EP20K60EQC208-2XN - 60K-Gate APEX-20KE FPGA, 208-PQFP | Intel
MPN: EP20K60EQC208-2XN ⚠ آخر فرصة للشراءEP20K60EQC208-2XN نظرة عامة
A Field Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that combines thousands of configurable logic blocks, programmable interconnect, and on-chip memory into a single semiconductor. Within the broader taxonomy, an FPGA sits above simple CPLDs in density and below ASICs in non-recurring engineering cost. The APEX-20KE family introduced MultiCore architecture, merging LUT-based logic (efficient for data-paths, register-intensive math, and DSP) with product-term logic (efficient for control/state machines) on the same die, plus dedicated embedded system blocks (ESBs) for memory. This makes the APEX-20KE a hybrid logic-and-memory platform rather than a pure LUT device.
Key differentiating features include 2560 logic elements, 32 Kbits of distributed RAM, in-system programmability via JTAG, MultiVolt I/O support for interfacing to 1.8 V, 2.5 V, 3.3 V and 5 V buses, and a built-in PLL for clock management. The '-2' speed grade and 'N' suffix denote the commercial temperature range (0 °C to 85 °C) and lead-free, RoHS-compliant packaging per the FindIC summary.
The EP20K60EQC208-2XN is typically used in telecommunications line cards, industrial control backplanes, and legacy PCI bridge designs where high logic density and large embedded RAM are required. Designers migrating to newer Cyclone or MAX families should treat this part as a long-term-support / last-time-buy candidate rather than a greenfield choice.
When designing with this device, provide at least four 0.1 µF decoupling capacitors around the package perimeter, keep the PLL power island isolated, and program the configuration bitstream via the ByteBlaster or Master/Slave serial modes documented in the APEX-20KE datasheet. The 208-PQFP is a perimeter-lead package, so PCB escape routing is straightforward but limits pin density versus a BGA.
This page synthesizes distributor stock data, parametric cross-references, and practical design considerations that are not collected in any single manufacturer document.
بدائل مباشرة لـ EP20K60EQC208-2XN — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع EP20K60EQC208-2XN (نفس عامل الشكل والبصمة) — يختلف في Core Supply Voltage, Operating Temperature, Typical Gates, Family, Logic Elements / Cells.
EP20K60EQC208-2X
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP20K60EQC208-2N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP20K60EQC208-2
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP20K60EQC208-1X
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP20K60EQC208-1
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP20K60EQC208-2XN الحدود القصوى والخصائص الكهربائية
| Family | APEX-20KE |
| Logic Elements | 2,560 |
| Typical Gates | 60,000 |
| Embedded RAM | 32,768 bits (32 Kbit) |
| User I/Os | 148 |
| العلبة | 208-pin PQFP (BFQFP) |
| نوع التركيب | Surface Mount |
| Core Process Technology | 0.22 µm CMOS |
| Core Supply Voltage | 1.71 V to 1.89 V (1.8 V nominal) |
| Internal Frequency (max) | 200 MHz |
| Propagation Delay (typ.) | 1.72 ns |
| Speed Grade | -2 |
| درجة حرارة التشغيل | 0 °C to +85 °C (commercial) |
| Configuration Interface | JTAG / Passive Serial / Passive Parallel |
| PLL | Yes (clock management) |
| حالة RoHS | Compliant (Pb-free N-suffix) |
| Architecture | MultiCore (LUT + product-term + ESB) |
تكوين أطراف EP20K60EQC208-2XN
| دبوس 1 | I/O — User I/O bank 1 |
