MCF5307CAI90B vs MCF5274CVM166 مقارنة
مقارنة تفصيلية جنبًا إلى جنب لـ MCF5307CAI90B بواسطة NXP Semiconductors و MCF5274CVM166 بواسطة NXP Semiconductors. قارن المواصفات الرئيسية والمعلمات الكهربائية والتغليف وحالة دورة الحياة والأسعار والتوافر لتحديد أفضل مكوّن لمتطلبات تصميمك.
NXP Semiconductors
MCF5307CAI90B - ColdFire V3 32-Bit MPU, 90MHz, 208-FQFP | NXP
MCF5307CAI90B ✓ نشط
مقارنة المواصفات
| المعامل | MCF5307CAI90B | MCF5274CVM166 |
|---|---|---|
| العلامة التجارية | NXP Semiconductors | NXP Semiconductors |
| الفئة | Microcontrollers | Microcontrollers |
| حالة دورة الحياة | نشط | NRND |
| Processor Core | ColdFire V3 | ColdFire V2 |
| Core Architecture | 32-bit RISC (M68k-derived ColdFire) | — |
| Maximum Core Frequency | 90 MHz | — |
| Performance | 70 MIPS (Dhrystone 2.1) | — |
| Instruction Set | ColdFire V3 + MAC (multiply-accumulate) | — |
| جهد التغذية | 3.3 V | — |
| Process Technology | 0.32 um | — |
| On-chip SRAM | 4 KB | — |
| External Memory Bus | 32-bit (FPM/EDO/SDRAM DRAM supported) | — |
| DMA Controller | 4 channels | — |
| Timers | 3 timer modules | — |
| UART | 2 UARTs | — |
| I2C | 1 I2C interface | — |
| QSPI | 1 QSPI port | — |
| Parallel I/O | 16-bit general-purpose | — |
| العلبة | 208-FQFP (28 mm x 28 mm) | 256-map BGA, 17 mm x 17 mm |
| نوع التركيب | Surface Mount, Gull-Wing | Surface mount |
| Temperature Grade | Commercial | — |
| Product Type | — | 32-bit ROMless integrated microprocessor |
| أقصى تردد للساعة | — | 166 MHz |
| Instruction Width | — | 32 bit |
| Program Memory Type | — | ROMless |
| External Oscillator | — | External |
| Nominal I/O Supply Voltage | — | 2.5 V / 3.3 V |
| Core Supply Range in Cross-Reference Result | — | 1.4 V to 1.6 V |
| درجة حرارة التشغيل | — | -40°C to 85°C |
| RAM Organization Reported by Third-Party Listing | — | 64K x 8 |
| Program Memory Size | — | [DATA_NEEDED: program memory size] |
| EEPROM Size | — | [DATA_NEEDED: EEPROM size] |
| Number of GPIO Pins | — | [DATA_NEEDED: GPIO pin count] |
| Ethernet Interface | — | [DATA_NEEDED: Ethernet interface configuration] |
| External Memory Interface | — | [DATA_NEEDED: external memory interface configuration] |
| RoHS Compliance | — | [DATA_NEEDED: RoHS compliance] |
| REACH Compliance | — | [DATA_NEEDED: REACH compliance] |
| AEC-Q100 Qualification | — | [DATA_NEEDED: AEC-Q100 qualification] |