10AX090R4F40I3LG - 900K LE Arria 10 GX FPGA, 1517-FCBGA | Intel
MPN: 10AX090R4F40I3LG ✓ نشط10AX090R4F40I3LG نظرة عامة
An FPGA (Field-Programmable Gate Array) is a semiconductor device whose digital logic fabric, routing, and I/O cells can be configured by the end user after manufacture. Within the broader taxonomy, FPGAs sit under programmable logic devices (PLDs) → programmable logic ICs → integrated circuits → semiconductors. Modern high-end FPGAs such as the Arria 10 GX family integrate hard IP for transceivers, external memory controllers (DDR3/DDR4/QDRIV), PCIe Gen3, and embedded hard processor subsystems, displacing what once required several discrete ASSPs.
Key features of the 10AX090R4F40I3LG include 1,518 DSP blocks delivering up to 1.5 TFLOPS of single-precision floating-point throughput, 24 full-duplex transceivers supporting CPRI, 10GbE, PCIe Gen3 x8, and backplane data rates up to 14.4 Gbps, and a hard floating-point multiplier chain for radar and beam-forming workloads. The device also integrates a hard memory controller supporting DDR4 up to 2,133 Mbps and QDRIV at up to 1,066 MHz, with an LVDS serializer/deserializer rate of up to 1.6 Gbps.
Architecturally, the Arria 10 GX fabric combines a logic array with embedded SRAM blocks, a fractional synthesis PLL network, and partial reconfiguration support that allows runtime swap of design blocks. The 14.4 Gbps transceivers are organized into six banks of four channels, each with dedicated PMA and PCS blocks optimized for backplane, chip-to-chip, and optical-module interfaces.
Typical applications include 4K/8K video broadcast and display processing, PCIe Gen3 accelerator cards, military radar and electronic-warfare front ends, 100G/400G OTN line-card bridging, and ASIC prototyping. The industrial temperature grade and high transceiver density make it a strong fit for long-life-cycle defense and industrial imaging systems where single-board compute density is critical.
When designing with the 10AX090R4F40I3LG, plan PCB power integrity for peak core current transients in excess of 60 A at 0.9 V; use a 14+ layer stack-up with low-inductance power planes and at least 30 decoupling capacitors distributed around the FCBGA. Always validate transceiver channel reach with the IBIS-AMI models provided by Intel before committing to PCB stack-up.
This page consolidates distributor pricing, drop-in same-package alternatives from the Arria 10 family, and design notes not aggregated on a single OEM or distributor page, giving procurement and FPGA architects a single reference for the 10AX090R4F40I3LG.
بدائل مباشرة لـ 10AX090R4F40I3LG — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع 10AX090R4F40I3LG (نفس عامل الشكل والبصمة) — يختلف في Package, RoHS Status, Process Technology, Transceivers, DSP Blocks.
10AX090R4F40E3LG
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←10AX090R3F40I2LG
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←10AX090N4F40I3LG
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←10AX090R3F40I2SG
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منهاتواصل لمعرفة السعر
عرض ورقة البيانات ←10AX090R2F40I2LG
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منهاتواصل لمعرفة السعر
عرض ورقة البيانات ←10AX090R4F40I3LG الحدود القصوى والخصائص الكهربائية
| Family | Arria 10 GX |
| Logic Elements (LE) | 900,000 |
| Embedded Memory (bits) | 59,234,304 |
| DSP Blocks | 1,518 |
| User I/O Count | 342 |
| Transceivers | 24 channels up to 14.4 Gbps |
| Hard Memory Controller | DDR3/DDR4/QDRIV |
| Process Technology | 20nm Tri-Gate CMOS |
| Core Voltage | 0.9 V |
| العلبة | 1517-ball FCBGA (40 x 40 mm) |
| درجة حرارة التشغيل | -40C to +100C (Industrial) |
| نوع التركيب | Surface Mount (BGA) |
| مستوى MSL | 3 |
| حالة RoHS | Compliant |
| PCIe Hard IP | PCIe Gen3 x8 |
دليل تكوين أطراف 10AX090R4F40I3LG 1517-ball fcbga (40 x 40 mm)
تكوين الأطراف لـ 10AX090R4F40I3LG (حزمة 1517-ball fcbga (40 x 40 mm)). تتضمن هذه الدائرة المتكاملة الرقمية GPIO وواجهات الاتصال (UART وSPI وI2C) وأطراف الطاقة. راجع ورقة بيانات الشركة المصنعة لوظائف الأطراف البديلة وخيارات التكوين. ضرورية لتصميم الأنظمة المدمجة وتخطيط PCB.
لا تتوفر بيانات مفصلة لمخطط التوصيلات لـ 10AX090R4F40I3LG.
راجع ورقة البيانات للحصول على تكوين الأطراف الكامل.
التطبيقات النموذجية
10AX090R4F40I3LG مناسب لـ 6 التطبيقs: PCIe Gen3 Accelerator Cards, 4K/8K Video Broadcast Processing, Military Radar and EW Front Ends, 100G/400G OTN Line-Card Bridging, ASIC Prototyping and Emulation, Industrial Imaging and Machine Vision.
PCIe Gen3 Accelerator Cards
The 10AX090R4F40I3LG fits PCIe Gen3 x8 accelerator cards because it integrates a hardened PCIe Gen3 controller and 24 transceivers at 14.4 Gbps, eliminating external PHY ICs. With 900K logic elements and 1,518 DSP blocks, designers can host deep-learning inference engines, FPGA-side preprocessing for AI workloads, or custom NVMe accelerators on the same die. The 342 user I/O and 0.9 V core simplify power-rail design at typical accelerator card budgets of 25-75 W.
