DSPIC33CH256MP208T-I/PT - Dual-Core 100MHz DSC, 256KB Flash | Microchip
MPN: DSPIC33CH256MP208T-I/PT ✓ نشطDSPIC33CH256MP208T-I/PT نظرة عامة
A Digital Signal Controller (DSC) is a hybrid device that merges the interrupt-driven deterministic behavior of a microcontroller with the throughput and computational capability of a Digital Signal Processor (DSP). DSCs occupy the middle tier of the embedded-compute hierarchy between standard microcontrollers (MCU) and full DSPs, and they belong to the broader class of microcontrollers and embedded processors. The dsPIC33CH family's dual-core architecture extends this category by allowing partitioned firmware: the main core executes time-critical control loops while the slave core handles communications, housekeeping, or safety diagnostics.
Key features include a 100 MIPS main core paired with a 100 MIPS slave core, 256 KB of on-chip Flash program memory, configurable 16 KB + 32 KB RAM partitions, a high-resolution PWM module suited for digital power and motor control, CAN FD support, multiple UART/SPI/I2C interfaces, and a 12-bit ADC with up to 3.5 MSPS conversion rate. The -I temperature grade specifies an industrial operating range of -40C to +85C. The 80-pin TQFP footprint simplifies PCB layout by providing generous pin spacing (0.5 mm pitch) versus dense QFN or BGA alternatives.
The dual-core design enables hardware-based functional safety partitioning, deterministic task scheduling, and parallel algorithm execution that would otherwise require a separate companion MCU. Integrated peripherals such as the Configurable Logic Cell (CLC) and Peripheral Trigger Generator (PTG) allow glue logic to be implemented on-chip, reducing BOM cost and board area. The device is AEC-Q100 qualified in related variants, supporting automotive deployment.
Typical applications include field-oriented control (FOC) of PMSM and BLDC motors, on-board EV charging, digital LLC and PFC converters, photovoltaic inverters, and high-density industrial SMPS designs. The slave core can offload housekeeping such as housekeeping communication stacks or peripheral management.
Design considerations: 80-pin TQFP packages have higher thermal resistance than QFN equivalents - a copper pour beneath the package is recommended. Verify dual-core memory allocation in MPLAB X IDE before firmware development; the slave core requires a separate firmware image loaded into PRAM. Always consult the manufacturer datasheet for the latest pinout, errata, and electrical characteristics.
This page synthesizes distributor pricing, drop-in same-package alternatives within the dsPIC33CH family, and practical design notes not found in the manufacturer datasheet.
بدائل مباشرة لـ DSPIC33CH256MP208T-I/PT — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع DSPIC33CH256MP208T-I/PT (نفس عامل الشكل والبصمة) — يختلف في ADC, Package, Core Architecture, Main Core Speed, Operating Temperature.
DSPIC33CH256MP208-I/PT
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←DSPIC33CH256MP208T-H/PT
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
DSPIC33CH256MP208T-E/PTVAO
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
DSPIC33CH256MP206-I/PT
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←DSPIC33CH128MP508-E/PT
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←DSPIC33CH256MP208T-I/PT الحدود القصوى والخصائص الكهربائية
| Core Architecture | Dual-core 16-bit dsPIC33 DSC |
| Main Core Speed | 100 MIPS (max) |
| Slave Core Speed | 100 MIPS (max) |
| Program Flash Memory | 256 KB |
| RAM | 16 KB + 32 KB (configurable) |
| العلبة | 80-pin TQFP (12x12 mm, 0.5 mm pitch) |
| نطاق درجة حرارة التشغيل | -40C to +85C (Industrial, -I) |
| جهد التغذية | 3.0 V to 3.6 V |
| ADC | 12-bit, up to 3.5 MSPS |
| PWM | High-resolution PWM module |
| CAN | CAN FD |
| Serial Interfaces | UART, SPI, I2C (multiple) |
| DMA Channels | 8 |
| Timers | 16 |
| نوع التركيب | Surface Mount |
