DSPIC33EP32GP504T-E/ML - 16-bit 60MIPS DSC 32KB Flash | Microchip
MPN: DSPIC33EP32GP504T-E/ML ✓ نشطDSPIC33EP32GP504T-E/ML نظرة عامة
A digital signal controller combines the computational architecture of a digital signal processor (DSP) with the peripheral set and ease of use of a microcontroller (MCU). Within the power-management hierarchy, the dsPIC33EP family sits above basic 8-bit MCUs and below high-end 32-bit application processors, making it a workhorse for embedded control tasks that need real-time math such as PID loops, digital filtering, and power-conversion control.
Key features include a 16-bit dsPIC core with DSP engine (17-bit x 17-bit multiplier, 40-bit accumulator, dual modulo and bit-reversed addressing), 32KB self-programmable FLASH, up to 70 MIPS rated family speed (60 MIPS for this speed grade), on-chip CAN 2.0B, CTMU (Charge Time Measurement Unit), and a Peripheral Trigger Generator (PTG) that offloads task scheduling from the CPU. The supplied operating voltage is 3.3V (2.97V to 3.63V per family design), enabling low-power 3.3V system design.
Architecturally, the dsPIC33EP uses an enhanced Harvard pipeline with deterministic single-cycle multiply-accumulate, which is why the family is favored for motor control and switch-mode power supplies where interrupt latency predictability matters. The exposed-pad 44-QFN improves thermal dissipation and supply-noise performance compared with leaded packages.
Typical applications include brushless DC (BLDC) and PMSM motor control, digital power supplies (PFC, LLC), automotive body and sensor modules exploiting AEC-Q100 qualification, and industrial sensors that use CAN or UART communication.
Design consideration: budget the 2KB RAM carefully - the DSP accumulators, DMA buffers, and CAN message buffers all compete for this small data space, so use linker scatter and X/Y data memory segmentation deliberately.
This page synthesizes distributor pricing, same-footprint drop-in alternatives, and practical design notes not found in the manufacturer datasheet, with prices as of 2026-09-24.
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الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع DSPIC33EP32GP504T-E/ML (نفس عامل الشكل والبصمة) — يختلف في Package, Operating Temperature, RAM, Core, Program Memory.
DSPIC33EP32GP504-E/ML
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منهاتواصل لمعرفة السعر
عرض ورقة البيانات ←DSPIC33EP32GP504T-I/ML
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DSPIC33EP32GP504-I/ML
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منهاتواصل لمعرفة السعر
عرض ورقة البيانات ←DSPIC33EP64GP504T-E/ML
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عرض ورقة البيانات ←DSPIC33EP128GP504T-E/ML
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منهاتواصل لمعرفة السعر
عرض ورقة البيانات ←DSPIC33EP32MC504T-E/ML
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منهاتواصل لمعرفة السعر
عرض ورقة البيانات ←DSPIC33EP32GP504T-E/ML الحدود القصوى والخصائص الكهربائية
| Core | dsPIC33E 16-bit DSC core |
| Core Speed | 60 MIPS |
| Family Maximum Speed | 70 MIPS |
| Program Memory | 32KB (10.7K x 24) FLASH |
| RAM | 2KB |
| Operating Voltage | 3.3 V |
| Supply Voltage Range | 2.97 V to 3.63 V |
