EP1K30FC256-1 vs EP1K30FC256-1N مقارنة
مقارنة تفصيلية جنبًا إلى جنب لـ EP1K30FC256-1 بواسطة Intel و EP1K30FC256-1N بواسطة Intel. قارن المواصفات الرئيسية والمعلمات الكهربائية والتغليف وحالة دورة الحياة والأسعار والتوافر لتحديد أفضل مكوّن لمتطلبات تصميمك.
مقارنة المواصفات
| المعامل | EP1K30FC256-1 | EP1K30FC256-1N |
|---|---|---|
| العلامة التجارية | Intel | Intel |
| الفئة | FPGA & CPLD | FPGA & CPLD |
| حالة دورة الحياة | NRND | Obsolete |
| Family | ACEX-1K | ACEX-1K |
| Logic Elements | 17,280 | 1,728 |
| Typical Gates | 30,000 | 30,000 |
| Logic Cells | 1,728 | — |
| Embedded RAM Bits | 24,576 | 24,576 |
| User I/O Pins | 171 | — |
| Logic Array Blocks (LABs) | 216 | — |
| Embedded Array Blocks (EABs) | 6 | — |
| Core Voltage (VCCINT) | 2.5 V | — |
| I/O Voltage (VCCIO) | 3.3 V / 2.5 V (multi-voltage) | — |
| Operating Temperature Grade | Commercial (0C to +70C) | — |
| Speed Grade | -1 (standard, slowest in family) | -1 |
| Maximum Internal Frequency | 250 MHz (per family datasheet) | — |
| Process Technology | 2.5 V CMOS | 0.22 um SRAM CMOS |
| العلبة | 256-pin FineLine BGA (FBGA) | 256-BGA (FineLine BGA, 17x17 mm) |
| نوع التركيب | Surface Mount (BGA) | Surface Mount |
| Configuration Interface | Passive Serial / Passive Parallel / JTAG | — |
| Programming Method | SRAM-based, in-system programmable | — |
| حالة RoHS | Compliant | — |
| Maximum User I/O | — | 171 |
| Supply Voltage - Core | — | 2.5 V |
| Number of I/O Banks | — | [DATA_NEEDED: I/O banks] |
| درجة حرارة التشغيل | — | 0C to +70C (commercial) |
| Configuration Method | — | SRAM (external PROM required) |
| Programming Interface | — | JTAG (IEEE 1149.1) |
| Lead Free / RoHS | — | Lead free per Altera/Intel product declaration |
| مستوى MSL | — | [DATA_NEEDED: MSL rating] |
| Internal Max Frequency | — | up to 250 MHz (family typical) |