RTAX2000S-CG1152V vs RTAX2000S-1LG1152V مقارنة
مقارنة تفصيلية جنبًا إلى جنب لـ RTAX2000S-CG1152V بواسطة Microchip Technology و RTAX2000S-1LG1152V بواسطة Microchip Technology. قارن المواصفات الرئيسية والمعلمات الكهربائية والتغليف وحالة دورة الحياة والأسعار والتوافر لتحديد أفضل مكوّن لمتطلبات تصميمك.
Microchip Technology
RTAX2000S-CG1152V - 2M-Gate Rad-Tolerant FPGA | Microchip
RTAX2000S-CG1152V ✓ نشطMicrochip Technology
RTAX2000S-1LG1152V - 2M-Gate Rad-Tolerant FPGA | Microchip
RTAX2000S-1LG1152V ✓ نشطمقارنة المواصفات
| المعامل | RTAX2000S-CG1152V | RTAX2000S-1LG1152V |
|---|---|---|
| العلامة التجارية | Microchip Technology | Microchip Technology |
| الفئة | FPGA & CPLD | FPGA & CPLD |
| حالة دورة الحياة | نشط | نشط |
| Equivalent System Gates | 2,000,000 | 2,000,000 gates |
| CLBs (Logic Modules) | 21,504 | — |
| Logic Cells | 32,256 | 32,256 |
| User I/O | 684 inputs / 684 outputs | — |
| Core Supply Voltage | 1.5 V nominal | — |
| Process Technology | CMOS | — |
| Programming Technology | Anti-fuse (OTP), live at power-up | — |
| Radiation Tolerance | Radiation-tolerant (RadTolerant, RTAX-S family) | Radiation-tolerant for space flight systems |
| Embedded Memory | Embedded SRAM with built-in FIFO control logic | Embedded SRAM with built-in FIFO control logic |
| Clocking | Segmentable clocks, chip-wide highway routing | — |
| Arithmetic Support | Dedicated carry logic | — |
| درجة حرارة التشغيل | -55C to +125C | [DATA_NEEDED: operating temperature range] |
| العلبة | CG1152 - 1152-terminal ceramic metal-sealed cofired CBGA | 1152-ball ceramic column grid array (LG1152 / CGA-1152) |
| نوع التركيب | Surface Mount (BGA) | Surface Mount |
| Maximum Density in Family | Up to 4,000,000 equivalent system gates (RTAX-S/SL family) | — |
| حالة RoHS | [DATA_NEEDED: RoHS Status] | unknown (ceramic hermetic package; verify on product page) |
| مستوى MSL | [DATA_NEEDED: MSL Level] | — |
| CLBs (Logic Elements) | — | 21,504 |
| Technology | — | CMOS antifuse (OTP) |
| Family | — | RTAX-S/SL Radiation-Tolerant FPGAs |
| Speed Grade | — | -1 |
| Configuration | — | Live at power-up (antifuse, no external boot device) |
| Clock Features | — | Segmentable clocks, chip-wide synchronization |
| Programmability | — | One-time programmable (OTP) |
| Power | — | [DATA_NEEDED: static and dynamic power figures] |
| Core Voltage | — | [DATA_NEEDED: core supply voltage] |
| Qualification | — | Space/defense qualified flow (see Microchip DLA Cross Reference Guide) |