 'C6' speed grade offers a -6 speed rating for internal logic, and the 'C' prefix denotes the commercial temperature grade of 0C to +85C. Static power consumption is significantly reduced compared to Cyclone II, enabling fan-less operation in cost-sensitive applications.
From an architectural perspective, the Cyclone III device family uses 4-input look-up tables (LUTs) per logic element, M9K block RAM tiles, and 18x18 multiplier blocks optimized for DSP. The 780-FBGA package provides high I/O density suitable for memory-bus bridging, video processing pipelines, and parallel sensor aggregation. Configuration is supported through JTAG, Active Serial (AS), Active Parallel (AP), and Passive Serial (PS) modes via the dedicated configuration pins.
Typical applications include industrial motor control, video surveillance and image processing, telecom line cards, low-cost ASIC prototyping, and embedded vision systems. The combination of DSP blocks and on-chip memory is particularly suited to digital filtering, FFT computation, and image pre-processing. Designers transitioning from older Cyclone II designs will find pin-compatible migration options within the family.
When designing with this device, ensure the PCB BGA layout meets the 1.0mm ball pitch clearance rules of the 780-FBGA package and that the Quartus II power-play analysis is run early in the design cycle. Decoupling must follow the reference design guidance in the Cyclone III Device Handbook.
This page synthesizes distributor pricing, drop-in Cyclone III alternatives, and practical design notes not found in the manufacturer datasheet alone, helping engineers select the right Cyclone III variant for their application.
直接替换替代料： EP3C55F780C6 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP3C55F780C6 （相同外形与封装尺寸） ——差异在于 Package, Process Technology, Speed Grade, Embedded 18x18 Multipliers, RoHS Status.
快速对比工具——选择替代料号进行并排对比：
EP3C55F780C6N
✅ 直接替换✓ 有现货
$52.1 / 个
查看数据手册 →EP3C55F780C7N
✅ 直接替换✓ 有现货
$138.31 / 个
查看数据手册 →EP3C55F780C7
✅ 直接替换✓ 有现货
$76.75 / 个
查看数据手册 →EP3C55F780I7N
✅ 直接替换✓ 有现货
$195 / 个
查看数据手册 →EP3C55F780I6
✅ 直接替换📋 参考替代料（不在目录中）
EP3C55F780C8N
✅ 直接替换✓ 有现货
$58.2 / 个
查看数据手册 →EP3C40F780C6
✅ 直接替换✓ 有现货
$142.1 / 个
查看数据手册 →EP3C55F780C6 最大额定值与电气特性
| Series | Cyclone III |
| Logic Elements | 55,856 |
| Embedded Memory Bits | 2,396,160 |
| Number of Block RAM (M9K) | 260 |
| 18x18 Hardware Multipliers | 156 |
| User I/Os | 377 |
| 封装 | 780-ball FBGA |
| Speed Grade | -6 (C6) |
| 工作温度 | 0C to +85C (Commercial) |
| Process Technology | 65 nm low power |
| Configuration Methods | JTAG, AS, AP, PS |
| Number of PLLs | 4 |
| Maximum User I/O Voltage Standards | LVDS, LVTTL, LVCMOS, SSTL, HSTL |
| RoHS 状态 | Compliant |
| 安装类型 | Surface Mount (BGA) |
EP3C55F780C6 780-ball fbga 引脚配置指南
EP3C55F780C6（780-ball fbga 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP3C55F780C6.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP3C55F780C6 适用于 6 应用s: Industrial Motor Control, Video Surveillance and Image Processing, ASIC Prototyping and Verification, Telecom Line Cards and Protocol Bridging, Embedded Vision Systems, Low-Cost DSP and FIR Filter Arrays.
Industrial Motor Control
The EP3C55F780C6 is well suited to multi-axis industrial motor control with its 156 18x18 hardware multipliers enabling high-bandwidth current loop DSP and 2,396,160 bits of block RAM providing headroom for state machines and lookup tables. The 377 user I/Os accommodate multiple encoder inputs, PWM outputs, and gate-driver interfaces. The Cyclone III family's 65nm low-power process reduces thermal dissipation in enclosed industrial cabinets. Designers benefit from Quartus II's Qsys tool for fast integration of the Nios II soft processor for supervisory control.
推荐
Video Surveillance and Image Processing
The 2,396,160 bits of embedded block RAM in the EP3C55F780C6 serve as efficient line buffers for video pipelines, while the 156 dedicated 18x18 multipliers accelerate 2D convolution, Sobel edge detection, and color-space conversion. The 377 user I/Os accept parallel camera data, HDMI, or BT.656 streams, and drive DDR2 memory interfaces for frame buffering. Cyclone III's Video and Image Processing (VIP) megafunctions in Quartus II reduce design time for filters, scalers, and deinterlacers common in surveillance equipment.
推荐
ASIC Prototyping and Verification
The 55,856 logic elements of the EP3C55F780C6 can emulate mid-complexity ASIC RTL with operating frequencies that meet functional verification targets. The 780-FBGA package exposes enough user I/Os to map peripheral interfaces, while the four PLLs provide multiple clock domains matching real ASIC conditions. Quartus II's LogicLock regions and incremental compile enable team-based partitioning of large designs, and the static-power reduction over Cyclone II supports long regression runs in verification farms.
推荐
Telecom Line Cards and Protocol Bridging
Telecom line cards use the EP3C55F780C6 to bridge legacy TDM (T1/E1) streams to packet backplanes, with the 156 hardware multipliers handling per-channel HDLC encoding and the 377 user I/Os providing glue-less interfaces to framers and PHYs. The four PLLs synthesize the multiple clock rates required (8 kHz frame sync, 1.544/2.048 MHz data, 19.44 MHz backplane). Block RAM is used for jitter buffers and per-channel state, while the Cyclone III low-power design reduces thermal load in densely packed central-office racks.