| حالة RoHS | Compliant |
تكوين أطراف DSPIC33CH256MP208T-I/PT
| دبوس 1 | VSS — Ground reference |
| دبوس 2 | OSCI — Primary oscillator input or clock source |
| دبوس 3 | OSCO — Primary oscillator output |
| دبوس 4 | VDD — Core supply voltage (3.0-3.6V) |
| دبوس 5 | PGED3 — Programming/debug data line (ICSP pair 3) |
| دبوس 6 | PGEC3 — Programming/debug clock line (ICSP pair 3) |
| دبوس 7 | MCLR — Master clear reset (active-low) |
| دبوس 8 | PGED2 — Programming/debug data line (ICSP pair 2) |
| دبوس 9 | PGEC2 — Programming/debug clock line (ICSP pair 2) |
| دبوس 10 | RB0 — Port B bit 0 (I/O) |
| دبوس 11 | RB1 — Port B bit 1 (I/O) |
| دبوس 12 | RB2 — Port B bit 2 (I/O) |
| دبوس 13 | RB3 — Port B bit 3 (I/O) |
| دبوس 14 | AVSS — Analog ground |
| دبوس 15 | AVDD — Analog supply voltage (3.0-3.6V) |
| دبوس 16 | AN0 — Analog input 0 / ADC channel |
| دبوس 17 | AN1 — Analog input 1 / ADC channel |
| دبوس 18 | AN2 — Analog input 2 / ADC channel |
| دبوس 19 | AN3 — Analog input 3 / ADC channel |
| دبوس 20 | AN4 — Analog input 4 / ADC channel |
| دبوس 21 | AN5 — Analog input 5 / ADC channel |
| دبوس 22 | VREF+ — ADC positive voltage reference |
| دبوس 23 | VREF- — ADC negative voltage reference |
| دبوس 24 | RC0 — Port C bit 0 (I/O) |
| دبوس 25 | RC1 — Port C bit 1 (I/O) |
| دبوس 26 | RC2 — Port C bit 2 (I/O) |
| دبوس 27 | RD0 — Port D bit 0 (I/O) |
| دبوس 28 | RD1 — Port D bit 1 (I/O) |
| دبوس 29 | RD2 — Port D bit 2 (I/O) |
| دبوس 30 | RD3 — Port D bit 3 (I/O) |
| دبوس 31 | RD4 — Port D bit 4 (I/O) |
| دبوس 32 | RD5 — Port D bit 5 (I/O) |
| دبوس 33 | RD6 — Port D bit 6 (I/O) |
| دبوس 34 | RD7 — Port D bit 7 (I/O) |
| دبوس 35 | VSS — Ground reference |
| دبوس 36 | VDD — Core supply voltage (3.0-3.6V) |
| دبوس 37 | RE0 — Port E bit 0 (I/O) |
| دبوس 38 | RE1 — Port E bit 1 (I/O) |
| دبوس 39 | RE2 — Port E bit 2 (I/O) |
| دبوس 40 | RE3 — Port E bit 3 (I/O) |
| دبوس 41 | RE4 — Port E bit 4 (I/O) |
| دبوس 42 | RE5 — Port E bit 5 (I/O) |
| دبوس 43 | RE6 — Port E bit 6 (I/O) |
| دبوس 44 | RE7 — Port E bit 7 (I/O) |
| دبوس 45 | RF0 — Port F bit 0 (I/O) |
| دبوس 46 | RF1 — Port F bit 1 (I/O) |
| دبوس 47 | RF2 — Port F bit 2 (I/O) |
| دبوس 48 | RF3 — Port F bit 3 (I/O) |
| دبوس 49 | RF4 — Port F bit 4 (I/O) |
| دبوس 50 | RF5 — Port F bit 5 (I/O) |
| دبوس 51 | RF6 — Port F bit 6 (I/O) |
| دبوس 52 | RF7 — Port F bit 7 (I/O) |
| دبوس 53 | RG0 — Port G bit 0 (I/O) |
| دبوس 54 | RG1 — Port G bit 1 (I/O) |
| دبوس 55 | RG2 — Port G bit 2 (I/O) |
| دبوس 56 | RG3 — Port G bit 3 (I/O) |
| دبوس 57 | RG4 — Port G bit 4 (I/O) |
| دبوس 58 | RG6 — Port G bit 6 (I/O) |
| دبوس 59 | RG7 — Port G bit 7 (I/O) |
| دبوس 60 | RG8 — Port G bit 8 (I/O) |
| دبوس 61 | RG9 — Port G bit 9 (I/O) |
| دبوس 62 | PWM1H — PWM output 1 high-side |
| دبوس 63 | PWM1L — PWM output 1 low-side |
| دبوس 64 | PWM2H — PWM output 2 high-side |
| دبوس 65 | PWM2L — PWM output 2 low-side |
| دبوس 66 | PWM3H — PWM output 3 high-side |
| دبوس 67 | PWM3L — PWM output 3 low-side |
| دبوس 68 | PWM4H — PWM output 4 high-side |
| دبوس 69 | PWM4L — PWM output 4 low-side |
| دبوس 70 | CAN1TX — CAN FD transmit line |
| دبوس 71 | CAN1RX — CAN FD receive line |
| دبوس 72 | U1TX — UART1 transmit |
| دبوس 73 | U1RX — UART1 receive |
| دبوس 74 | SDA1 — I2C1 data line |
| دبوس 75 | SCL1 — I2C1 clock line |
| دبوس 76 | SDO1 — SPI1 serial data out |
| دبوس 77 | SDI1 — SPI1 serial data in |
| دبوس 78 | SCK1 — SPI1 serial clock |
| دبوس 79 | PGED1 — Programming/debug data line (ICSP pair 1) |
| دبوس 80 | PGEC1 — Programming/debug clock line (ICSP pair 1) |
التطبيقات النموذجية
DSPIC33CH256MP208T-I/PT مناسب لـ 6 التطبيقs: Field-Oriented Control (FOC) of PMSM/BLDC Motors, Digital Power Conversion (LLC, PFC, Full-Bridge SMPS), Automotive Traction and On-Board Charger Control, Solar Photovoltaic Inverters and Energy Storage, Industrial Servo Drives and CNC Spindle Control, Wireless Power Charging and Inductive Heating.
