A3P600-2FGG144 vs A3P600-FGG144 مقارنة
مقارنة تفصيلية جنبًا إلى جنب لـ A3P600-2FGG144 بواسطة Microsemi و A3P600-FGG144 بواسطة Microchip Technology. قارن المواصفات الرئيسية والمعلمات الكهربائية والتغليف وحالة دورة الحياة والأسعار والتوافر لتحديد أفضل مكوّن لمتطلبات تصميمك.
مقارنة المواصفات
| المعامل | A3P600-2FGG144 | A3P600-FGG144 |
|---|---|---|
| العلامة التجارية | Microsemi | Microchip Technology |
| الفئة | FPGA & CPLD | FPGA & CPLD |
| حالة دورة الحياة | نشط | نشط |
| Family | ProASIC3 | ProASIC3 (Actel/Microchip) |
| Equivalent Gate Count | 600000 gates | — |
| Logic Cells (CLBs) | 13824 CLBs | 13824 CLBs |
| User I/O | 97 I/O | 97 |
| System Performance | 310 MHz | — |
| Process Technology | 130 nm CMOS | — |
| Core Voltage | 1.5 V | [DATA_NEEDED: core voltage] |
| Program Technology | Nonvolatile Flash | — |
| العلبة | 144-Ball FBGA (FGG144) | 144-FBGA / 144-LBGA (FGG144) |
| Ball Pitch | 1 mm | 1.00 mm |
| نوع التركيب | Surface Mount | Surface Mount |
| Packaging | Tray | — |
| Speed Grade | -2 | — |
| Configuration | Single-chip, Instant On, no external boot device | Instant-On, single-chip, no external boot device |
| I/O Banks | 4 (independently supplied VCCIB banks) | 4 (A3P1000/A3P600/A3P400) |
| Embedded Memory | [DATA_NEEDED: embedded RAM bits] | — |
| درجة حرارة التشغيل | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| حالة RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| System Gates | — | 600000 gates |
| Configuration Memory | — | 110592 bits |
| Technology | — | CMOS flash-based FPGA, nonvolatile |
| Maximum Frequency | — | 350 MHz (per distributor listing) |
| Speed Grade Designation | — | Standard (unmarked suffix in MPN) |
| Temperature Grade | — | Commercial (I suffix denotes industrial -40C to +100C) |