STM32F745ZET6 vs STM32F103ZET7 مقارنة
مقارنة تفصيلية جنبًا إلى جنب لـ STM32F745ZET6 بواسطة STMicroelectronics و STM32F103ZET7 بواسطة STMicroelectronics. قارن المواصفات الرئيسية والمعلمات الكهربائية والتغليف وحالة دورة الحياة والأسعار والتوافر لتحديد أفضل مكوّن لمتطلبات تصميمك.
STMicroelectronics
STM32F745ZET6 - 216MHz Cortex-M7 512KB MCU | STMicroelectronics
STM32F745ZET6 ✓ نشطSTMicroelectronics
STM32F103ZET7 - 72MHz Cortex-M3 512KB MCU | STMicroelectronics
STM32F103ZET7 ✓ نشطمقارنة المواصفات
| المعامل | STM32F745ZET6 | STM32F103ZET7 |
|---|---|---|
| العلامة التجارية | STMicroelectronics | STMicroelectronics |
| الفئة | Microcontrollers | Microcontrollers |
| حالة دورة الحياة | نشط | نشط |
| Core | 32-bit ARM Cortex-M7 | ARM Cortex-M3 |
| Maximum Operating Frequency | 216 MHz | 72 MHz |
| Flash Memory | 512 KB (512K x 8) | — |
| Architecture | 32-bit RISC | 32-bit RISC |
| العلبة | 144-LQFP (20 mm x 20 mm) | 144-LQFP |
| Supply Voltage Options | 1.8 V, 2.5 V, and 3.3 V | — |
| Microcontroller Family | STM32F7 | — |
| Product Type | 32-bit microcontroller IC | 32-bit ARM Cortex-M3 microcontroller |
| DSP/FPU Positioning | High-performance and DSP/FPU | — |
| نوع التركيب | Surface mount | Surface Mount |
| Packaging | Tray | — |
| RAM | [DATA_NEEDED: RAM memory] | — |
| نطاق درجة حرارة التشغيل | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| Maximum I/O Count | [DATA_NEEDED: maximum I/O count] | — |
| Peripheral Interfaces | [DATA_NEEDED: peripheral interfaces] | — |
| Clock Sources | [DATA_NEEDED: clock sources] | — |
| Flash Endurance | [DATA_NEEDED: Flash endurance] | — |
| ESD/Humidity Qualification | [DATA_NEEDED: ESD and humidity qualification] | — |
| RoHS | [DATA_NEEDED: RoHS status] | — |
| REACH | [DATA_NEEDED: REACH status] | — |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification] | [DATA_NEEDED: AEC-Q100 qualification] |
| Embedded Flash Memory | — | 512 KB |
| Operating Voltage | — | 2.5 V/3.3 V |
| Timer Count | — | 11 timers |
| ADC Count | — | 3 ADCs |
| Communication Interface Count | — | 13 communication interfaces |
| USB Interface | — | USB |
| CAN Interface | — | CAN |
| Package Body Size | — | 20 mm x 20 mm |
| MCU Family | — | STM32F1 high-density performance line |
| Flash Organization | — | 512K x 8 |
| RAM Capacity | — | [DATA_NEEDED: RAM capacity] |
| GPIO Count | — | [DATA_NEEDED: GPIO count] |
| حالة RoHS | — | [DATA_NEEDED: RoHS status] |
| REACH Status | — | [DATA_NEEDED: REACH status] |