5CSEBA4U23I7N vs 5CSEBA6U23I7LN مقارنة
مقارنة تفصيلية جنبًا إلى جنب لـ 5CSEBA4U23I7N بواسطة Intel و 5CSEBA6U23I7LN بواسطة Intel. قارن المواصفات الرئيسية والمعلمات الكهربائية والتغليف وحالة دورة الحياة والأسعار والتوافر لتحديد أفضل مكوّن لمتطلبات تصميمك.
مقارنة المواصفات
| المعامل | 5CSEBA4U23I7N | 5CSEBA6U23I7LN |
|---|---|---|
| العلامة التجارية | Intel | Intel |
| الفئة | FPGA & CPLD | FPGA & CPLD |
| حالة دورة الحياة | نشط | نشط |
| Product Type | System on Chip (SoC) FPGA | — |
| FPGA Family | Cyclone V SE | — |
| Logic Elements | 40,000 | 110,000 |
| Processor Subsystem | Dual ARM Cortex-A9 MPCore with CoreSight | — |
| Processor Cores | 2 | Dual ARM Cortex-A9 MPCore with CoreSight |
| Operating Frequency | 800 MHz | — |
| I/O Count | 224 | — |
| جهد التغذية | 1.1 V | — |
| العلبة | 672-pin UBGA | 672-pin UBGA (UBG-672) 23x23 mm |
| Package Dimensions | 23 mm x 23 mm | — |
| Package Type | FBGA | — |
| نوع التركيب | Surface Mount | Surface Mount (BGA) |
| Cell Count | 40,000 | — |
| Process Technology | [DATA_NEEDED: process technology] | — |
| درجة حرارة التشغيل | [DATA_NEEDED: operating temperature range] | — |
| حالة RoHS | Compliant | Compliant (lead-free suffix) |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| AEC-Q100 Status | [DATA_NEEDED: AEC-Q100 qualification] | — |
| Lead-Free Status | [DATA_NEEDED: lead-free status] | — |
| Transceiver Count | [DATA_NEEDED: transceiver count] | — |
| On-Chip Memory | [DATA_NEEDED: on-chip memory capacity] | — |
| Configuration Method | [DATA_NEEDED: configuration method] | — |
| Family | — | Cyclone V SE SoC FPGA |
| Maximum CPU Clock | — | 925 MHz |
| Speed Grade | — | I7 (fast) |
| Temperature Range | — | Industrial (-40C to +100C junction) |
| Suffix L | — | Lead-free |
| Suffix N | — | Tray packaging |
| Hard Memory Blocks | — | [DATA_NEEDED: total M10K and MLAB bits] |
| DSP Blocks | — | [DATA_NEEDED: variable-precision DSP block count] |
| HPS Peripherals | — | Gigabit Ethernet, USB 2.0 OTG, CAN, SPI, I2C, UART, SD/SDIO |
| Configuration Mode | — | JTAG and Active Serial (AS) |
| Process Node | — | TSMC 28 nm low-power |
| Design Toolchain | — | Intel Quartus Prime + SoC EDS |