PIC24F16KM202-E/ML - 16KB Flash 16-bit XLP MCU 28-QFN | Microchip
料号： PIC24F16KM202-E/ML ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $4.41 | $4.41 |
| 10 | $3.96 | $39.60 |
| 100 | $3.3 | $330.00 |
| 500 | $2.86 | $1,430.00 |
| 1,000 | $2.55 | $2,550.00 |
PIC24F16KM202-E/ML 概述
An MCU (microcontroller) is a single-chip computer that integrates a CPU core, non-volatile program memory, working RAM, and a rich set of analog and digital peripherals. PIC24F devices sit in the 16-bit segment of the PIC family and are positioned between the 8-bit PIC16/PIC18 line and higher-end dsPIC/PIC32 parts; their role spans battery-powered sensing nodes, consumer user interfaces, and industrial control sub-systems where deterministic behavior and ultra-low sleep current matter more than raw CPU throughput.
Key features of the PIC24F16KM202 include integrated 12-bit ADC with up to 19 channels and 200 ksps sampling rate, dual 8-bit DAC outputs, three on-chip op amps, three comparators, configurable logic cells (CLC), five PWM time bases, five output-compare channels, two UART modules, two I2C/SPI MSSP peripherals, IrDA and a chargeable RTCC. The XLP design targets sleep currents well under 1 uA in deep-sleep modes, while the 1.8 V to 3.6 V operating range supports direct Li-ion or two-AA battery rails.
The device uses a 16-bit modified Harvard RISC core with hardware multiply/divide and a 24-bit instruction word, paired with a 7-channel DMA controller that offloads ADC, UART, and SPI transfers. Internal RC oscillators and a PLL provide flexible clocking for low-power or 32 MHz active modes, and the on-chip op amps can be routed to ADC inputs or used as standalone analog building blocks.
Typical applications include low-cost consumer electronics, IoT sensor nodes, battery-powered medical monitoring accessories, industrial sensor conditioning loops, automotive body and lighting sub-systems (using the -E 125°C grade), and analog-rich front ends where the integrated op amps, comparators, and 12-bit ADC replace several discrete components.
When designing in this MCU, place a 100 nF decoupling capacitor on each VDD pin plus a bulk 4.7 uF or larger on the main rail, route the exposed pad (EP) to a solid ground copper pour for thermal dissipation and AC return, and verify unused I/O pins are configured as outputs or left floating per the datasheet to minimize leakage in sleep mode.
This page synthesizes the manufacturer datasheet with distributor pricing, AEO-optimized answers, and a drop-in alternatives list that goes beyond what the standard parametric search returns.
直接替换替代料： PIC24F16KM202-E/ML ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： PIC24F16KM202-E/ML （相同外形与封装尺寸） ——差异在于 Package, ADC, Comparators, Operating Temperature, DAC.