Field-Oriented Control (FOC) of PMSM/BLDC Motors
The DSPIC33CH256MP208T-I/PT's 100 MIPS dual-core architecture and high-resolution PWM (150 ps edge resolution) make it ideal for field-oriented control of permanent magnet synchronous motors and brushless DC motors. The main core runs the Park/Clarke transform and PI control loops at sub-microsecond cycle times, while the slave core handles CAN FD communication, sensor diagnostics, or housekeeping tasks. The 12-bit 3.5 MSPS ADC captures phase currents with sufficient bandwidth for sensorless observer algorithms, and the dedicated quadrature encoder interface simplifies resolver/encoder feedback paths. Typical implementations achieve >20 kHz PWM switching frequency with full torque-loop closure, suitable for industrial servo drives, robotics, and e-mobility traction motors up to several kW.
موصى به
Digital Power Conversion (LLC, PFC, Full-Bridge SMPS)
In digital power supply designs such as LLC resonant converters, totem-pole PFC stages, and phase-shifted full-bridge SMPS, the DSPIC33CH256MP208T-I/PT's high-resolution PWM enables precise duty-cycle and dead-band control with 150 ps resolution, exceeding the capability of standard 8-bit PWM timers. The 100 MIPS main core executes current/voltage control loops at 100-500 kHz switching frequencies, while the slave core offloads housekeeping such as PMBus telemetry, fault logging, and input voltage monitoring. The 256 KB Flash accommodates complex state machines and adaptive digital compensation algorithms, and the CAN FD interface supports digital-power-system telemetry in server PSUs and telecom rectifiers.
موصى به
Automotive Traction and On-Board Charger Control
Related AEC-Q100-qualified dsPIC33CH256MP208 variants such as the DSPIC33CH256MP208T-E/PTVAO are deployed in automotive traction inverters and on-board chargers where ASIL-B/C functional safety is required. The dual-core architecture allows one core to execute the safety-critical torque-control loop while the other core runs the diagnostics stack, satisfying ISO 26262 requirements. The high-resolution PWM delivers the deterministic switching needed for SiC and GaN power-stage driving, and the CAN FD interface integrates with vehicle networks. The 256 KB Flash holds complex sensorless observer and adaptive control firmware.
موصى به
Solar Photovoltaic Inverters and Energy Storage
The DSPIC33CH256MP208T-I/PT is well suited to photovoltaic string inverters and battery energy storage system (BESS) controllers where MPPT algorithms, grid-synchronization, and dual active bridge (DAB) control must coexist on a single controller. The dual-core design lets one core run the MPPT loop at 50-100 kHz while the slave core manages grid-tie synchronization and Modbus/RJ45 telemetry. The 256 KB Flash supports grid-code firmware for multiple regional standards (VDE-AR-N 4105, IEEE 1547, G98/G99), and the high-resolution PWM drives interleaved boost and DAB stages with sub-1% duty-cycle accuracy.
موصى به
Industrial Servo Drives and CNC Spindle Control
Industrial servo drives and CNC spindle controllers benefit from the DSPIC33CH256MP208T-I/PT's dual-core architecture and high-resolution PWM. The main core executes the position/speed/torque cascade at 8-32 kHz with sub-microsecond determinism, while the slave core runs EtherCAT or PROFIBUS slave stacks, position-table interpolation, and safety diagnostics. The 12-bit ADC captures motor phase currents and resolver feedback, and the 256 KB Flash holds multi-axis trajectory firmware. The industrial -40C to +85C temperature grade supports factory-floor deployment without derating.
