ATSAM4S16CB-CFN - 120MHz Cortex-M4 MCU 1MB Flash | Microchip
MPN: ATSAM4S16CB-CFN ✓ نشطATSAM4S16CB-CFN نظرة عامة
A microcontroller (MCU) is a single integrated circuit that combines a processor core, program memory, data memory, and peripherals into one chip, forming the lowest tier of the embedded processing hierarchy (MCU -> embedded processor -> application processor). The ARM Cortex-M4 is a 32-bit RISC core optimized for deterministic real-time control, and when equipped with DSP instructions and a Memory Protection Unit (MPU) it serves both control and signal-processing roles in embedded systems.
Key features of the ATSAM4S16CB-CFN include the 120 MHz Cortex-M4 core with Thumb-2 instruction set and hardware DSP instructions, 1024 KB dual-bank Flash with ECC, Security Bit and lock regions for code protection, and pin-to-pin compatibility with the Microchip SAM7S, SAM3N and SAM3S MCU families, which protects software and PCB investment across generations.
Technically, the dual-bank Flash architecture supports safe in-application programming and firmware update strategies, while the MPU enables privileged/unprivileged software partitioning for robust designs. The Cortex-M4 DSP extension accelerates filtering and transform math such as FFT and FIR operations that are common in motor control and sensing applications.
Typical applications include industrial automation and motor control, consumer and portable devices, and embedded systems that need an upgrade path from SAM3S/SAM7S designs where the pin-compatible footprint allows a drop-in performance migration.
Design consideration: verify that the board power rails and BGA ball map support the operating temperature class of the -CFN green package, and budget Flash bank allocation before enabling ECC-protected dual-bank operation.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
بدائل مباشرة لـ ATSAM4S16CB-CFN — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع ATSAM4S16CB-CFN (نفس عامل الشكل والبصمة) — يختلف في Package, RoHS Status, USB, ADC, Packaging.
ATSAM4SA16CB-CFN
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←ATSAM4S8CB-CFN
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منهاتواصل لمعرفة السعر
عرض ورقة البيانات ←ATSAM4S16CA-CFN
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منهاتواصل لمعرفة السعر
عرض ورقة البيانات ←ATSAM4SD16CB-CFN
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منهاتواصل لمعرفة السعر
عرض ورقة البيانات ←ATSAM4N16CA-CFUR
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←ATSAM4S16CB-CFN الحدود القصوى والخصائص الكهربائية
| Core Processor | ARM Cortex-M4 |
| Core Size | 32-Bit Single-Core |
| أقصى تردد للساعة | 120 MHz |
| Flash Memory Size | 1 MB (1M x 8) |
| Flash Architecture | Dual-Bank with ECC, Security Bit and Lock |
| SRAM Size | 128 KB |
| Instruction Set | Thumb-2, DSP Instructions |
| Memory Protection | MPU (Memory Protection Unit) |
| Series | SAM4S (ATSAM4S16) |
| العلبة | 100-VFBGA (7x7 mm) |
| نوع التركيب | Surface Mount |
| Pin-to-Pin Compatibility | SAM7S, SAM3N, SAM3S MCUs |
| حالة RoHS | Green (RoHS compliant per Mouser listing) |
دليل تكوين أطراف ATSAM4S16CB-CFN 100-vfbga (7x7 mm)
تكوين الأطراف لـ ATSAM4S16CB-CFN (حزمة 100-vfbga (7x7 mm)). تتضمن هذه الدائرة المتكاملة الرقمية GPIO وواجهات الاتصال (UART وSPI وI2C) وأطراف الطاقة. راجع ورقة بيانات الشركة المصنعة لوظائف الأطراف البديلة وخيارات التكوين. ضرورية لتصميم الأنظمة المدمجة وتخطيط PCB.
لا تتوفر بيانات مفصلة لمخطط التوصيلات لـ ATSAM4S16CB-CFN.
راجع ورقة البيانات للحصول على تكوين الأطراف الكامل.
التطبيقات النموذجية
ATSAM4S16CB-CFN مناسب لـ 6 التطبيقs: Industrial Automation and Control, Motor Control Drives, Consumer and Portable Devices, Embedded Systems Upgrade from SAM3S/SAM7S, Data Loggers and Metering, IoT Sensor Nodes and Gateways.