| دبوس 2 | I/O — User I/O bank 1 |
| دبوس 3 | I/O — User I/O bank 1 |
| دبوس 4 | GND — Ground |
| دبوس 5 | I/O — User I/O bank 1 |
| دبوس 6 | I/O — User I/O bank 1 |
| دبوس 7 | VCCIO1 — I/O bank 1 supply |
| دبوس 8 | I/O — User I/O bank 1 |
| دبوس 9 | I/O — User I/O bank 1 |
| دبوس 10 | I/O — User I/O bank 1 |
| دبوس 11 | GND — Ground |
| دبوس 12 | I/O — User I/O bank 1 |
| دبوس 13 | I/O — User I/O bank 1 |
| دبوس 14 | TDI — JTAG Test Data In |
| دبوس 15 | TMS — JTAG Test Mode Select |
| دبوس 16 | TCK — JTAG Test Clock |
| دبوس 17 | I/O — User I/O bank 1 |
| دبوس 18 | I/O — User I/O bank 1 |
| دبوس 19 | VCCINT — Core supply 1.8 V |
| دبوس 20 | GND — Ground |
| دبوس 21 | I/O — User I/O bank 1 |
| دبوس 22 | I/O — User I/O bank 1 |
| دبوس 23 | I/O — User I/O bank 1 |
| دبوس 24 | I/O — User I/O bank 1 |
| دبوس 25 | I/O — User I/O bank 1 |
| دبوس 26 | GND — Ground |
| دبوس 27 | I/O — User I/O bank 1 |
| دبوس 28 | I/O — User I/O bank 1 |
| دبوس 29 | VCCIO1 — I/O bank 1 supply |
| دبوس 30 | I/O — User I/O bank 1 |
| دبوس 31 | I/O — User I/O bank 1 |
| دبوس 32 | I/O — User I/O bank 1 |
| دبوس 33 | GND — Ground |
| دبوس 34 | I/O — User I/O bank 1 |
| دبوس 35 | I/O — User I/O bank 1 |
| دبوس 36 | I/O — User I/O bank 1 |
| دبوس 37 | VCCINT — Core supply 1.8 V |
| دبوس 38 | GND — Ground |
| دبوس 39 | I/O — User I/O bank 1 |
| دبوس 40 | I/O — User I/O bank 1 |
| دبوس 41 | I/O — User I/O bank 1 |
| دبوس 42 | I/O — User I/O bank 1 |
| دبوس 43 | I/O — User I/O bank 1 |
| دبوس 44 | GND — Ground |
| دبوس 45 | I/O — User I/O bank 1 |
| دبوس 46 | I/O — User I/O bank 1 |
| دبوس 47 | VCCIO1 — I/O bank 1 supply |
| دبوس 48 | I/O — User I/O bank 1 |
| دبوس 49 | I/O — User I/O bank 1 |
| دبوس 50 | I/O — User I/O bank 1 |
| دبوس 51 | GND — Ground |
| دبوس 52 | I/O — User I/O bank 2 |
| دبوس 53 | I/O — User I/O bank 2 |
| دبوس 54 | I/O — User I/O bank 2 |
| دبوس 55 | VCCINT — Core supply 1.8 V |
| دبوس 56 | I/O — User I/O bank 2 |
| دبوس 57 | I/O — User I/O bank 2 |
| دبوس 58 | I/O — User I/O bank 2 |
| دبوس 59 | I/O — User I/O bank 2 |
| دبوس 60 | GND — Ground |
| دبوس 61 | I/O — User I/O bank 2 |
| دبوس 62 | I/O — User I/O bank 2 |
| دبوس 63 | VCCIO2 — I/O bank 2 supply |
| دبوس 64 | I/O — User I/O bank 2 |
| دبوس 65 | I/O — User I/O bank 2 |
| دبوس 66 | I/O — User I/O bank 2 |
| دبوس 67 | I/O — User I/O bank 2 |
| دبوس 68 | GND — Ground |
| دبوس 69 | I/O — User I/O bank 2 |
| دبوس 70 | I/O — User I/O bank 2 |
| دبوس 71 | I/O — User I/O bank 2 |
| دبوس 72 | VCCINT — Core supply 1.8 V |
| دبوس 73 | I/O — User I/O bank 2 |
| دبوس 74 | I/O — User I/O bank 2 |
| دبوس 75 | GND — Ground |
| دبوس 76 | I/O — User I/O bank 2 |
| دبوس 77 | I/O — User I/O bank 2 |
| دبوس 78 | I/O — User I/O bank 2 |
| دبوس 79 | I/O — User I/O bank 2 |
| دبوس 80 | I/O — User I/O bank 2 |
| دبوس 81 | VCCIO2 — I/O bank 2 supply |
| دبوس 82 | I/O — User I/O bank 2 |
| دبوس 83 | I/O — User I/O bank 2 |
| دبوس 84 | GND — Ground |
| دبوس 85 | I/O — User I/O bank 3 |
| دبوس 86 | I/O — User I/O bank 3 |
| دبوس 87 | I/O — User I/O bank 3 |
| دبوس 88 | I/O — User I/O bank 3 |
| دبوس 89 | VCCINT — Core supply 1.8 V |
| دبوس 90 | GND — Ground |
| دبوس 91 | I/O — User I/O bank 3 |
| دبوس 92 | I/O — User I/O bank 3 |
| دبوس 93 | I/O — User I/O bank 3 |
| دبوس 94 | I/O — User I/O bank 3 |
| دبوس 95 | I/O — User I/O bank 3 |
| دبوس 96 | GND — Ground |
| دبوس 97 | I/O — User I/O bank 3 |
| دبوس 98 | I/O — User I/O bank 3 |
| دبوس 99 | VCCIO3 — I/O bank 3 supply |
| دبوس 100 | I/O — User I/O bank 3 |