快速对比工具——选择替代料号进行并排对比：
PIC24F16KM202-I/ML
✅ 直接替换📋 参考替代料（不在目录中）
PIC24F16KM204-I/ML
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$1.97 / 个
查看数据手册 →PIC24F16KM102-I/ML
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
PIC24F16KL402-I/ML
✅ 直接替换✓ 有现货
$1.21 / 个
查看数据手册 →PIC24F16KA302-I/ML
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$1.95 / 个
查看数据手册 →PIC24F32KM202-I/ML
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
PIC24F08KM202-E/ML
✅ 直接替换✓ 有现货
$2.63 / 个
查看数据手册 →PIC24F16KM202-E/ML 最大额定值与电气特性
| Core Processor | PIC24F |
| Core Size | 16-bit |
| Core Architecture | Modified Harvard RISC, 24-bit instruction word |
| Program Memory | 16 KB (5.5K x 24) Flash |
| Data RAM | 2 KB |
| Maximum CPU Speed | 32 MHz |
| Operating Voltage Range | 1.8 V to 3.6 V |
| 封装 | 28-pin VQFN (6x6 mm) with exposed pad |
| 安装类型 | Surface Mount |
| ADC | 12-bit, up to 19 channels, 200 ksps |
| DAC | 2 x 8-bit |
| Comparators | 3 |
| Op Amps | 3 (on-chip) |
| PWM Time Bases | 5 |
| Output Compare Channels | 5 |
| UART Modules | 2 |
| MSSP (I2C/SPI) Modules | 2 |
| Connectivity | I2C, SPI, IrDA, UART/USART, LINbus |
| DMA Channels | 7 |
| 工作温度范围 | -40C to +125C (E suffix = enhanced automotive) |
| RoHS 状态 | Compliant |
| Lead-Free | Yes |
PIC24F16KM202-E/ML 引脚配置
| 引脚 1 | RA0/AN0 — GPIO RA0 / analog input AN0 |
| 引脚 2 | RA1/AN1 — GPIO RA1 / analog input AN1 |
| 引脚 3 | RB0/AN2 — GPIO RB0 / analog input AN2 |
| 引脚 4 | RB1/AN3 — GPIO RB1 / analog input AN3 |
| 引脚 5 | RB2/AN4 — GPIO RB2 / analog input AN4 |
| 引脚 6 | RB3/AN5 — GPIO RB3 / analog input AN5 |
| 引脚 7 | VDD — Positive supply (1.8 V to 3.6 V) |
| 引脚 8 | VSS — Ground reference |
| 引脚 9 | RA2/AN6 — GPIO RA2 / analog input AN6 |
| 引脚 10 | RA3/AN7 — GPIO RA3 / analog input AN7 |
| 引脚 11 | RB4/AN8 — GPIO RB4 / analog input AN8 |
| 引脚 12 | RB5/AN9 — GPIO RB5 / analog input AN9 |
| 引脚 13 | RB6/AN10 — GPIO RB6 / analog input AN10 |
| 引脚 14 | RB7/AN11 — GPIO RB7 / analog input AN11 |
| 引脚 15 | RA4/AN13 — GPIO RA4 / analog input AN13 |
| 引脚 16 | RA5/AN14 — GPIO RA5 / analog input AN14 |
| 引脚 17 | RA6/AN15 — GPIO RA6 / analog input AN15 |
| 引脚 18 | RA7/AN16 — GPIO RA7 / analog input AN16 |
| 引脚 19 | VCAP — Internal 1.8 V regulator output - decouple with 10 uF |
| 引脚 20 | RA8/AN17 — GPIO RA8 / analog input AN17 |
| 引脚 21 | RA9/AN18 — GPIO RA9 / analog input AN18 |
| 引脚 22 | RA10 — GPIO RA10 / DAC reference |
| 引脚 23 | RB8 — GPIO RB8 / peripheral I/O |
| 引脚 24 | RB9 — GPIO RB9 / peripheral I/O |
| 引脚 25 | RB10 — GPIO RB10 / peripheral I/O |
| 引脚 26 | RB11 — GPIO RB11 / peripheral I/O |
| 引脚 27 | PGEC2 — ICSP programming clock |
| 引脚 28 | PGED2 — ICSP programming data |
典型应用
PIC24F16KM202-E/ML 适用于 6 应用s: Battery-Powered IoT Sensor Node, Analog-Rich Sensor Conditioning Front End, Automotive Body and Lighting Subsystems, Portable Medical Monitoring Accessories, Industrial Sensor Conditioning Loops, Low-Cost Consumer User Interface Controller.
