SCS8AC60EACFUE vs MC9S08DN32AMLC مقارنة
مقارنة تفصيلية جنبًا إلى جنب لـ SCS8AC60EACFUE بواسطة NXP Semiconductors و MC9S08DN32AMLC بواسطة NXP Semiconductors. قارن المواصفات الرئيسية والمعلمات الكهربائية والتغليف وحالة دورة الحياة والأسعار والتوافر لتحديد أفضل مكوّن لمتطلبات تصميمك.
مقارنة المواصفات
| المعامل | SCS8AC60EACFUE | MC9S08DN32AMLC |
|---|---|---|
| العلامة التجارية | NXP Semiconductors | NXP Semiconductors |
| الفئة | Microcontrollers | Microcontrollers |
| حالة دورة الحياة | Unknown | NRND |
| Product Type | 8-bit embedded microcontroller | — |
| Processor Family | HC08/S08 | — |
| Manufacturer | NXP Semiconductors | — |
| Architecture | 8-bit | — |
| جهد التغذية | [DATA_NEEDED: supply voltage] | [DATA_NEEDED: VDD range] |
| Clock Frequency | [DATA_NEEDED: clock frequency] | — |
| Flash Memory | [DATA_NEEDED: flash memory] | — |
| RAM | [DATA_NEEDED: RAM] | 1.5 KB (1.5K x 8) |
| GPIO Count | [DATA_NEEDED: GPIO count] | — |
| Serial Interfaces | [DATA_NEEDED: serial interfaces] | SCI (UART), SPI, I2C |
| Timers | [DATA_NEEDED: timer resources] | — |
| Analog Peripherals | [DATA_NEEDED: analog peripherals] | — |
| درجة حرارة التشغيل | [DATA_NEEDED: operating temperature range] | -40 C to +125 C |
| العلبة | [DATA_NEEDED: package type] | 32-LQFP (7x7 mm) |
| نوع التركيب | Surface-mount status not confirmed | Surface Mount |
| عدد الأطراف | [DATA_NEEDED: pin count] | — |
| RoHS | [DATA_NEEDED: RoHS status] | — |
| REACH | [DATA_NEEDED: REACH status] | — |
| حالة دورة الحياة | [DATA_NEEDED: manufacturer lifecycle status] | — |
| Core | — | HCS08 (S08) |
| Instruction Set | — | HC08 with BGND |
| CPU Frequency | — | 40 MHz |
| Bus Frequency | — | 20 MHz |
| Program Memory (Flash) | — | 32 KB (32K x 8) |
| EEPROM | — | Embedded |
| Number of I/O | — | 25 |
| ADC | — | 12-bit, up to 16 channels, 2.5 us conversion |
| CAN (MSCAN) | — | CAN 2.0 A/B |
| Packaging | — | Tray |
| حالة RoHS | — | Compliant |
| Oscillator Type | — | External |
| Debug Interface | — | Background Debug Mode (BDM) |