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XC9572XL

XC9572XL - 3.3V 72-Macrocell CPLD 5ns | Xilinx AMD

The Xilinx (now AMD) XC9572XL is a 3.3V high-performance CPLD (Complex Programmable Logic Device) providing 1,600 usable gates, 72 macrocells, and a worst-case pin-to-pin propagation delay of 5 ns, housed in low-profile VQFP packages such as the 44-pin VQ44 and 64-pin VQ64. A CPLD is a type of programmable logic device that sits between simple PLDs and FPGAs in the programmable logic hierarchy. Unlike FPGAs, which use look-up tables and volatile configuration memory, CPLDs use macrocell-based sum-of-products architecture with nonvolatile program storage, delivering deterministic, pin-to-pin timing and instant-on operation at power-up. This makes CPLDs the workhorse choice for glue logic, bus interfacing, and power-sequencing control in embedded systems. The XC9572XL is comprised of four 54V18 Function Blocks, each containing 18 macrocells. Key features include 3.3V core operation targeted at high-performance, low-voltage applications in leading-edge communications and computing systems; industry-leading pin-locking capability through a switch matrix that routes flexibly; and multiple speed grades (-5, -7, -10) so designers can trade speed against cost. Individual output enables and slew-rate-limited outputs ease 3.3V bus interfacing. Architecturally, every macrocell is a registered or combinational function generator with product-term allocation, allowing dense state machines without wasting resources. Because configuration is stored in nonvolatile memory across the XC9500XL family, no external boot flash or configuration controller is required, simplifying BOM and board design compared with SRAM-based FPGAs. Typical applications include address decoding and glue logic in embedded processors, bus bridging and interfacing in communications equipment, power-up reset and sequencing control, industrial I/O expansion, and legacy system life-cycle extensions where deterministic timing matters. Design-wise, use the -5 speed grade only where the 5 ns timing is genuinely needed; the -10 grade offers the best value for most glue-logic tasks. Note that design entry requires the legacy Xilinx ISE toolchain, which no longer runs natively on modern Windows. This page synthesizes distributor pricing, drop-in alternatives across speed grades and packages, and practical design notes not found in the manufacturer datasheet DS057.

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XC9572XL-10VQG64C

XC9572XL-10VQG64C - 72-Macrocell 10ns CPLD | AMD/Xilinx

The AMD/Xilinx XC9572XL-10VQG64C is a 3.3V, 10ns pin-to-pin delay, 72-macrocell high-performance CPLD housed in a 64-pin VQFP (VQG64) package. It is built on the 2.5V XC9500XL family architecture, providing four 54V18 Function Blocks (FBs) that deliver 1,600 usable gates with predictable, JTAG-programmable logic and 100,000 program/erase cycles endurance. The device targets glue-logic and bus-interface functions where deterministic timing and instant-on (in-system programmable via IEEE 1149.1 JTAG) replace discrete 74-series logic. A CPLD (Complex Programmable Logic Device) is a non-volatile, instant-on programmable logic device whose architecture is a sea of macrocells backed by a programmable interconnect matrix. In the system hierarchy, a CPLD sits below an FPGA (typically lower density but lower power and no configuration time) and above discrete SSI/MSI gates. CPLDs are routinely used as interface bridges, address decoders, state machines, and power-up sequencers in designs that need predictable timing in a single device. Key features of the XC9572XL-10VQG64C include 72 macrocells, 1,600 usable gates, 4 ns internal timing with 10 ns pin-to-pin (tPD) at 3.3V, 34 user I/O pins (64-pin VQFP), 5V-tolerant I/O with 3.3V core, and In-System Programmable (ISP) via JTAG. The XC9500XL family uses 5V tolerant I/O on a 3.3V core for mixed-voltage board designs. The device is specified over the commercial 0C to +70C ambient range (C suffix), with an industrial -40C to +85C option available as XC9572XL-10VQG64I. Architecturally, each Function Block contains 18 macrocells, 54 product terms, and a sum term allocated from a global pool, with the IEEE 1149.1 boundary-scan chain extending across all I/O pins. Per datasheet DS057, the Fast CONNECT switch matrix provides 100% connectivity to every FB output, enabling deterministic place-and-route timing. The I/O blocks support 5V tolerant inputs, 24 mA drive, slew-rate control, and per-pin user I/O standards. Typical applications include bus-interface bridging, address decoding, power-up logic sequencing, and I/O expansion in telecom line cards, industrial controllers, and embedded computing platforms. Because of its 5V tolerant I/O on a 3.3V core, the XC9572XL-10VQG64C is well suited to legacy systems that mix 5V peripherals with 3.3V ASICs. Designers also use it as an FPGA configuration PROM companion or as a power-sequencer for multi-rail designs. When designing with this part, ensure the JTAG TMS, TCK, TDI, and TDO pins are reserved and pulled appropriately, and provide a clean VCCAUX 3.3V rail because all outputs are powered from VCCIO while the core runs from VCCINT. Verify pin-compatibility across the family when migrating density, since the XC9536XL, XC9572XL, and XC95144XL share a footprint family plan across the 44-, 64-, and 100-pin VQFP/TQFP packages. This page synthesizes distributor stock and lead-time data, pin-compatible XC9500XL alternatives, and practical glue-logic design notes not found in the manufacturer datasheet alone.

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XCF02SVOG20C

XCF02SVOG20C - 2Mb Platform Flash PROM for FPGA Config | AMD/Xilinx

The AMD/Xilinx XCF02SVOG20C is a 2-Mbit in-system programmable configuration PROM designed to store configuration bitstreams for Xilinx FPGAs, housed in a 20-pin TSSOP package. It provides 2,097,152 bits of NOR Flash memory organized as 2,000K x 1, operates from a 3.0V to 3.6V supply, and supports the IEEE 1149.1 / IEEE 1532 JTAG standard for in-system programming and boundary-scan testing. The device delivers guaranteed endurance of 20,000 program/erase cycles and minimum data retention of 20 years, making it suitable for long-lifecycle industrial and embedded designs. A Platform Flash PROM is a non-volatile configuration memory IC purpose-built to hold FPGA bitstreams outside the FPGA fabric. In the broader component taxonomy it belongs to NOR Flash -> non-volatile memory -> memory IC -> integrated circuit. Unlike discrete SPI Flash or parallel boot memories, Platform Flash devices integrate the JTAG programming chain, FPGA hand-shake pins (CCLK, DONE, INIT, PROGRAM) and a cascade-ready architecture, so a single IC can boot a Xilinx Spartan or Virtex FPGA without external glue logic. Key features include 2Mb density in a compact 20-TSSOP footprint, low-power advanced CMOS NOR Flash process, cascadable bitstream expansion for larger FPGAs, and JTAG boundary-scan with 3-stage registers per bidirectional pin. The industrial temperature grade (VOG suffix = -40C to +85C) and lead-free TSSOP-20 packaging make XCF02SVOG20C a mainstream choice for cost-sensitive Spartan-3 / Spartan-3A designs. The OG20C suffix denotes a TSSOP-20 package supplied in tube. From a system-level perspective, XCF02SVOG20C connects directly to the FPGA's configuration mode pins (M[2:0] = 010 selects Master Serial mode). On power-up the PROM serial-clocks the bitstream via the FPGA CCLK pin, the FPGA drives DONE high, and the PROM tri-states its data line. The bidirectional pins are observable and controllable through the JTAG boundary-scan register, which speeds prototype debug and board-level interconnect testing. The NOR Flash cell array provides fast read access with low standby current. Typical applications include Spartan-3, Spartan-3A, Spartan-3E, and Virtex-II configuration storage, industrial control boards, factory automation equipment, medical imaging FPGA platforms, and any design that requires a small-footprint non-volatile boot source for Xilinx FPGAs. Two or more XCF02S PROMs can be cascaded to support larger bitstreams for higher-density FPGAs. When designing with XCF02SVOG20C, confirm the FPGA bitstream does not exceed 2Mb before committing the BOM. AMD PCN XCN20013 (2026) confirms there is NO direct drop-in replacement for XCF02SVOG20C; design teams are advised to forecast demand and place final orders before key dates in Appendix A of that PCN, or migrate the FPGA to a newer family that boots from internal SPI Flash. This page synthesizes distributor pricing, lifecycle risk context (XCN20013), drop-in alternative scarcity, and practical design notes not found in the manufacturer datasheet alone.