موصى به
4K/8K Video Broadcast Processing
The 10AX090R4F40I3LG's 1,518 DSP blocks deliver several hundred GMACs of video pixel throughput, well matched to multi-channel 4Kp60 and 8K broadcast pipelines for SDI-over-IP, HEVC/H.265 mezzanine compression, and HDR tone mapping. The integrated DDR4 controller at 2,133 Mbps supports 4:4:4 frame buffers without external memory PHYs, and the 24 transceivers handle 12G-SDI, 25G Ethernet, and SMPTE 2110 IP-based video fabrics concurrently.
موصى به
Military Radar and EW Front Ends
The 10AX090R4F40I3LG is well suited to radar and electronic-warfare front-end processing thanks to its industrial -40C to +100C operating range, 1.5 TFLOPS floating-point capability via the DSP chain, and 14.4 Gbps transceivers for direct ADC-to-FPGA links such as JESD204B/C. The 900K logic elements provide headroom for adaptive beamforming weights, pulse compression, and CFAR detection at the same time as ethernet fan-out to back-end processors.
موصى به
100G/400G OTN Line-Card Bridging
The 10AX090R4F40I3LG handles OTN line-card bridging in metro and long-haul transport equipment because its 24 transceivers can be aggregated into multiple 100G OTU4 or 4x25G breakout ports without external muxponders. The 59 Mbit embedded memory and DDR4 controller simplify OTN framer buffering, and the 900K logic elements carry full ODUflex mapping, GMP encoding, and FEC (RS-FEC, GFEC) within a single device.
موصى به
ASIC Prototyping and Emulation
The 10AX090R4F40I3LG serves as an effective ASIC prototyping vehicle with 900K logic elements, abundant DSP and block RAM, and 342 user I/O for multi-FPGA partitioning. The industrial temperature grade supports bring-up at both bench and chassis temperatures, and the integrated PCIe Gen3 hard IP enables direct linking to host emulators such as Synopsys ZeBu or Cadence Protium for software co-verification.
موصى به
Industrial Imaging and Machine Vision
The 10AX090R4F40I3LG powers high-speed industrial imaging because its 1,518 DSP blocks handle real-time Bayer demosaic, lens distortion correction, and convolution at multi-gigapixel rates. The 24 transceivers link CoaXPress 2.0, 10 GigE Vision, and Camera Link HS cameras concurrently, while the DDR4 controller at 2,133 Mbps absorbs line-scan bursts. The industrial temperature grade ensures operation on factory floors without thermal throttling.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ 10AX090R4F40I3LG — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | 10AX090R4F40E3LG | 10AX090R3F40I2LG | 10AX090N4F40I3LG | 10AX090R3F40I2SG | 10AX090R2F40I2LG |
|---|---|---|---|---|---|---|
| Package | 1517-ball FCBGA (F40, 40x40 mm) | 1517-ball FCBGA (F40) - same | 1517-ball FCBGA (F40) - same | 1517-ball FCBGA (F40) - same | 1517-ball FCBGA (F40) - same | 1517-ball FCBGA (F40) - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Speed Grade | -4 (fastest) | -4 (same) | -3 (slower, ~15% lower Fmax) | -4 (same) | -3 (slower) | -2 (slowest) |
| Logic Elements | 900,000 | 900,000 | 900,000 | 900,000 | 900,000 | 900,000 |
| Transceiver Variant | GX (24 ch @ 14.4 Gbps) | GX (same) | GX (same) | GT (reduced) | GX (same) | GX (same) |
| Temperature Grade | Industrial (-40C to +100C) | Extended (commercial) | Industrial (same) | Industrial (same) | Industrial (same) | Industrial (same) |
| Core Voltage | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V |
أبرز الفروقات
- Industrial temperature grade in F40 package (مقابل10AX090R4F40E3LG)
- Fastest speed grade in the Arria 10 GX F40 family (مقابل10AX090R3F40I2LG)
- Full 24-channel 14.4 Gbps transceiver array (مقابل10AX090N4F40I3LG)
ملاحظات التصميم
Estimated: at 0.9 V core with peak transceiver utilization, the 10AX090R4F40I3LG can draw 60-90 A transient current. Use a 14+ layer PCB stack-up with dedicated 0.9 V and 1.8 V planes, place 30-50 ceramic decoupling capacitors (10 nF, 100 nF, and 4.7 uF mix) around the FCBGA periphery, and follow the Intel Power Distribution Network (PDN) design guidelines for Arria 10 to keep core voltage ripple below 2%.
The 1517-ball FCBGA has a theta_JB around 0.5 C/W and a theta_JA around 8-12 C/W depending on airflow. For 25 W sustained dissipation, attach a heatsink with thermal interface material rated for industrial temperatures, or use the FCBGA's top-side integrated heat-spreader footprint. Always validate with the Arria 10 thermal model and characterize in worst-case ambient (industrial: +100C).
Use microvia or stacked-via technology for fan-out from the 1 mm pitch FCBGA. Match trace lengths within a transceiver channel to within 0.127 mm to keep skew within the 14.4 Gbps margin. Reference-plane stitching vias must be placed every lambda/20 along high-speed traces to suppress resonances.
Do not assume the JTAG ID of speed-grade variants is identical - the Quartus programmer must match the exact MPN before configuration. Industrial (-I) and extended (-E) grades are NOT interchangeable for systems specified to operate beyond 0C. Always check the Intel PCN feed for the F40 package before committing a board revision to volume production.
معلومات الامتثال
RoHS and lead-free confirmed by the Heisener and Ampheo product pages; AEC-Q100 not applicable for an FPGA. Always request C of C for industrial-temp orders.
