MC9S08DZ32AMLF vs MC9S08DZ32ACLF مقارنة
مقارنة تفصيلية جنبًا إلى جنب لـ MC9S08DZ32AMLF بواسطة NXP Semiconductors و MC9S08DZ32ACLF بواسطة NXP Semiconductors. قارن المواصفات الرئيسية والمعلمات الكهربائية والتغليف وحالة دورة الحياة والأسعار والتوافر لتحديد أفضل مكوّن لمتطلبات تصميمك.
NXP Semiconductors
MC9S08DZ32AMLF - 8-bit MCU 32KB Flash 40MHz CAN LQFP-48 | NXP
MC9S08DZ32AMLF NrndNXP Semiconductors
MC9S08DZ32ACLF - 32KB Flash 8-bit CAN MCU, 40MHz LQFP-48 | NXP
MC9S08DZ32ACLF Nrndمقارنة المواصفات
| المعامل | MC9S08DZ32AMLF | MC9S08DZ32ACLF |
|---|---|---|
| العلامة التجارية | NXP Semiconductors | NXP Semiconductors |
| الفئة | Microcontrollers | Microcontrollers |
| حالة دورة الحياة | NRND | NRND |
| Core Processor | HCS08 (S08 CISC) | — |
| Core Size | 8-Bit | — |
| Maximum CPU Frequency | 40 MHz (20 MHz internal bus) | 40 MHz (20 MHz bus) |
| Program Memory Size | 32 KB (32K x 8) Flash | — |
| RAM Size | 2 KB | — |
| EEPROM | Embedded EEPROM | On-chip (size [DATA_NEEDED: exact EEPROM size]) |
| جهد التغذية | 3.3 V / 5 V | 2.7 V to 5.5 V (3.3 V / 5 V) |
| CAN | Yes (embedded MSCAN) | MSCAN (CAN 2.0 A/B) |
| Serial Interfaces | SCI, SPI, I2C | — |
| ADC | 24-channel, 12-bit, 2.5 us conversion | 24-channel, 12-bit, 2.5 us conversion |
| Analog Comparator | Yes | Yes (on-chip) |
| Interrupt/Reset Sources | Up to 32 | — |
| Instruction Set | HC08 with added BGND instruction | HC08 with BGND added |
| On-Chip Debug | Yes (on-chip emulation/debug) | — |
| العلبة | 48-LQFP (7x7 mm) | 48-pin LQFP (7x7 mm) |
| نوع التركيب | Surface Mount | Surface Mount |
| Packaging | Tray | — |
| Product Category | Microcontrollers (MCU) | — |
| Qualification | Automotive-grade family (AEC-Q100 per series documentation) | — |
| حالة دورة الحياة | NRND (Not Recommended for New Designs) | — |
| Core | — | HCS08 (S08) 8-bit CPU |
| Program Memory (Flash) | — | 32 KB |
| RAM | — | 2 KB |
| SCI / LIN | — | SCI with LIN master support |
| SPI | — | Yes (on-chip) |
| I2C | — | Yes (on-chip) |
| Interrupt Sources | — | Up to 32 |
| Debug Interface | — | Background Debug Mode (BDM) / on-chip emulation |
| درجة حرارة التشغيل | — | -40C to +85C (automotive grade available) |
| مستوى MSL | — | [DATA_NEEDED: MSL level] |
| حالة RoHS | — | [DATA_NEEDED] |