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XCF04S-VO20C

XCF04S-VO20C - 4Mb FPGA Configuration PROM, 20-TSSOP | AMD/Xilinx

The AMD/Xilinx XCF04S-VO20C is a 4-megabit in-system programmable Platform Flash configuration PROM designed to store configuration bitstreams for Xilinx FPGAs, packaged in a 20-pin thin shrink small outline package (TSSOP) and supplied in a tube. It operates from a 3.0 V to 3.6 V single supply, uses serial SPI-like configuration interface logic, and is rated for commercial-grade environments, making it a drop-in configuration memory solution for legacy AMD/Xilinx FPGA designs. An FPGA configuration PROM is a non-volatile flash memory device that holds the FPGA's bitstream and loads it into the FPGA's internal configuration logic at power-up. In the broader component taxonomy, the XCF04S-VO20C sits in the hierarchy: configuration memory -> PROM -> non-volatile memory -> memory IC -> semiconductor. The Platform Flash family is purpose-built for AMD/Xilinx Spartan, Virtex, and CoolRunner device chains, replacing older one-time-programmable PROMs to lower board cost and shorten programming cycles via in-system programmability through JTAG or slave-serial modes. Key features include 4 Mb of flash storage, an industrial-standard 4-pin SPI/I2C-like configuration interface, in-system programmability (ISP) via JTAG, and support for daisy-chain configuration across multiple FPGA devices or PROMs. The 20-TSSOP footprint is the same as the larger XCF08P/XCF16P family members, offering a consistent PCB layout when migrating bitstream size. Commercial temperature-grade operation and a single 3.3 V supply simplify power design versus dual-supply PROMs. From a technical standpoint, the XCF04S-VO20C is built on a NOR-flash process with an internal oscillator, command state machine, and configuration-data serializer. When the FPGA releases its DONE pin (or equivalent configuration logic), the PROM shifts out the bitstream through the dedicated data/clock pins. The flash-based design supports thousands of reprogram cycles, eliminating the need for UV-erase windows of older EPROM PROMs and reducing manufacturing rework time. The 20-TSSOP package keeps the device footprint identical to peers in the Platform Flash family. Typical applications include Spartan-3 / Spartan-6 FPGA boot-memory links, Virtex-II/Virtex-4/Virtex-5 configuration-storage companions, industrial PLCs and embedded controller boards, and legacy industrial-camera or motor-control platforms that still ship with a separate configuration PROM. It is also commonly seen in test-and-measurement prototypes where designers prefer a dedicated PROM over in-FPGA bitstream compression methods. When designing with the XCF04S-VO20C, ensure the FPGA's mode pins are set to Master Serial mode (M[2:0] = 000) so the PROM drives CCLK, and confirm the JTAG chain order in software (iMPACT, Vivado hardware manager) to avoid in-system programming conflicts. As of 2026-10-11, this part shows active distributor stock but is flagged in the AMD/Xilinx product change-notification system as approaching end of life - check PCN status before new designs. This page consolidates distributor pricing, drop-in alternatives such as XCF04SVOG20C and XCF08P family members, and PCB-layout notes not included in the manufacturer datasheet.

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XCF04SVOG20C

XCF04SVOG20C - 4Mb Platform Flash Configuration PROM | AMD/Xilinx

The AMD/Xilinx XCF04SVOG20C is a 4-Mbit in-system programmable Platform Flash configuration PROM designed to store and load configuration bitstreams for Xilinx FPGAs such as Spartan-6, Virtex-5, and earlier Series-6/7 devices. The device integrates 4194 kbits of non-volatile flash organized as 4000k x 1 (4-Mbit density) in a 20-pin TSSOP plastic package rated for the industrial operating range. According to AMD/Xilinx product documentation, the part supports a simple serial configuration interface (slave serial mode), daisy-chained multi-device configuration, in-system programmability via JTAG (IEEE 1149.1), and built-in data decompression that lets the PROM hold up to 8 Mbits of compressed configuration data. A Platform Flash PROM is a non-volatile configuration memory IC that boots up an FPGA by clocking out its stored bitstream at power-on. The category belongs to the broader taxonomy of FPGA configuration memories -> serial flash for FPGAs -> non-volatile boot memory -> programmable logic support ICs. Unlike generic SPI flash, Platform Flash PROMs are designed with FPGA-specific control signals (CCLK, DONE, INIT, PROGRAM) and timing compatible with Xilinx slave-serial and SelectMAP-mapped configuration protocols, which simplifies board design and removes the need to bind an MCU to load the bitstream. Key features include a low-power advanced CMOS FLASH process, IEEE 1149.1 JTAG boundary-scan and in-system programming, configurable slave serial or daisy-chain configuration modes, an internal oscillator that drives the master CCLK output, design version storage for multi-bitstream systems, and a read-protect security fuse. The PROM is specified for 3.3V core and I/O operation and is rated for an operating temperature range appropriate to industrial environments. Architecturally, the XCF04SVOG20C combines a 4-Mbit flash array with a configuration controller state machine that handles FPGA handshaking. Endurance is rated by the manufacturer at thousands of program/erase cycles, and data retention is specified in years for industrial-grade operation. The single-pin-per-bit data path makes the device pin-compatible within the Platform Flash PROM family across densities of 1 Mbit, 4 Mbit, 8 Mbit, 16 Mbit, and 32 Mbit. Typical applications include Spartan-6 and Virtex-5 FPGA configuration, FPGA-based industrial controllers that boot from non-volatile memory, test-and-measurement loaders, and any Xilinx FPGA system that requires field-updatable configuration or daisy-chained multi-FPGA configuration. Designers also use Platform Flash PROMs in safety-critical systems because the PROM's configuration validity is verified by the FPGA's CRC logic at every boot. Design consideration: when migrating an XCF04S design to a newer Xilinx configuration solution, verify the master/slave mode and DONE polarity on the PCB. Also note that the XCF04SVOG20C has been transitioned out of production by AMD/Xilinx (see lifecycle status); users with long-lived programs should plan around the suggested active alternatives listed below. This page consolidates distributor pricing, lifecycle status, drop-in alternatives, and design notes for engineers migrating off the XCF04SVOG20C, with information that goes beyond the manufacturer datasheet.