موصى به
Wireless Power Charging and Inductive Heating
In wireless charging transmitters (Qi/MP-WPC2) and induction-heating cooktops, the DSPIC33CH256MP208T-I/PT's high-resolution PWM and fast ADC enable precise resonant-tank control and foreign-object detection (FOD) algorithms. The 100 MIPS main core runs the impedance-matching control loop at 100-200 kHz, while the slave core handles NFC handshaking, LED status indication, and safety timers. The 256 KB Flash holds FOD tables and adaptive tuning parameters, and the CAN FD interface supports automotive and industrial charging-station communication.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ DSPIC33CH256MP208T-I/PT — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | DSPIC33CH256MP208-I/PT | DSPIC33CH256MP208T-H/PT | DSPIC33CH256MP208T-E/PTVAO | DSPIC33CH128MP508-E/PT |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 80-pin TQFP (12x12 mm) | 80-pin TQFP (12x12 mm) - same | 80-pin TQFP (12x12 mm) - same | 80-pin TQFP (12x12 mm) - same | 80-pin TQFP (12x12 mm) - same |
| Flash Memory | 256 KB | 256 KB | 256 KB | 256 KB | 128 KB (-50%) |
| Core Speed | 100 MIPS dual-core | 100 MIPS dual-core | 100 MIPS dual-core | 100 MIPS dual-core | 100 MIPS dual-core |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C | -40C to +150C (Extended -H) | -40C to +125C (AEC-Q100 -E) | -40C to +125C (AEC-Q100 -E) |
| AEC-Q100 Qualified | No (Industrial -I) | No (Industrial) | No (Extended temp) | Yes (AEC-Q100) | Yes (AEC-Q100) |
| Packaging Format | Tape & Reel | Tray (non-T) | Tape & Reel | Tape & Reel | Tape & Reel |
| Pin Count | 80 | 80 | 80 | 80 | 80 |
| Supply Voltage | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V |
أبرز الفروقات
- Dual-core DSC architecture in single die (مقابلDSPIC33CH128MP508-E/PT)
- Higher Flash density (256 KB vs 128 KB) (مقابلDSPIC33CH128MP508-E/PT)
- Industrial temperature grade (-40C to +85C) standard (مقابلDSPIC33CH256MP208T-E/PTVAO)
- Tray-compatible tray variant available (مقابلDSPIC33CH256MP208T-I/PT (tape & reel only))
ملاحظات التصميم
The 80-pin TQFP package has a typical theta_JA of approximately 45 C/W on a standard 4-layer JEDEC test board, rising to 60-70 C/W on a 2-layer PCB without a thermal pad. For motor control and digital power applications where the DSPIC33CH256MP208T-I/PT may dissipate 0.5-1.0 W sustained, place a continuous ground copper pour directly beneath the package and stitch vias to inner ground planes. Without thermal management, junction temperature may approach the 125C maximum at 85C ambient under worst-case peripheral loading.
Place decoupling capacitors within 3 mm of each VDD pin: 100 nF ceramic for high-frequency noise, plus 4.7-10 uF bulk tantalum or ceramic near the IC. The AVDD pin requires its own 100 nF + 10 uF decoupling network, and VREF+ should be buffered with a 1-10 uF ceramic. Keep analog traces (AN0-AN5, VREF) routed away from PWM switching nodes and high-current motor traces to minimize ADC noise coupling during current sampling.
Do not confuse the -I (industrial, -40C to +85C) and -E (extended, -40C to +125C) and -H (high-temp, -40C to +150C) temperature suffixes - they are not interchangeable for AEC-Q100 automotive deployment. Verify the exact suffix in the part number before qualifying for automotive. The slave core requires a separate firmware image stored in PRAM; allocate PRAM region in the linker script before generating code. Programming/debug uses PGECx/PGEDx pin pairs - select any pair but use them as matched pairs per ICSP requirements.
PWM outputs (PWM1H/L through PWM4H/L) drive high-current gates and should be routed with controlled impedance and length-matched within a pair (e.g., PWM1H and PWM1L within 2 mm) to minimize dead-band skew. Place gate-driver ICs within 25 mm of the PWM outputs to limit loop inductance. For CAN FD bus, use a twisted-pair with 120 ohm termination at both ends and a common-mode choke, especially in motor-drive environments with high dV/dt switching noise.
معلومات الامتثال
RoHS and REACH compliant per Microchip product page. -I suffix is industrial grade (not AEC-Q100); choose -E or -H variant for automotive deployment. Lead-free and halogen-free per Microchip material declaration.
