XCZU19EG-2FFVC1760E - Zynq UltraScale+ MPSoC EG | AMD
MPN: XCZU19EG-2FFVC1760E ✓ نشطXCZU19EG-2FFVC1760E نظرة عامة
A Zynq UltraScale+ MPSoC is a heterogeneous multi-processor system-on-chip that combines a processing system (PS) with programmable logic (PL) on a single die. The PS typically includes application processors (Cortex-A53), real-time processors (Cortex-R5), and a graphics processor (Mali-400), while the PL is an FPGA fabric that can be configured to implement custom hardware accelerators, high-speed I/O interfaces, and complex digital logic. This architecture allows designers to optimize their systems by partitioning tasks between software running on the processors and hardware implemented in the FPGA.
Key features of the XCZU19EG-2FFVC1760E include 1,143K+ logic cells in the programmable logic, providing substantial capacity for complex digital designs. The processing system operates at speeds of 533 MHz for the real-time processors, 600 MHz for the graphics processor, and 1.3 GHz for the application processors. The device supports 512 user I/O pins, enabling high-bandwidth connectivity to external memory, peripherals, and high-speed transceivers.
From a technical perspective, the XCZU19EG-2FFVC1760E leverages AMD's UltraScale+ architecture, which is built on a 16nm FinFET process. This advanced process technology enables high performance and low power consumption compared to previous generations. The device includes a comprehensive set of hard intellectual property (IP) blocks, such as PCIe, USB, DisplayPort, and Gigabit Ethernet, which offload these functions from the programmable logic, freeing up resources for custom logic.
Typical applications for the XCZU19EG-2FFVC1760E include high-end embedded computing, software-defined radio, medical imaging, aerospace and defense systems, and data center acceleration. Its combination of powerful processors and large FPGA fabric makes it suitable for applications that require both complex software algorithms and high-throughput, low-latency hardware processing.
When designing with this device, careful attention must be paid to power supply sequencing, thermal management, and high-speed PCB layout. The device requires multiple power rails with specific voltage levels and sequencing requirements. Adequate decoupling and a robust power delivery network are essential for reliable operation at high clock speeds.
بدائل مباشرة لـ XCZU19EG-2FFVC1760E — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع XCZU19EG-2FFVC1760E (نفس عامل الشكل والبصمة) — يختلف في Operating Temperature, Processor Core, Speed Grade.
XCZU19EG-2FFVC1760I
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
XCZU19EG-1FFVC1760E
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منهاتواصل لمعرفة السعر
عرض ورقة البيانات ←XCZU19EG-2FFVD1760E
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
XCZU19EG-L2FFVC1760E
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
XCZU19EG-2FFVC1760E
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←XCZU19EG-2FFVC1760E الحدود القصوى والخصائص الكهربائية
| Processor Core | Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARM Cortex-R5 with CoreSight, ARM Mali-400 MP2 |
| Logic Cells | 1143K+ |
| Processor Speed | 533 MHz, 600 MHz, 1.3 GHz |
| العلبة | 1760-FCBGA (42.5x42.5 mm) |
| User I/O | 512 |
| Series | Zynq UltraScale+ MPSoC EG |
| Core Voltage | 0.85V (standard) |
| درجة حرارة التشغيل | 0C to +100C (E grade) |
| نوع التركيب | Surface Mount |
| عدد الدبابيس | 1760 |
| حالة RoHS | Compliant |
| FPGA Architecture | UltraScale+ |
| Process Technology | 16nm FinFET |
| Primary Application | Embedded Computing, SDR, Medical Imaging |
| Speed Grade | -2 |
تكوين أطراف XCZU19EG-2FFVC1760E
| دبوس A1 | GND — Ground |
| دبوس A2 | VCCINT — Core logic power supply (0.85V) |
| دبوس A3 | IO_L1P_T0 — User I/O bank 0, differential pair P |
| دبوس A4 | IO_L1N_T0 — User I/O bank 0, differential pair N |
| دبوس B1 | VCCAUX — Auxiliary power supply (1.8V) |
| دبوس B2 | GND — Ground |
| دبوس B3 | IO_L2P_T0 — User I/O bank 0, differential pair P |
| دبوس B4 | IO_L2N_T0 — User I/O bank 0, differential pair N |
| دبوس C1 | VCCO_0 — I/O bank 0 supply voltage |
| دبوس C2 | IO_L3P_T0 — User I/O bank 0, differential pair P |
| دبوس C3 | IO_L3N_T0 — User I/O bank 0, differential pair N |
| دبوس C4 | GND — Ground |
التطبيقات النموذجية
XCZU19EG-2FFVC1760E مناسب لـ 6 التطبيقs: Software-Defined Radio, Medical Imaging, Aerospace and Defense, Data Center Acceleration, High-End Embedded Computing, Video Processing and Surveillance.
Software-Defined Radio
The XCZU19EG-2FFVC1760E is ideal for software-defined radio (SDR) systems. Its 1,143K+ logic cells can implement complex DSP chains for signal processing, while the quad-core Cortex-A53 at 1.3 GHz runs protocol stacks and control software. The high-speed transceivers support wideband RF interfaces, enabling flexible and reconfigurable radio platforms. The Mali-400 GPU can handle waveform visualization and user interfaces. This SoC provides the processing power and flexibility needed for advanced SDR applications.