| العلبة | 44-QFN (8x8 mm), exposed pad |
| نوع التركيب | Surface Mount |
| درجة حرارة التشغيل | -40C to +125C |
| Qualification | AEC-Q100 qualified, automotive |
| Series | dsPIC 33EP |
| Technology | CMOS |
| Packaging | Tape & Reel (T suffix) |
| حالة RoHS | Compliant (lead-free) |
| Peripherals (family) | CAN, CTMU, PTG, Op Amps |
تكوين أطراف DSPIC33EP32GP504T-E/ML
| دبوس 1 | MCLR — Master clear reset input / programming voltage |
| دبوس 2 | AN0/VREF+/CN3/RB0 — Analog input 0 / positive voltage reference |
| دبوس 3 | AN1/VREF-/CN2/RB1 — Analog input 1 / negative voltage reference |
| دبوس 4 | AN2/SS1/CN4/RB2 — Analog input 2 / SPI slave select 1 |
| دبوس 5 | AN3/INDX/CN5/RB3 — Analog input 3 / QEI index input |
| دبوس 6 | AN4/QEA/IC7/CN6/RB4 — Analog input 4 / QEI phase A / capture 7 |
| دبوس 7 | AN5/QEB/IC8/CN7/RB5 — Analog input 5 / QEI phase B / capture 8 |
| دبوس 8 | AN6/OCFA/RB6 — Analog input 6 / output-compare fault A |
| دبوس 9 | AN7/OCFB/RB7 — Analog input 7 / output-compare fault B |
| دبوس 10 | AN8/RB8 — Analog input 8 / digital I/O |
| دبوس 11 | AN9/RB9 — Analog input 9 / digital I/O |
| دبوس 12 | TCK — JTAG test clock |
| دبوس 13 | TDI — JTAG test data input |
| دبوس 14 | TDO — JTAG test data output |
| دبوس 15 | TMS — JTAG test mode select |
| دبوس 16 | VSS — Ground reference |
| دبوس 17 | VDD — Positive supply (3.3V) |
| دبوس 18 | PGEC1/AN10/RB10 — Programming clock 1 / analog input 10 |
| دبوس 19 | PGED1/AN11/RB11 — Programming data 1 / analog input 11 |
| دبوس 20 | PGEC2/AN12/RB12 — Programming clock 2 / analog input 12 |
| دبوس 21 | PGED2/AN13/RB13 — Programming data 2 / analog input 13 |
| دبوس 22 | VSS — Ground reference |
| دبوس 23 | VDD — Positive supply (3.3V) |
| دبوس 24 | AN14/CVREF/RB14 — Analog input 14 / comparator voltage reference |
| دبوس 25 | AN15/RB15 — Analog input 15 / digital I/O |
| دبوس 26 | AVDD — Analog supply (3.3V) |
| دبوس 27 | AVSS — Analog ground |
| دبوس 28 | PWM1L1/RE0 — Motor PWM 1 low / digital I/O |
| دبوس 29 | PWM1H1/RE1 — Motor PWM 1 high / digital I/O |
| دبوس 30 | PWM1L2/RE2 — Motor PWM 2 low / digital I/O |
| دبوس 31 | PWM1H2/RE3 — Motor PWM 2 high / digital I/O |
| دبوس 32 | PWM1L3/RE4 — Motor PWM 3 low / digital I/O |
| دبوس 33 | PWM1H3/RE5 — Motor PWM 3 high / digital I/O |
| دبوس 34 | PWM2L1/RE6 — Motor PWM 4 low / digital I/O |
| دبوس 35 | PWM2H1/RE7 — Motor PWM 4 high / digital I/O |
| دبوس 36 | PWM2L2/RF0 — Motor PWM 5 low / digital I/O |
| دبوس 37 | PWM2H2/RF1 — Motor PWM 5 high / digital I/O |
| دبوس 38 | SDA1/RF2 — I2C data 1 / digital I/O |
| دبوس 39 | SCL1/RF3 — I2C clock 1 / digital I/O |
| دبوس 40 | RC12 — Digital I/O / RTCC secondary oscillator option |
| دبوس 41 | SOSCI/CN1/RC13 — 32kHz secondary oscillator input / change notify |
| دبوس 42 | SOSCO/T1CK/CN0/RA4 — 32kHz secondary oscillator output / Timer1 clock |
| دبوس 43 | OSC1/CLKI/RA2 — Primary oscillator input / external clock |
| دبوس 44 | OSC2/CLKO/RA3 — Primary oscillator output / crystal connection |
التطبيقات النموذجية
DSPIC33EP32GP504T-E/ML مناسب لـ 6 التطبيقs: Brushless DC Motor Control, Digital Power Supplies, Automotive Body and Sensor Modules, Industrial Sensor Interfaces, Embedded Control and Automation, Consumer and IoT Devices.
