EP2A25F724 vs EP2A25F672C9 مقارنة
مقارنة تفصيلية جنبًا إلى جنب لـ EP2A25F724 بواسطة Altera و EP2A25F672C9 بواسطة Altera. قارن المواصفات الرئيسية والمعلمات الكهربائية والتغليف وحالة دورة الحياة والأسعار والتوافر لتحديد أفضل مكوّن لمتطلبات تصميمك.
مقارنة المواصفات
| المعامل | EP2A25F724 | EP2A25F672C9 |
|---|---|---|
| العلامة التجارية | Altera | Altera |
| الفئة | Memory ICs | FPGA & CPLD |
| حالة دورة الحياة | NRND | NRND |
| Device Type | Enhanced Configuration Device (EPC) | — |
| Target FPGA Family | Altera APEX II (EP2A-series) | — |
| Memory Technology | Flash (non-volatile, no battery required) | — |
| Configuration Modes | Passive Serial, Passive Parallel Async, Passive Parallel Sync | — |
| العلبة | 724-ball FineLine BGA | 672-ball FCBGA (FineLine BGA) |
| JTAG Support | IEEE Std. 1149.1 (boundary-scan / ISP) | — |
| Multi-Device Configuration | Yes - supports daisy-chained APEX II FPGAs | — |
| In-System Programmability | Yes (via JTAG) | — |
| درجة حرارة التشغيل | [DATA_NEEDED: operating temperature grade] | 0°C to 85°C (Commercial) |
| جهد التغذية | [DATA_NEEDED: VCC nominal] | [DATA_NEEDED: core VCC voltage] |
| On-chip Oscillator | Yes (internal configuration clock) | — |
| User Flash Region | Yes (separate from configuration data) | — |
| نوع التركيب | Surface Mount (BGA) | Surface Mount |
| حالة RoHS | Compliant | [DATA_NEEDED] |
| حالة دورة الحياة | Not Recommended for New Designs (NRND) - Altera acquired by Intel 2015 | — |
| Family | — | APEX II |
| Logic Elements (LE) | — | Approximately 25,000 |
| Macro Cells | — | 2432 |
| User I/O | — | 492 |
| Package Dimensions | — | 27 mm x 27 mm |
| Ball Pitch | — | 1.0 mm |
| Process Technology | — | 0.15 µm all-layer copper, up to 8 metal layers |
| Logic Family | — | CMOS |
| Propagation Delay | — | 1.69 ns |
| I/O Standards | — | LVTTL, LVCMOS, PCI, LVDS, HSTL, SSTL (multi-voltage 1.5/1.8/2.5/3.3 V) |
| Configuration | — | Passive Serial, Passive Parallel Synchronous, JTAG |
| Embedded Memory | — | ESBs for dual-port RAM, ROM, FIFO |