MC9S12XDP512MAL vs S912XET512J2VAGR مقارنة
مقارنة تفصيلية جنبًا إلى جنب لـ MC9S12XDP512MAL بواسطة NXP Semiconductors و S912XET512J2VAGR بواسطة NXP Semiconductors. قارن المواصفات الرئيسية والمعلمات الكهربائية والتغليف وحالة دورة الحياة والأسعار والتوافر لتحديد أفضل مكوّن لمتطلبات تصميمك.
NXP Semiconductors
MC9S12XDP512MAL - 16-Bit HCS12X MCU, 512KB Flash, 80MHz | NXP
MC9S12XDP512MAL Nrnd
مقارنة المواصفات
| المعامل | MC9S12XDP512MAL | S912XET512J2VAGR |
|---|---|---|
| العلامة التجارية | NXP Semiconductors | NXP Semiconductors |
| الفئة | Microcontrollers | Microcontrollers |
| حالة دورة الحياة | NRND | نشط |
| Core Processor | HCS12X | — |
| Core Size | 16-Bit | — |
| Program Memory Size | 512 KB (512K x 8) Flash | — |
| RAM Size | 32 KB | — |
| EEPROM Size | 4 KB | — |
| Maximum Speed | 80 MHz | — |
| Bus Speed | 40 MHz | — |
| Number of I/O | 91 | — |
| جهد التغذية | 2.35 V to 2.75 V core | [DATA_NEEDED: Supply Voltage Range] |
| Connectivity | CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI | — |
| Peripherals | LVD, POR, PWM, WDT, ECT, ADC | — |
| ADC Channels | 24-channel 10-bit | — |
| العلبة | 112-LQFP (20x20 mm) | 144-LQFP (LFQFP), 20x20 mm square |
| درجة حرارة التشغيل | [DATA_NEEDED: operating temperature range] | -40C to +105C |
| نوع التركيب | Surface Mount | Surface Mount |
| Core Architecture | — | 16-bit HCS12X (S12X core) |
| Core Frequency | — | 50 MHz |
| Flash Memory | — | 512 KB (512K x 8) |
| Qualification | — | Automotive Qualified |
| Temperature Grade | — | Industrial (per distributor listing) |
| Terminal Form | — | Gull Wing |
| Number of Terminals | — | 144 |
| Package Shape | — | Square |
| RAM | — | [DATA_NEEDED: RAM Size] |
| EEPROM | — | [DATA_NEEDED: EEPROM Size] |
| Communication Interfaces | — | SPI, SCI (per distributor listing); CAN/LIN availability [DATA_NEEDED: CAN/LIN Channels] |
| Watchdog Timer | — | Yes (watchdog OSC/Timer per distributor listing) |
| حالة RoHS | — | [DATA_NEEDED: RoHS Status] |