| دبوس 101 | I/O — User I/O bank 3 |
| دبوس 102 | I/O — User I/O bank 3 |
| دبوس 103 | GND — Ground |
| دبوس 104 | I/O — User I/O bank 3 |
| دبوس 105 | I/O — User I/O bank 3 |
| دبوس 106 | I/O — User I/O bank 3 |
| دبوس 107 | VCCINT — Core supply 1.8 V |
| دبوس 108 | I/O — User I/O bank 3 |
| دبوس 109 | I/O — User I/O bank 3 |
| دبوس 110 | GND — Ground |
| دبوس 111 | I/O — User I/O bank 3 |
| دبوس 112 | I/O — User I/O bank 3 |
| دبوس 113 | I/O — User I/O bank 3 |
| دبوس 114 | I/O — User I/O bank 3 |
| دبوس 115 | I/O — User I/O bank 3 |
| دبوس 116 | VCCIO3 — I/O bank 3 supply |
| دبوس 117 | I/O — User I/O bank 3 |
| دبوس 118 | I/O — User I/O bank 3 |
| دبوس 119 | GND — Ground |
| دبوس 120 | I/O — User I/O bank 4 |
| دبوس 121 | I/O — User I/O bank 4 |
| دبوس 122 | I/O — User I/O bank 4 |
| دبوس 123 | VCCINT — Core supply 1.8 V |
| دبوس 124 | GND — Ground |
| دبوس 125 | I/O — User I/O bank 4 |
| دبوس 126 | I/O — User I/O bank 4 |
| دبوس 127 | I/O — User I/O bank 4 |
| دبوس 128 | I/O — User I/O bank 4 |
| دبوس 129 | I/O — User I/O bank 4 |
| دبوس 130 | GND — Ground |
| دبوس 131 | I/O — User I/O bank 4 |
| دبوس 132 | I/O — User I/O bank 4 |
| دبوس 133 | VCCIO4 — I/O bank 4 supply |
| دبوس 134 | I/O — User I/O bank 4 |
| دبوس 135 | I/O — User I/O bank 4 |
| دبوس 136 | I/O — User I/O bank 4 |
| دبوس 137 | I/O — User I/O bank 4 |
| دبوس 138 | GND — Ground |
| دبوس 139 | I/O — User I/O bank 4 |
| دبوس 140 | I/O — User I/O bank 4 |
| دبوس 141 | I/O — User I/O bank 4 |
| دبوس 142 | VCCINT — Core supply 1.8 V |
| دبوس 143 | I/O — User I/O bank 4 |
| دبوس 144 | I/O — User I/O bank 4 |
| دبوس 145 | GND — Ground |
| دبوس 146 | I/O — User I/O bank 4 |
| دبوس 147 | I/O — User I/O bank 4 |
| دبوس 148 | I/O — User I/O bank 4 |
| دبوس 149 | I/O — User I/O bank 4 |
| دبوس 150 | I/O — User I/O bank 4 |
| دبوس 151 | VCCIO4 — I/O bank 4 supply |
| دبوس 152 | I/O — User I/O bank 4 |
| دبوس 153 | I/O — User I/O bank 4 |
| دبوس 154 | GND — Ground |
| دبوس 155 | I/O — User I/O bank 5 |
| دبوس 156 | I/O — User I/O bank 5 |
| دبوس 157 | I/O — User I/O bank 5 |
| دبوس 158 | VCCINT — Core supply 1.8 V |
| دبوس 159 | GND — Ground |
| دبوس 160 | I/O — User I/O bank 5 |
| دبوس 161 | I/O — User I/O bank 5 |
| دبوس 162 | I/O — User I/O bank 5 |
| دبوس 163 | I/O — User I/O bank 5 |
| دبوس 164 | I/O — User I/O bank 5 |
| دبوس 165 | GND — Ground |
| دبوس 166 | I/O — User I/O bank 5 |
| دبوس 167 | I/O — User I/O bank 5 |
| دبوس 168 | VCCIO5 — I/O bank 5 supply |
| دبوس 169 | I/O — User I/O bank 5 |
| دبوس 170 | I/O — User I/O bank 5 |
| دبوس 171 | I/O — User I/O bank 5 |
| دبوس 172 | GND — Ground |
| دبوس 173 | I/O — User I/O bank 5 |
| دبوس 174 | I/O — User I/O bank 5 |
| دبوس 175 | I/O — User I/O bank 5 |
| دبوس 176 | VCCINT — Core supply 1.8 V |
| دبوس 177 | I/O — User I/O bank 5 |
| دبوس 178 | I/O — User I/O bank 5 |
| دبوس 179 | GND — Ground |
| دبوس 180 | I/O — User I/O bank 5 |
| دبوس 181 | I/O — User I/O bank 5 |
| دبوس 182 | I/O — User I/O bank 5 |
| دبوس 183 | I/O — User I/O bank 5 |
| دبوس 184 | I/O — User I/O bank 5 |
| دبوس 185 | VCCIO5 — I/O bank 5 supply |
| دبوس 186 | I/O — User I/O bank 5 |
| دبوس 187 | I/O — User I/O bank 5 |
| دبوس 188 | GND — Ground |
| دبوس 189 | I/O — User I/O bank 6 |
| دبوس 190 | I/O — User I/O bank 6 |
| دبوس 191 | I/O — User I/O bank 6 |
| دبوس 192 | VCCINT — Core supply 1.8 V |
| دبوس 193 | CLK0 — Clock input 0 (PLL reference) |
| دبوس 194 | CLK1 — Clock input 1 |
| دبوس 195 | GND — Ground |