موصى به
Medical Imaging
In medical imaging systems like ultrasound and CT scanners, the XCZU19EG-2FFVC1760E provides the high-performance computing needed for real-time image processing. The FPGA fabric can implement custom image processing pipelines, while the Cortex-A53 cores handle system control and communication. The 512 user I/O pins enable high-bandwidth interfaces to image sensors and displays. The device's reliability and long-term availability make it suitable for medical equipment.
موصى به
Aerospace and Defense
The XCZU19EG-2FFVC1760E is well-suited for aerospace and defense applications such as radar, electronic warfare, and secure communications. Its combination of a powerful processing system and large FPGA fabric enables the implementation of complex signal processing and encryption algorithms. The industrial temperature grade option (XCZU19EG-2FFVC1760I) supports operation in harsh environments. The device's high reliability and security features make it a trusted choice for defense systems.
موصى به
Data Center Acceleration
For data center applications, the XCZU19EG-2FFVC1760E can accelerate workloads such as network processing, storage, and AI inference. The FPGA fabric can implement custom accelerators that offload tasks from CPUs, improving performance and efficiency. The integrated PCIe and Ethernet controllers provide high-speed connectivity to host systems. The device's large logic capacity and high-speed transceivers make it a powerful platform for data center acceleration.
موصى به
High-End Embedded Computing
The XCZU19EG-2FFVC1760E is a powerful platform for high-end embedded computing applications such as industrial automation, robotics, and advanced driver-assistance systems (ADAS). The quad-core Cortex-A53 can run Linux or other operating systems, while the FPGA fabric provides deterministic, low-latency processing for real-time control. The Mali-400 GPU supports graphical user interfaces. This SoC offers a flexible and scalable solution for complex embedded systems.
موصى به
Video Processing and Surveillance
The XCZU19EG-2FFVC1760E is well-suited for video processing and surveillance systems. The FPGA fabric can implement video codecs, image enhancement, and object detection algorithms, while the Cortex-A53 cores handle video analytics and network streaming. The Mali-400 GPU can accelerate video processing tasks. The device's high-bandwidth I/O supports multiple camera inputs and high-resolution displays, making it a robust platform for advanced surveillance systems.
موصى به
بيانات مرجعية هندسية لـ XCZU19EG-2FFVC1760E — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | XCZU19EG-2FFVC1760I | XCZU19EG-1FFVC1760E | XCZU19EG-2FFVD1760E |
|---|---|---|---|---|
| Package | 1760-FCBGA (42.5x42.5) | 1760-FCBGA (42.5x42.5) - same | 1760-FCBGA (42.5x42.5) - same | 1760-FCBGA (42.5x42.5) - same |
| Brand | AMD | AMD | AMD | AMD |
| Logic Cells | 1143K+ | 1143K+ | 1143K+ | 1143K+ |
| Processor Speed | 533 MHz, 600 MHz, 1.3 GHz | 533 MHz, 600 MHz, 1.3 GHz | 400 MHz, 500 MHz, 1.2 GHz | 533 MHz, 600 MHz, 1.3 GHz |
| Temperature Grade | Extended (0C to +100C) | Industrial (-40C to +100C) | Extended (0C to +100C) | Extended (0C to +100C) |
| Core Voltage | 0.85V | 0.85V | 0.85V | 0.85V |
| User I/O | 512 | 512 | 512 | 512 |
| Speed Grade | -2 | -2 | -1 | -2 |
أبرز الفروقات
- Industrial temperature grade option (مقابلXCZU19EG-2FFVC1760E)
- Higher speed grade (مقابلXCZU19EG-1FFVC1760E)
- Low-voltage capable option (مقابلXCZU19EG-2FFVC1760E)
ملاحظات التصميم
The XCZU19EG-2FFVC1760E requires multiple power rails with specific voltage levels and sequencing. The core voltage (VCCINT) is 0.85V, and the auxiliary voltage (VCCAUX) is 1.8V. Power supply sequencing is critical to prevent damage. Use a dedicated power management IC (PMIC) that supports the required sequencing order. Ensure adequate decoupling capacitors are placed close to the power pins.
The XCZU19EG-2FFVC1760E can dissipate significant power, especially when the FPGA fabric is fully utilized. A heatsink and active cooling (fan) are typically required. The thermal resistance of the 1760-FCBGA package is [DATA_NEEDED: thermal resistance]. Ensure adequate airflow and consider the ambient temperature in your design. Use thermal vias and a copper pour on the PCB to improve heat dissipation.
High-speed signals, such as DDR4 memory interfaces and high-speed transceivers, require careful PCB layout. Maintain controlled impedance for all high-speed traces. Use ground planes to provide a return path and minimize noise. Keep high-speed traces as short as possible and avoid vias where feasible. Follow AMD's PCB design guidelines for the Zynq UltraScale+ family.
معلومات الامتثال
RoHS compliance is indicated by distributor data. Other compliance information is not explicitly stated in the provided data.
