A3P600-FGG484 vs A3P600L-FGG484I مقارنة
مقارنة تفصيلية جنبًا إلى جنب لـ A3P600-FGG484 بواسطة Microchip Technology و A3P600L-FGG484I بواسطة Microchip Technology. قارن المواصفات الرئيسية والمعلمات الكهربائية والتغليف وحالة دورة الحياة والأسعار والتوافر لتحديد أفضل مكوّن لمتطلبات تصميمك.
مقارنة المواصفات
| المعامل | A3P600-FGG484 | A3P600L-FGG484I |
|---|---|---|
| العلامة التجارية | Microchip Technology | Microchip Technology |
| الفئة | FPGA & CPLD | FPGA & CPLD |
| حالة دورة الحياة | نشط | نشط |
| Family | ProASIC3 | — |
| System Gates | 600K | — |
| Maximum System Frequency | 231 MHz | — |
| Process Technology | 130 nm CMOS | — |
| Core Supply Voltage | 1.5 V | 1.2 V to 1.5 V |
| User I/O Count | 235 | — |
| العلبة | 484-Pin FBGA (FGG484) | — |
| نوع التركيب | Surface Mount | Surface Mount |
| Configuration Memory | Flash-based (non-volatile, single chip) | — |
| Terminal Form | Ball | — |
| Package Shape | Square BGA | — |
| Temperature Grade | Commercial | — |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL level] | — |
| Operating Temperature Minimum | 0 C | — |
| Operating Temperature Maximum | [DATA_NEEDED: maximum operating temperature] | — |
| حالة RoHS | Lead Free | Compliant (Green) |
| Number of Logic Elements (LEs) | [DATA_NEEDED: logic element count] | — |
| Embedded Memory | [DATA_NEEDED: embedded SRAM capacity] | — |
| Product Series | — | ProASIC3L |
| FPGA Family | — | Flash FPGA |
| Total System Gates | — | 600000 |
| Logic Elements | — | 13824 |
| User I/Os | — | 235 |
| Maximum System Performance | — | 350 MHz |
| Technology Node | — | 130 nm CMOS |
| Package Type | — | 484-ball FBGA (PBGA484) |
| Package Dimensions | — | 23 mm x 23 mm |
| Package Height | — | 2.23 mm |
| Ball Pitch | — | 1 mm |
| نطاق درجة حرارة التشغيل | — | [DATA_NEEDED: industrial grade temperature range] |
| Configuration | — | Non-volatile flash, instant-on |
| Low Power Mode | — | Flash*Freeze |