| دبوس 196 | CLK2 — Clock input 2 |
| دبوس 197 | CLK3 — Clock input 3 |
| دبوس 198 | MSEL0 — Configuration mode select 0 |
| دبوس 199 | MSEL1 — Configuration mode select 1 |
| دبوس 200 | MSEL2 — Configuration mode select 2 |
| دبوس 201 | nSTATUS — Configuration status (open-drain) |
| دبوس 202 | nCONFIG — Configuration start (active-low) |
| دبوس 203 | DCLK — Configuration clock input |
| دبوس 204 | DATA0 — Configuration data input 0 |
| دبوس 205 | CONF_DONE — Configuration complete (open-drain) |
| دبوس 206 | TDO — JTAG Test Data Out |
| دبوس 207 | PLL_ENA — PLL enable |
| دبوس 208 | PLL_FB — PLL analog filter / feedback |
التطبيقات النموذجية
EP20K60EQC208-2XN مناسب لـ 6 التطبيقs: Telecommunications Line-Card Glue Logic, Legacy PCI Bridge / Bus Interface, Industrial Control Backplane Controller, DSP Front-End / Data Acquisition, Test & Measurement Instrument Backplane, Aerospace / Defense Retrofit (with qualification).
Telecommunications Line-Card Glue Logic
The EP20K60EQC208-2XN is well-suited to telecom line-card glue logic where 2,560 logic elements and 32 Kbit of embedded RAM provide enough density for protocol adaptation, framing, and per-channel state machines. Its 148 user I/Os comfortably drive multi-standard backplane buses (H.110, MVIP, or proprietary TDM) at the part's 200 MHz internal frequency. Compared with a discrete CPLD bank, the MultiCore LUT+product-term architecture of the APEX-20KE halves the device count and reduces PCB area, while MultiVolt I/O banks interface directly to 3.3 V and 5 V bus drivers without level shifters.
موصى به
Legacy PCI Bridge / Bus Interface
The EP20K60EQC208-2XN is frequently deployed in legacy PCI 32-bit/33 MHz bridge designs where its 148 I/Os match the bus plus local-processor interface, and its 32 Kbit ESB RAM implements FIFOs and address-mapping tables. The 200 MHz internal frequency supports 33 MHz PCI with comfortable setup/hold margin. Per the manufacturer datasheet, the 5 V-tolerant I/O banks tolerate legacy PCI signalling directly, while the 1.8 V core keeps power dissipation moderate on a -2 speed grade. This makes the part a popular drop-in when modernizing legacy add-in cards without a full PCB redesign.
موصى به
Industrial Control Backplane Controller
The EP20K60EQC208-2XN serves as a backplane controller in industrial automation, where it bridges Fieldbus (Profibus, CAN, or Modbus) segments to a central PLC. Its MultiCore architecture combines product-term logic (ideal for deterministic state machines) with LUT-based DSP blocks for signal conditioning math, all on one die. The commercial 0 °C to 85 °C operating temperature range and 148 I/Os allow direct connection to backplane drivers without external bus switches. Last-time-buy status as of 2026-09-08 means designers must stockpile or qualify the EP20K60EQC208-2N finish variant as a long-term fallback.
موصى به
DSP Front-End / Data Acquisition
The EP20K60EQC208-2XN is well-matched to DSP front-end designs such as sonar, instrumentation, and digital-beamforming, where its 32 Kbit ESB RAM buffers samples while LUT-based DSP blocks implement FIR/IIR filters. The 1.72 ns propagation delay per LE supports sustained 200 MHz datapaths at the part's maximum internal clock, and the MultiVolt I/O banks directly interface to 1.8 V modern ADCs without glue logic. Compared to a hard DSP, the APEX-20KE offers reprogrammable filter coefficients in-system, which simplifies prototyping and field upgrades of signal-processing chains.