Industrial Automation and Control
The ATSAM4S16CB-CFN fits industrial automation nodes because its 120 MHz Cortex-M4 core with DSP instructions executes control-loop math, protocol stacks, and HMI logic on a single chip, while the 1 MB dual-bank Flash with ECC holds large firmware images plus logging data with bit-error protection. In a factory sensor node or PLC I/O module, the MCU typically runs Modbus/CAN industrial protocols from the 1 MB Flash while the 128 KB SRAM buffers process data. The dual-bank architecture permits fail-safe field firmware updates without a bootloader window of vulnerability, and the Memory Protection Unit isolates the protocol stack from safety-critical control code. The 7x7 mm VFBGA footprint keeps the controller section compact on dense industrial PCBs, and SAM3S/SAM7S pin compatibility allows brown-field upgrades of installed bases.
موصى به
Motor Control Drives
The ATSAM4S16CB-CFN suits low-to-mid power motor drives because the Cortex-M4 DSP extension executes FOC field-oriented-control transforms - Clarke, Park, inverse Park, and PID - with single-cycle MAC operations at 120 MHz, providing loop bandwidth sufficient for PMSM and BLDC control. The 1 MB Flash stores sensorless observer algorithms alongside the control code, and ECC protects the algorithm image from Flash bit faults over product lifetime. The 128 KB SRAM accommodates current-sensor buffers and diagnostic logs. In a typical servo or fan drive, the MCU reads phase currents, computes the FOC pipeline at PWM frequency, and manages communication. The pin-compatible upgrade path from SAM3S allows existing drive designs to gain DSP performance without a board respin, reducing redesign cost and qualification effort.
موصى به
Consumer and Portable Devices
The ATSAM4S16CB-CFN serves consumer products such as wearable accessories, portable instruments, and smart peripherals where a 7x7 mm BGA saves board area and the 1 MB Flash supports feature-rich firmware including graphics or audio processing. The 120 MHz Cortex-M4 with DSP instructions accelerates sensor fusion, filtering, and audio decode routines, while the 128 KB SRAM handles frame and sample buffers. Green RoHS-compliant packaging meets consumer environmental regulations, and the dual-bank Flash enables over-the-air style firmware updates through a companion radio, a common requirement in connected consumer devices. Because the SAM4S family offers multiple memory density and package options sharing one die family, a single PCB platform can span product tiers by swapping to the ATSAM4S8CB-CFN lower-cost variant.
موصى به
Embedded Systems Upgrade from SAM3S/SAM7S
The ATSAM4S16CB-CFN is explicitly pin-to-pin compatible with the Microchip SAM7S, SAM3N, and SAM3S MCU families, making it the designated upgrade vehicle for legacy boards. A design built around a SAM3S at 64 MHz can migrate to the 120 MHz Cortex-M4 with doubled Flash (1 MB versus typical 256-512 KB) and 128 KB SRAM without changing the PCB land pattern, preserving the tooling investment while gaining DSP instructions and ECC Flash. Software porting effort is minimized through the shared CMSIS and peripheral architecture continuity across the Atmel/Microchip ARM lineups. Typical beneficiaries are legacy meters, controllers, and communication bridges whose feature growth has outgrown the older device. Validation should focus on the peripheral timing differences and the -CFN green BGA assembly profile rather than the ball map, which remains compatible.
موصى به
Data Loggers and Metering
The ATSAM4S16CB-CFN fits data acquisition loggers and energy metering front-ends where long Flash lifetime and data integrity matter. The dual-bank 1 MB Flash with ECC protects stored calibration constants and log records against Flash bit wear and single-bit errors, while the lock regions and Security Bit guard firmware and billing data against extraction. The 120 MHz Cortex-M4 with DSP instructions performs FFT and harmonic analysis for power-quality metering in real time, and the 128 KB SRAM buffers records between write cycles to Flash. A typical metering design uses the MCU to sample voltage and current channels, compute RMS energy and THD, and log results locally. The compact 7x7 mm BGA suits sealed meter enclosures, and the green package supports global regulatory acceptance for utility products.
