MPXC2011DT1 vs MPX12DP مقارنة
مقارنة تفصيلية جنبًا إلى جنب لـ MPXC2011DT1 بواسطة NXP Semiconductors و MPX12DP بواسطة NXP Semiconductors. قارن المواصفات الرئيسية والمعلمات الكهربائية والتغليف وحالة دورة الحياة والأسعار والتوافر لتحديد أفضل مكوّن لمتطلبات تصميمك.
مقارنة المواصفات
| المعامل | MPXC2011DT1 | MPX12DP |
|---|---|---|
| العلامة التجارية | NXP Semiconductors | NXP Semiconductors |
| الفئة | Pressure Sensors | Pressure Sensors |
| حالة دورة الحياة | نشط | Obsolete |
| Pressure Type | Differential | Differential |
| Operating Pressure Range | 0 kPa to 10 kPa (0 PSI to 1.45 PSI) | 0 kPa to 10 kPa (0 PSI to 1.45 PSI) |
| Full-Scale Output | 25 mV typical at 10 V excitation | — |
| Sensitivity | 2.5 mV/kPa typical | 5.5 mV/kPa typical |
| Excitation Voltage | 3 V DC to 10 V DC (10 V nominal) | 3 V DC typical |
| نوع الخرج | Analog Wheatstone bridge (ratiometric) | Analog Wheatstone bridge (mV) |
| العلبة | 4-SSIP Chip Pak module, side port | — |
| Port Style | Female, 3.25 mm (0.128 in) barbed side port | — |
| Termination Style | Through-hole PCB, 4 leads | — |
| درجة حرارة التشغيل | 0 °C to +85 °C | -40C to +125C |
| Compensation | On-chip temperature compensated and calibrated | Uncompensated (external required) |
| Technology | Piezoresistive silicon strain gauge | — |
| Module Dimensions | 7.6 mm x 12.8 mm nominal | — |
| نوع التركيب | Through-hole (PCB mount with side-port tubing) | Through Hole |
| حالة RoHS | [DATA_NEEDED: RoHS status not in web data] | [DATA_NEEDED: RoHS status] |
| Full-Scale Span | — | 35 mV typical (20 mV min / 75 mV max) |
| نطاق جهد الخرج | — | 0 mV to 55 mV at 3 V excitation |
| Linearity | — | +/-5% of span |
| Pressure Port Style | — | Dual axial tube, 4.93 mm (0.19 in) diameter |
| Package / Mounting | — | 4-SIP through-hole module |
| Storage Temperature | — | [DATA_NEEDED: storage temperature] |
| Lead Free | — | [DATA_NEEDED: lead-free status] |
| مستوى MSL | — | Not applicable (through-hole) |