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XCF16PVO48C0973

XCF16PVO48C0973 - 16Mb FPGA Configuration PROM | AMD Xilinx

The AMD Xilinx XCF16PVO48C0973 is a 16-Mbit In-System Programmable Configuration PROM designed to store and stream configuration bitstreams to Xilinx FPGA families. Housed in a 48-pin TSOP (TFSOP) package, it provides a serial configuration interface optimized for Spartan, Virtex, and CoolRunner device chains. With an operating supply range of 1.65V to 2.0V and industrial-grade -40C to +85C temperature support, the part is suitable for commercial, industrial, and ruggedized embedded systems. A configuration PROM is a non-volatile serial memory that holds the FPGA bitstream and presents it to the FPGA at power-up, after reset, or on demand through JTAG/Serial-mode commands. Compared to parallel flash, configuration PROMs deliver a smaller footprint, simpler interface timing, and proven Xilinx ecosystem compatibility - making them a reference solution for legacy and current Spartan-3, Virtex-4/5, and CoolRunner-II designs that still rely on dedicated boot storage. Key features of the XCF16PVO48C0973 include 16-Mbit (16Mx1 serial organization) density, in-system programmability through the JTAG/standard Xilinx PROM programming interface, low standby current typical of serial PROMs, and a 48-TSOP package with a 0.724 inch (18.40 mm) body width. The part supports master-serial configuration modes and provides CRC-based bitstream integrity checking during FPGA load. From an architecture perspective, the device uses a serial-NOR-style command set with opcode-driven read operations, and integrates Xilinx-specific configuration flow states (e.g., 8-bit address counters, bitstream framing) that allow the FPGA to load its image directly without an external microcontroller. This eliminates boot firmware complexity in most FPGA designs. Typical applications include Spartan-3/3E/6 FPGA boot storage, Virtex-4/5 configuration backup, industrial controller FPGA subsystems, military/aerospace rad-tolerant FPGA designs (when paired with rad-hard FPGAs), and remote field-upgradeable embedded systems that need reliable in-system re-programmability over the JTAG port. When designing with this PROM, verify the FPGA-to-PROM pin mapping against the target FPGA's Master Serial configuration mode table, ensure the 1.8V rail meets PROM inrush current during read bursts, and place a 0.1 uF + bulk capacitor pair within 5 mm of the VCC pins to maintain clean read-clock edges. This page synthesizes current distributor pricing, in-system programming guidance, and pin-compatible alternatives across the Xilinx XCF family - content not aggregated on individual distributor listings.

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XCF16PVOG48C

XCF16PVOG48C - 16Mb FPGA Configuration PROM | AMD Xilinx | 48-TSOP

The AMD Xilinx XCF16PVOG48C is a 16-Mbit in-system programmable configuration PROM from the Platform Flash series, supplied in a 48-pin TSOP (VOG48) package and optimized for storing Xilinx FPGA configuration bit streams at 1.8V VCCINT. According to AMD/Xilinx documentation, this serial flash device is engineered for high-density FPGA bitstream storage with JTAG-based in-system programming and supports industrial temperature operation from -40C to +85C. As part of the XCFxxP family, it pairs directly with 1.8V-core Spartan-3AN, Virtex-5, and other contemporary Xilinx FPGA families for master-serial or slave-serial boot. An FPGA configuration PROM is a non-volatile memory that holds the FPGA's bitstream image so the device can self-config at power-up without an external microcontroller. The Platform Flash family sits in the hierarchy: PROM -> non-volatile memory -> configuration storage -> FPGA boot subsystem. Modern AMD/Xilinx FPGAs often embed multi-Mbit configuration storage directly on silicon, but external Platform Flash PROMs remain widely used for multi-boot images, remote field updates, and security applications where bitstream confidentiality is enforced outside the FPGA die. Key features include 16-Mbit density (twice the capacity of the XCF08P), 48-TSOP surface-mount package (0.724 inch / 18.40 mm body width), 1.65V to 2V VCCINT supply (1.8V nominal), industrial -40C to +85C operating range, JTAG IEEE 1149.1 boundary-scan and in-system programmability, and a serial configuration interface compatible with the Xilinx FPGA serial configuration bus (CCLK, DIN, DOUT, INIT, DONE). These traits allow the XCF16PVOG48C to replace the XCF08PVOG48C directly while doubling bitstream capacity for larger FPGA families or compressed bitstream storage. The device uses a serial NOR-style architecture with command-driven read/write/erase operations, organized as 16-Mbit of main memory plus a small status register for programming state. Programming and erase are managed by an internal state machine triggered over JTAG; verification uses the standard Xilinx iMPACT/iCE tools. The architecture deliberately keeps the serial interface simple so the FPGA's existing configuration controller can stream the bitstream without glue logic. Typical applications include Spartan-3AN FPGA configuration, Virtex-5 LX/SX/TX configuration, multi-boot FPGA designs, industrial control systems requiring remote in-field firmware updates, secure bitstream storage for defense and aerospace designs, and prototyping platforms where the configuration source must be field-reprogrammable without removing the FPGA from the board. When designing with this device, ensure the JTAG chain includes the PROM between TDI and TDO and that the FPGA's mode pins (M0/M1/M2) select the correct serial configuration mode. The 1.8V VCCINT must be supplied before the FPGA begins configuration; sequence accordingly to avoid partial bitstream corruption. This page synthesizes distributor pricing, drop-in Platform Flash alternatives, and design notes on JTAG chain ordering not found in a single manufacturer document.

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XCF32PVOG48C

XCF32PVOG48C - 32Mb FPGA Config PROM 1.8V 48-TSOP | AMD

The AMD XCF32PVOG48C is a 32-Megabit in-system programmable configuration PROM for Xilinx FPGAs, supplied in a 48-pin TSOP package and operating from a 1.65 V to 2.0 V VCC supply. It is part of the Platform Flash PROM family and stores large FPGA configuration bitstreams that are loaded into Xilinx/AMD FPGAs at power-up. The XCF32PVOG48C variant specifically uses the 1.8 V Platform Flash XL family and is offered in a commercial operating temperature grade. A Platform Flash configuration PROM is a non-volatile NOR Flash memory device whose primary role is to hold the FPGA bitstream and present it to the target FPGA over a serial or parallel configuration interface. In the broader memory hierarchy it sits under EEPROM and Flash PROM, and above raw NOR Flash, providing a pre-validated, FPGA-aware configuration storage medium. It relieves the system designer of placing a separate boot Flash on the board and is typically the first device in the FPGA configuration chain. Key electrical features include a 32 Mbit (4 Mbyte) organized as 1-bit-wide serial/parallel PROM, a 1.65 V to 2.0 V operating voltage range with 3.3 V tolerant I/O pins, low-power advanced CMOS Flash technology, an in-system programmable JTAG/IEEE 1149.1 interface, and cascade support for storing larger bitstreams. The 48-pin TSOP provides a compact, surface-mount footprint compatible with standard PCB assembly lines. Architecturally, the device uses a NOR Flash core tied to a serial/parallel configuration controller, with dedicated CCLK, DIN/DOUT, and CF pins mapping directly to the FPGA configuration port. The 1.8 V internal core reduces power consumption versus 3.3 V PROMs, which is meaningful when the PROM is continuously powered alongside the FPGA. Typical applications include Xilinx Virtex and Spartan FPGA configuration boot storage, industrial control boards, communications infrastructure, and test/measurement platforms that require reliable field-upgradable bitstream storage. For military and aerospace designs, AMD also offers the XQF32PVOG48M variant in the same family. When designing with this part, ensure that the FPGA configuration mode (serial vs. parallel) and density match the bitstream size, and verify that the JTAG chain supports ISP programming of the PROM.

