MCF5275LCVM166 vs MCF5274LCVM166 مقارنة
مقارنة تفصيلية جنبًا إلى جنب لـ MCF5275LCVM166 بواسطة NXP Semiconductors و MCF5274LCVM166 بواسطة NXP Semiconductors. قارن المواصفات الرئيسية والمعلمات الكهربائية والتغليف وحالة دورة الحياة والأسعار والتوافر لتحديد أفضل مكوّن لمتطلبات تصميمك.
NXP Semiconductors
MCF5274LCVM166 - 32-Bit ColdFire V2 MPU 166MHz LBGA-196 | NXP
MCF5274LCVM166 Nrndمقارنة المواصفات
| المعامل | MCF5275LCVM166 | MCF5274LCVM166 |
|---|---|---|
| العلامة التجارية | NXP Semiconductors | NXP Semiconductors |
| الفئة | Microcontrollers | Microcontrollers |
| حالة دورة الحياة | NRND | NRND |
| Core Architecture | ColdFire V2 (32-bit, variable-length RISC) | 32-bit RISC (ColdFire) |
| Maximum Core Clock | 166 MHz | — |
| On-chip SRAM | 64 KB | — |
| Program Memory | ROMless (external memory required) | ROMless (external boot) |
| جهد التغذية | 3.3 V I/O, internal core rail generated on-chip | — |
| Ethernet | 10/100 MAC with MII/RMII | 10/100 Fast Ethernet MAC (integrated PHY on selected family members) |
| USB | USB 2.0 full-speed device/host | USB 2.0 Full-Speed Device/Host (integrated PHY on selected family members) |
| UART | 2 | — |
| I2C | 2 | — |
| DMA Channels | 16 (eDMA) | [DATA_NEEDED: number of DMA channels] |
| Timers | 4 x 32-bit | — |
| External Bus | 16-bit EBI (SDRAM/SRAM/ROM) | — |
| العلبة | 196-LBGA (15x15 mm) | 196-LBGA (15x15 mm) |
| نوع التركيب | Surface Mount | Surface Mount (BGA) |
| درجة حرارة التشغيل | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: exact operating temperature range] |
| حالة RoHS | Compliant | Compliant (per distributor listing) |
| Core | — | ColdFire V2 (MCF527x family) |
| Maximum Core Frequency | — | 166 MHz |
| Core Supply Voltage | — | 1.5 V |
| I/O Supply Voltage | — | 3.3 V |
| RAM | — | [DATA_NEEDED: internal SRAM size] |
| Temperature Grade | — | Industrial |
| Cryptography | — | Hardware crypto accelerator (DES / 3DES / AES / SHA-1) |
| External Memory Bus | — | SDRAM / SRAM / ROM controller |
| Serial Peripherals | — | UART, I2C, QSPI |