EP1K30TI144-2 vs EP1K50TI144-2 مقارنة
مقارنة تفصيلية جنبًا إلى جنب لـ EP1K30TI144-2 بواسطة Intel و EP1K50TI144-2 بواسطة Intel. قارن المواصفات الرئيسية والمعلمات الكهربائية والتغليف وحالة دورة الحياة والأسعار والتوافر لتحديد أفضل مكوّن لمتطلبات تصميمك.
مقارنة المواصفات
| المعامل | EP1K30TI144-2 | EP1K50TI144-2 |
|---|---|---|
| العلامة التجارية | Intel | Intel |
| الفئة | FPGA & CPLD | FPGA & CPLD |
| حالة دورة الحياة | Obsolete | Obsolete |
| Family | ACEX-1K | ACEX-1K |
| Series | EP1K30 | — |
| Logic Elements / Cells | 1728 | — |
| Total RAM Bits | 24576 | 40,960 |
| Number of Logic Array Blocks (LABs) | 216 | — |
| Equivalent Gates | 30,000 | — |
| User I/O Count | 102 | — |
| Number of I/O Banks | 4 | — |
| Supply Voltage - Core | 2.5 V (2.375 V min, 2.625 V max) | — |
| Supply Voltage - I/O | 2.5 V / 3.3 V / 5.0 V (multiVolt) | — |
| Maximum Internal Frequency | 200 MHz | — |
| Process Technology | 0.22 µm CMOS, SRAM-based | SRAM-based, 0.18 µm |
| Embedded Memory Type | Dual-port EAB (Embedded Array Block) | — |
| العلبة | 144-LQFP (TQFP), 22 mm × 22 mm, 0.5 mm pitch | 144-LQFP (TQFP-144) |
| درجة حرارة التشغيل | -40 °C to +85 °C (Industrial, "I" suffix) | -40 °C to +85 °C (Industrial) |
| Speed Grade | -2 (mid-tier) | -2 |
| Configuration Method | SRAM, requires external configuration PROM (EPC) | Passive Serial / Passive Parallel / JTAG |
| Programming Interface | JTAG (IEEE 1149.1) / IEEE 1532 ISP | — |
| نوع التركيب | Surface Mount | Surface Mount |
| حالة RoHS | [DATA_NEEDED: RoHS compliance - legacy part] | [DATA_NEEDED: RoHS compliance] |
| Logic Elements (LEs) | — | 2,880 |
| Typical Gates | — | 50,000 |
| Maximum User I/O | — | 102 |
| Logic Array Blocks (LABs) | — | 360 |
| Embedded Array Blocks (EABs) | — | [DATA_NEEDED: EAB count] |
| Core Supply Voltage (VCCINT) | — | 2.5 V (2.375 V to 2.625 V) |
| I/O Supply Voltage (VCCIO) | — | [DATA_NEEDED: VCCIO range] |
| JTAG Support | — | IEEE 1149.1 Boundary Scan |
| مستوى MSL | — | [DATA_NEEDED: MSL rating] |