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XCKU035-1FBVA676C

XCKU035-1FBVA676C Kintex UltraScale FPGA 444K Cells | AMD

The AMD Xilinx XCKU035-1FBVA676C is a Kintex UltraScale Field Programmable Gate Array built on TSMC's 20nm process, integrating 444,343 logic cells and 19,456,000 system gates in a 676-ball FCBGA package (27 mm × 27 mm) with 312 user I/Os. It runs a -1 speed grade targeting up to 630 MHz fabric performance, with 12.5 Gb/s capable transceivers (GTH) on select Kintex UltraScale SKUs and 240 DSP48E2 slices optimized for high-throughput fixed- and floating-point arithmetic. The commercial temperature grade (suffix C) supports 0 °C to +85 °C operation with a 0.95 V core voltage. What is an FPGA? A Field Programmable Gate Array (FPGA) is a programmable logic device that lets designers implement custom digital circuits after PCB fabrication by configuring an array of configurable logic blocks (CLBs), dedicated DSP slices, block RAM, and high-speed serial transceivers. Within the broader semiconductor hierarchy, an FPGA sits between general-purpose CPUs/GPUs (fixed instruction set, software-defined) and ASICs (fixed hardware). AMD's Kintex UltraScale family occupies the mid-range position in the UltraScale portfolio, sitting below Virtex UltraScale (highest logic density and bandwidth) and above Artix UltraScale (lowest cost and power). All Xilinx boards shift the value curve toward best-in-class price/performance/watt at 20nm. Key features of the XCKU035-1FBVA676C include up to 1,250 Mbps of DDR4 external memory interface support, integrated PCIe Gen3 hard cores, 4.7 Mb of distributed RAM, 240 DSP slices, and 16 GT transceivers on -1 speed grade parts in the larger Kintex UltraScale family. The device provides 312 high-performance SelectIO pins supporting multiple I/O standards including LVDS, HSTL, SSTL, and differential memory interfaces. The device also exposes 3 MMCM and 8 PLL mixed-mode clock managers for high-frequency clock synthesis and skew management. Architecturally, the Kintex UltraScale device uses UltraScale architecture enhancements over 7-series FPGAs - including new routing interconnect, more efficient clock networks, and improved block RAM and DSP resources. The 20nm planar CMOS process allows higher integration while keeping leakage power low, and the GT(GTH) transceivers support 12.5 Gb/s line rates for backplane and chip-to-chip serial interconnect. The XCKU035-1FBVA676C serves wireless baseband processing, software defined radio, high-definition video processing pipelines, high-speed serial backplane bridging, and PCIe accelerator card designs in the 100K–500K logic-cell density class. When laying out a board with this BGA, allocate 12 power rails (VCCINT, VCCAUX, VCCO, MGTAVCC, MGTAVTT, VBATT, MGTVCCAUX, VCCADC, VCCBRAM, VCCO_HP, VCCAUX_IO, plus GT helper rails) and follow the package-specific K7-PCB decaps guidance in UG583 to control simultaneous switching noise and SSN.

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XCKU035-2FBVA676E

XCKU035-2FBVA676E - 676-pin Kintex UltraScale FPGA | AMD

The AMD (formerly Xilinx) XCKU035-2FBVA676E is a Kintex UltraScale field-programmable gate array (FPGA) IC delivering 355,474 logic cells (194,560 6-input LUTs), 19.45M total on-chip memory bits, and 312 user I/Os, fabricated in a 20 nm CMOS process and housed in a 676-ball flip-chip BGA (FCBGA-676) package. It is a logic-density mid-range device in the Kintex UltraScale family and is targeted at high-throughput DSP, 100G packet processing, and ASIC-prototyping workloads. The "-2" suffix denotes the -2 speed grade (the second-fastest bin in the family), and the "E" suffix denotes the extended (industrial) temperature screening of -40 C to +100 C. A Kintex UltraScale FPGA belongs to the broader UltraScale architecture family, which is positioned between cost-optimized Artix/Spartan devices and the highest-density Virtex UltraScale devices in the AMD product hierarchy. FPGAs (Field-Programmable Gate Arrays) are programmable logic devices containing large arrays of configurable logic blocks (CLBs), block RAM (BRAM), DSP slices, high-speed transceiver tiles (GTX/GTH), and clock-management tiles (CMTs/PLLs/MMCMs). The Kintex UltraScale tier targets price/performance-sensitive applications such as 100G optical line cards, software-defined radio, and high-end DSP prototyping. Key headline specifications include 1,700 Configurable Logic Blocks (CLBs) and 444,343 logic cells in some datasheet groupings (the modern nominal figure is 355,474), up to 19.45 Mbits of distributed + block RAM, 312 user I/Os in the FBVA676 package, and 16.3G transceivers (per UltraScale family documentation). The device integrates 20 CMT clock tiles and 240 DSP slices, providing substantial arithmetic throughput and flexible clocking. Architecturally, the Kintex UltraScale uses the UltraScale routing fabric with stacked 3D silicon interposer-style back-bias routing, supporting up to 16.3 Gb/s transceivers for chip-to-chip and backplane SERDES. The 20 nm node and monolithic die deliver higher performance-per-watt than prior 28 nm 7-series Kintex devices while maintaining PCIe Gen3 hard-IP blocks. Typical applications for the XCKU035-2FBVA676E include 100G Ethernet bridge/router line cards, software-defined radio baseband cards, ASIC prototyping with 100% RTL mapping, high-end video processing, and DSP front-end for radar/medical imaging. The wide logic/memory/transceiver budget makes it the typical "starting point" for ADC-DAC-coupled signal-processing cards. When designing with the XCKU035-2FBVA676E, ensure multi-rail decoupling per the AMD UltraScale PCB Design Guide (UG583) for power-rail sequencing. The industrial temperature screen (E) allows deployment in outdoor telecom and industrial-control applications beyond commercial grade. This page combines verified distributor pricing, drop-in alternative analysis across the Kintex UltraScale family, and practical design notes not consolidated on the AMD datasheet.

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XCKU035-2FBVA676I

XCKU035-2FBVA676I - Kintex UltraScale FPGA, 444K Logic Cells | AMD

The AMD XCKU035-2FBVA676I is a Kintex UltraScale Field Programmable Gate Array (FPGA) with 444,343 logic cells and 19,456,000 bits of block RAM, housed in a 676-ball Flip-Chip BGA package. Built on a 20nm process node and offered at a -2 (mid) speed grade, this device targets mid-range high-performance applications requiring an optimal balance of price, performance, and power efficiency. A Field Programmable Gate Array (FPGA) is a reconfigurable integrated circuit whose logic fabric, interconnect, and I/O can be programmed post-manufacture to implement arbitrary digital functions. FPGAs belong to the broader category of programmable logic devices (PLDs), which sit hierarchically under digital semiconductors and ICs. The Kintex UltraScale family from AMD (formerly Xilinx) addresses the spectrum between cost-optimized Artix and high-end Virtex devices, focusing on DSP, memory bandwidth, and transceiver integration. Key features of the XCKU035 include 312 maximum user I/Os, integrated DSP slices for high-throughput signal processing, dedicated block RAM (BRAM) for on-chip data storage, and high-speed serial transceivers suitable for chip-to-chip and backplane links. The device supports multiple configuration modes including JTAG, SPI, and BPI, enabling flexible boot strategies in production systems. The Kintex UltraScale architecture leverages a 20nm planar process with stacked-silicon interconnect (SSI) options in larger family members. The XCKU035 uses monolithic silicon, providing predictable performance and lower cost. The UltraScale architecture introduces enhanced routing, multi-die clocking, and improved DSP and BRAM utilization rates over prior 7-Series FPGAs. Typical applications of the XCKU035-2FBVA676I include high-speed data acquisition systems, software-defined radio (SDR) baseband processing, video broadcast equipment, industrial machine vision, 100G network interface cards, and aerospace telemetry. Its combination of logic density, memory bandwidth, and transceivers makes it well-suited for prototyping ASICs or low-volume production. When designing with the FBVA676 BGA, plan for high-density PCB fabrication with microvia or via-in-pad stackups, controlled-impedance traces for transceivers, and robust power distribution with high-frequency decoupling to satisfy simultaneous switching noise (SSN) requirements. This page synthesizes distributor pricing, FPGA drop-in alternatives within the same 676-BGA footprint, and practical design notes not typically presented in the manufacturer datasheet.