Brushless DC Motor Control
The DSPIC33EP32GP504T-E/ML fits BLDC and PMSM motor control because its 16-bit DSP engine executes field-oriented control math deterministically at 60 MIPS, with single-cycle 17x17 multiply and 40-bit accumulation for fast PI and Park/Clarke transforms. The dsPIC33EP GP family PWM outputs drive three-phase bridges, and the deterministic interrupt latency keeps current-loop sampling jitter low. Placed as the sole MCU driving the gate-driver stage, it reads phase currents through its ADC and commutates within one PWM period; the trade-off is that only 2KB RAM constrains buffer sizes, so keep current-loop state compact and use X/Y memory segmentation for DSP data.
موصى به
Digital Power Supplies
Switch-mode power supplies (PFC, LLC, flyback) benefit from the DSPIC33EP32GP504T-E/ML's combination of 60 MIPS real-time loop capability, ADC-triggered PWM updates, and the Peripheral Trigger Generator that chains ADC conversion to PWM duty updates without CPU intervention. Running voltage and current compensators at the switching frequency is achievable because the DSP MAC operations execute in single cycles at 3.3V. The CTMU supports precision time measurement for auxiliary functions. The design consideration is the 2KB RAM: keep compensator state and software multipliers in X/Y data space and avoid large ISR local frames, and budget a compact bootloader in the 32KB FLASH.
موصى به
Automotive Body and Sensor Modules
Because the DSPIC33EP32GP504T-E/ML is AEC-Q100 qualified and rated -40C to +125C, it suits automotive body electronics such as valve drivers, sensor conditioners, and lighting control modules operating near heat sources. The E extended-temperature suffix plus Q100 screening means the part has passed automotive stress qualification, and CAN 2.0B on the family enables in-vehicle network nodes at 1 Mbit/s. Implementation typically uses CAN for communication, the CTMU for capacitive touch or time measurement, and PWM outputs for actuators. The main design consideration is 3.3V logic interfacing with 12V automotive loads through appropriate transceivers and protection.
موصى به
Industrial Sensor Interfaces
Industrial sensor nodes use the DSPIC33EP32GP504T-E/ML's 16-bit ADC inputs AN0-AN15, CTMU for ratiometric measurement, and DSP capability for digital filtering of noisy sensor signals. The 60 MIPS core can run IIR/FIR filters and RMS computations in real time while a UART or CAN link transmits processed data. The extended -40C to +125C range suits furnace-adjacent and outdoor enclosures, and the exposed-pad 44-QFN conducts heat away on a copper pour. Designers should place precision analog away from PWM switching noise on the PCB and use the on-chip VREF options; the 2KB RAM limits long sample buffers, so stream data instead of storing it.
موصى به
Embedded Control and Automation
General embedded control tasks - relay sequencing, process timers, communication gateways - map well onto the DSPIC33EP32GP504T-E/ML because the dsPIC33EP family offers a mature C toolchain (MPLAB X, XC16 compiler), hardware debugging via PGEC1/PGED1, and PTG offloading of trigger sequencing. At 60 MIPS the core executes control loops with deterministic latency, important for machine safety logic. CAN and UART peripherals cover industrial bus connectivity. The practical benefit versus a generic MCU is the DSP headroom for on-line analytics (vibration, FFT) without an external coprocessor, though 32KB FLASH means the bootloader and application must share space efficiently.
