M1AFS600-2FGG256 vs M1AFS250-2FG256I مقارنة
مقارنة تفصيلية جنبًا إلى جنب لـ M1AFS600-2FGG256 بواسطة Microchip Technology و M1AFS250-2FG256I بواسطة Microchip Technology. قارن المواصفات الرئيسية والمعلمات الكهربائية والتغليف وحالة دورة الحياة والأسعار والتوافر لتحديد أفضل مكوّن لمتطلبات تصميمك.
Microchip Technology
M1AFS600-2FGG256 - Fusion 600K-Gate Mixed-Signal FPGA | Microchip
M1AFS600-2FGG256 ✓ نشطMicrochip Technology
M1AFS250-2FG256I - 250K Gate Fusion FPGA, ARM M1 | Microchip
M1AFS250-2FG256I ✓ نشطمقارنة المواصفات
| المعامل | M1AFS600-2FGG256 | M1AFS250-2FG256I |
|---|---|---|
| العلامة التجارية | Microchip Technology | Microchip Technology |
| الفئة | FPGA & CPLD | FPGA & CPLD |
| حالة دورة الحياة | نشط | نشط |
| Family | Fusion (M1) Mixed-Signal FPGA | Fusion (M1AFS, ARM Cortex-M1 support) |
| System Gates | 600K | 250K |
| User I/O | 119 | 114 |
| Programmable Resources (DigiKey listing) | 110592 | — |
| Process Technology | 130 nm | 130 nm, 7-layer metal flash-based CMOS |
| Core Supply Voltage | 1.5 V | 1.5 V |
| Maximum Frequency | 1470.59 MHz | — |
| Configuration Technology | Flash-based (non-volatile) | — |
| العلبة | 256-LBGA (FBGA / FG256) | 256-ball FBGA (256-LBGA) |
| نوع التركيب | Surface Mount | Surface Mount |
| Analog Peripherals | Integrated configurable analog subsystem | — |
| On-chip Memory | Large flash memory blocks | — |
| Clock Management | On-chip clock generation and management circuitry | — |
| درجة حرارة التشغيل | [DATA_NEEDED: Operating Temperature] | — |
| I/O Supply Voltage | [DATA_NEEDED: I/O Supply Voltage] | — |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL Level] | — |
| Embedded RAM Bits | — | 36864 |
| System Performance | — | 350 MHz |
| Processor Core | — | ARM Cortex-M1 (hard IP) |
| Configuration Memory | — | Flash-based, nonvolatile |
| Power-Up Mode | — | Live at Power-Up (LAPU) |
| Analog Block | — | Configurable analog (voltage, current, temperature monitoring) |
| Speed Grade | — | -2 |
| Temperature Range | — | Industrial (-40C to +85C) |
| حالة RoHS | — | RoHS Non-Compliant (contains lead; FGG variant is lead-free) |
| Packaging | — | Tray |