موصى به
Test & Measurement Instrument Backplane
The EP20K60EQC208-2XN is used in test-and-measurement equipment as a backplane controller that aggregates data from multiple ADC/DAC channels and routes it to a host processor. With 148 I/Os and 32 Kbit of embedded RAM, the part implements small FIFO buffers per channel and protocol translation to USB or Ethernet. The Quartus II 13.0 toolchain support means existing test labs can continue programming without retraining. Last-time-buy status as of 2026-09-08 prompts long-term-stock acquisition strategies, especially for ATE platforms with multi-decade service contracts.
موصى به
Aerospace / Defense Retrofit (with qualification)
The EP20K60EQC208-2XN is occasionally used in defense retrofits and military communication systems where existing designs rely on its 1.8 V core, 148 I/Os, and MultiCore LUT+product-term architecture. Although the standard part is commercial-grade (0 °C to 85 °C), the same silicon underpins MIL-PRF-38535 flow variants sold through authorized defense distributors. The 208-PQFP perimeter-lead package also simplifies lead-form rework on legacy avionics cards. Because the family is on last-time-buy as of 2026-09-08, programs should establish a long-term-storage contract for sustaining engineering over the platform's deployment lifetime.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ EP20K60EQC208-2XN — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | EP20K60EQC208-2X | EP20K60EQC208-2N | EP20K60EQC208-2 | EP20K60EQC208-1X | EP20K60EQC208-1 |
|---|---|---|---|---|---|---|
| Package | 208-PQFP | 208-PQFP - same | 208-PQFP - same | 208-PQFP - same | 208-PQFP - same | 208-PQFP - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 2,560 | 2,560 | 2,560 | 2,560 | 2,560 | 2,560 |
| Embedded RAM | 32 Kbit | 32 Kbit | 32 Kbit | 32 Kbit | 32 Kbit | 32 Kbit |
| User I/Os | 148 | 148 | 148 | 148 | 148 | 148 |
| Speed Grade | -2 | -2 (same) | -2 (same) | -2 (same) | -1 (slower) | -1 (slower) |
| Operating Temperature | 0 °C to 85 °C (commercial) | 0 °C to 85 °C | 0 °C to 85 °C | 0 °C to 85 °C | 0 °C to 85 °C | 0 °C to 85 °C |
أبرز الفروقات
- MultiCore architecture combines LUT and product-term logic on one die (مقابلPure LUT FPGAs (Xilinx XC4000 series from the same era))
- 32 Kbit embedded system blocks (ESBs) configurable as RAM/ROM/FIFO without LE cost (مقابلLegacy Xilinx XC4000E distributed RAM)
- Per-package finish variants (-1, -2, -3 speed grades and -N, -X finish codes) enable drop-in PCB reuse (مقابلSingle-finish competitors)
ملاحظات التصميم
The 1.8 V core supply (VCCINT) and the four VCCIO bank supplies must be decoupled with at least four 0.1 µF ceramic capacitors placed within 5 mm of the package perimeter, plus one 10 µF tantalum or polymer bulk capacitor per supply rail. Estimated: at 200 MHz toggling with 60% utilization, ICCINT is in the 200-400 mA range per Altera's APEX-20KE power estimator; budgeting a 1 A regulator for VCCINT and 0.5 A per VCCIO bank provides safe margin.
The 208-pin PQFP uses 0.5 mm pitch gull-wing leads; route signals on inner layers with 0.2 mm trace width and 0.2 mm clearance to escape the perimeter. Provide a continuous ground plane on layer 2 directly under the package to control return paths and to limit SSO noise. Estimated: with 148 I/Os switching at 100 MHz simultaneously, the device can source/sink up to ~24 mA per bank transient - keep high-current outputs isolated from clock inputs to minimise jitter.
Do not program an APEX-20KE bitstream generated for a -1 speed grade into a -2 speed-grade silicon expecting faster timing - the fitter constraints differ and you may see setup violations. Always rebuild the bitstream in Quartus II with the correct device selection. Likewise, the trailing 'N' suffix denotes Pb-free finish, not a different speed grade -2N is identical to -2 except for lead plating.
معلومات الامتثال
RoHS/Pb-free compliance inferred from the N-suffix Pb-free finish code per Altera naming conventions. AEC-Q100 not applicable to commercial-grade FPGAs. Halogen-free status not stated in verified data.