موصى به
Consumer and IoT Devices
Cost-sensitive consumer products - appliances, chargers, small displays - use the DSPIC33EP32GP504T-E/ML's 3.3V single-supply operation, rich GPIO on PORTB/PORTE/PORTF, and 60 MIPS throughput at modest cost (about $4.62 at qty 1 as of 2026-09-24). The I2C pins (SDA1/SCL1) interface touch controllers and EEPROMs, and PWM channels drive LEDs and small motors. The extended-temperature and AEC-Q100 qualification exceed consumer requirements but add robustness for enclosed, poorly ventilated products. Designers should mind the 2KB RAM for any TLS or buffering stacks, and note the 44-QFN 8x8 footprint needs reflow soldering, not hand assembly at high volume.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ DSPIC33EP32GP504T-E/ML — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | DSPIC33EP32GP504-E/ML | DSPIC33EP32GP504T-I/ML | DSPIC33EP64GP504T-E/ML | DSPIC33EP128GP504T-E/ML | DSPIC33EP32MC504T-E/ML |
|---|---|---|---|---|---|---|
| Package | 44-QFN (8x8) | 44-QFN (8x8) - same | 44-QFN (8x8) - same | 44-QFN (8x8) - same | 44-QFN (8x8) - same | 44-QFN (8x8) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Speed | 60 MIPS | 60 MIPS | 60 MIPS | 60 MIPS | 60 MIPS | 60 MIPS |
| Program Memory (FLASH) | 32KB (10.7K x 24) | 32KB (10.7K x 24) | 32KB (10.7K x 24) | 64KB (21.5K x 24) | 128KB (43K x 24) | 32KB (10.7K x 24) |
| Operating Temperature | -40C to +125C (E grade) | -40C to +125C | -40C to +85C (I grade) | -40C to +125C | -40C to +125C | -40C to +125C |
| AEC-Q100 Qualification | Qualified | Qualified | Not automotive grade (industrial) | Qualified (E grade) | Qualified (E grade) | Qualified (E grade) |
| Peripheral Specialization | General purpose (GP) | General purpose (GP) | General purpose (GP) | General purpose (GP) | General purpose (GP) | Motor control (MC) high-resolution PWM |
| Packaging (Shipping) | Tape & Reel (T) | Cut tape / tube | Tape & Reel | Tape & Reel | Tape & Reel | Tape & Reel |
أبرز الفروقات
- Extended automotive temperature grade at GP-family price (مقابلDSPIC33EP32GP504T-I/ML)
- Same footprint but 4x the program memory available (مقابلDSPIC33EP128GP504T-E/ML)
- General-purpose peripheral mix vs motor-control specialization (مقابلDSPIC33EP32MC504T-E/ML)
ملاحظات التصميم
The DSPIC33EP32GP504T-E/ML runs from a single 3.3V rail (2.97V-3.63V range per family specs). Decouple each VDD pin (pins 17, 23) with 100nF ceramic placed within 2mm of the pin, plus one bulk 10uF near the part. AVDD (pin 26) needs separate RC filtering (e.g., ferrite bead + 10uF + 100nF) to keep ADC noise low - do not tie AVDD directly to noisy digital VDD if you rely on ADC precision. Estimated: digital core current is typically tens of mA at 60 MIPS, so a 3.3V LDO or buck with 150mA+ capability suffices for the MCU alone.
The exposed pad on the 44-QFN (8x8mm) must be soldered to a grounded copper pour with an array of thermal vias - it provides both the main ground return and heat spreading, especially important at the -40C to +125C extended-temperature rating where junction margin is limited. Follow Microchip package outline drawing (checklist in the family datasheet) for QFN land pattern; use NSMD pads and print pin 1 dot clearly. Avoid routing PWM traces (pins 28-37) under the analog pins 2-11 to protect ADC integrity.
The most common dsPIC33EP bring-up failure is misconfiguring the oscillator: the device boots from FRC (internal fast RC) and must be switched to the external crystal/PLL in software to reach 60 MIPS - verify FNOSC, POSCMD, and PLLDIV fuse settings in MPLAB X. Second pitfall: forgetting that PGEC1/PGED1 or PGEC2/PGED2 pins are needed for ICSP programming - keep at least one pair accessible on a header. Third: the T suffix tape-and-reel parts are moisture sensitive; bake per MSL instructions before reflow.
PWM outputs on PORTE (pins 28-35) switch fast and couple into the analog inputs AN0-AN9 on adjacent PORTB pins. Guard the ADC inputs with ground traces, add series resistors (1k-10k) plus small RC filters at analog front-ends, and keep the CAN/UART stubs short. For motor-drive layouts, route the six PWM lines as length-matched groups to the gate drivers and place gate-driver ground references close to the MCU ground pour to minimize ground bounce during switching edges.
معلومات الامتثال
AEC-Q100 qualified and automotive-listed per Microchip USA and DigiKey product data. RoHS/lead-free status per standard Microchip green packaging for ML QFN; REACH and halogen-free declarations not stated in the provided data.