EP2AGZ300HF40C3G vs EP2AGZ300HF40C4N مقارنة
مقارنة تفصيلية جنبًا إلى جنب لـ EP2AGZ300HF40C3G بواسطة Intel و EP2AGZ300HF40C4N بواسطة Intel. قارن المواصفات الرئيسية والمعلمات الكهربائية والتغليف وحالة دورة الحياة والأسعار والتوافر لتحديد أفضل مكوّن لمتطلبات تصميمك.
مقارنة المواصفات
| المعامل | EP2AGZ300HF40C3G | EP2AGZ300HF40C4N |
|---|---|---|
| العلامة التجارية | Intel | Intel |
| الفئة | FPGA & CPLD | FPGA & CPLD |
| حالة دورة الحياة | نشط | نشط |
| Series | Arria II GZ | Arria II GZ |
| Manufacturer | Intel (formerly Altera) | Intel (formerly Altera) |
| Logic Elements (LE) | 300,000 | 298,000 |
| User I/O Count | 734 | 734 |
| العلبة | 1517-ball FBGA | — |
| Speed Grade | C3 (commercial) | — |
| Lead Finish | Pb-free (G suffix) | — |
| درجة حرارة التشغيل | Commercial (0C to +85C) | — |
| Embedded Memory | Approx. 18.7 Mbits | — |
| DSP Blocks | 800+ (18x18 multipliers) | — |
| Multi-Gigabit Transceivers | 24 (up to 6.375 Gbps) | — |
| PLLs | 8 | — |
| Hard Memory Controllers | DDR3, QDRII+, RLDRAM II | — |
| PCIe Hard IP | PCIe Gen2 (x1/x4/x8) | — |
| Process Technology | 40 nm TSMC | — |
| Configuration Method | Serial/Parallel, partial reconfiguration supported | — |
| حالة RoHS | Pb-free finish - compliant | Compliant |
| نوع التركيب | Surface Mount (BGA) | Surface Mount (BGA) |
| Embedded Memory (bits) | — | 18,854,912 (~18.5 Mbit) |
| Number of LABs/CLBs | — | 1,194 |
| Package Type | — | 1517-BBGA, FCBGA (Flip-Chip BGA) |
| Package Code | — | HBGA |
| Terminal Form | — | Ball |
| Terminal Pitch | — | [DATA_NEEDED: terminal pitch mm] |
| Operating Temperature Grade | — | Commercial (C4) |
| Process Node | — | 40 nm TSMC low-power |
| Supply Voltage (Core) | — | 0.9 V (typical) |
| Transceiver Speed (max) | — | 6.375 Gbps |
| Number of Transceivers | — | Up to 28 (variant-dependent) |
| PLL Count | — | 12 |
| Hard PCIe Gen2 IP | — | Yes (x1/x2/x4/x8) |
| DDR3 Memory Controller Hard PHY | — | Yes |
| LVDS Support | — | Up to 1.4 Gbps |
| Design Software | — | Quartus II (13.0+ for Arria II GZ) |