A3P600-FGG484 vs A3P600-FGG484I مقارنة
مقارنة تفصيلية جنبًا إلى جنب لـ A3P600-FGG484 بواسطة Microchip Technology و A3P600-FGG484I بواسطة Microchip Technology. قارن المواصفات الرئيسية والمعلمات الكهربائية والتغليف وحالة دورة الحياة والأسعار والتوافر لتحديد أفضل مكوّن لمتطلبات تصميمك.
مقارنة المواصفات
| المعامل | A3P600-FGG484 | A3P600-FGG484I |
|---|---|---|
| العلامة التجارية | Microchip Technology | Microchip Technology |
| الفئة | FPGA & CPLD | FPGA & CPLD |
| حالة دورة الحياة | نشط | نشط |
| سعر الوحدة (USD) | — | $55.30 |
| Family | ProASIC3 | — |
| System Gates | 600K | 600000 |
| Maximum System Frequency | 231 MHz | — |
| Process Technology | 130 nm CMOS | 130 nm |
| Core Supply Voltage | 1.5 V | 1.5 V |
| User I/O Count | 235 | — |
| العلبة | 484-Pin FBGA (FGG484) | — |
| نوع التركيب | Surface Mount | Surface Mount |
| Configuration Memory | Flash-based (non-volatile, single chip) | — |
| Terminal Form | Ball | — |
| Package Shape | Square BGA | — |
| Temperature Grade | Commercial | — |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL level] | — |
| Operating Temperature Minimum | 0 C | — |
| Operating Temperature Maximum | [DATA_NEEDED: maximum operating temperature] | — |
| حالة RoHS | Lead Free | [DATA_NEEDED: RoHS compliance statement] |
| Number of Logic Elements (LEs) | [DATA_NEEDED: logic element count] | — |
| Embedded Memory | [DATA_NEEDED: embedded SRAM capacity] | — |
| FPGA Family | — | ProASIC3 |
| Number of User I/O | — | 235 |
| Embedded SRAM | — | 13.5 kB |
| System Performance | — | 231 MHz |
| Package Type | — | 484-FBGA |
| Operating Temperature Grade | — | Industrial (I suffix) |
| Lead-Free Finish | — | Yes (LEAD FREE per Mouser listing) |
| Configuration | — | Flash-based, non-volatile, instant on |
| Programming Interface | — | JTAG |
| REACH Status | — | [DATA_NEEDED: REACH compliance statement] |
| AEC-Q100 | — | Not applicable (FPGA) |
| Tray Packaging | — | Yes (per datasheets.com listing) |