موصى به
IoT Sensor Nodes and Gateways
The ATSAM4S16CB-CFN acts as the application host in IoT sensor nodes and edge gateways, running the sensor-fusion and protocol logic while a companion radio module handles connectivity. The Cortex-M4 DSP instructions accelerate calibration filtering and cryptographic-grade preprocessing, and the 1 MB dual-bank Flash securely stores the application plus an OTA update image in the alternate bank, enabling fail-safe remote updates - a critical feature for unattended deployed nodes. The 128 KB SRAM manages packet buffers and sensor FIFOs. The MPU partitions third-party driver code from application logic, improving robustness in long-life deployments. The 7x7 mm VFBGA keeps node PCBs compact for wall or pole mounting, and the pin-compatible family range allows a hardware platform to scale memory across product variants.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ ATSAM4S16CB-CFN — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | ATSAM4SA16CB-CFN | ATSAM4S8CB-CFN | ATSAM4S16CA-CFN | ATSAM4SD16CB-CFN | ATSAM4N16CA-CFUR |
|---|---|---|---|---|---|---|
| Package | 100-VFBGA (7x7 mm) | 100-VFBGA (7x7 mm) - same | 100-VFBGA (7x7 mm) - same | 100-VFBGA (7x7 mm) - same | 100-VFBGA (7x7 mm) - same | 100-VFBGA - same footprint family |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core | ARM Cortex-M4, 120 MHz | ARM Cortex-M4, 120 MHz | ARM Cortex-M4, 120 MHz | ARM Cortex-M4, 120 MHz | ARM Cortex-M4, 120 MHz | ARM Cortex-M4, 120 MHz (lower power) |
| Flash Memory | 1 MB dual-bank, ECC | 1 MB class | 512 KB (-50%) | 1 MB | 1 MB | 1 MB |
| DSP Instructions | Yes (Cortex-M4 DSP) | Yes | Yes | Yes | Yes | Yes |
| Flash ECC / Security | ECC, Security Bit, Lock | ECC, enhanced security features | ECC, Security Bit, Lock | ECC, Security Bit, Lock | ECC, Security Bit, Lock | ECC, Security Bit, Lock |
| Pin Compatibility (SAM3S/SAM7S) | Yes | Yes | Yes | Yes | Yes | Yes (SAM4N family) |
أبرز الفروقات
- Largest Flash in the 100-VFBGA pin-compatible family (مقابلATSAM4S8CB-CFN)
- Security-enhanced sibling available without respin (مقابلATSAM4SA16CB-CFN)
- Pin-to-pin upgrade from three legacy families (مقابلATSAM4SD16CB-CFN)
ملاحظات التصميم
Design the BGA land pattern strictly from the SAM4S datasheet 100-ball VFBGA (7x7 mm) ball map rather than copying from SAM3S documents, even though the families are pin-to-pin compatible - verify via the official SAM4S datasheet that the ball assignments match your board revision. For the 0.8 mm-class BGA pitch, specify a standard NSMD pad with via-in-pad or dog-bone escape routing on outer layers, and check your fab house capability for the trace/space required under the 7x7 mm body.
Plan the power tree around the SAM4S core-and-peripheral supply architecture described in the SAM4S datasheet, providing clean decoupling at each supply ball pair with 100 nF ceramics placed on the opposite side of the board directly under the BGA, plus bulk capacitance near the regulator. Estimate: with a 120 MHz Cortex-M4 running full-speed code from Flash, dynamic current scales with clock, so budget regulator headroom for worst-case peripheral-plus-core load rather than typical sleep-mode figures.
Do not treat the dual-bank Flash as ordinary single-bank memory in your bootloader design: bank swap, ECC configuration, and lock-region changes must follow the SAM4S datasheet flash controller sequence, and an incorrectly implemented swap can brick field units. Also confirm Security Bit policy early - once set, debug access is permanently restricted. When migrating from SAM3S, re-verify peripheral clock dividers, since the 120 MHz maximum is double the older family limit.
معلومات الامتثال
Mouser listing describes the package as BGA, GREEN with MRL data, indicating green RoHS-compliant packaging. Detailed REACH/halogen-free status should be confirmed via Microchip compliance documentation.