MC9S08SH4MFK vs MC9S08SH4CTJ مقارنة
مقارنة تفصيلية جنبًا إلى جنب لـ MC9S08SH4MFK بواسطة NXP Semiconductors و MC9S08SH4CTJ بواسطة NXP Semiconductors. قارن المواصفات الرئيسية والمعلمات الكهربائية والتغليف وحالة دورة الحياة والأسعار والتوافر لتحديد أفضل مكوّن لمتطلبات تصميمك.
مقارنة المواصفات
| المعامل | MC9S08SH4MFK | MC9S08SH4CTJ |
|---|---|---|
| العلامة التجارية | NXP Semiconductors | NXP Semiconductors |
| الفئة | Microcontrollers | Microcontrollers |
| حالة دورة الحياة | نشط | NRND |
| Core | HCS08 (8-bit) | — |
| Program Memory Size | 4 KB (4K x 8) Flash | — |
| RAM Size | 256 B | — |
| Maximum CPU Clock | 40 MHz | — |
| Number of I/O Pins | 17 | — |
| العلبة / الحالة | 24-VFQFN Exposed Pad (4x4 mm) | — |
| Supply Voltage Range | 2.7 V to 5.5 V | — |
| ADC | 12-channel, 10-bit, 2.5 us conversion | 12-channel, 10-bit, 2.5 us conversion, auto-compare, internal temperature sensor |
| Oscillator Type | Internal | — |
| Interrupt/Reset Sources | Up to 32 | — |
| Instruction Set | HC08 with BGND instruction | HC08 with BGND extension |
| Packaging | Tray | — |
| نوع التركيب | Surface Mount | Surface Mount |
| درجة حرارة التشغيل | -40 C to +85 C (industrial, [DATA_NEEDED: confirm exact grade]) | -40 C to +85 C (industrial, TJ suffix implied) |
| Compliance | RoHS compliant ([DATA_NEEDED: confirm exact status]) | — |
| Core Architecture | — | HCS08 (enhanced 8-bit) |
| CPU Bit Width | — | 8-bit |
| Maximum Bus Frequency | — | 40 MHz |
| Program Memory (Flash) | — | 4 KB (4K x 8) |
| RAM | — | 256 B |
| Operating Voltage | — | 2.7 V to 5.5 V |
| Timers | — | MTIM, RTI, TPM (PWM) |
| Communication Interfaces | — | SCI/UART, SPI, I2C |
| Analog Comparator | — | Yes (integrated) |
| العلبة | — | 20-pin TSSOP |
| Low-Power Modes | — | STOP, WAIT with fast wake-up |
| Debug Interface | — | Single-wire BDM (background debug mode) |
| Interrupt Sources | — | Up to 32 |
| حالة RoHS | — | Compliant |