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XCKU040-2FFVA1156I

XCKU040-2FFVA1156I - Kintex UltraScale FPGA 520 I/O | AMD

The AMD XCKU040-2FFVA1156I is a Kintex UltraScale FPGA with 520 user I/O, 21,606,000 system logic capacity, 530,250 DSP-equivalent resource units, speed grade -2, in a 1156-ball FCBGA package rated for industrial temperatures of -40C to +100C. A Field Programmable Gate Array (FPGA) is a semiconductor device containing a fabric of configurable logic blocks (CLBs), DSP slices, block RAM, and programmable interconnect that designers configure after manufacturing. Within the power-management hierarchy of digital system ICs, an FPGA sits at the top of the programmable logic taxonomy: programmable logic device (PLD) -> FPGA -> system-on-chip FPGA. FPGAs are used where custom logic, parallelism, or post-deployment reconfigurability is required that fixed-function ASICs or microcontrollers cannot provide. Key features of the XCKU040-2FFVA1156I include the 20nm UltraScale architecture, which lowers total power consumption versus the previous 28nm 7-series generation, a -2 speed grade for high-performance designs, and an industrial (I-suffix) temperature rating of -40C to +100C. The 1156-ball flip-chip BGA provides 520 user I/O for high-bandwidth parallel interfaces, and the fabric includes MMCM and PLL clock management resources. On the technical side, the Kintex UltraScale family focuses on price/performance using monolithic 20nm die. The device core supply operates from 0.922V to 0.979V per the datasheet listing. The UltraScale architecture adds enhanced routing, higher DSP throughput, and improved clocking compared to Kintex-7, making the XCKU040 a popular mid-density choice between the XCKU035 and XCKU060. Typical applications include industrial image processing and machine vision, wireless baseband and RF front-end processing, medical ultrasound, and ASIC prototyping. The 520 I/O count suits multi-camera sensor aggregation and high-width data converters. Design consideration: FCBGA-1156 devices require careful PCB stackup design - escape routing under the 1.0mm ball pitch typically needs via-in-pad or at least 8 layers, and core voltage rails must meet the tight 0.922-0.979V tolerance. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.

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XCKU3P-1FFVB676E

XCKU3P-1FFVB676E - Kintex UltraScale+ FPGA | 355K LC | AMD

The AMD Xilinx XCKU3P-1FFVB676E is a Kintex UltraScale+ field-programmable gate array (FPGA) offering 355,950 logic cells, 31,641,600 bits of block RAM, and 1,560 DSP slices, housed in a 676-ball FCBGA package (FFVB676) at the -1 speed grade and the E (extended) temperature tier. It integrates 280 user I/O pins and 24 transceivers supporting up to 16.375 Gbps, making it the mid-density workhorse of the Kintex UltraScale+ family. Kintex UltraScale+ FPGAs occupy a specific tier in AMD's programmable-logic taxonomy: below Virtex UltraScale+ for highest performance and above Artix-7/Artix UltraScale+ for cost-optimized applications. Architecturally, the UltraScale+ generation introduces a register-rich silicon fabric, 3rd-generation SSI (stacked silicon interconnect) techniques, and tightly coupled DSP/BRAM columns, delivering up to 2x the performance-per-watt versus the prior generation for DSP-intensive workloads such as 5G baseband, machine-learning inference, and high-speed instrumentation. Key features of the XCKU3P include 16.375 Gbps GTH transceivers (24 channels), 6.6 Tbps serial bandwidth per device, integrated 100G Ethernet MACs, and a system-monitoring block that tracks on-die voltage and temperature. The device supports DDR4-2400 with on-chip ECC and offers hardware-rooted security via bitstream encryption and authentication using AES-256 and RSA-2048. The 676-ball FCBGA package has a body size of 27 mm × 27 mm with a 1.0 mm ball pitch, suitable for high-density PCB designs using standard BGA assembly. Typical applications span high-performance digital signal processing, 100G Ethernet network interface cards, 4K/8K video processing pipelines, test and measurement instrumentation, software-defined radio (SDR), and radar/EW front-end processing. The combination of high-speed transceivers and abundant DSP resources makes it a strong fit for low-latency, line-rate processing in both wired and wireless infrastructure. When designing with the XCKU3P-1FFVB676E, allocate at least eight PCB layers with continuous GND planes and matched-length pairs for transceivers; the package's 1.0 mm pitch requires HDI stack-ups (microvias). The extended (E) temperature grade supports -40 °C to +100 °C junction, and designers must respect the 2.0 W/cm² package thermal envelope with adequate airflow or heatsinking for sustained workloads. Vivado Design Suite is required for implementation.

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XCKU5P-2FFVB676I

XCKU5P-2FFVB676I - Kintex UltraScale+ FPGA 474K LC | AMD

The AMD XCKU5P-2FFVB676I is a Kintex UltraScale+ Field Programmable Gate Array (FPGA) with 474,600 logic cells, 280 user I/Os, and 41,984,000 bits of block RAM, housed in a 676-ball FCBGA (FFVB676) package rated for the industrial temperature range. An FPGA is an integrated circuit that designers configure after manufacturing - hence field-programmable. FPGAs sit within the programmable logic device (PLD) family alongside CPLDs and form the heart of modern adaptive computing systems, providing arrays of programmable logic blocks, routing fabric, and I/O banks that enable highly parallel hardware acceleration. They are frequently used where ASIC cost or inflexibility cannot be justified. Key features of the XCKU5P include support for 725 MHz internal clocking, MMCM and PLL clock-management tiles, and core operation from 825 mV to 876 mV. The -2 speed grade balances maximum fabric performance against dynamic power, and the industrial rating (-40C to +100C junction) suits harsh deployments. Technically, the Kintex UltraScale+ family is built on a 16nm FinFET process delivering approximately 1.5x better performance-per-watt than the previous 20nm UltraScale generation. The device integrates high-speed serial transceivers, PCIe Gen3/4 hard blocks, and 100G Ethernet MAC capability, supporting high-bandwidth connectivity and partial reconfiguration for dynamic logic updates without system power-down. Typical applications include wired and wireless communications infrastructure, data center acceleration, video and image processing, and aerospace and defense systems where logic density plus low power are decisive. Designers should pay careful attention to power integrity: the 0.85 V typical core rail demands a clean, low-noise supply with dedicated power planes and extensive decoupling, and thermal dissipation under high utilization must be budgeted via the FCBGA thermal path. This page synthesizes distributor pricing, verified drop-in same-family alternatives, and practical design guidance not found in the manufacturer datasheet alone.

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XCVU9P-2FLGA2104I

XCVU9P-2FLGA2104I - Virtex UltraScale+ FPGA | AMD/Xilinx

The AMD XCVU9P-2FLGA2104I is a Virtex UltraScale+ FPGA delivering 416 user I/O, 3,911,680 Kb of block RAM capacity and 2,586,150 CLB flip-flops in a 2104-ball FCBGA (FLGA2104) package, with the -2I industrial speed grade rated for -40C to +100C operation. It targets high-performance digital designs that need massive parallel processing, on-chip memory, and high-speed serial connectivity. A Field Programmable Gate Array (FPGA) is a reconfigurable integrated circuit whose logic fabric, memory, and interconnect are programmed after manufacturing. Within the semiconductor hierarchy, FPGAs sit alongside ASICs and ASSPs as core system logic devices, and the Virtex UltraScale+ family is AMD Xilinx's flagship programmable logic line for leading-edge compute, networking, and aerospace systems. Key features include the 16nm FinFET UltraScale+ fabric, the -2 speed grade optimized for high clock frequencies, and 416 package I/O for wide external buses. The device's block RAM and UltraRAM resources (up to 270 Mb UltraRAM cited in application literature) support deep buffering for packet processing and machine learning pipelines. Architecturally, the Virtex UltraScale+ family combines CLB logic, DSP48E2 slices, block RAM, UltraRAM, and GTY multi-gigabit transceivers (52 package GTY channels cited for this device) on a single die, enabling deterministic, low-latency implementations such as hardware trading paths and 5G fronthaul. The 2104-ball FCBGA packaging provides the power and signal integrity required at these data rates. Typical applications include 5G wireless baseband, data center acceleration, AI inference, and low-latency financial trading, all of which exploit the fabric's parallelism and transceiver bandwidth. Industrial and aerospace systems also use the -I industrial temperature variant for extended thermal environments. Design consideration: plan power distribution and decoupling for the multiple VCCINT/VCCO rails early, and use AMD Xilinx Vivado for synthesis and implementation - the -2I speed grade files are required for correct timing closure. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.