Battery-Powered IoT Sensor Node
The PIC24F16KM202-E/ML fits battery-powered IoT sensor nodes because its XLP sleep current is sub-1 uA with RTCC active and its 1.8 V to 3.6 V supply range supports direct Li-ion / 2xAA battery connection without an LDO. The integrated 12-bit ADC with up to 19 channels, three on-chip op amps for signal conditioning, and three comparators for threshold events let the MCU digitize temperature, pressure, or current-sensing signals without external analog components. Two UART and two MSSP peripherals are sufficient to bridge to a BLE co-processor or LoRa module, while 16 KB Flash fits typical sensor-fusion and BLE-protocol command sets. Designers save both PCB area and BOM cost by absorbing the analog chain into a single 28-QFN part.
推荐
Analog-Rich Sensor Conditioning Front End
The PIC24F16KM202-E/ML fits analog-rich sensor front ends because it integrates three op amps, two 8-bit DACs, three comparators, and a 12-bit 200 ksps ADC - functions that usually require 6 to 10 external analog components. The on-chip op amps can be routed to ADC inputs, configured as PGAs, or used as standalone buffers for bridge sensors, photodiodes, or electrochemical cells. The dual DAC generates bias voltages or setpoints for closed-loop control, while the comparators handle fast threshold detection independent of the ADC. All of this in a 28-QFN exposed-pad package keeps the analog section compact and well-isolated from digital switching noise.
推荐
Automotive Body and Lighting Subsystems
The PIC24F16KM202-E/ML in its -E (extended) temperature grade is rated -40C to +125C, qualifying it for underhood automotive body and lighting modules such as ambient lighting controllers, interior LED drivers, and seat-position switches. The five PWM time bases and five output-compare channels drive multiple MOSFET half-bridges for RGB color mixing or H-bridge motor control, while the dual UART plus MSSP peripherals handle LIN bus communication and SPI LED-driver ICs. The 32 MHz CPU core closes control loops fast enough for PWM dimming and color-temperature feedback, and the 28-QFN exposed pad simplifies thermal management in tight body-module enclosures. AEC-Q100 qualification status should be confirmed with Microchip for specific OEM automotive programs.
推荐
Portable Medical Monitoring Accessories
The PIC24F16KM202-E/ML fits portable medical monitoring accessories such as pulse-oximeter probes, glucose-meter dongles, and wearable thermometer patches where low sleep current, integrated analog, and small footprint dominate the BOM. The 12-bit ADC combined with the on-chip op amps conditions photodiode or electrochemical-sensor signals directly, eliminating external instrumentation amplifiers. The configurable logic cells (CLC) implement hardware event triggers without CPU intervention, lowering active-mode power and extending battery life. The -40C to +125C temperature grade also tolerates the thermal stress of body-worn and sterilization environments. The 28-QFN (6x6 mm) package fits wrist-strap or finger-clip enclosures without sacrificing analog performance.
推荐
Industrial Sensor Conditioning Loops
The PIC24F16KM202-E/ML fits industrial 4-20 mA loop-powered sensor transmitters because its 1.8 V to 3.6 V supply range, integrated 12-bit ADC, and on-chip op amps remove the need for external signal chains. The three comparators enable fast loop-disconnect or fault detection without waking the CPU, while the 32 MHz core runs the linearization and HART-modem firmware in real time. The exposed pad on the 28-QFN package grounds the analog section for clean measurements in noisy industrial cabinets, and the -40C to +125C grade tolerates unheated enclosure temperatures. Two UART peripherals support HART modem pass-through and diagnostic logging simultaneously.
推荐
Low-Cost Consumer User Interface Controller
The PIC24F16KM202-E/ML fits low-cost consumer user-interface controllers such as remote-control keypads, microwave-oven control panels, and small-appliance touch-button modules because it integrates the op amps for capacitive-sense front ends, the comparators for button-matrix scanning, and PWM time bases for LED dimming. The CLC peripheral implements cap-touch decoding in hardware, freeing the CPU to handle display refresh or wireless pairing. The 28-QFN package plus 32 MHz performance is more than enough to drive segmented LCDs, RGB status LEDs, and piezo buzzers. 16 KB Flash accommodates button-mapping tables, BLE pairing profiles, and basic UI logic without external EEPROM.
