STM32F103ZCT7 vs STM32F103ZET7 مقارنة
مقارنة تفصيلية جنبًا إلى جنب لـ STM32F103ZCT7 بواسطة STMicroelectronics و STM32F103ZET7 بواسطة STMicroelectronics. قارن المواصفات الرئيسية والمعلمات الكهربائية والتغليف وحالة دورة الحياة والأسعار والتوافر لتحديد أفضل مكوّن لمتطلبات تصميمك.
STMicroelectronics
STM32F103ZCT7 - 72MHz 256KB Cortex-M3 MCU | STMicroelectronics
STM32F103ZCT7 ✓ نشطSTMicroelectronics
STM32F103ZET7 - 72MHz Cortex-M3 512KB MCU | STMicroelectronics
STM32F103ZET7 ✓ نشطمقارنة المواصفات
| المعامل | STM32F103ZCT7 | STM32F103ZET7 |
|---|---|---|
| العلامة التجارية | STMicroelectronics | STMicroelectronics |
| الفئة | Microcontrollers | Microcontrollers |
| حالة دورة الحياة | نشط | نشط |
| Product Type | 32-bit ARM Cortex-M3 microcontroller | 32-bit ARM Cortex-M3 microcontroller |
| أقصى تردد للساعة | 72 MHz | — |
| Flash Memory | 256 KB | — |
| Flash Organization | 256K x 8 bits | 512K x 8 |
| Processor Architecture | ARM Cortex-M3 | — |
| Instruction Width | 32-bit | — |
| العلبة | 144-pin LQFP | 144-LQFP |
| Supply Voltage Variant | 2.5 V / 3.3 V | — |
| Communication Interfaces | 13 communication interfaces | — |
| Timers | 11 timers | — |
| ADC Resources | 3 ADCs | — |
| USB Support | USB | — |
| CAN Support | CAN | — |
| Application Focus | Mixed-signal and timer-driven control | — |
| نوع التركيب | Surface-mount LQFP | Surface Mount |
| درجة حرارة التشغيل | [DATA_NEEDED: operating temperature range] | — |
| SRAM | [DATA_NEEDED: SRAM size] | — |
| GPIO Count | [DATA_NEEDED: GPIO count] | [DATA_NEEDED: GPIO count] |
| حالة RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| REACH Status | [DATA_NEEDED: REACH status] | [DATA_NEEDED: REACH status] |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification status] | [DATA_NEEDED: AEC-Q100 qualification] |
| Maximum Operating Frequency | — | 72 MHz |
| Architecture | — | 32-bit RISC |
| Embedded Flash Memory | — | 512 KB |
| Operating Voltage | — | 2.5 V/3.3 V |
| Timer Count | — | 11 timers |
| ADC Count | — | 3 ADCs |
| Communication Interface Count | — | 13 communication interfaces |
| USB Interface | — | USB |
| CAN Interface | — | CAN |
| Package Body Size | — | 20 mm x 20 mm |
| Core | — | ARM Cortex-M3 |
| MCU Family | — | STM32F1 high-density performance line |
| نطاق درجة حرارة التشغيل | — | [DATA_NEEDED: operating temperature range] |
| RAM Capacity | — | [DATA_NEEDED: RAM capacity] |