推荐
Embedded Vision Systems
The EP3C55F780C6 provides a balanced resource mix for embedded vision: 55,856 LEs for control logic and feature-extraction pipelines, 2,396,160 bits of block RAM for image and filter taps, and 156 DSP blocks for convolution and optical-flow computation. The 377 user I/Os connect directly to CMOS image sensors, MIPI adapters, and DDR2/DDR3 memory. The 780-FBGA package fits handheld and panel-mounted industrial cameras. Designers use Altera's VIP suite and OpenCL for rapid algorithm implementation.
推荐
Low-Cost DSP and FIR Filter Arrays
The 156 dedicated 18x18 multipliers of the EP3C55F780C6 implement parallel FIR and IIR filters with throughput rates up to hundreds of MSPS when pipelined. The 2,396,160 bits of block RAM store filter coefficients and delay-line samples, and the four PLLs generate the required sample-rate clocks. The Cyclone III architecture's low static power makes multi-channel filter banks (used in audio processing, software-defined radio, and instrumentation) practical on a single device without active cooling.
推荐
推荐产品汇总
工程参考数据： EP3C55F780C6 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP3C55F780C6N | EP3C55F780C7N | EP3C55F780C7 | EP3C55F780I7N | EP3C55F780I6 | EP3C55F780C8N | EP3C40F780C6 |
|---|---|---|---|---|---|---|---|---|
| Package | 780-ball FBGA | 780-ball FBGA - same | 780-ball FBGA - same | 780-ball FBGA - same | 780-ball FBGA - same | 780-ball FBGA - same | 780-ball FBGA - same | 780-ball FBGA - same |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Logic Elements | 55,856 | 55,856 - same | 55,856 - same | 55,856 - same | 55,856 - same | 55,856 - same | 55,856 - same | 39,600 (-29%) |
| Speed Grade | C6 (-6) | C6 (-6) - same | C7 (-7), ~15% faster | C7 (-7), ~15% faster | C7 (-7) industrial | C6 (-6) industrial | C8 (-8), ~10% slower | C6 (-6) - same |
| Temperature Grade | Commercial (0C to +85C) | Commercial - same | Commercial | Commercial | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial | Commercial |
| Embedded Memory Bits | 2,396,160 | 2,396,160 - same | 2,396,160 - same | 2,396,160 - same | 2,396,160 - same | 2,396,160 - same | 2,396,160 - same | 1,161,216 (-51%) |
| 18x18 Multipliers | 156 | 156 - same | 156 - same | 156 - same | 156 - same | 156 - same | 156 - same | 126 (-19%) |
| User I/Os | 377 | 377 - same | 377 - same | 377 - same | 377 - same | 377 - same | 377 - same | 377 - same |
| RoHS Compliant | Yes (non-N indicates legacy lead) | Yes | Yes | No (legacy lead) | Yes | No (legacy lead, industrial) | Yes | No (legacy lead) |
| Series | Cyclone III | Cyclone III - same | Cyclone III - same | Cyclone III - same | Cyclone III - same | Cyclone III - same | Cyclone III - same | Cyclone III - same |
关键差异点
- Same density and I/O across all speed/temperature variants （对比 EP3C55F780C7N)
- Industrial temperature option in same package （对比 EP3C55F780I7N)
- Lead-free RoHS compliance option （对比 EP3C55F780C6N)
- 55,856 LEs vs 39,600 in lower-density 780-FBGA part （对比 EP3C40F780C6)
设计说明
The 780-ball FBGA package uses a 1.0mm ball pitch with a 29x29 array (depopulated center). The PCB must support microvia (laser-drilled) stack-up or via-in-pad technology to fan out the inner balls. Maintain a minimum 0.4mm drill-to-copper clearance and use the manufacturer's recommended land pattern. BGA ball collapse during reflow is typically 0.15-0.20mm, so the PCB pad diameter should be 0.45-0.50mm for reliable joint formation. A 6-6-6 or 7-7-7 layer stack-up is recommended for signal integrity on high-speed LVDS pairs.
Cyclone III's 65nm low-power process significantly reduces static power compared to Cyclone II, but at high utilization (above 70% LEs and full DSP engagement) the device can still dissipate 2-4W. For the 780-FBGA package, the thermal resistance is approximately 15 C/W with a 4-layer PCB and adequate thermal vias in the central ball-depopulated region. If junction temperature must stay below 100C in enclosed industrial enclosures, run the Quartus II PowerPlay early estimator and add a small heatsink or airflow.
Configuration failures are the most common bring-up issue. Ensure the MSEL pins are strapped correctly to select the configuration mode (AS, AP, PS, or JTAG), and that the CONF_DONE pin pulls high through an external 10k resistor. The EPCS serial configuration device must match the AS mode data width. Always include a JTAG header on the PCB for in-system programming and debug, and use the Quartus II Programmer with the correct BSDL file for boundary-scan testing.
The Cyclone III I/O banks support multiple voltage standards (LVDS, LVTTL, LVCMOS, SSTL, HSTL) but each bank shares a single VCCIO. When designing with mixed-voltage I/O (e.g., 3.3V LVCMOS for legacy peripherals and 1.8V SSTL for DDR2 memory), plan bank assignments carefully so each bank contains only one VCCIO requirement. Use the Quartus II I/O Assignment Analysis tool to catch conflicts before layout, and add 33 ohm series-termination resistors near the FPGA on high-speed LVDS pairs to control reflections.
合规信息
The EP3C55F780C6 (non-N suffix) is a legacy lead-bearing variant; for RoHS-compliant production, use the EP3C55F780C6N (lead-free). AEC-Q100 is not applicable as this is a commercial-grade programmable logic device.