MPC8245LVV333D vs MPC8245LVV300D مقارنة
مقارنة تفصيلية جنبًا إلى جنب لـ MPC8245LVV333D بواسطة NXP Semiconductors و MPC8245LVV300D بواسطة NXP Semiconductors. قارن المواصفات الرئيسية والمعلمات الكهربائية والتغليف وحالة دورة الحياة والأسعار والتوافر لتحديد أفضل مكوّن لمتطلبات تصميمك.
NXP Semiconductors
MPC8245LVV333D - 333MHz PowerPC 603e Integrated Host Processor
MPC8245LVV333D Obsoleteمقارنة المواصفات
| المعامل | MPC8245LVV333D | MPC8245LVV300D |
|---|---|---|
| العلامة التجارية | NXP Semiconductors | NXP Semiconductors |
| الفئة | Microcontrollers | Microcontrollers |
| حالة دورة الحياة | Obsolete | نشط |
| Manufacturer | NXP USA Inc. (formerly Freescale / Motorola) | NXP Semiconductors (formerly Freescale) |
| Product Category | Microprocessors (MPU) | — |
| Core Architecture | PowerPC 603e (Power Architecture technology) | — |
| Core Count | 1 | — |
| عرض ناقل البيانات | 32-bit | 32-bit |
| Core Frequency | 333 MHz | 300 MHz |
| Integrated Bridge | PCI bridge + memory controller | — |
| PCI Interface | PCI 2.2 compliant, 32-bit, up to 66 MHz | — |
| Memory Controller | 64-bit SDRAM (PC133), ROM/Flash interface | — |
| Supply Voltage - Core | 2.0 V (L suffix, low-voltage core) | — |
| Supply Voltage - I/O | 3.3 V | — |
| درجة حرارة التشغيل | 0 C to +105 C (junction) | 0 C to 105 C |
| العلبة / الحالة | 352-TBGA (35x35 mm) | — |
| نوع التركيب | Surface Mount (BGA) | Surface Mount |
| حالة RoHS | [DATA_NEEDED: rohs status not confirmed in verified web data] | — |
| Lead-Free / BGA Solder | [DATA_NEEDED: lead-free status not confirmed] | — |
| Core Processor | — | PowerPC 603e |
| Number of Cores | — | 1 |
| Series | — | MPC82xx |
| Co-Processors / DSP | — | None |
| RAM Controllers | — | SDRAM (64-bit) |
| Graphics Acceleration | — | No |
| Display & Interface Controllers | — | None |
| Ethernet | — | [DATA_NEEDED: integrated Ethernet MAC count] |
| USB | — | [DATA_NEEDED: integrated USB] |
| PCI Bridge | — | PCI 2.2, 32-bit, up to 66 MHz |
| العلبة | — | 352-TBGA (35 x 35 mm) |
| Part Status | — | Active |