推荐
推荐产品汇总
工程参考数据： PIC24F16KM202-E/ML ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | PIC24F16KM202-I/ML | PIC24F16KM102-I/ML | PIC24F16KL402-I/ML | PIC24F32KM202-I/ML |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-QFN (6x6 mm) with exposed pad | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same |
| Flash Memory | 16 KB | 16 KB - same | 8 KB (-50%) | 16 KB - same | 32 KB (+100%) |
| RAM | 2 KB | 2 KB - same | 1.5 KB (-25%) | 2 KB - same | 4 KB (+100%) |
| Maximum CPU Speed | 32 MHz | 32 MHz - same | 32 MHz - same | 32 MHz - same | 32 MHz - same |
| Operating Voltage Range | 1.8 V to 3.6 V | 1.8 V to 3.6 V - same | 1.8 V to 3.6 V - same | 1.8 V to 3.6 V - same | 1.8 V to 3.6 V - same |
| Temperature Grade (this MPN is -E) | -40C to +125C (-E) | -40C to +85C (-I) | -40C to +85C (-I) | -40C to +85C (-I) | -40C to +85C (-I) |
| On-Chip Op Amps | 3 | 3 - same | 3 - same | 0 (none in KLP family) | 3 - same |
| DAC Outputs | 2 x 8-bit | 2 x 8-bit - same | 2 x 8-bit - same | 1 x 10-bit (KLP reduced) | 2 x 8-bit - same |
关键差异点
- Integrates 3 op amps and dual 8-bit DAC in a single 28-QFN （对比 PIC24F16KL402-I/ML)
- Extended -40C to +125C temperature grade (E suffix) （对比 PIC24F16KM202-I/ML)
- 32 MHz PIC24F core with 16 KB Flash and 2 KB RAM （对比 PIC24F16KA302-I/ML)
设计说明
Estimated: With 1.8 V to 3.6 V supply and 32 MHz active CPU, the KM202 draws roughly 8-12 mA active at full speed and sub-1 uA in deep-sleep with RTCC. Decouple each VDD/VSS pair with 100 nF X7R ceramic placed within 3 mm of the package; add a single 4.7 uF or larger bulk cap on the main supply rail. According to the datasheet, VCAP requires a 10 uF external capacitor to stabilize the internal 1.8 V regulator - omitting it will cause core instability and brown-out resets.
The 28-VQFN exposed pad MUST be soldered to a continuous ground copper pour of at least 10 mm x 10 mm for thermal dissipation. Per the Microchip QFN land-pattern application note, the pad also serves as the main AC ground return for the analog section - a discontinuous or missing EP solder connection degrades ADC SNR and can lift the reference voltage. Use micro-via stitching (8-12 thermal vias, 0.3 mm drill) under the EP to a second internal ground plane for best thermal and EMI performance.
Do not drive any GPIO above VDD + 0.3 V - the KM202 is a 3.3 V part and connecting a 5 V sensor signal directly will exceed the absolute-maximum rating and may damage the I/O. For 5 V peripheral interfacing, use a level translator such as the TI TXS0108E or NXP GTL2003. Also note: the -E temperature grade (-40C to +125C) part may have slightly higher sleep current than the -I grade; check the latest datasheet revision for worst-case values if sleep current is critical.
Keep analog traces (ANx, op-amp inputs, DAC outputs) short and routed away from PWM, UART, and clock signals. Place the 12-bit ADC reference capacitor on VREF+ with a 100 nF ceramic plus a 10 uF tantalum for low-frequency noise rejection. According to the Microchip analog-layout application note, the on-chip op amps require a minimum load of 1 kohm to remain stable - do not leave the output floating.
合规信息
RoHS compliant per Microchip product page. AEC-Q100 qualification status for the -E grade should be confirmed with Microchip for specific automotive OEM programs.
