EP2A70B652C8 vs EP2A70B652C9 مقارنة
مقارنة تفصيلية جنبًا إلى جنب لـ EP2A70B652C8 بواسطة Intel و EP2A70B652C9 بواسطة Intel. قارن المواصفات الرئيسية والمعلمات الكهربائية والتغليف وحالة دورة الحياة والأسعار والتوافر لتحديد أفضل مكوّن لمتطلبات تصميمك.
مقارنة المواصفات
| المعامل | EP2A70B652C8 | EP2A70B652C9 |
|---|---|---|
| العلامة التجارية | Intel | Intel |
| الفئة | FPGA & CPLD | FPGA & CPLD |
| حالة دورة الحياة | Obsolete | Obsolete |
| Logic Elements | 67200 | [DATA_NEEDED: Logic Element count for APEX II EP2A70] |
| Typical Gates | 1,125,000 | — |
| Embedded Memory (bits) | 4,096,000 | — |
| Embedded Memory Blocks | [DATA_NEEDED: number of EABs/M512/M4K blocks] | — |
| PLLs | 4 | — |
| Maximum User I/O Pins | [DATA_NEEDED: per BGA-652 pinout] | — |
| العلبة | 652-ball BGA | BGA-652 |
| Speed Grade | -8 | C9 |
| درجة حرارة التشغيل | 0C to +85C (commercial) | -40C to +85C (industrial range, to be confirmed) |
| Process Node | 0.15 um CMOS SRAM | — |
| Supply Voltage Core | [DATA_NEEDED: VCCINT] | — |
| Configuration Mode | Passive Serial / Parallel / JTAG | — |
| Family | APEX II | APEX II |
| حالة RoHS | [DATA_NEEDED] | [DATA_NEEDED: RoHS compliance] |
| نوع التركيب | Surface Mount (BGA) | Surface Mount (BGA) |
| مستوى MSL | [DATA_NEEDED] | — |
| Logic Cells | — | 67,200 |
| Process Technology | — | 0.18 um CMOS |
| Supply Voltage - Core | — | 1.8 V |
| I/O Voltage Support | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Embedded Memory | — | EAB-based RAM blocks |
| PLL Count | — | [DATA_NEEDED: PLL count] |
| User I/O Banks | — | [DATA_NEEDED: User I/O bank count for BGA-652] |
| Transceivers | — | [DATA_NEEDED: High-speed transceiver count] |
| Lead-Free | — | [DATA_NEEDED: Lead-free status] |
| Design Software | — | Quartus II (legacy, APEX II support) |