MC9S08AW48CFGE vs S9S08AW60E5MFGE مقارنة
مقارنة تفصيلية جنبًا إلى جنب لـ MC9S08AW48CFGE بواسطة NXP Semiconductors و S9S08AW60E5MFGE بواسطة NXP Semiconductors. قارن المواصفات الرئيسية والمعلمات الكهربائية والتغليف وحالة دورة الحياة والأسعار والتوافر لتحديد أفضل مكوّن لمتطلبات تصميمك.
NXP Semiconductors
S9S08AW60E5MFGE - 60KB Flash 8-Bit MCU 44-LQFP | NXP (Tape & Reel)
S9S08AW60E5MFGE ✓ نشطمقارنة المواصفات
| المعامل | MC9S08AW48CFGE | S9S08AW60E5MFGE |
|---|---|---|
| العلامة التجارية | NXP Semiconductors | NXP Semiconductors |
| الفئة | Microcontrollers | Microcontrollers |
| حالة دورة الحياة | NRND | نشط |
| Core | HCS08 (S08) | — |
| Core Size | 8-bit | — |
| CPU Speed | 40 MHz | — |
| Internal Bus Frequency | 20 MHz | — |
| Program Memory (Flash) | 48 KB (48K x 8) | — |
| RAM Size | 2 KB | — |
| I/O Ports | 38 (per NXP summary); 34 (per distributor listing) | — |
| جهد التغذية | 2.7 V to 5.5 V | 3 V / 3.3 V / 5 V |
| العلبة | 44-pin LQFP (10x10 mm, 0.5 mm pitch) | 44-pin LQFP (10 x 10 mm) |
| Operating Temperature Grade | Industrial | — |
| Connectivity | I2C, SCI, SPI | — |
| Peripherals | LVD, POR, PWM, WDT | — |
| Instruction Set | HC08 with added BGND instruction | — |
| Debug Interface | Single-wire background debug mode (BKGD) | BDM (Background Debug Mode) |
| ROM Type | Flash | — |
| نوع التركيب | Surface Mount | Surface Mount |
| حالة RoHS | Compliant | — |
| Core Architecture | — | HCS08 (S08 enhanced), 8-bit CISC |
| CPU Clock (Max) | — | 40 MHz (20 MHz bus) |
| Program Flash | — | 60 KB (60K x 8) |
| RAM | — | [DATA_NEEDED: RAM size] |
| EEPROM / Data Flash | — | [DATA_NEEDED: data EEPROM size] |
| I/O Pins | — | [DATA_NEEDED: GPIO count] |
| ADC | — | Multi-channel 10-bit (per family) |
| Communication | — | SCI (UART), SPI, I2C |
| Timers | — | TPM modules with PWM channels |
| درجة حرارة التشغيل | — | -40C to +125C (automotive range) |
| Family | — | S08 / MC9S08AW60 series |
| Automotive/Industrial | — | Dual-targeted |
| Lead Free / RoHS | — | Yes (per suffix "E" = Pb-free, "R" = tape & reel) |