RTAX4000D-CQ352E vs RTAX4000SL-CQ352EV مقارنة
مقارنة تفصيلية جنبًا إلى جنب لـ RTAX4000D-CQ352E بواسطة Microsemi و RTAX4000SL-CQ352EV بواسطة Microchip Technology. قارن المواصفات الرئيسية والمعلمات الكهربائية والتغليف وحالة دورة الحياة والأسعار والتوافر لتحديد أفضل مكوّن لمتطلبات تصميمك.
Microchip Technology
RTAX4000SL-CQ352EV - 4M Gate Rad-Tolerant FPGA | Microchip
RTAX4000SL-CQ352EV ✓ نشطمقارنة المواصفات
| المعامل | RTAX4000D-CQ352E | RTAX4000SL-CQ352EV |
|---|---|---|
| العلامة التجارية | Microsemi | Microchip Technology |
| الفئة | FPGA & CPLD | FPGA & CPLD |
| حالة دورة الحياة | نشط | نشط |
| Family | RTAX-DSP Radiation-Tolerant FPGA | RTAX-SL (Radiation-Tolerant FPGA) |
| System Gates | 4,000,000 | 4,000,000 |
| Logic Cells | 33,600 | — |
| Process Technology | 0.15 um CMOS | 0.15 um CMOS antifuse |
| Core Supply Voltage | 1.5 V | 1.5 V |
| العلبة | 352-Pin CQFP (CQ352) ceramic, hermetic | 352-pin CQFP (Ceramic Quad Flat Pack) |
| Configuration | Live at power-up (antifuse, single-chip) | Single-chip, no external boot memory |
| Embedded Memory | Embedded SRAM with built-in FIFO control logic | — |
| Clocking | Segmentable clocks, chip-wide highway routing | — |
| Number of CLBs | [DATA_NEEDED: CLB / AX cell organization count] | — |
| User I/O Count | [DATA_NEEDED: user I/O count for CQ352 package] | — |
| Speed Grade | Standard (no dash-1 speed suffix indicated in CQ352E ordering code) | — |
| درجة حرارة التشغيل | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| Radiation Tolerance | Radiation-tolerant, space-flight qualified family (per Microchip RTAX-DSP product page) | Radiation-tolerant (TID/SEL/SEU per family datasheet) |
| نوع التركيب | Surface Mount | Surface Mount |
| حالة RoHS | [DATA_NEEDED: RoHS status - hermetic ceramic aerospace package, typically exempt] | [DATA_NEEDED: RoHS status] |
| Design Software | Microsemi/Microchip Libero SoC | — |
| Logic Cells (ASIC Gates) | — | 40,320 |
| Screening Level | — | EV (enhanced spaceflight screening) |
| Programming Technology | — | Antifuse (one-time programmable, live at power-up) |
| I/O Supply Voltage | — | [DATA_NEEDED: I/O bank voltage] |
| Maximum System Frequency | — | [DATA_NEEDED: maximum system frequency] |
| Package Material | — | Hermetic ceramic (JESD-30 S-CQFP-F352) |
| Typical Application | — | Space-flight systems, satellites, payload processing |