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XCZU11EG-2FFVF1517I

XCZU11EG-2FFVF1517I - Zynq UltraScale+ MPSoC EG | AMD

The AMD XCZU11EG-2FFVF1517I is a Zynq® UltraScale+™ MPSoC EG device integrating a Quad ARM® Cortex®-A53 MPCore™ processor system with a Dual ARM® Cortex®-R5 real-time processor, an ARM Mali™-400 MP2 graphics processing unit, and a large programmable FPGA fabric in a 1517-ball FCBGA (40x40 mm) package. The -2 speed grade and industrial temperature grade (I) make it suitable for high-performance embedded applications requiring both hardware flexibility and software agility. A System-on-Chip FPGA (SoC FPGA) combines a hard processor subsystem (PS) with programmable logic (PL) on a single die. This architecture enables designers to implement custom hardware accelerators, high-speed I/O interfaces, and real-time control functions in the PL while running an operating system such as Linux or VxWorks on the ARM cores in the PS. The Zynq UltraScale+ family sits at the high end of this hierarchy, offering advanced DSP engines, high-bandwidth DDR memory interfaces, and multi-gigabit transceivers that go beyond conventional FPGA or microcontroller solutions. Key features of XCZU11EG-2FFVF1517I include 653,100 programmable logic cells, 597,120 FPGA registers, and 22,124,954 bits of block RAM. The PS supports a 1.3 GHz maximum ARM Cortex-A53 clock, a 600 MHz Cortex-R5 clock, and a 533 MHz Mali-400 MP2 clock. Connectivity interfaces include CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, allowing direct interface to a wide range of peripheral devices and system networks. The MPSoC is built on TSMC 16nm FinFET technology, enabling high logic density with manageable power dissipation. The -2 speed grade provides balanced timing performance for the programmable fabric, while the industrial temperature grade supports operation in demanding -40°C to +100°C environments. The 1517-ball FCBGA package with 40x40 mm body and 0.8 mm ball pitch enables high-density PCB routing for complex multi-rail power and high-speed serial links. Typical applications include edge AI inference at industrial sites, 5G/4G baseband processing, radar and electronic warfare systems, broadcast and professional AV equipment, medical imaging, and data center SmartNICs. Designers should note that the device requires multiple power rails (VCCINT, VCCAUX, VCCBRAM, VCCO, PS rails) and careful sequencing; the recommended power-up sequence can be found in PG201 (Zynq UltraScale+ PCB Design). Adequate decoupling capacitors and a solid power delivery network are critical to achieving reliable high-speed operation. When designing with this MPSoC, ensure that the boot mode pins are correctly configured for the desired QSPI, SD, or JTAG boot source. The PS can offload complex control tasks, while the PL implements latency-sensitive data path acceleration. Thermal management must consider both the PS and PL power consumption, and a heatsink or airflow is recommended for sustained high utilization.

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XCZU11EG-3FFVF1517E

XCZU11EG-3FFVF1517E - Zynq UltraScale+ MPSoC EG | AMD

The AMD XCZU11EG-3FFVF1517E is a Zynq UltraScale+ MPSoC EG device, integrating a quad-core ARM Cortex-A53 application processor, dual-core ARM Cortex-R5 real-time processor, and ARM Mali-400 MP2 graphics processing unit with UltraScale+ programmable logic. This System-on-Chip (SoC) is housed in a 1517-pin FCBGA package (40x40 mm) and supports 464 user I/O pins. The device operates with a maximum logic cell count of 653K+ and features processor speeds of 600 MHz (Cortex-R5), 667 MHz (Mali-400), and 1.5 GHz (Cortex-A53). A Zynq UltraScale+ MPSoC is a heterogeneous computing platform that combines a multi-core ARM processing system (PS) with programmable logic (PL) fabric on a single die. This architecture enables designers to implement complex algorithms in hardware for high throughput while maintaining software flexibility for control and interface tasks. The EG variant targets embedded applications requiring a balance of compute performance and programmable logic density. Key features include the 653K+ logic cells, 464 I/O pins, and the high-performance 1.5 GHz Cortex-A53 cluster. The device supports a wide range of high-speed serial transceivers and memory interfaces, making it suitable for data-intensive applications. The -3 speed grade indicates the highest performance tier for this package, enabling maximum clock frequencies and throughput. The XCZU11EG-3FFVF1517E leverages TSMC's 16nm FinFET process technology, providing excellent power efficiency and performance. The UltraScale+ architecture includes advanced clocking resources, DSP slices, and block RAM, enabling efficient implementation of signal processing and AI inference workloads. The integrated ARM cores handle operating systems and application software, while the PL accelerates custom logic. Typical applications include software-defined radio, medical imaging, aerospace and defense systems, and high-end industrial automation. The device's combination of processing power and programmable logic makes it ideal for edge computing platforms that require real-time processing and flexible I/O. The 1517-FCBGA package supports dense PCB routing and high-speed signal integrity. When designing with this device, careful attention must be paid to power supply sequencing and decoupling. The multiple power rails (VCCINT, VCCAUX, VCCO, and PS rails) require proper filtering and sequencing to ensure reliable operation. The device also requires a configuration source, such as QSPI flash or SD card, for booting the processing system.

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XCZU15EG-1FFVB1156E

XCZU15EG-1FFVB1156E - Zynq UltraScale+ MPSoC EG | AMD

The AMD XCZU15EG-1FFVB1156E is a Zynq UltraScale+ MPSoC EG family device, integrating a quad-core ARM Cortex-A53 application processor, dual-core ARM Cortex-R5 real-time processor, and ARM Mali-400 MP2 graphics processing unit with programmable logic. This System-on-Chip (SoC) combines the flexibility of an FPGA with the performance of a multi-core processor, targeting high-end embedded applications. A Zynq UltraScale+ MPSoC is a heterogeneous computing platform that merges a processing system (PS) with programmable logic (PL) on a single die. The PS runs operating systems like Linux or bare-metal applications, while the PL implements custom hardware accelerators, high-speed I/O, and custom peripherals. This architecture enables designers to optimize performance, power, and cost by partitioning tasks between software and hardware. Key features include 747K+ logic cells, 328 user I/O pins, and a 1156-FCBGA (35x35 mm) package. The device operates with a nominal core voltage of 0.85V (range 0.825V to 0.876V) and supports clock speeds of 500MHz (Cortex-R5), 600MHz (Cortex-A53), and 1.2GHz (Mali-400). The '1' speed grade indicates standard performance, while the 'E' suffix denotes an extended temperature range of 0°C to +100°C. The XCZU15EG-1FFVB1156E is built on TSMC's 20nm technology, offering a balance of logic density, power efficiency, and performance. The device includes 256KB of on-chip RAM, a rich set of peripherals, and high-speed transceivers for connectivity. Its architecture supports hardware acceleration, real-time control, and advanced graphics, making it suitable for compute-intensive tasks. Typical applications include software-defined radio, medical imaging, aerospace and defense systems, and industrial automation. The combination of ARM cores and FPGA fabric allows for flexible, high-performance designs that can adapt to evolving requirements. When designing with this device, careful attention must be paid to power supply decoupling and thermal management. The 1156-FCBGA package requires a multi-layer PCB with dedicated power and ground planes. The device's power sequencing requirements must be followed to ensure reliable operation.

