MC9S08DZ60AMLF vs MC9S08DV60AMLF مقارنة
مقارنة تفصيلية جنبًا إلى جنب لـ MC9S08DZ60AMLF بواسطة NXP Semiconductors و MC9S08DV60AMLF بواسطة NXP Semiconductors. قارن المواصفات الرئيسية والمعلمات الكهربائية والتغليف وحالة دورة الحياة والأسعار والتوافر لتحديد أفضل مكوّن لمتطلبات تصميمك.
مقارنة المواصفات
| المعامل | MC9S08DZ60AMLF | MC9S08DV60AMLF |
|---|---|---|
| العلامة التجارية | NXP Semiconductors | NXP Semiconductors |
| الفئة | Microcontrollers | Microcontrollers |
| حالة دورة الحياة | NRND | نشط |
| Core Processor | S08 (HCS08), 8-bit CISC | HCS08 (enhanced HC08 with BGND) |
| Core Size | 8-Bit | 8-bit |
| Maximum CPU Frequency | 40 MHz (20 MHz bus) | — |
| Program Memory Size | 60 KB (60K x 8) Flash | 60 KB (60K x 8) Flash |
| RAM Size | 4 KB | 3 KB |
| Data EEPROM | Embedded EEPROM | — |
| Connectivity | CAN 2.0 A/B (MSCAN), LIN master-capable SCI, SPI, SCI | — |
| ADC Resolution | 12-bit | — |
| ADC Channels | 24-channel (16-channel 12-bit ADC per FindIC overview) | — |
| ADC Conversion Time | 2.5 us | — |
| Analog Comparators | 1 | — |
| جهد التغذية | 3.3 V / 5 V | — |
| Interrupt/Reset Sources | Up to 32 | — |
| Debug | On-chip background debug (BGND instruction) | — |
| العلبة | 48-LQFP (7x7 mm) | 48-LQFP (7x7 mm) |
| نوع التركيب | Surface Mount | Surface Mount |
| Packaging | Tray | — |
| حالة RoHS | RoHS compliant (per distributor listing) | ROHS3 Compliant |
| حالة دورة الحياة | NRND (Not Recommended for New Designs) per NXP | — |
| درجة حرارة التشغيل | [DATA_NEEDED: operating temperature range] | -40C to +125C |
| Manufacturer | — | NXP Semiconductors (formerly Freescale) |
| Series | — | S08 |
| Core Speed | — | 40 MHz (20 MHz bus) |
| Supply Voltage Range | — | 2.7 V to 5.5 V |
| Number of I/O | — | 53 GPIO + 1 input-only |
| Communication Interfaces | — | MSCAN (CAN 2.0A/B), SCI/SPI, LIN master |
| ADC | — | 8-channel 10-bit (per datasheet family) |
| Timers | — | Multiple TPM (per datasheet family) |
| Debug Interface | — | Single-wire BDM |