EP1K30FC256-3NAA vs EP1K30FC256-1N مقارنة
مقارنة تفصيلية جنبًا إلى جنب لـ EP1K30FC256-3NAA بواسطة Intel و EP1K30FC256-1N بواسطة Intel. قارن المواصفات الرئيسية والمعلمات الكهربائية والتغليف وحالة دورة الحياة والأسعار والتوافر لتحديد أفضل مكوّن لمتطلبات تصميمك.
مقارنة المواصفات
| المعامل | EP1K30FC256-3NAA | EP1K30FC256-1N |
|---|---|---|
| العلامة التجارية | Intel | Intel |
| الفئة | FPGA & CPLD | FPGA & CPLD |
| حالة دورة الحياة | Obsolete | Obsolete |
| Product Category | FPGA - Field Programmable Gate Array | — |
| Family | ACEX-1K | ACEX-1K |
| Number of Logic Elements | 1728 | — |
| Number of Gates | 30000 (30K) | — |
| Embedded RAM Bits | 24576 bits | 24,576 |
| Number of User I/Os | 171 | — |
| Maximum Internal Clock Frequency | 200 MHz | — |
| Core Supply Voltage | 2.5 V | — |
| IC Process Technology | 0.22 um | — |
| Package Type | 256-ball FBGA (FineLine BGA) | — |
| Package Form | 256-BBGA | — |
| نوع التركيب | Surface Mount | Surface Mount |
| Speed Grade | -3 (ordering code) | -1 |
| Configuration Type | SRAM-based, external configuration device required | — |
| نطاق درجة حرارة التشغيل | [DATA_NEEDED: operating temperature range] | — |
| I/O Supply Voltage | [DATA_NEEDED: VCCIO voltage options] | — |
| Power Dissipation | [DATA_NEEDED: typical power dissipation, design dependent] | — |
| Lead-Free / RoHS | [DATA_NEEDED: manufacturer PCN confirms RoHS status] | — |
| Logic Elements | — | 1,728 |
| Typical Gates | — | 30,000 |
| Maximum User I/O | — | 171 |
| Supply Voltage - Core | — | 2.5 V |
| Number of I/O Banks | — | [DATA_NEEDED: I/O banks] |
| درجة حرارة التشغيل | — | 0C to +70C (commercial) |
| العلبة | — | 256-BGA (FineLine BGA, 17x17 mm) |
| Process Technology | — | 0.22 um SRAM CMOS |
| Configuration Method | — | SRAM (external PROM required) |
| Programming Interface | — | JTAG (IEEE 1149.1) |
| Lead Free / RoHS | — | Lead free per Altera/Intel product declaration |
| مستوى MSL | — | [DATA_NEEDED: MSL rating] |
| Internal Max Frequency | — | up to 250 MHz (family typical) |