A3P600-FGG144 vs A3P600-2FGG144 مقارنة
مقارنة تفصيلية جنبًا إلى جنب لـ A3P600-FGG144 بواسطة Microchip Technology و A3P600-2FGG144 بواسطة Microsemi. قارن المواصفات الرئيسية والمعلمات الكهربائية والتغليف وحالة دورة الحياة والأسعار والتوافر لتحديد أفضل مكوّن لمتطلبات تصميمك.
مقارنة المواصفات
| المعامل | A3P600-FGG144 | A3P600-2FGG144 |
|---|---|---|
| العلامة التجارية | Microchip Technology | Microsemi |
| الفئة | FPGA & CPLD | FPGA & CPLD |
| حالة دورة الحياة | نشط | نشط |
| System Gates | 600000 gates | — |
| Logic Cells (CLBs) | 13824 CLBs | 13824 CLBs |
| User I/O | 97 | 97 I/O |
| Configuration Memory | 110592 bits | — |
| Technology | CMOS flash-based FPGA, nonvolatile | — |
| Family | ProASIC3 (Actel/Microchip) | ProASIC3 |
| العلبة | 144-FBGA / 144-LBGA (FGG144) | 144-Ball FBGA (FGG144) |
| Ball Pitch | 1.00 mm | 1 mm |
| نوع التركيب | Surface Mount | Surface Mount |
| Maximum Frequency | 350 MHz (per distributor listing) | — |
| I/O Banks | 4 (A3P1000/A3P600/A3P400) | 4 (independently supplied VCCIB banks) |
| Speed Grade Designation | Standard (unmarked suffix in MPN) | — |
| Temperature Grade | Commercial (I suffix denotes industrial -40C to +100C) | — |
| Configuration | Instant-On, single-chip, no external boot device | Single-chip, Instant On, no external boot device |
| Core Voltage | [DATA_NEEDED: core voltage] | 1.5 V |
| درجة حرارة التشغيل | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| حالة RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Equivalent Gate Count | — | 600000 gates |
| System Performance | — | 310 MHz |
| Process Technology | — | 130 nm CMOS |
| Program Technology | — | Nonvolatile Flash |
| Packaging | — | Tray |
| Speed Grade | — | -2 |
| Embedded Memory | — | [DATA_NEEDED: embedded RAM bits] |