EP1K50TI144-2 vs EP1K50TI144-1X مقارنة
مقارنة تفصيلية جنبًا إلى جنب لـ EP1K50TI144-2 بواسطة Intel و EP1K50TI144-1X بواسطة Intel. قارن المواصفات الرئيسية والمعلمات الكهربائية والتغليف وحالة دورة الحياة والأسعار والتوافر لتحديد أفضل مكوّن لمتطلبات تصميمك.
مقارنة المواصفات
| المعامل | EP1K50TI144-2 | EP1K50TI144-1X |
|---|---|---|
| العلامة التجارية | Intel | Intel |
| الفئة | FPGA & CPLD | FPGA & CPLD |
| حالة دورة الحياة | Obsolete | Obsolete |
| Family | ACEX-1K | ACEX 1K |
| Logic Elements (LEs) | 2,880 | — |
| Typical Gates | 50,000 | — |
| Maximum User I/O | 102 | — |
| Logic Array Blocks (LABs) | 360 | — |
| Embedded Array Blocks (EABs) | [DATA_NEEDED: EAB count] | — |
| Total RAM Bits | 40,960 | — |
| Core Supply Voltage (VCCINT) | 2.5 V (2.375 V to 2.625 V) | — |
| I/O Supply Voltage (VCCIO) | [DATA_NEEDED: VCCIO range] | — |
| Speed Grade | -2 | -1 (slowest, lowest cost) |
| درجة حرارة التشغيل | -40 °C to +85 °C (Industrial) | -40 C to +85 C (Industrial) |
| العلبة | 144-LQFP (TQFP-144) | — |
| نوع التركيب | Surface Mount | Surface Mount |
| Process Technology | SRAM-based, 0.18 µm | — |
| Configuration Method | Passive Serial / Passive Parallel / JTAG | Volatile SRAM, external configuration device required |
| JTAG Support | IEEE 1149.1 Boundary Scan | — |
| مستوى MSL | [DATA_NEEDED: MSL rating] | — |
| حالة RoHS | [DATA_NEEDED: RoHS compliance] | [DATA_NEEDED: RoHS status] |
| Series | — | EP1K50 |
| Device Type | — | FPGA (Field Programmable Gate Array) |
| Equivalent Gates | — | 50,000 |
| Logic Elements / Cells | — | 2,880 |
| Configurable Logic Blocks (CLBs) | — | 360 |
| Maximum User I/O Pins | — | 102 |
| Dedicated Input Pins | — | 6 |
| Number of Terminals | — | 144 |
| Package Code | — | QFP / TQFP-144 (Industrial) |
| Package Style | — | Low-profile Fine-pitch Quad Flat Pack (LFQFP / LQFP), 0.5 mm pitch |
| Terminal Form | — | Gull Wing |
| Supply Voltage (VCCINT) | — | 2.375 V to 2.625 V (nominal 2.5 V) |
| أقصى تردد للساعة | — | 90 MHz |
| Design Toolchain | — | Quartus II (legacy support) |