MPX4250A vs MPX4250GP مقارنة
مقارنة تفصيلية جنبًا إلى جنب لـ MPX4250A بواسطة NXP Semiconductors و MPX4250GP بواسطة NXP Semiconductors. قارن المواصفات الرئيسية والمعلمات الكهربائية والتغليف وحالة دورة الحياة والأسعار والتوافر لتحديد أفضل مكوّن لمتطلبات تصميمك.
NXP Semiconductors
MPX4250GP - 250kPa Vented Gauge Pressure Sensor | NXP Semiconductors
MPX4250GP ✓ نشطمقارنة المواصفات
| المعامل | MPX4250A | MPX4250GP |
|---|---|---|
| العلامة التجارية | NXP Semiconductors | NXP Semiconductors |
| الفئة | Pressure Sensors | Pressure Sensors |
| حالة دورة الحياة | NRND | نشط |
| نوع المستشعر | Manifold Absolute Pressure (MAP), sealed vacuum reference | — |
| Pressure Range | 20 kPa to 250 kPa (2.9 PSI to 36.3 PSI) | — |
| Maximum Overload Pressure | [DATA_NEEDED: maximum overload pressure] | — |
| Operating Pressure Range | 20 to 250 kPa absolute | 0 kPa to 250 kPa (0 to 36.26 PSI) |
| نوع الخرج | Analog, ratiometric to supply voltage | Analog, Ratiometric |
| نطاق جهد الخرج | 0.2 V to 4.9 V (at 5.0 V supply) | 0.2 V to 4.9 V |
| جهد التغذية | 4.85 V to 5.35 V (5.0 V typical) | 4.85 V to 5.35 V |
| تيار التغذية | [DATA_NEEDED: supply current at 5 V] | [DATA_NEEDED: supply current] |
| Sensitivity | Approx. 18.4 mV/kPa (at Vsup = 5.0 V) | 18.8 mV/kPa (nominal) |
| Response Time | 1.0 ms | — |
| درجة حرارة التشغيل | -40 C to +125 C | -40C to +125C |
| Storage Temperature | [DATA_NEEDED: storage temperature range] | — |
| العلبة / الحالة | 6-SIP Module | — |
| نوع التركيب | Through Hole, SIP | Through-hole SIP module |
| Port Style | No port / non-port (basic element) | — |
| On-Chip Signal Conditioning | Yes (amplified, temperature-compensated, calibrated) | — |
| حالة RoHS | Compliant (per NXP product page) | [DATA_NEEDED: RoHS status] |
| Manufacturer | — | NXP Semiconductors |
| Pressure Type | — | Vented Gauge |
| Maximum Overpressure | — | [DATA_NEEDED: max overpressure rating] |
| Accuracy | — | [DATA_NEEDED: total error band] |
| Port Size | — | 0.19 inch (4.93 mm) male tube / barbed |
| العلبة | — | 6-SIP Module (6-pin Single Inline Package) |
| Compensation | — | On-chip temperature compensated and calibrated |