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XCZU15EG-2FFVB1156I

XCZU15EG-2FFVB1156I - Zynq UltraScale+ MPSoC EG | AMD

The AMD XCZU15EG-2FFVB1156I is a Zynq UltraScale+ MPSoC EG device that integrates a quad-core ARM Cortex-A53 application processor, a dual-core ARM Cortex-R5 real-time processor, and an ARM Mali-400 MP2 graphics processing unit with a 16nm FinFET+ programmable logic fabric. This System-on-Chip (SoC) is housed in a 1156-ball FCBGA package measuring 35x35 mm, offering 747K+ logic cells and supporting processor speeds of 533 MHz (Cortex-A53), 600 MHz (Cortex-R5), and 1.3 GHz (Mali-400 MP2). A Zynq UltraScale+ MPSoC is a heterogeneous computing platform that combines multi-core ARM processors with FPGA fabric on a single die, enabling software-defined hardware acceleration. This device family sits within the broader hierarchy of adaptive SoCs, which bridge the gap between traditional microprocessors and reconfigurable logic. The EG variant specifically targets embedded applications requiring a balance of processing performance and programmable logic density. Key features of the XCZU15EG-2FFVB1156I include 747K+ logic cells, 32 Mb of block RAM, and 1,152 DSP slices for high-throughput signal processing. The device supports DDR4, LPDDR4, and 32-bit/64-bit memory interfaces, along with high-speed transceivers for serial connectivity. The -2 speed grade provides a balance between performance and power consumption, making it suitable for mid-range embedded systems. Architecturally, the device leverages AMD's UltraScale+ architecture with 16nm FinFET+ technology, delivering up to 1.5x performance-per-watt improvement over previous generations. The integrated ARM processors run a full operating system like Linux, while the programmable logic handles real-time, low-latency tasks. This heterogeneous approach enables system designers to partition workloads optimally between software and hardware. Typical applications include software-defined radio, medical imaging, industrial automation, and aerospace/defense systems. The device's combination of high-speed serial transceivers, DSP resources, and multi-core processing makes it ideal for edge computing platforms that require both flexibility and performance. When designing with this device, careful attention must be paid to power supply sequencing and thermal management. The 1156-ball FCBGA package requires a multi-layer PCB with dedicated power and ground planes to ensure signal integrity and heat dissipation.

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XCZU19EG-1FFVC1760E

XCZU19EG-1FFVC1760E - Zynq UltraScale+ MPSoC EG | AMD

The AMD XCZU19EG-1FFVC1760E is a Zynq UltraScale+ MPSoC EG family device, integrating a quad-core ARM Cortex-A53 application processor, dual-core ARM Cortex-R5 real-time processor, and ARM Mali-400 MP2 graphics processing unit with UltraScale+ programmable logic. It is housed in a 1760-FCBGA package (42.5x42.5 mm) and operates over a 0°C to 100°C junction temperature range. A System-on-Chip (SoC) FPGA combines a hard processor system (PS) with programmable logic (PL) on a single die, enabling software-defined functionality with hardware acceleration. The Zynq UltraScale+ MPSoC family extends this concept with heterogeneous processing, supporting asymmetric multiprocessing and real-time control alongside FPGA fabric. Key features include 1143K+ logic cells, 500MHz/600MHz/1.2GHz processor clock speeds, and a 1760-ball FCBGA package. The EG variant provides extensive DSP and block RAM resources for compute-intensive applications. The device supports high-speed transceivers, PCIe, and DDR4 memory interfaces. Architecturally, the device uses TSMC 16nm FinFET process technology, balancing performance with power efficiency. The programmable logic is based on the UltraScale+ architecture, featuring configurable logic blocks, DSP48E2 slices, and UltraRAM. The PS subsystem includes memory controllers, peripheral interfaces, and security features. Typical applications include aerospace and defense signal processing, automotive driver assistance systems, industrial automation, and data center acceleration. The combination of ARM processing and FPGA fabric makes it suitable for edge computing and real-time control. When designing with this device, consider power sequencing requirements and thermal management. The 1760-FCBGA package requires careful PCB layout for signal integrity and power delivery. Refer to the AMD Zynq UltraScale+ MPSoC datasheet for detailed design guidelines.

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XCZU19EG-2FFVB1517I

XCZU19EG-2FFVB1517I - Zynq UltraScale+ MPSoC | AMD

The AMD XCZU19EG-2FFVB1517I is a Zynq UltraScale+ MPSoC EG system-on-chip (SoC) in a 1517-FCBGA (40x40 mm) package. It integrates quad ARM Cortex-A53 MPCore with CoreSight, dual ARM Cortex-R5 with CoreSight, an ARM Mali-400 MP2 graphics processor, and 1,143K+ FPGA logic cells. Its processing subsystem supports clock frequencies of 533 MHz, 600 MHz, and 1.3 GHz, enabling compute-intensive embedded applications in a single device. An MPSoC is a multi-processor system-on-chip that combines a processor system (PS) with programmable logic (PL) fabric, allowing designers to integrate software-based control and hardware-accelerated datapaths on one die. Within the programmable-logic hierarchy, the Zynq UltraScale+ MPSoC sits above traditional FPGAs by adding hardened ARM cores, memory controllers, and high-speed transceivers. This class of device is commonly used in 5G wireless, aerospace, defense, medical imaging, and data center acceleration. Key features of the XCZU19EG-2FFVB1517I include high logic density with 1,143K+ logic cells, a -2 speed grade for balanced performance, and industrial temperature grade (I suffix) for extended environmental operation. The 1517-FCBGA package exposes 16 accessible GTH transceivers; the device contains 72 total transceivers, but the D1760 package is required to access all GTY channels. The quad A53 cluster can run Linux, while the dual R5 cores handle deterministic real-time control. From a technical depth perspective, the Zynq UltraScale+ architecture uses 16nm FinFET process technology. The programmable logic can implement complex DSP pipelines, AI inference engines, and custom protocol bridges. The hardened PS includes DDR4 memory controllers, but the exact DDR4 PHY configuration and I/O bank assignments must be verified in the AMD package pinout file. The Mali-400 MP2 GPU accelerates lightweight graphics or compute-display tasks. Typical applications include 5G/6G radio and fronthaul processing, radar and electronic warfare subsystems, medical imaging and ultrasound beamforming, industrial machine vision, SmartNIC acceleration, and multi-channel video surveillance. The combination of hardened processors and scalable logic gives designers flexibility to partition functions between software and hardware. When designing with this device, plan a proper multi-rail power sequence and a robust thermal solution. Because exact VCCINT/VCCAUX voltage levels and thermal data are not included in the verified web snippets, refer to the official AMD Zynq UltraScale+ MPSoC data sheets and package pinout files before final board design.

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XCZU19EG-2FFVC1760E

XCZU19EG-2FFVC1760E - Zynq UltraScale+ MPSoC EG | AMD

The AMD XCZU19EG-2FFVC1760E is a high-performance Zynq UltraScale+ MPSoC EG family system-on-chip (SoC) that integrates a quad-core ARM Cortex-A53 application processor, a dual-core ARM Cortex-R5 real-time processor, and an ARM Mali-400 MP2 graphics processing unit with a large programmable logic (FPGA) fabric. This device is housed in a 1760-ball FCBGA package measuring 42.5x42.5 mm and is designed for demanding embedded applications requiring both high-level operating system support and real-time, low-latency processing. A Zynq UltraScale+ MPSoC is a heterogeneous multi-processor system-on-chip that combines a processing system (PS) with programmable logic (PL) on a single die. The PS typically includes application processors (Cortex-A53), real-time processors (Cortex-R5), and a graphics processor (Mali-400), while the PL is an FPGA fabric that can be configured to implement custom hardware accelerators, high-speed I/O interfaces, and complex digital logic. This architecture allows designers to optimize their systems by partitioning tasks between software running on the processors and hardware implemented in the FPGA. Key features of the XCZU19EG-2FFVC1760E include 1,143K+ logic cells in the programmable logic, providing substantial capacity for complex digital designs. The processing system operates at speeds of 533 MHz for the real-time processors, 600 MHz for the graphics processor, and 1.3 GHz for the application processors. The device supports 512 user I/O pins, enabling high-bandwidth connectivity to external memory, peripherals, and high-speed transceivers. From a technical perspective, the XCZU19EG-2FFVC1760E leverages AMD's UltraScale+ architecture, which is built on a 16nm FinFET process. This advanced process technology enables high performance and low power consumption compared to previous generations. The device includes a comprehensive set of hard intellectual property (IP) blocks, such as PCIe, USB, DisplayPort, and Gigabit Ethernet, which offload these functions from the programmable logic, freeing up resources for custom logic. Typical applications for the XCZU19EG-2FFVC1760E include high-end embedded computing, software-defined radio, medical imaging, aerospace and defense systems, and data center acceleration. Its combination of powerful processors and large FPGA fabric makes it suitable for applications that require both complex software algorithms and high-throughput, low-latency hardware processing. When designing with this device, careful attention must be paid to power supply sequencing, thermal management, and high-speed PCB layout. The device requires multiple power rails with specific voltage levels and sequencing requirements. Adequate decoupling and a robust power delivery network are essential for reliable operation at high clock speeds.

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XCZU1CG-2SFVA625E

XCZU1CG-2SFVA625E - Zynq UltraScale+ SoC FPGA | AMD

The AMD XCZU1CG-2SFVA625E is a Zynq® UltraScale+™ MPSoC (Multi-Processor System-on-Chip) that integrates a dual-core ARM® Cortex®-A53 application processor and a dual-core ARM® Cortex®-R5 real-time processor with programmable logic fabric in a single 625-ball FCBGA package. This device is part of the Zynq UltraScale+ family, offering a balance of processing performance and FPGA flexibility for a wide range of embedded applications. A Zynq UltraScale+ MPSoC is a heterogeneous computing platform that combines a processing system (PS) with programmable logic (PL) on a single chip. The PS runs operating systems like Linux or bare-metal applications, while the PL implements custom hardware accelerators, high-speed I/O interfaces, and custom peripherals. This architecture enables designers to optimize performance, power, and cost by partitioning tasks between software and hardware. Key features of the XCZU1CG-2SFVA625E include a maximum clock frequency of 1.333GHz for the Cortex-A53 cores and 533MHz for the Cortex-R5 cores, providing substantial processing power for demanding applications. The device is housed in a 625-FCBGA package with a 21x21mm footprint, offering a compact solution for space-constrained designs. The -2 speed grade indicates a mid-range performance level, balancing speed and power consumption. The XCZU1CG-2SFVA625E is built on TSMC's 16nm FinFET process technology, enabling high performance with low power consumption. The programmable logic fabric provides a rich set of resources including configurable logic blocks, block RAM, DSP slices, and high-speed transceivers, allowing for flexible hardware acceleration and custom I/O implementations. The device also includes a comprehensive set of hard IP blocks, such as PCIe, USB, and DisplayPort controllers, reducing the need for external components. Typical applications for this device include industrial automation, automotive driver assistance systems, medical imaging, and aerospace and defense systems. The combination of ARM processing and FPGA flexibility makes it ideal for applications requiring real-time processing, high-speed data acquisition, and custom I/O interfaces. When designing with this device, careful attention must be paid to power supply sequencing and decoupling. The multiple power rails require proper sequencing to ensure reliable operation, and the high-speed transceivers demand clean power and careful PCB layout to maintain signal integrity.

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XCZU28DR-1FSVE1156E

XCZU28DR-1FSVE1156E - Zynq UltraScale+ RFSoC Gen3 | AMD

The AMD XCZU28DR-1FSVE1156E is a Zynq UltraScale+ RFSoC Gen3 adaptive SoC, integrating a multi-core ARM Cortex-A53 processing system with UltraScale+ programmable logic and high-performance RF data converters in a single device. This part is specifically designed for demanding RF and wireless applications, offering a comprehensive system-on-chip solution that reduces board space and power consumption compared to discrete implementations. A Zynq UltraScale+ RFSoC is a class of adaptive SoC that combines a processing system (PS) with programmable logic (PL) and dedicated RF analog-to-digital converters (ADCs) and digital-to-analog converters (DACs). This integration eliminates the need for separate data converter ICs and high-speed digital interfaces, simplifying system design and improving signal integrity. The RFSoC family sits within the broader adaptive SoC hierarchy, which includes the Zynq-7000 and Zynq UltraScale+ families, and is positioned for applications requiring direct RF sampling. The XCZU28DR-1FSVE1156E features a powerful processing system with quad-core ARM Cortex-A53 application processors and dual-core Cortex-R5 real-time processors, providing both high-level operating system support and deterministic real-time control. The programmable logic is based on the UltraScale+ architecture, offering high-density logic, DSP slices, and block RAM. The device is packaged in a 1156-ball BGA (FSVE1156) package, which provides excellent thermal and electrical performance for high-speed signals. This RFSoC integrates eight 14-bit 5.0 GSPS ADCs and eight 14-bit 9.85 GSPS DACs, enabling direct RF sampling in the sub-6 GHz range. The RF data converters feature digital up-conversion (DUC) and digital down-conversion (DDC) blocks, supporting flexible frequency planning. The device also includes a comprehensive set of hard IP blocks, including PCIe Gen3, 100G Ethernet, and Interlaken, reducing the need for soft logic implementation. Typical applications for the XCZU28DR-1FSVE1156E include 5G NR base stations, phased array radar, electronic warfare, and test and measurement equipment. The device's high-speed data converters and processing capabilities make it ideal for software-defined radio (SDR) platforms. When designing with this device, careful attention must be paid to power supply sequencing, clocking, and thermal management to ensure reliable operation.

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الفئات الفرعية

المنتجات (35,000+)

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XCKU035-2FBVA676E - 676-pin Kintex UltraScale FPGA | AMD

XCKU035-2FBVA676I - Kintex UltraScale FPGA, 444K Logic Cells | AMD

XCKU040-2FFVA1156I - Kintex UltraScale FPGA 520 I/O | AMD

XCKU3P-1FFVB676E - Kintex UltraScale+ FPGA | 355K LC | AMD

XCKU5P-2FFVB676I - Kintex UltraScale+ FPGA 474K LC | AMD

XCVU9P-2FLGA2104I - Virtex UltraScale+ FPGA | AMD/Xilinx

XCZU11EG-2FFVF1517I - Zynq UltraScale+ MPSoC EG | AMD

XCZU11EG-3FFVF1517E - Zynq UltraScale+ MPSoC EG | AMD

XCZU15EG-1FFVB1156E - Zynq UltraScale+ MPSoC EG | AMD

XCZU15EG-2FFVB1156I - Zynq UltraScale+ MPSoC EG | AMD

XCZU19EG-1FFVC1760E - Zynq UltraScale+ MPSoC EG | AMD

XCZU19EG-2FFVB1517I - Zynq UltraScale+ MPSoC | AMD

XCZU19EG-2FFVC1760E - Zynq UltraScale+ MPSoC EG | AMD

XCZU1CG-2SFVA625E - Zynq UltraScale+ SoC FPGA | AMD

XCZU28DR-1FSVE1156E - Zynq UltraScale+ RFSoC Gen3 | AMD